904-27-1-12-2-B-0

## _**901-910 SERIES CHIPSET HEAT SINKS**_ 

PIN FIN & ELLIPTICAL HEAT SINKS 

Wakefield-Vette’s 901-910 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx. TI, Motorola and many more! These heat sinks are designed for air flow applications. Enclosed pages have thermal performance data for natural forced convection values. 

**4 Springs at each corner** 

Wakefield-Vette heat sink assembles onto chip set using the space that is between the PCB and the substrate of the solder balls. The solder balls provide a minimal gap of .5mm to .7mm. Attachment feature is below a .4mm thickness. The clipping system will not interfere or damage chip. Contact area is the edge of chip. 

## **Thermal Cooling Solutions from SMART to FINISH** 

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**Material:** AL 6063 **Finish:** Black Anodize 

All dimensions in millimeters (mm) 

## Part Numbering System 

* 

*Note: When selecting part number chip set thickness (CST) relates to spring selection! 

## **Thermal Cooling Solutions from SMART to FINISH** 

## _**901-910 SERIES CHIPSET HEAT SINKS**_ 

## **THERMAL PERFORMANCE** 

## **Thermal Cooling Solutions from SMART to FINISH** 

## _**901-910 SERIES CHIPSET HEAT SINKS**_ 

## **THERMAL PERFORMANCE** 

## **Thermal Cooling Solutions from SMART to FINISH** 

## _**901-910 SERIES CHIPSET HEAT SINKS**_ 

## **SHOCK TEST SPECIFICATION** ： 

Wave Form ：Half sine wave Acceleration ：50 g Duration Time ：11 ms No. of Shock ：Each axis 3 times Shock Direction ：±X, ±Y, ±Z axis Reliability & Communication Testing Instruments 

## **Random Vibration test** 

Frequency ：5 Hz to 500 Hz Acceleration ：3.13 grms P.S.D ：0.01 g2/HZ (5 Hz) 0.02 g2/HZ (20 Hz to 500 Hz) Test Axis ：X, Y, Z axis Test Time ：10 mins (Each axis) Total Test Time ：30 mins 

**STEP 1:** Center heat Sink onto BGA. Tilt and hook one side of the clip under the BGA chip. 

**STEP 2:** Press down the other side of clip to snap it onto the BGA chip. 

**STEP :3** Make sure the stop pin is not on top of the chip set. Installation Done! 

## **Thermal Cooling Solutions from SMART to FINISH** 

_**901-910 SERIES CHIPSET HEAT SINKS**_ _—_— wl[a] Contact Us / Corporate Location Information —~{, Wakefield-Vette is Global. Global presence means our engineering, design, sales and support are close to % our customers, in the Americas, Europe, Middle East and Asia. It mean multi-national manufacturing and delivery. And it means a global Wakefield-Vette supply chain that can deliver, and provide support quickly, anywhere, with the highest quality solutions. Contact sales for a list of Distributors that carry stock. East Coast Operations wakefield-vette New Hampshire 33 Bridge Street Pelham.NH 03076 Phone: 603-635-2800 Fax: 603-635-1900 Info@wakefield-vette.com (Wakefield-Vette Headquarters) 2013 Wakefield-Vette. All rights reserved. Information is subject to change without notice. Wakefield-Vette assumes no liability for the errors that may appear in this document. **Visit us on the web at:** www.wakefield-vette.com 

## **Thermal Cooling Solutions from SMART to FINISH**