Cooling & Thermal Management

Heat Sink, Square, PCB, 1 Clip, T0-220 & T0-264, TO-247, 20.47 mm, 38 mm, 25 mm

Heat Sink, Square, PCB, 2 Clips, T0-220 & T0-264, TO-247, 20.47 mm, 38 mm, 50 mm

Fan / Force Cooled Heat Sink, COLDCUBE® Series, 0.12 °C/W, 82 mm, 75 mm, 100 mm

Heat Sink, BGA, FPGAs, Double Sided Adhesive, 7.93 °C/W, BGA, 45 mm, 10 mm, 45 mm

Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.51 °C/W, BGA, 28 mm, 9 mm, 28 mm

Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.12 °C/W, BGA, 38 mm, 6 mm, 38 mm

Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.38 °C/W, BGA, 40 mm, 5 mm, 40 mm

PHASE CHANGE THERMAL MATERIAL, 25.4MM

PHASE CHANGE THERMAL MATERIAL, 127MM

PHASE CHANGE THERMAL MATERIAL, RECT

PHASE CHANGE THERMAL MATERIAL, TO220

PHASE CHANGE THERMAL MATERIAL, TO247

PHASE CHANGE THERMAL MATERIAL, TO264

Fan / Force Cooled Heat Sink, BGA, Chip Set, 1.95 °C/W, 16 mm, 40 mm, 40 mm, 5.5 CFM, 26 dBA

CRYSTAL INSULATOR, RECTANGULAR, 0.1MM

Heat Sink, For North Bridge, 1.25 °C/W, BGA, 37.5 mm, 33 mm, 37.5 mm

Fan / Force Cooled Heat Sink, BGA, Chip Set, 35 mm, 35 mm

Fan / Force Cooled Heat Sink, BGA, Chip Set, 28.6 mm, 42.5 mm, 42.5 mm

Heat Sink, Universal Processor, 40 mm, 5 mm, 30 mm

Heat Sink, Component Mounted, Low Profile, Multifin, 2 °C/W, PGA, 30 mm, 16 mm, 30 mm

Heat Sink, Component Mounted, Low Profile, Multifin, 0.4 °C/W, PGA, 80 mm, 16 mm, 80 mm

Heat Sink, Component Mounted, Low Profile, Multifin, 0.3 °C/W, PGA, 100 mm, 16 mm, 100 mm

HEAT SINK, ALUMINIUM ALLOY, 50MM, TO-220

Fan Blower, Dual Inlet, D2E Series, IP20, Centrifugal, 230 VAC, AC, 165 mm, 180 mm, 256 CFM

CENTRIFUGAL FAN, 199MM, 230VAC, 400W

Fan Blower, D3G133 Series, IP54, Centrifugal, 230 VAC, AC, 213 mm, 270 mm, 523.83 CFM

Fan Blower, EC Centrifugal, 230 VAC, AC, 146 mm, 220 mm, 635 CFM

Fan Blower, D4E Series, IP44, Centrifugal, 230 VAC, AC, 241 mm, 270 mm, 730 CFM

SLIM-LINE BLOWER, 30MM, 0.76CFM, 5VDC

SLIM-LINE BLOWER, 30MM, 1.09CFM, 5VDC