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Heat Sink, For Board Level Power Semiconductor, 11 °C/W, TO-220, 34.9 mm, 38.1 mm, 12.7 mm
HEAT SINK
HEAT SINK, ALUMINIUM, 35MM, BGA
HEAT SINK, ALUMINIUM, 27.9MM
HEAT SINK, ALUMINIUM, TO-PACKAGE, SMD
HEAT SINK, NATURAL CONVECTION, 45°C @ 7.5W
Heat Sink, Omnidirectional, For Power Semiconductor, 6.7 °C/W, TO-3, 46 mm, 12.7 mm, 46.5 mm
HEATSINK, TO126, INTEGRATED CLIP, 100MM 99AC8442
HEATSINK, TO126, INTEGRATED CLIP, 25MM
HEATSINK, TO126, INTEGRATED CLIP, 50MM 99AC8444