7128DG

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TO -2 20, TO -2 20- s ingle gauge (0.020")<br>**----- End of picture text -----**<br>


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Copper channel style heat sink with integrated clip<br>PF) This non -e lectronic component is functionally unaffected by the normal soldering or reflow processes used for<br>_aeet Lay semiconductor circuits . The heat resistance time or heat resistance temperature is not applicable for the component .<br>A\\ } Height: 29 . 21<br>‘ts Mount Orientation: Vertical<br>a Finish: Tin Plated<br>el RoHS: compliant<br>\<br>**----- End of picture text -----**<br>


Thermal Resistance: 19 ~~.~~ 20 

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— ie,shawTop detailis cut 7<br>| L| away to:<br>27.94 n 127<br>(1.100) 4 39 (0.050)<br>(0.00) | = c 6.12 2,793.43<br>(0.241) (0.110-0.135)<br>127 ae |<br>(0.050}—* (0425)oaq (0.066)1.07 I) (0.176)4a?<br>(0.0423) 531<br>Fr)~~ (0.866)An200 | (0.209)<br>(0.375)<br>im<br>67 (0 . 184) | Z Dim: 2 . 92 (0 . 115)<br>Lae Device Centerline<br>| ' | 4 Mounting surace<br>- -. of Heat Sink<br>1 \aypical Device<br>Lead Locations<br>H<br>'<br>| a? 21 (2 Places)<br>x1 _ x1 _+|<br>FIGURE 1<br>Air Velocity—Feet Per Minute<br>0 200 400 600 800 861000<br>v 100;Na<br>Zseto ttS4rrryTrp i, 2s8<br>a2 |(|)/ [| | PtPeetfel ke3 |<br>{Deeeceeeeeen!<br>S é La | fa<br>Sza“ ol) LieTot| Ee<br>z ofl | |[| [| |)| T |7 tT| TffT | ofSae<br>0 1 2 3 4 5<br>Heat Dissipated—Watts<br>**----- End of picture text -----**<br>


X Dim: 10 ~~.~~ 69 (0 ~~.~~ 421) | Y Dim: 4 ~~.~~ 67 (0 ~~.~~ 184) | Z Dim: 2 ~~.~~ 92 (0 ~~.~~ 115)