Cooling & Thermal Management

Heat Sink, For Ball Grid Array, Standard, 10 °C/W, BGA, 40 mm, 10 mm, 23.9 mm

Heat Sink, For Ball Grid Array, Standard, 9.7 °C/W, BGA, 40 mm, 10 mm, 40 mm

Heat Sink, For Ball Grid Array, Standard, 8.2 °C/W, BGA, 40 mm, 18 mm, 40 mm

Heat Sink, TO-220/218, 7.2 °C/W, TO-218, TO-220, 35 mm, 38 mm, 25.4 mm

Heat Sink, TO-220/218, 5.8 °C/W, TO-218, TO-220, TO-247, 35 mm, 50 mm, 25.4 mm

Heat Sink, Square, PCB, 1 Clip, T0-220 & T0-264, TO-247, 20.47 mm, 38 mm, 25 mm

Heat Sink, Square, PCB, 2 Clips, T0-220 & T0-264, TO-247, 20.47 mm, 38 mm, 50 mm

Fan / Force Cooled Heat Sink, COLDCUBE® Series, 0.12 °C/W, 82 mm, 75 mm, 100 mm

Heat Sink, BGA, FPGAs, Double Sided Adhesive, 7.93 °C/W, BGA, 45 mm, 10 mm, 45 mm

Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.51 °C/W, BGA, 28 mm, 9 mm, 28 mm

Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.12 °C/W, BGA, 38 mm, 6 mm, 38 mm

Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.38 °C/W, BGA, 40 mm, 5 mm, 40 mm

PHASE CHANGE THERMAL MATERIAL, 25.4MM

PHASE CHANGE THERMAL MATERIAL, 127MM

PHASE CHANGE THERMAL MATERIAL, RECT

PHASE CHANGE THERMAL MATERIAL, TO220

PHASE CHANGE THERMAL MATERIAL, TO247

PHASE CHANGE THERMAL MATERIAL, TO264

Fan / Force Cooled Heat Sink, BGA, Chip Set, 1.95 °C/W, 16 mm, 40 mm, 40 mm, 5.5 CFM, 26 dBA

CRYSTAL INSULATOR, RECTANGULAR, 0.1MM

Heat Sink, For North Bridge, 1.25 °C/W, BGA, 37.5 mm, 33 mm, 37.5 mm

Fan / Force Cooled Heat Sink, BGA, Chip Set, 35 mm, 35 mm

Fan / Force Cooled Heat Sink, BGA, Chip Set, 28.6 mm, 42.5 mm, 42.5 mm

Heat Sink, Universal Processor, 40 mm, 5 mm, 30 mm

Heat Sink, Component Mounted, Low Profile, Multifin, 2 °C/W, PGA, 30 mm, 16 mm, 30 mm

Heat Sink, Component Mounted, Low Profile, Multifin, 0.4 °C/W, PGA, 80 mm, 16 mm, 80 mm

Heat Sink, Component Mounted, Low Profile, Multifin, 0.3 °C/W, PGA, 100 mm, 16 mm, 100 mm

HEAT SINK, ALUMINIUM ALLOY, 50MM, TO-220

Fan Blower, Dual Inlet, D2E Series, IP20, Centrifugal, 230 VAC, AC, 165 mm, 180 mm, 256 CFM

CENTRIFUGAL FAN, 199MM, 230VAC, 400W