680-5A..

Heat Sink, Omnidirectional, For Power Semiconductor, 6.7 °C/W, TO-3, 46 mm, 12.7 mm, 46.5 mm

⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
Manufacturer: WAKEFIELD THERMAL
Product type: Natural Convection Heat Sinks
Thermal Resistance:6.7°C/W; Packages Cooled:TO-3; External Width - Metric:46mm; External Height - Metric:12.7mm; External Length - Metric:46.5mm; External Diameter - Metric:-; Heat Sink Material
SVHC: No SVHC (14-Jun-2023)
Product Range: -
Packages Cooled: TO-3
Heat Sink Material: Aluminium
Thermal Resistance: 6.7°C/W
External Width - Metric: 46mm
External Height - Metric: 12.7mm
External Length - Metric: 46.5mm
External Width - Imperial: 1.81"
External Diameter - Metric: -
External Height - Imperial: 0.5"
External Length - Imperial: 1.83"
External Diameter - Imperial: -
Delivery and price
Units per pack	50
Price	6.89 €
Current stock	10+
Lead time	30 days
Datasheet
`WTS001_p1-25  6/14/07  10:54 AM  Page 22` 

## **Board Level Heat Sinks** | 

## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS** 

## **217 SERIES** 

## **Surface Mount Heat Sinks** 

D[2] PAK, TO-220, SOT-223, SOL-20 

Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers' component thermal specifications. 

## **FEATURES AND BENEFITS:** 

- No interface material is needed 

- Copper with matte tin plating for improved solderability and assembly 

- Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats 

- EIA standards and ESD protection are specified 

- • Can be used with water soluble or no clean SMT solder creams or other pastes 

**==> picture [516 x 489] intentionally omitted <==**

**----- Start of picture text -----**<br>
Height Above Footprint Thermal Performance at Typical Load<br>Standard PC Board Dimensions Package Package Natural Forced<br>P/N in. (mm) in. (mm) Format Quantity Convection Convection)<br>217-36CTE6 .360 (9.1) .600 (15.2) x .740 (18.8) Bulk 1 55°C @ 1W 16.0°C/W @ 200 LFM<br>217-36CTTE6 .360 (9.1) .600 (15.2) x .740 (18.8) Tube 20 55°C @ 1W 16.0°C/W @ 200 LFM<br>217-36CTRE6 .360 (9.1) .600 (15.2) x .740 (18.8) Tape & Reel 250 55°C @ 1W  16.0°C/W @ 200 LFM<br>Material: Copper, Matte Tin Plated<br>MECHANICAL DIMENSIONS 217 HEAT SINK WITH<br>THERMAL PERFORMANCE<br>DDPAK DEVICE 6 LAYER BOARD, D' PAK<br>125°C LEAD, 40°C AMBIENT<br>ameLH i CLOLVEE<br>ited | Tyler|<br>215 - a7 aeeece<br>i ia = [2-4<br>Lee |<br>217-36CT6 0 1 2 3 4<br>Device Power Dissipation. W<br>KEY: a Device only, NC      5 Device + HS, NC      A Device + HS, 100 lfm     oO Device + HS, 200 lfm      © Device + HS, 300 lfm<br>eee<br>A, 9.079<br>A SECTION A-A<br>. 948 _| L409<br>NOTES<br>pies 1. Material to be “ESD” TAPE DETAILS<br>2. Approximately 6 Meters per Reel<br><I 3. 250 Pieces per Reel.<br>613.00 217-36CTR6<br>vo™N<br>REEL DETAILS<br>Dimensions: in.<br>Device Tab dT, C<br>**----- End of picture text -----**<br>


**22** ~~MUOO~~ 

`WTS001_p1-25  6/14/07  10:54 AM  Page 23` 

## **Board Level Heat Sinks** 

## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS** 

**==> picture [162 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
217 SERIES Surface Mount Heat Sinks<br>**----- End of picture text -----**<br>


**==> picture [523 x 328] intentionally omitted <==**

**----- Start of picture text -----**<br>
D [2] PAK, TO-220, SOL-20<br>MECHANICAL DIMENSIONS BOARD LAYOUT RECOMMENDATIONS<br>217 SERIES<br>TUBE DETAILS 64 USE MAX COPPER TO 75<br>ALLOW MAX CONDUCTION<br>64 R 060; FORO10 MINSOLDER { TO HEAT SINK Ni rassn | 36<br>020 | BALL. TRAP 66 as. SSUELELELSSSSSPOTTED:{|<br>19D 265 ! |<br>oe<br>Ee a . 640<br>35 aut \N \N .66 075<br>84 eS REF: JEDEC TO—220AB \ [fs !y .Y<br>SOLDER MASK OPENING<br>1eA g 4y<br>64 CF O RPPERHEATSINKFOOTPRINT GZ yZ<br>Jiaoaint 060 FOR010 MINSOLDER MIN COPPER<br>TUBE: 16.25 Inches Long,<br>Min. ESD Material with Nail<br>W Stops W 14 BALL TRAP FOR HEATSINK<br>20 Pieces per Tube<br>217-36CTT6<br>SOL 20<br>REF: JEDEC TO-263 (DD PAK)<br>REF: JEDEC MO-169 (DD PAK) 217-36CT6<br>Dimensions: in.<br>**----- End of picture text -----**<br>


**==> picture [48 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
218 SERIES<br>**----- End of picture text -----**<br>


## **Surface Mount Heat Sink** 

SMT Devices 

**Height Above Maximum Standard PC Board Footprint Thermal Performance at Typical Load P/N in. (mm) in. (mm) Natural Convection Forced Convection** 218-40CTE3 .40 (10.2) .90 (22.9) x .315 (8.0) 62°C rise @ 2W 21°C/W @ 200LFM 218-40CTE5 .40 (10.2) 1.03 (26.2) x .50 (12.7) 62°C rise @ 2W 21°C/W @ 200LFM 

Material: Copper, Matte Tin Plated 

## **MECHANICAL DIMENSIONS** 

**==> picture [164 x 6] intentionally omitted <==**

**----- Start of picture text -----**<br>
218-40CT3 218-40CT5<br>**----- End of picture text -----**<br>


**==> picture [185 x 160] intentionally omitted <==**

**----- Start of picture text -----**<br>
NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>AIR VELOCITY (LFM)<br>0 200 400 600 800 1000<br>100 | | | i, | J [ 7T [ JT 25<br>80 0 20<br>6040 Poieea a 2 See]———$—— — =>| 1510<br>20 a e eeeeee |}_}—_} 5<br>a<br>0 0<br>0 (| [    0.5200 [| [     1.400 [| 0 [     1.5600 [| [TT     2.0800 J[ JT 1000  2.5 |<br>HEAT DISSIPATED (WATTS)<br>Solid line = 218-40CT5     Dashed Line = 218-40CT3<br>)AMBIENT (C<br>ABOVE AMBIENT AIR (C)<br>HEAT SINK TEMPERATURE RISE  THERMAL RESISTANCE SINK TO<br>**----- End of picture text -----**<br>


**23** 

`WTS001_p1-25  6/14/07  10:54 AM  Page 24` 

## **Board Level Heat Sinks** 

## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS** 

## **206 SERIES Vertical Mount Heat Sink** 

TO-220 **Height Above Maximum Standard PC Board Footprint Thermal Performance at Typical Load P/N in. (mm) in. (mm) Natural Convection Forced Convection** ‘Aa 206-1PABEH ~~a~~ 1.18 (30.0) 1.00 (25.4) x .50 (12.7) 56°C rise @ 4W 7.3°C/W @ 200LFM Material: Aluminum, Black Anodized 

## **MECHANICAL DIMENSIONS** 

**==> picture [189 x 143] intentionally omitted <==**

**----- Start of picture text -----**<br>
NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>AIR VELOCITY (LFM)<br>0 200 400 600 800 1000<br>100 [| [ | | [| [| [ JT ET | 10<br>80 P ft | ft fT [ fT fT 7 8<br>|| | {| tf [oe tt tt<br>60 | | | hee ttt tt 6<br>40 [| | ryt ft ft | ~+—t 4<br>20 | tT ys [ ft ft tT [tT fT 2<br>[| {| | | | [| [ [T JT JT]<br>0 fr [| | | [ [T | fT JT Tt | 0<br>0    2200     4400     6600     8800    110 0 0<br>HEAT DISSIPATED (WATTS)<br>)AMBIENT (C<br>ABOVE AMBIENT AIR (C)<br>HEAT SINK TEMPERATURE RISE  THERMAL RESISTANCE SINK TO<br>**----- End of picture text -----**<br>


## **230 & 234 SERIES** 

## **Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks** 

TO-220 

||||**Height Above**||**Footprint**||**Solderable**||**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**|
|---|---|---|---|---|---|---|---|---|---|---|
|||**Standard**|**PC Board**||**Dimensions**|**Mounting**|**Tab**|**Mounting**|**Natural**|**Forced**|
|||**P/N**|**in.(mm)**||**in.(mm)**|**Configuation**|**Option**|**Style**|**Convection**|**Convection)**|
|||230-75AB|.750 (19.1)|.570 (14.5) x .500 (12.7)|.570 (14.5) x .500 (12.7)|Vert./Horiz.|No Tab|Clip/Mtg Hole|57°C @ 2W|7.5°C/W @ 400 LFM|
|||230-75ABE-01|.750 (19.1)|.570 (14.5) x .500 (12.7)|.570 (14.5) x .500 (12.7)|Vertical|01|Clip/Mtg Hole|57°C @ 2W|7.5°C/W @ 400 LFM|
|PATENT PENDING|PATENT PENDING|230-75ABE-05|.500 (12.7)|.750 (19.1) x .570 (14.5)|.750 (19.1) x .570 (14.5)|Horizontal|05|Clip/Mtg Hole|57°C @ 2W|7.5°C/W @ 400 LFM|
|||230-75ABE-10|.875 (22.2)|.570 (14.5) x .500 (12.7)|.570 (14.5) x .500 (12.7)|Vertical|10|Clip/Mtg Hole|57°C @ 2W|7.5°C/W @ 400 LFM|
|||234-75AB|.790 (20.0)|.570 (14.5) x .500 (12.7)|.570 (14.5) x .500 (12.7)|Vert./Horiz|No Tab|Clip/Mtg Hole|57°C @ 2W|7.5°C/W @ 400 LFM|
|||234-75ABE-01|.790 (20.0)|.570 (14.5) x .500 (12.7)|.570 (14.5) x .500 (12.7)|Vertical|01|Clip/Mtg Hole|57°C @ 2W|7.5°C/W @ 400 LFM|
|||234-75ABE-05|.500(12.7)|.790|.790(20.0)x .570(14.5)|Horizontal|05|Clip/MtgHole|57°C @ 2W|7.5°C/W @ 400 LFM|
|||Material: Aluminum, Black Anodized|||||||||



**==> picture [498 x 142] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS 230-75AB-01 230-75AB-10 230 AND 234 SERIES 230-75AB-05 230 SERIES<br>—»| pe et ge 570 MAX 750 SUGGESTED TAB HOLE=<br>Pe <—_—> ro Max + | | —| (145) /- -- (19.1) 0.075 (1.9) (PLATED)<br>' jf— be ere125 ; us Zti 210025) PAD<br>NATURAL AND FORCED<br>500 (es) [7 i4d. | [) root °<br>(12.7) I 250 375 020 TAB 10 f CONVECTION CHARACTERISTICS<br>234 SERIES f + os1.3) a f063 25) mile 032 TAB(05)  01 lie [5; |; | ; =~ AIR VELOCITY (LFM)<br>(3) |e | be aah | soon(12.7) a “| SSve jqp___200__aN<br>—»| (12.7)500 4 234-75AB el S70MAX|(148)  4 4} (12.7)500 |g 234-75AB-01 Py 234-75AB-05 234 SERIES SUGGESTED TABHOLE- Ee gf OS<br>+ TT j 0.075 (1.9) (PLATED) ati 5 : Loos tt<br>7 f | [| + + | | | 2x.100 Palla PAD es ne,A<br>(18.3) 790 | JOU 720.290 | | 210 I _ (25) "|" ct 40ae ee<br>— (20.1) |) C| a (18.3) (20.1) | (5.3) Os) t , Ea | | aro 2 7 | Hl i :<br>| E-| ' “jt032 ) | Ba f ———_ oe _ a Sy lyjz aeeepP pt7,<br>Dimensions: in. (mm) —+|l—0 3)i (1.3)0505— || f CY165 heel| ae 24.1258.2) (12.7)500 ea 0 POWER1 DISSIPATION2 3 (WATTS)4<br>**----- End of picture text -----**<br>


**24** 

`WTS001_p1-25  6/14/07  10:54 AM  Page 25` 

**Board Level Heat Sinks** 

## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS** 

**==> picture [470 x 262] intentionally omitted <==**

**----- Start of picture text -----**<br>
241 SERIES Horizontal Mount Heat Sink TO-220<br>Height Above Maximum<br>Standard PC Board Footprint Thermal Performance at Typical Load<br>P/N in. (mm) in. (mm) Natural Convection Forced Convection<br>241-69ABE-03 .39 (9.9) .86 (21.8) x .69 (17.5) 77°C rise @ 4W 12°C/W @ 200LFM<br>Material: Aluminum, Black Anodized<br>NATURAL AND FORCED<br>| CONVECTION CHARACTERISTICS<br>MECHANICAL DIMENSIONS<br>AIR VELOCITY (LFM)<br>|}Wi{| 0 200 400 600 800 1000<br>100 a 2018<br>80 a 16<br>26 (21.8) Pore 14<br>092  [ 81 60 ee 12<br>Sa 10<br>40 a SS el 8<br>6<br>ve 20 Ser PEE 4<br>&} -6- ee eee td 2<br>0 0<br>L a 0 a 200   1     2400     3600    4800    51000<br>83 [21.1] —T<br>HEAT DISSIPATED (WATTS)<br>AMBIENT (C)<br>ABOVE AMBIENT AIR (C)<br>HEAT SINK TEMPERATURE RISE  THERMAL RESISTANCE SINK TO<br>**----- End of picture text -----**<br>


**==> picture [445 x 266] intentionally omitted <==**

**----- Start of picture text -----**<br>
262 SERIES Horizontal and Vertical Mount Heat Sink TO-220<br>Height Above Maximum<br>Standard PC Board Footprint Thermal Performance at Typical Load<br>P/N in. (mm) in. (mm) Natural Convection Forced Convection<br>262-75ABE-05 .53 (13.4) .75 (19.1) x .50 (12.78) 80°C rise @ 2W 10°C/W @ 200LFM<br>262-75ABE-01 .75 (19.1) .53 (13.4) x .50 (12.7) 80°C rise @ 2W 10°C/W @ 200LFM<br>Material: Aluminum, Black Anodized<br>NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>MECHANICAL DIMENSIONS<br>Ld AIR VELOCITY (LFM)<br>oaLith] 0 200 400 600 800 1000<br>100 PEREEe TT 10<br>or asiuax 80 LLP NLLY 8<br>7] =0 92or 8e s)1 r ”m n 60 aLLINaSsee e rs 6<br>| 40 Loepa 4<br>20 ee a 2<br>7. 0 Se 0<br>05113) 16 [4.1] ~ —_sonen 0 a    1200     2400     3600    4800    51000<br>SUGGESTED TAB HOLE HEAT DISSIPATED (WATTS)<br>)AMBIENT (C<br>ABOVE AMBIENT AIR (C)<br>HEAT SINK TEMPERATURE RISE  THERMAL RESISTANCE SINK TO<br>**----- End of picture text -----**<br>


**25** 

`WTS001_p26-49  6/14/07  10:55 AM  Page 26` 

## **Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 233 & 236 SERIES Self-Locking Wavesolderable Heat Sinks** 

||||**233 & 236 SERIES**|**233 & 236 SERIES**||**Self-Locking Wavesolderable Heat Sinks**|**Self-Locking Wavesolderable Heat Sinks**|**Self-Locking Wavesolderable Heat Sinks**|**Self-Locking Wavesolderable Heat Sinks**||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||**233 & 236 SERIES**|**233 & 236 SERIES**||**Self-Locking Wavesolderable Heat Sinks**|**Self-Locking Wavesolderable Heat Sinks**|**Self-Locking Wavesolderable Heat Sinks**|**Self-Locking Wavesolderable Heat Sinks**|||TO-220|
|||||**Height Above**|||**Footprint**||||**Thermal Performance at Typical Load**||
|i|a||**Standard**<br>**P/N**|**PC Board**<br>**in.(mm)**|||**Dimensions**<br>**in.(mm)**|**Mounting**<br>**Configuration**|**Solderable**<br>**Tab Options**|**Mounting**<br>**Style**|**Natural**<br>**Convection**|**Forced**<br>**Convection**|
||||233-60AB|.600 (15.2)|||.570 (14.5) x .500 (12.7)|Vert./Horiz.|No Tab|Clip/Mtg Hole|58°C @ 2W|11.0°C/W @ 400 LFM|
||||233-60ABE-01|.600 (15.2)|||.570 (14.5) x .500 (12.7)|Vertical|01|Clip/Mtg Hole|58°C @ 2W|11.0°C/W @ 400 LFM|
||||233-60ABE-05|.500 (12.7)|||.600 (15.2) x .570 (14.5)|Horizontal|05|Clip/Mtg Hole|58°C @ 2W|11.0°C/W @ 400 LFM|
|PATENT PENDING|PATENT PENDING||233-60ABE-10|.725 (18.4)|||.570 (14.5) x .500 (12.7)|Vertical|10|Clip/Mtg Hole|58°C @ 2W|11.0°C/W @ 400 LFM|
||||236-150AB|1.500 (38.1)|||.570 (14.5) x .500 (12.7)|Vert./Horiz|No Tab|Clip/Mtg Hole|40°C @ 2W|4.80°C/W @ 400 LFM|
||||236-150ABE-01|1.500 (38.1)|||.570 (14.5) x .500 (12.7)|Vertical|01|Clip/Mtg Hole|40°C @ 2W|4.80°C/W @ 400 LFM|
||||236-150ABE-05|.500 (12.7)||1.500 (38.1) x .570 (14.5)||Horizontal|05|Clip/Mtg Hole|40°C @ 2W|4.80°C/W @ 400 LFM|
||||236-150ABE-10|1.625 (41.3)|||.570(14.5)x .570(12.7)|Vetrical|10|Clip/MtgHole|40°C @ 2W|4.80°C/W @ 400 LFM|
||||Material: Aluminum, Black Anodized||||||||||



|**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**|
|---|



## **MECHANICAL DIMENSIONS 233 AND 236 SERIES** 

**==> picture [357 x 87] intentionally omitted <==**

**----- Start of picture text -----**<br>
t —>} 233-60AB-01 | | | (0.8)032 TAB 01, 233-60AB-10  020(0.5) TAB 10 f 1 050032<br>— 1.500 236-150AB-01 236-150AB-10 (1.3) (0.8)<br>(38.1) Ww A APA (4.2)165 —»| :<br>S70MAX | i<br>(14.5} ry 250 125 »| SOOMIN |g 233-60AB-05<br>236-150AB-05<br>a—_—t (12.7)Sco TYP (64) (3.2)| | (12.7)<br>: (15.2ite 236-150AB Lt‘ —_—— —_ a =<br>(| | ) a ; a° 233-60ABSERIES NUMBER | LENGTH“A’600 (15.2)<br>233-60AB Dimensions: in. (mm) (13)80__p{/. #068(1.5) | } 236-150AB +500 (38.1)<br>**----- End of picture text -----**<br>


PATENT 5381041 

## **Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks** 

## **275 & 231 SERIES** 

||**275 & 231 SERIES**|**275 & 231 SERIES**||**Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks**|**Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks**|**Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks**|**Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks**|**Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks**||TO-220|
|---|---|---|---|---|---|---|---|---|---|---|
|||**Height Above**|||**Footprint**|||**Thermal Performance at Typical Load**|||
|**Standard**|||**PC Board**||**Dimensions**|**Mounting**|**Solderable**|**Mounting**|**Natural**|**Forced**|
|**P/N**<br>~~ne~~||~~ne~~|**in.(mm)**<br>~~ne~~||**in.(mm)**<br>~~ne~~|**Configuration**<br>~~ne~~|**Tab Options**<br>~~ne~~|**Style**<br>~~ne~~|**Convection**<br>~~ne~~|**Convection**<br>~~ne~~|
|275-75AB|||.750 (19.1)||.835 (21.2) x .400 (12.7)|Vert./Horiz.|No Tab|Clip/Mtg Hole|44 C @ 2W|7.9°C/W @ 400 LFM|
|275-75ABE-01|||.750 (19.1)||.835 (21.2) x .400 (12.7)|Vertical|01|Clip/Mtg Hole|44°C @ 2W|7.9°C/W @ 400 LFM|
|275-75ABE-10|||.875 (12.7)||.835 (21.2) x .400 (14.5)|Vertical|10|Clip/Mtg Hole|44°C @ 2W|7.9°C/W @ 400 LFM|
|231-69PAB|||.690 (18.4)||.835 (21.2) x .400 (12.7)|Vert./Horiz.|No Tab|Clip/Mtg Hole|45°C @ 2W|8°C/W @ 400 LFM|
|231-69PABE|||.400 (10.1)||.690 (17.5) x .835 (12.7)|Horizontal|13H|Clip/Mtg Hole|45°C @ 2W|8°C/W @ 400 LFM|
|231-69PABE-XXX|||.690 (17.5)||.835 (21.2) x .400 (12.7)|Vertical|13V, 14V, 15V|Clip/Mtg Hole|45°C @ 2W|8°C/W @ 400 LFM|
|231-75PAB|||.750 (19.1)||.835 (21.2) x .400 (14.5)|Vert./Horiz.|No Tab|Clip/Mtg Hole|43°C @ 2W|7.9°C/W @ 400 LFM|
|231-75PABE|||.400 (10.1)||.750 (19.1) x .835 (12.7)|Horizontal|13H|Clip/Mtg Hole|43°C @ 2W|7.9°C/W @ 400 LFM|
|231-75PABE-XXX|||.750 (19.1)||.835 (21.2) x .400 (12.7)|Vertical|13V, 14V, 15V|Clip/Mtg Hole|43°C @ 2W|7.9°C/W @ 400 LFM|
|231-137PAB|||1.375 (35)||.835 (21.2 x .400 (12.7)|Vert./Horiz.|No Tab|Clip/Mtg Hole|32°C @ 2W|5.9°C/W @ 400 LFM|
|231-137PABE|||.400 (10.2)||1.375 (34.9) x .835 (12.7)|Horizontal|13H|Clip/Mtg Hole|32°C @ 2W|5.9°C/W @ 400 LFM|
|231-137PABE-XXX|||1.375(35)||.835(21.2)x .400(12.7)|Vertical|13V,14V,15V|Clip/MtgHole|32°C @ 2W|5.9°C/W @ 400 LFM|



Material: Aluminum, Pre-anodized Black (PAB), Anodized Black (AB) 

**==> picture [487 x 172] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL Dimple on 231-69, 275-75 Series only availableDimple not 275 AND 231 SERIES CONVECTION CHARACTERISTICSNATURAL AND FORCED<br>DIMENSIONS “7 IN Fah Lance not 278-75 Serieson — 855 AIR VELOCITY (LFM)<br>one‘a| a[oTre| enx|Sta‘I antavalable2723175 Series 89- iLiyTT) — ( TAB 13H ay. | —_025020SERIESSERIES275231 (0.5)(0.6) {VERTICAL@ FORSUGGESTED ANDTABSALL HORIZONTAL MOUNTING}=PART13V,21.7)TAB14V,NUMBERS HOLES 15V & <xWE42zo2scSS2oc 10080 rT:j,0 N\200Sp -75PAB!73ten—>aeaA;<br>—_ i 0.150 | 020 (0.5) | ass3 (0.5) @.075 (1.9) (PLATED)WITH .100 (2.5) PAD 2>Su 40bs Se eaeae<br>All versions No Tab ‘ VERTICAL MOUNT HORIZONTAL MOUNT wae =< ;LA |<br>400 REF Nene *2 *o 1 2 3 4<br>TAB14V 3 75125% TAB13V | 1102) \~| ves3B pertaoe ( ae ry—aeyCeYo]—ae =—nL_-4|e}OTfe h—oy 84125 POWER NATURAL AND FORCED   DISSIPATION (WATTS)<br>CONVECTION CHARACTERISTICS<br>a 63 & ‘ i LI (it = 44<br>} 4 ee a 1 ea 375 082 (TAB01) AIR VELOCITY (LFM)<br>U 375 ; 4 3 —+/-00a) w jop0 200 4006008001000)<br>a 062 REF es) f 062 REF age TAB 01 t 063063__,. TAB 10 i" 020 m8 (TABI Gers a i lodiad<br>— 125 (3.2) as aes +<br>185 | 8) 03} le Be mp |<br>TAB 15V + SUGGESTED<br>82)128 890 (17.5) | 345 (88) 2.075 (1 (PLATED)TAS HOLE= ye Wp>2 Seraetie—<br>TAB 13H<br>**----- End of picture text -----**<br>


**==> picture [45 x 17] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL<br>DIMENSIONS<br>**----- End of picture text -----**<br>


**Dimensions: in. (mm)** 

**26** 

`WTS001_p26-49  6/14/07  10:55 AM  Page 27` 

**Board Level Heat Sinks** 

## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS** 

**235 SERIES Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks** TO-220 **Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection** 235-85AB .850 (21.6) 1.000 (25.4) x .500 (12.7) Vert./Horiz. No Tab Clip/Mtg Hole 40°C @ 2W 6.8°C/W @ 400 LFM 235-85ABE-01 .850 (21.6) 1.000 (25.4) x .500 (12.7) Vertical 01 Clip/Mtg Hole 40°C @ 2W 6.8°C/W @ 400 LFM 235-85ABE-05 .500 (12.7) .850 (21.6) x 1.000 (25.4) Horizontal 05 Clip/Mtg Hole 40°C @ 2W 6.8°C/W @ 400 LFM PATENT 5381041 235-85ABE-10 .975 (24.8) 1.000 (25.4) x .500 (12.7) Vertical 10 Clip/Mtg Hole 40°C @ 2W 6.8°C/W @ 400 LFM Material: Aluminum, Black Anodized “oan| k- -—- (25.4)1.00 « **235-85AB MECHANICAL DIMENSIONS 235 SERIES CONVECTION CHARACTERISTICSNATURAL AND FORCED** 7 AIR VELOCITY (LFM) } wrs ‘002 200 = 400~——«600 800 1000.) Poet by (21.6) uw popeo)sy 880 Boel)|__| i) —} &| |eePecoe eSEegt 9FS,| L z5Be a aS) SoS Lt ee Lr saa | |? ge Py. CS ve ett a \ | (64)250 r fies)375 082 (TAROT) SwFS ofea(ott ||ft[Pt] Ps}|) &o3s **235-85AB-05** ali 063 __, ree60(4.1) 3} **235-85AB-01** (1.5) ole **235-85AB-10** 1 ela‘} 020 (TAB10)o5) TZWu OF 1 2 3 4 504@ i ' “= POWER DISSIPATION (WATTS) ai£050=| | |_127)500 MIN 08)"tasoari 165 **Dimensions: in. (mm)** ge CSRS0078WITH 0.100(1 PLEO (2 5) (PAD) 

**==> picture [49 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
243 SERIES<br>**----- End of picture text -----**<br>


## **Labor-Saving Clip-On Heat Sinks** 

**==> picture [22 x 7] intentionally omitted <==**

**----- Start of picture text -----**<br>
TO-220<br>**----- End of picture text -----**<br>


**Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Mounting Natural Forced P/N in. (mm) in. (mm) Configuration Tab Options Style Convection Convection** 243-1PAB 1.000 (25.4) .800 (20.3) x .270 (6.9) Vert./Horiz. No Tab Clip 50°C@ 2W 4.5°C/W @ 400 LFM 243-3PAB .800 (20.3) .800 (20.3) x .270 (6.9) Verl./Horiz. No Tab Clip 78°C@ 2W 8.2°C/W @ 400 LFM Material: Aluminum, Pre-anodized Black **MECHANICAL DIMENSIONS** a7)068 sy **CONVECTION CHARACTERISTICSNATURAL AND FORCED NATURAL AND FORCED** 800 ' **243 SERIES** > O AIR VELOCITY (LFM) 

**==> picture [233 x 59] intentionally omitted <==**

**----- Start of picture text -----**<br>
CONVECTION CHARACTERISTICSNATURAL AND FORCED NATURAL AND FORCED<br>> O 5 AIR VELOCITY (LFM)<br>‘, rs)ee 0 200 400 600 800<br>& ce<br>SECTION A-A : VIEW B-B gepe 0 {fesseAe| ots me<br>**----- End of picture text -----**<br>


**==> picture [68 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


## **Snap-Down Self-Locking Heat Sinks** 

**==> picture [49 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
239 SERIES<br>**----- End of picture text -----**<br>


|||||**Snap-Down Self-Locking Heat Sinks**<br>**239 SERIES**|**Snap-Down Self-Locking Heat Sinks**|||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
|||||**Snap-Down Self-Locking Heat Sinks**<br>**239 SERIES**|**Snap-Down Self-Locking Heat Sinks**||||||TO-220|
|||||**Height Above**<br>**Footprint**|||||||**Thermal Performance at Typical Load**|
|||||**Standard**<br>**PC Board**<br>**Dimensions**|**Mounting**||**Solderable**||**Mounting**||**Natural**<br>**Forced**|
|||||**P/N**<br>**in.(mm)**<br>**in.(mm)**|**Configuration**||**Tab Options**||**Style**||**Convection**<br>**Convection**|
|||||239-75AB<br>.750 (19.1)<br>1.120 (28.4) x .435 (11.0)|Vert./Horiz||No Tab||Clip/Mtg Hole|Clip/Mtg Hole|38°C @ 2W<br>6°C/W @ 400 LFM|
|||||239-75ABE-03<br>.750 (19.1)<br>1.120 (28.4) x .435 (11.0)|Vertical||03||Clip/Mtg Hole|Clip/Mtg Hole|38°C @ 2W<br>6°C/W @ 400 LFM|
|||||239-75ABE-04<br>.750(19.1)<br>1.120(28.4)x .435(11.0)|Vertical||04||Clip/MtgHole|Hole|38°C @ 2W<br>6°C/W @ 400 LFM|
|PATENT PENDING||||Material: Aluminum, Black Anodized||||||||
|**Dimensions: in. (mm)**<br>**MECHANICAL DIMENSIONS**<br>**SECTION A-A**<br>**239-75AB**<br>ve<br>4<br>0.150<br>|<br>-—<br>|<br>11,1)<br>on<br>O~~t~~<br>mr | |<br>438<br>o<br>730<br>An)<br>Y<br>(19.1)bd]<br>U<br>amy<br>||<br>4<br>|<br>=<br>gy<br>Of<br>pms<br>7)<br>— fag<br>49<br>(223)<br>(7.0)<br>(284)<br>**®** SUGGESTED<br>TABHOLE=<br>075 {1.9} (PLATED)<br>WITH 940025) (PAD)|||||**239 SERIES**<br>**239-75AB-03**<br>**239-75AB-04**<br>435,<br>0.150<br>~~<br><—<br>(11.1)<br>|<br>G8)<br>lV<br>nial<br>v1<br>lee<br>Ht<br>Tf<br>|ea @5)<br>|<br>yo<br>“ee<br>,<br>020<br>~~m~~yF eih= <br>|<br>02 |<br>(16)<br>||||||**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>AIR VELOCITY (LFM)<br>o<br>60080010004)<br>ro)<br>0<br>200<br>400<br>20<br>F&F<br>=<<br>100<br>3 of EEEEE 8<br>a**e** al<br>II ey”#8<br>g<br>[4 ge<br>Z<br>[oe,<br>BE<br>Ha | |<br>|<br>|<br>[<br>| | [4<br>2BS<br>a<br>PZ gots<br>eere, &2<br>sy“PSs<br>22<br> gs eee, &<br>20<br>e<br>ge OC<br>er<br>t<br>au jetrrr)fo, "2<br>Te<br>"5<br>1<br>2<br>3<br>4<br>5<br>POWERDISSIPATION(WATTS)||



**27** 

`WTS001_p26-49  6/14/07  10:55 AM  Page 28` 

## **Board Level Heat Sinks** 

## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS** 

**==> picture [161 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
265 SERIES Vertical Mount Heat Sink<br>**----- End of picture text -----**<br>


**==> picture [485 x 575] intentionally omitted <==**

**----- Start of picture text -----**<br>
TO-220<br>Height Above Maximum<br>Standard PC Board Footprint Thermal Performance at Typical Load<br>P/N in. (mm) in. (mm) Natural Convection Forced Convection<br>265-118ABHE-22 1.18 (30.0) 1.00 (25.4) x .50 (12.7) 56°C rise @ 4W 7.0°C/W @ 200LFM<br>Material: Aluminum, Black Anodized<br>NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>1.00 [25 . 4] 50 [12.7]<br>AIR VELOCITY (LFM)<br>i .05 [1.3] 0 200 400 600 800 1000<br>| 0.125 (B3.18] ian 100 10<br>_ | JT | | [| TT | J ET<br>= 80 | [| | | [| [| | JT | | 8<br>70117 8 ) = 1.18 [30.0] 60 || | | | [oe] | tT 6<br>| ral oa t | | TNX, Paw Ty tT<br>iv a pom 40 LL || |riBertT TTT[| |)| [ 4<br>Z 0 8 [2 . 03] SEE DETAILA 4 20 || [|P7TtoptTTHetT fT tTtT fTTt TttT 2<br>9 8 [24.1] P| | | [| [ | fT fT fT]<br>L1 40  10 . 2 0 r | | | {| [ | | {[ { | 0<br>0    2200     4400     6600     8800    110 0 0<br>_ TAB HOLES © DETAIL A<br>L 96  o a .) HEAT DISSIPATED (WATTS)<br>286DB SERIES Vertical Mount Heat Sink TO-220<br>> Height Above Maximum<br>Standard PC Board Footprint Thermal Performance at Typical Load<br>P/N in. (mm) in. (mm) Natural Convection Forced Convection<br><4 eee<br>286DBE .95 (24.1) 1.00 (25.4) x .50 (12.7) 65°C rise @ 4W 9.0°C/W @ 200LFM<br>Material: Aluminum, Black Anodized<br>NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>1.00 [25.4]<br>AIR VELOCITY (LFM)<br>0 200 400 600 800 1000<br>150 [3.8] rT $00 [12.7]<br>{ 100 | | | | | fT | [ Eq | 10<br>80 8<br>tT Pf ft ft ft tort ty<br>0 81 [2.1] 3x | [ ke | [ [ere tT ft ff<br> [9.5] 70 [17.8] 60 Pf PT NA ear fe 6<br>i 40 ee ee ee ee 4<br>200 [5.1] eeeeeee ee eee<br>{| 0 50 11 . 3] 20 | [vty [ [| | T fT T 2<br>“1 0 1001 25 100 ( 25 ) | f | [| fT tT | tT tT yf<br>[2.5] oe 0 | | [| | [ [ | T— J T | 0<br>500 [12 . 7] 5 00 [12 . 7] 0    2200     4400     6600     8800    101000<br>. 050 [1 . 3] HEAT DISSIPATED (WATTS)<br>)AMBIENT (C<br>ABOVE AMBIENT AIR (C)<br>HEAT SINK TEMPERATURE RISE  THERMAL RESISTANCE SINK TO<br>AMBIENT (C)<br>ABOVE AMBIENT AIR (C)<br>HEAT SINK TEMPERATURE RISE  THERMAL RESISTANCE SINK TO<br>**----- End of picture text -----**<br>


## **MECHANICAL DIMENSIONS** 

## **MECHANICAL DIMENSIONS** 

**28** 

`WTS001_p26-49  6/14/07  10:55 AM  Page 29` 

## **Board Level Heat Sinks** 

## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS** 

**==> picture [255 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
273 SERIES Low-Cost, Low-Height Wavesolderable Heat Sinks<br>**----- End of picture text -----**<br>


|||||||||||||||||||||||**273 SERIES**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||||||||||||||||||||**273 SERIES**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|**Low-Cost, Low-Height Wavesolderable Heat Sinks**|||||TO-218, TO-220|
|||||||||||||||||||||||**Height Above**||||||**Footprint**|||||||||||||||||**Thermal Performance at Typical Load**|
|||||||||||||||||||||||**Standard**|**PC Board**|||||**Dimensions**|||||**Mounting**|||||||**Solderable**||||**Mounting**|**Natural**<br>**Forced**|
|||||||||||||||||||||||**P/N**|**in.(mm)**|||||**in.(mm)**||**Configuration**||||||||||**Tab Options**||||**Style**|**Convection**<br>**Convection**|
|||||||||||||||||||||||273-AB|.375 (9.5)|||||.750 (19.1) x .750 (19.1)|.750 (19.1) x .750 (19.1)||||Vert./Horiz.|||||||No Tab||||Mtg Hole|49°C @ 2W<br>7.2°C/W @ 400 LFM|
|||||||||||||||||||||||273-ABE-01|.375 (9.5)|||||.750 (19.1) x .750 (19.1)|||||Vertical|||||||01||||Mtg Hole|49°C @ 2W<br>7.2°C/W @ 400 LFM|
|||||||||||||||||||||||273-ABE-02|.375(9.5)|||||.750(19.1)x .750(19.1)|||||Vertical|||||||02||||MtgHole|49°C @ 2W<br>7.2°C/W @ 400 LFM|
|||||||||||||||||||||||Material: Aluminum, Black Anodized||||||||||||||||||||||||
||**MECHANICAL DIMENSIONS**<br>aa}DIATHR<br>050<br>—____<br>~<br>—<br>q<br>0<br>;<br>(1.3)<br>\<br>1<br>i ot<br>H<br>0<br>5<br>—_A||||||||||||||||||||||||||**273 SERIES**<br>TE)<br>en<br>?<br>250<br>oot<br>Ob<br>@y Cae<br>oa||||||Ges<br>_<br>of|0<br>Co|||||a<br>375<br>8<br>4|||||**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>AIRVELOCITY(LFM)<br>—_~<br>wO<br>ypp0__200<br>4006008001000<br>z 100<br>oF<br>er<br>of.7].<br>Le<br>ls we<br>et<br>aft<br>tT<br>art<br>is 28||
||**273-AB**<br>+d|||||||||||Dy||||||||||4<br>:<br>7|oo||ilo:<br>jj<br>Y=<br>oe<br>—|le-<br>b||||||||i<br>i<br>bo<br>050<br>u||||||~<br>1)<br>eee<br>4<br>[+8|||||aw<br>60<br>IN SERIES273 AB|}<br>12 nS<br>22<br>el<br>IN,Perry 8g<br>BLNee,<br>Sa<br>xu %<br><=<br>8 2s||
|||||||Note:<br>1. Suggested|||Tab|||Hole|||=|||&<br> 0.075 (1.9) (Plated) with @.100 (2.5) pad||||||||||**Dimensions: in. (mm)**<br>**273-AB-01**<br>.|||||||**273-AB-02**|||||||||DD<br>LA<br>—<br>4<br>£O<br>ee igLa >TP<br>rr) Be<br><< 19144<br>2 r<br>ou<br>SZ<br>TTP PTT<br>ry, &s<br>x<br>0<br>05<br>10<br>15<br>20<br>2530<br>35<br>40<br>45<br>50<br>a<br>POWER DISSIPATION (WATTS)||
|||||||||||||||||||||||||||||||||||||||||||||||
|||||||||||||||||||||||||||||||||||||||||||||||
|||||||||||||||||||||||**274 & 281 SERIES**||||||**Low-Cost, Low-Height Wavesolderable Heat Sinks**||||**Low-Cost, Low-Height Wavesolderable Heat Sinks**|||||||||||||TO-220|
|||||||||||||||||||||||**Height Above**||||||**Footprint**|||||||||||||||||**Thermal Performance at Typical Load**|
|||||||||||||||||||||||**Standard**|**PC Board**|||||**Dimensions**|||||**Mounting**|||||||**Solderable**||||**Mounting**|**Natural**<br>**Forced**|
|||||||||||||||||||||||**P/N**|**in.(mm)**|||||**in.(mm)**||**Configuration**||||||||||**Tab Options**||||**Style**|**Convection**<br>**Convection**|
|||||||||||||||||||||||274-1AB|.375 (9.5)|||||.520 (13.2) x .750 (19.1)|||||Vert./Horiz.|||||||No Tab||||Mtg Hole|56°C @ 2W<br>8.0°C/W @ 400 LFM|
|||||||||||||||||||||||274-1ABE-01|.375 (9.5)|||||.520 (13.2) x .750 (19.1)|||||Vertical|||||||01||||Mtg Hole|56°C @ 2W<br>8.0°C/W @ 400 LFM|
|||||||||||||||||||||||274-1ABE-02|.375 (9.5)|||||.520 (13.2) x .750 (19.1)|||||Vertical|||||||02||||Mtg Hole|56°C @ 2W<br>8.0°C/W @ 400 LFM|
|||||||||||||||||||||||274-2AB|.500 (12.7)|||||.520 (13.2) x .750 (19.1)|||||Vert./Horiz.|||||||No Tab||||Mtg Hole|50°C @ 2W<br>7.0°C/W @ 400 LFM|
|Material: Aluminum,<br>Black Anodized||||||||||||||||||||||274-2ABE-01<br>274-2ABE-02<br>274-3AB|.500 (12.7)<br>.500 (12.7)<br>.250 (6.4)|||||.520 (13.2) x .750 (19.1)<br>.520 (13.2) x .750 (19.1)<br>.520 (13.2) x .750 (19.1)|||||Vertical<br>Vertical<br>Vert./Horiz.|||||||01<br>02<br>No Tab||||Mtg Hole<br>Mtg Hole<br>Mtg Hole|50°C @ 2W<br>7.0°C/W @ 400 LFM<br>50°C @ 2W<br>7.0°C/W @ 400 LFM<br>62°C @ 2W<br>9.0°C/W @ 400 LFM|
|||||||||||||||||||||||274-3ABE-01|.250 (6.4)|||||.520 (13.2) x .750 (19.1)|||||Vertical|||||||01||||Mtg Hole|62°C @ 2W<br>9.0°C/W @ 400 LFM|
|||||||||||||||||||||||274-3ABE-02|.250 (6.4)|||||.520 (13.2) x .750 (19.1)|||||Vertical|||||||02||||Mtg Hole|62°C @ 2W<br>9.0°C/W @ 400 LFM|
|||||||||||||||||||||||281-1AB|.375 (9.5)|||||.520 (13.2) x .750 (19.1)|||||Vertical|||||||No Tab||||Mtg Hole|56°C @ 2W<br>8.0°C/W @ 400 LFM|
|||||||||||||||||||||||281-2AB|.500(12.7)|||||.520(13.2)x .750(19.1)|||||Vertical|||||||No Tab||||MtgHole|50°C @ 2W<br>7.0°C/W @ 400 LFM|
|||||||||||||||||||||||||||||||||||||||||||||||
||—| 0.520<br>|<br>(13.2)<br>ia<br>(19.1)<br>te<br>—-|<br>|<br>0050<br>+<br>9) <br>——<br>7<br>¥<br>(18.1)<br>Be<br>| 139<br>= Fo|||||||||**MECHANICAL DIMENSIONS**<br>**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>**274-XAB-01**<br>**274-XAB-02**<br>**274 SERIES**<br>**Dimensions: in. (mm)**<br>**274 SERIES**<br>**281 SERIES**<br>0.150<br>(3.8) OIA THRU<br>AIRVELOCITY(LFM)<br>!<br>!<br>:<br>i<br>we jog<br>9—_200__<br>400<br>800800100044<br>inal<br>Lal<br>eo OT<br>eT<br>dis ws<br>(19.1)<br>on<br>_<br>Js<br>—<br>es<br>Za<br>|_|<br>°<br>|<br>i_¥<br>250<br>ae<br>BEL NN eepemem) Be<br>4<br>(9.5)<br>a=<br>60<br>a<br>2G<br> 0.150<br>Ww<br>a<br>b__ 64)<br>gg<br>_.<br>ae "CISEE<br>TT<br>o Be<br>(aa) DIATHRU<br>(13)et _.||—t<br>(13)"11oge yt<br>Fe<br>yy[ete<br>tee 22<br>-<br>0.8)<br>Ww<br>4<br>es<br>6<br>q<br>{<br>08)<br>e)<br>55 »|<br>4 >t<br>| mett dy zo<br>ze “Tae, ee<br> tga<br>ZY~— 0.075 (1.9) (plated)0.100(28)pad<br>wu<br>o»ATT TT ti<br>| tt do<br>Z<br>(3.8) x (10.7)<br>ee<br>PCB recommended hole/pad size<br>x<br>0<br>05 10 15 20 25 30 35 40 45 50<br>e<br>POWER DISSIPATION<br>(WATTS:||||||||||||||||||||||||||||||||||||
|||||||||||||||||||||||||||||||||||||||||||||||
|||||||||||||||||||||||||||||||||||||||||||||||
|||||||||||||||||||||||**240 SERIES**|**Labor-Saving Twisted Fin Heat Sinks**||||||||||||||||||||||TO-220|
||||||||||||||||||||||||**Height Above**|||||**Footprint**|||||||||||||||||**Thermal Performance at Typical Load**|
|||||||||||||||||||||||**Standard**|**PC Board**|||||**Dimensions**|||||**Mounting**|||||||**Solderable**||||**Mounting**|**Natural**<br>**Forced**|
|||||||||||||||||||||||**P/N**|**in.(mm)**|||||**in.(mm)**|||||**Configuration**|||||||**Tab Options**||||**Style**|**Convection**<br>**Convection**|
|||||||||||||||||||||||240-118ABEH-22|1.180 (30.0)|||||1.000 (25.4) x .500 (12.7)|||||Vertical|||||||22||Clip/Mtg Hole<br>55°C @ 4W<br>5.3°C/W @ 400 LFM||||
|||||||||||||||||||||||240-118ABES-22|1.180(30.0)|||||1.000(25.4)x .500(12.7)|||||Vertical|||||||22|||Clip/MtgSlot<br>55°C @ 4W<br>5.3°C/W @ 400 LFM|||
|||||||||||||||||||||||Material: Aluminum, Black Anodized||||||||||||||||||||||||
||||—|<br>|<br>-—;<br>i|||||1,000<br>tesa)|||||7 <br>4|bw<br>|<br>9.125<br> 2)||||||||**MECHANICAL DIMENSIONS**<br>375<br>gare]<br>88)<br>{urd<br>Q<br>iy<br>js||||| <br>J|**240 SERIES**<br>500<br> 127)<br>DETAILA|||2x 070—<br>2x.060.<br>j<br>(18) 4<br>(5) <br>300<br>7|||||——<br>|||||=(rs)1h||||~|**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>AIRVELOCITY(LFM)<br>=|
|||**240-118ABH-22**<br>**240-118ABS-22**<br>**Dimensions: in. (mm)**<br>(30.0)<br>hs<br>-9—<br>JG<br>R<br>70 Ka | pd<br>N<br>Ve<br>\<br>ere PTA<br>h<br>qt<br>078)<br>an<br>i<br>ss<br>+<br>t<br>V\t<br>032<br>2PL-—|<br>(08)<br>|al_2n0<br>85<br>159<br>ay “ors<br>560<br>avs<br>(142)<br>9)<br>le 950<br>(24.1)||||||||||||||||||||||||||DETALA |<br>v4<br>a<br>ll<br>F<br>i099<br>(10.2)<br>rf<br>an”<br>SPRING STEEL<br>Order||Order|'<br>Order||e100 PLATED<br>es)<br>285SC 10#<br>OrderSpeedClips™|SpeedClips™|SpeedClips™|SpeedClips™|SL so<br>(241)<br>STAINLESSSTEEL 330SC4#<br>SpeedClips™Separately|||||||Sc<br>og<br>Ez of...) |i), 22<br>eR<br>ge<br>fe g<br>DIS CEPTCLI, @e<br>ae<br>LTSe<br>8s<br>Fz<br>gi<br>DIDISSE, Se<br>ge Se<br>ee<br>ge<br>53<br>oft<br>ttt try tT, €6<br>ee “Py<br>oe<br>gy<br>CPT Prrrrt), =<br>In<br>0<br>a<br>iva<br>0<br>2<br>4<br>6<br>8<br>10<br>POWER DISSIPATION (WATTS)||



**29** 

`WTS001_p26-49  6/14/07  10:55 AM  Page 30` 

## **Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS** 

||||||||||**Low-Height, Low-Profile Twisted Fin Heat Sinks**<br>**242 SERIES**|**Low-Height, Low-Profile Twisted Fin Heat Sinks**<br>**242 SERIES**|**Low-Height, Low-Profile Twisted Fin Heat Sinks**<br>**242 SERIES**|**Low-Height, Low-Profile Twisted Fin Heat Sinks**<br>**242 SERIES**|**Low-Height, Low-Profile Twisted Fin Heat Sinks**<br>**242 SERIES**|**Low-Height, Low-Profile Twisted Fin Heat Sinks**<br>**242 SERIES**|**Low-Height, Low-Profile Twisted Fin Heat Sinks**<br>**242 SERIES**|**Low-Height, Low-Profile Twisted Fin Heat Sinks**<br>**242 SERIES**|**Low-Height, Low-Profile Twisted Fin Heat Sinks**<br>**242 SERIES**|**Low-Height, Low-Profile Twisted Fin Heat Sinks**<br>**242 SERIES**||||||TO-220|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||||||||**Height Above**||**Footprint**||||||||||||**Thermal Performance at Typical Load**|
||||||||||**Standard**|**PC Board**||**Dimensions**|**Mounting**|||**Solderable**|||||**Mounting**<br>**Natural**<br>**Forced**||||
||||||||||**P/N**|**in.(mm)**||**in.(mm)**|**Configuration **|||**Tab Options**||||||||**Style**<br>**Convection**<br>**Convection**|
||||||||||242-125ABE-22|1.285(32.6)||.875(22.2)x .250(6.4)|Vertical|||||22||||MtgHole<br>48°C @ 2W<br>6.2°C/W @ 400 LFM|||
||||||||||Material: Aluminum, Black Anodized||||||||||||||||
||||||||||||||||||||||||||
||ane)—|<br>NE<br>|<br>10|||||—|<br>NM<br>i<br>a|FLAT||**242-125AB-22**<br> bo<br>esas<br>3.2)<br>L4}<br>PA<br>aN|**MECHANICAL DIMENSIONS**<br>PC.BOARD MTG. SUR-<br>ROM|||**242 SERIES**|||||||||||**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>AIRVELOCITY(LFM)<br>ey<br>~<br>we rpQ_ 200<br>4006908100099|
|||||T PTR<br>m»<br>SL<br>2B<br>!<br>(i989)<br>G7]<br>mM<br>Fr]<br>__i<br>{<br>;<br>ibs<br>x075—et<br>2<br>(1.9)<br>Hea)<br>(0.8) —||—<br>875<br>PARTIALVIEW<br>I-——<br>222)——*|__ONLYNEARSIDEFINSSHOWN||||||||**Dimensions: in. (mm)**<br>(6.4)<br>yo<br>A<br>Uo<br>a<br>a<br>Lot||||(25)<br>- 100_<br>TABHOLES||||||||Pas so|<br>16 ras<br>a<br>hy Be<br>2a “[AE<br>[|<br>ag<br>F2<br>pf<br>[Set<br>><br>Pr],<br>Se<br>su“eS 82<br>GS 9/171<br>==], 26<br>Bu<br>of2<br>»<br>FZ<br>EO<br>1<br>2<br>3<br>4<br>5<br>a<br>POWER DISSIPATION (WATTS)|
||||||||||||||||||||||||||
||||||||||**232 & 238 SERIES**|**232 & 238 SERIES**||**Staggered Fin Heat Sinks for Vertical Mounting**||||||||||||TO-202, TO-220|
|||||||ay||||**Height Above**||**Footprint**||||||||||||**Thermal Performance at Typical Load**|
|||||||Mf|||**Standard**<br>**P/N**|**PC Board**<br>**in.(mm)**||**Dimensions**<br>**in.(mm)**|**Mounting**<br>**Configuration**|||||**Solderable**<br>**Tab Options**||||||**Mounting**<br>**Natural**<br>**Forced**<br>**Style**<br>**Convection**<br>**Convection**|
||||||||||232-200AB|2.000 (50.8)||1.380 (35.1) x .500 (12.7)|Vertical|||||2, Twisted|||||Clip/Mtg Hole<br>48°C @ 4W<br>3.3°C/W @ 400 LFM||
||||\||||||232-200ABE-23|2.000 (50.8)||1.380 (35.1) x .500 (12.7)|Vertical|||||2, Solderable|||||Clip/Mtg Hole<br>48°C @ 4W<br>3.3°C/W @ 400 LFM||
|Material: Aluminum,<br>Black Anodized|||||||||238-200AB<br>238-200ABE-23|2.000 (50.8)<br> 2.000(50.8)||1.380 (35.1) x .500 (12.7)<br>1.380(35.1)x .500(12.7)|Verlical<br>Verlical|||||2, Twisted<br>2,Solderable||||||Mtg Slot<br>48°C @ 4W<br>3.3°C/W @ 400 LFM<br>MtgSlot<br>48°C @ 4W<br>3.3°C/W @ 400 LFM|
|**Dimensions: in. (mm)**<br>**MECHANICAL DIMENSIONS**<br>**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>**232-200AB-23**<br>**238-200AB**<br>**238-200AB-23**<br>**232-200AB**<br>**238 SERIES**<br>**232 AND 238 SERIES**<br>126<br>32)"<br>+00<br>AIRVELOCITY(LFM)<br>CI<br>Ld sospL<br>t LI<br>Lt<br>L_uciase<br>|]<br>t L_Iueese |_]<br>Ian—<br>w y99__200___<br>4006006010004)<br>CO<br>T4834, CO<br>C1<br>C1<br>=<br>vy La<br>=<br>Be PT"<br>ag<br>way<br>><br>oa)<br>CI<br>=<br>i<br>i608) LJ<br>CI<br>ze ol<br>|is 25<br>oomEI<br>6<br>1<br>Co<br>[J] ,sera,<br>|<br>=<br>i<br>C)<br>PE gyRett rarer, De<br>M<br>[_}<br>I<br>375<br>c<br>]<br>Sa<br>NX<br>"|<br>2<br>lounting Ct<br>Oo — cy 1.000<br>LJ<br>UI Mounting<br>| (95) {_]<br>(}<br>i ra<br>C_] f<br>38<br>us ©eee<br>Hy, ow<br>0<br>720<br>(25.4)<br>y<br>jag)<br>700<br>(48)<br>x<br>See<br>Z<br>‘eg<br>|<br>a<br>7,<br>&<br>0a<br>|<br>a<br>E:<br>cl<br>en<br>+t<br>Uf<br>—_—<br>2g apt<br>ee<br>Be<br>e}<br>UY<br>WJ<br>4<br>[<br>on fe<br>‘yoo Ree<br>,<br>tow<br>i<br>Tag¢<br>109REE<br>7<br>|<br>fy Zt.tPrrtrr 4, #s<br>25)"<br>25)|<br>ay<br>(6)<br>r<br>0<br>2<br>4<br>6<br>6<br>1<br>OU<br>1.000<br>(5)<br>187<br>(11.2) 5099440.<br>050_,<br>F#——<br>©<br>—!<br>(25.4)<br>(48)<br>—"<br>(254)<br>(11.2)<br>(13)<br>t<br>POWERDISSIPATION (WATTS)<br>~ 1.000<br>150<br>(25.4)<br>68)<br>650 FLAT<br>TABHOLES<br>9.130 PLATED<br>Stainless<br>Spring<br>—>| (165) }~—<br>(3.3)<br>Steel<br>Steel<br>otREF—e—<br>330SC4#<br>285SC10<br>(08)<br>(AS<br>(oS<br>a<br>YY<br>.<br>TM<br>i. 1.380<br>><br>ye<br>1.000<br>SZ<br>OrderSpeedClips © Separately<br>(35.1)<br>(25.4)|||||||||||||||||||||||||
||||||||||||||||||||||||||
||||||||||||||||||||||||||
||||||||||**Slim-Profile Heat Sinks With Integral Clips**<br>**251 SERIES**||||**Slim-Profile Heat Sinks With Integral Clips**|||||||||||15 Lead Multiwatt|
|||||||||||**Height Above**||**Footprint**||||||||||||**Thermal Performance at Typical Load**|
||||||||||**Standard**|**PC Board**||**Dimensions**|**Mounting**|||||**Solderable**||||||**Mounting**<br>**Natural**<br>**Forced**|
||||||||||**P/N**|**in.(mm)**||**in.(mm)**|**Configuration**|||||**Tab Options**||||||**Style**<br>**Convection**<br>**Convection**|
||||||||||251-62AB|.620 (15.7)||.910 (23.1) x .380 (9.7)|Vert./Horiz.|||||No Tab||||||Clip<br>66°C @ 3W<br>66°C/W @ 400 LFM|
||||||||||251-80AB|.845 (21.5)||.910 (23.1) x .380 (9.7)|Vert./Horiz.|||||No Tab||||||Clip<br>64°C @ 3W<br>66°C/W @ 400 LFM|
||||||||||251-80ABE-19|.875(22.2)||.910(23.1)x .380(9.7)|Vertical|||||19||||||Clip<br>64°C @ 3W<br>66°C/W @ 400 LFM|
||||||||||Material: Aluminum, Black Anodized||||||||||||||||
|||**MECHANICAL DIMENSIONS**||||||||||**251 SERIES**||||||||||||**NATURAL AND FORCED**|
|||||||||||||||||||||||||**CONVECTION CHARACTERISTICS**|
|i)||||«<br>}||G|'||iH<br>620|ft<br>a||if]<br>||a}<br>q|||||||||||oO<br>~<br>wO 4999200400600<br>8001000|
|ca |<br>v0<br>le 910<br>(23.4)|||||||**251-62AB**<br>'<br>re<br>280<br>+ 3<br>(7)<br>2x.060<br>SuggestedTabHoles<br>(1.5) “I<br>0.075<br>(1.9) (Plated)<br>with<br>2.100(2.5)PAD|||**251-80AB**<br>a<br>u<br>a<br>(22.2)|‘|:<br>a)<br>b <br>{<br>}<br>y<br>150<br>(38)<br>1<br>inh<br>2x.170<br>(4.3)|**Dimensions: in. (mm)**<br>**251-80AB-19**<br>120<br>:<br>ane<br>251-6208| 4<br>g<br> Ed aban<br>6)<br>ge et [ans O<br>\<br>EU<br>gyENS2 Be<br>y<br>ae<br>bt Set ett<br>we<br>b=<br>of<br>| Sia<br>TTTl; 4a<br>t _.<br>“060 Hi<br>Sw<br>| pe Sel 2oreene i<br>32<br>oe |<br>(13) on<br>28<br>20Lt ee<br>a ao)<br>(08<br>F<br>&<br>4<br>eS<br>8<br>)<br>(8)<br>gy (Zo<br>EET Fs<br>(32)<br>xc<br>0<br>1<br>2<br>3<br>4<br>5<br>”<br>°<br>POWERDISSIPATION (WATTS)||||||||||||



**30** 

`WTS001_p26-49  6/14/07  10:55 AM  Page 31` 

**Board Level Heat Sinks** 

## **BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATT™ COMPONENTS** 

**244 SERIES Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks** MULTIWATT **Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams)** 244-145AB 1.450 (36.8) 1.300 (33.0) x 480 (12.1) Vert/Horiz, No Tab 44°C @ 4W 4.4°C/W @ 400 LFM .0160 (7.25) 244-145ABE-50 1.650 (41.9) 1.300 (33.0) x 480 (12.1) Vertical 50 44°C @ 4W 4.4°C/W @ 400 LFM .0170 (7.20) Material: Aluminum, Black Anodized **MECHANICAL DIMENSIONS** 1.30 48 

**Dimensions: in. (mm)** 

|**245 SERIES**|**Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks**|**Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks**|**Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks**|**Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks**|**Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks**|**Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks**|||MULTIWATT|
|---|---|---|---|---|---|---|---|---|---|
||**Height Above**|**Footprint**|||**Thermal Performance at Typical Load**|||||
|**Standard**|**PC Board**|**Dimensions**|**Mounting**|**Solderable**||**Natural**|**Forced**||**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Configuration**|**Tab Options**||**Convection**|**Convection**||**lbs.(grams)**|
|245-145AB|1.450 (36.8)|1.750 (44.5) x .380 (9.7)|Ver.t/Horiz.|No Tab||38°C @ 4W|3.2°C/W @ 400 LFM||.0160 (7.25)|
|245-145ABE-50|1.650(41.9)|1.750(44.5)x .380(9.7)|Vertical|50||38°C @ 4W|3.2°C/W @ 400 LFM||.0170(7.20)|
|Material: Aluminum, Black Anodized||||||||||



**==> picture [90 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS<br>**----- End of picture text -----**<br>


**Dimensions: in. (mm)** 

## **Medium Height, Slim Profile Wavesolderable Folded Fin Heat Sinks** 

**246 SERIES Medium Height, Slim Profile Wavesolderable Folded Fin Heat Sinks** MULTIWATT **Height Above Footprint Thermal Performance at Typical Load Standard PC Board Dimensions Mounting Solderable Natural Forced Weight P/N in. (mm) in. (mm) Configuration Tab Options Convection Convection lbs. (grams)** 246-197AB 1.968 (50.0) 1.986 (50.4) x 3.75 (9.5) Vert./Horiz. No Tab 35°C @ 4W 2.8°C/W @ 400 LFM .0240 (10.90) 246-197ABE-50 2.168 (55.1) 1.986 (50.4) x 3.75 (9.5) Vertical 50 35°C @ 4W 2.8°C/W @ 400 LFM .0250 (11.40) **Order SpeedClip™ 285SC or 330SC separately.** (See 248 Series section). Material: Aluminum, Black Anodized 

## **MECHANICAL DIMENSIONS** 

**==> picture [68 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


**31** 

`WTS001_p26-49  6/14/07  10:55 AM  Page 32` 

## **Board Level Heat Sinks** 

## **BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATT™ COMPONENTS** 

|||**Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks**<br>**247 SERIES**|**Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks**|**Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks**|**Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks**|||MULTIWATT|
|---|---|---|---|---|---|---|---|---|
|||**Height Above**<br>**Footprint**|||**Thermal Performance at Typical Load**||||
|J~~a~~|~~a~~|**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**Solderable**<br>**Natural**<br>**Forced**<br>**Weight**<br>**P/N**<br>**in.(mm)**<br>**in.(mm)**<br>**Configuration**<br>**Tab Options**<br>**Convection**<br>**Convection**<br>**lbs.(grams)**<br>~~a~~|||||||
|||247-195AB<br>1.950 (49.5)<br>1.900 (48.3) x .950 (24.1)|Vert./Horiz.|No Tab|25°C@ 4W|2.4°C/W @ 400 LFM||.0330 (15.10)|
|||247-195ABE-50<br>1.950(49.5)<br>1.900(48.3)x .950(24.1)|Vertical|50|25°C@ 4W|2.4°C/W @ 400 LFM||.0340(15.60)|
|||**Order SpeedClip™ 285SC or 330SC separately.**(See 248 Series section).|||||||
|||Material: Aluminum, Black Anodized|||||||



## **MECHANICAL DIMENSIONS** 

## **Dimensions: in. (mm)** 

## **Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks** 

## **248 SERIES** 

|**248 SERIES**|**248 SERIES**|**Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks**|**Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks**|**Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks**|**Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks**|**Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks**|**Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks**|**Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks**|||MULTIWATT|MULTIWATT|
|---|---|---|---|---|---|---|---|---|---|---|---|---|
||**Height Above**||**Footprint**||||**Thermal Performance at Typical Load**||||||
|**Standard**||**PC Board**|**Dimensions**|**Mounting**||**Solderable**||**Natural**|**Forced**||**Weight**||
|**P/N**||**in.(mm)**|**in.(mm)**|**Configuration**||**Tab Options**|**Convection**||**Convection**||**lbs.(grams)**||
|248-162AB||1.620 (41.1)|2.000 (50.8) x .750 (19.1)|Vert/Horiz.||No Tab|35°C @ 4W||2.5°C/W @ 400 LFM||.026 (11.60)||
|248-162ABE-50||1.620(41.1)|2.000(50.8)x .750(19.1)|Vertical||50|35°C @ 4W||2.5°C/W @ 400 LFM||.027(12.20)||
|**Order SpeedClip™ 285SC or 330SC separately.**|||||||||||||
|Material: Aluminum, Black Anodized|||||||||||||
||||||||||||||
|**MECHANICAL DIMENSIONS**||||||||**Order SpeedClips™ separately for use**||**Order SpeedClips™ separately for use**|**Order SpeedClips™ separately for use**||
||||+2.00(50.8)||ne|ne7509.1)||**with Series 246, 247, 248 or 249**|**with Series 246, 247, 248 or 249**||||



## **MECHANICAL DIMENSIONS** 

## **Dimensions: in. (mm)** 

## **Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks** 

## **249 SERIES** 

|**249 SERIES**|**Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks**|**Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks**|**Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks**|**Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks**||||
|---|---|---|---|---|---|---|---|
|**249 SERIES**|**Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks**|**Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks**|**Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks**|**Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks**|||MULTIWATT|
||**Height Above**<br>**Footprint**|||**Thermal Performance at Typical Load**||||
|**Standard**|**PC Board**<br>**Dimensions**|**Mounting**|**Solderable**|**Natural**|**Forced**||**Weight**|
|**P/N**|**in.(mm)**<br>**in.(mm)**|**Configuration**|**Tab Options**|**Convection**|**Convection**||**lbs.(grams)**|
|249-113AB|1.130 (28.7)<br>1.900 (48.3) x .950 (24.1)|Vert./Horiz,|No Tab|35°C@ 4W|3.29°C/W @ 400 LFM||.020 (8.90)|
|249-113ABE-50|1.130(28.7)<br>1.900(48.3)x .950(24.1)|Vertical|50|35°C@ 4W|3.29°C/W @ 400 LFM||.021(9.40)|
|**Order SpeedClip™ 285SC or 330SC separately.**(See 248 Series section).||||||||
|Material: Aluminum, Black Anodized||||||||



## **MECHANICAL DIMENSIONS** 

**Dimensions: in. (mm)** 

**32** 

`WTS001_p26-49  6/14/07  10:55 AM  Page 33` 

**Board Level Heat Sinks** 

## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS** 

**==> picture [448 x 123] intentionally omitted <==**

**----- Start of picture text -----**<br>
288 SERIES Compact Wave-Solderable Low-Cost Heat Sinks TO-220, TO-202<br>Height Above Maximum Thermal Performance at Typical Load<br>Standard PC Board Footprint Natural Forced Weight<br>P/N in. (mm) in. (mm) Convection Convection lbs. (grams)<br>288-1ABE 1.250 (31.8) 0.875 (22.2) x 0.215 (5.5) 85°C @ 4W 12°C/W @ 200 LFM 0.0057 (2.59)<br>Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good space is available. The 288-1AB is a stamped aluminum heat sink, black an-<br>electrical connections for vertical mounting of TO-220 and TO-202 semiconduc- odized, designed for applications requiring good heat dissipation from a heat<br>tor packages. These heat sinks are designed for use where minimum PC board sink occupying minimum space, available at minimum cost.<br>288 SERIES<br>NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>**----- End of picture text -----**<br>


## **MECHANICAL DIMENSIONS** 

**==> picture [68 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


## **Top-Mount Booster Heat Sinks for Use with 270/272/280 Series** 

**==> picture [48 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
271 SERIES<br>**----- End of picture text -----**<br>


**==> picture [449 x 103] intentionally omitted <==**

**----- Start of picture text -----**<br>
271 SERIES TO-220<br>Horizontal<br>Height Above Mounting Footprint Thermal Performance at Typical Load<br>Standard Semiconductor Case Dimensions Natural Forced Weight<br>P/N in. (mm) in. (mm) Convection Convection lbs. (grams)<br>271-AB 0.500 (12.7) 1.750 (44.5) x 0.700 (17.8) 62°C @ 4W (NOTE A) 5.1°C/W @ 400 LFM 0.0052 (2.36)<br>31 °C @ 4W (NOTE B) 1.8°C/W 400 LFM (NOTE B)<br>Material: Aluminum, Black Anodized<br>This top-hat style booster heat sink can be added to any of the 270, 272, or 280 NOTE A: Thermal resistance with one 271-AB. NOTE B: Thermal resistance<br>Series for improved performance.  (total) as shown with (2) 271-AB types added to (1) 272-AB type.<br>**----- End of picture text -----**<br>


## **MECHANICAL DIMENSIONS** 

## **271 SERIES** 

**==> picture [455 x 141] intentionally omitted <==**

**----- Start of picture text -----**<br>
NATURAL AND FORCED<br>080.425 CONVECTION CHARACTERISTICS AIR VELOCITY (LFM)<br>9.530 0.405 t S 0 200 400<br>(13.5) (103)We. 0.700 we OTTTTTT<br>(178) se | Ww | f2700R280seRes | 1<br>a ee NZ weet<br>1750AOU 0.144 ieso col}"TZPSLNaeaaaeer oe<br>(44.5) (37) DIA THRU ocd aot NZ | 41 ee<br>| 14 0.500 ws$8 oo |AAAL | stnied SERIES | WITH<br>a7<br>— 0.50 r a |oe C2ag WITTUAT TTTeartT<br>(12.7) 0.040 xc O02 4 6 8 10 12 14 18 18<br>—————_ (1.0) REF POWER DISSIPATION (WATTS)<br>Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


**33** 

`WTS001_p26-49  6/14/07  10:55 AM  Page 34` 

## **Board Level Heat Sinks** 

## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS** 

## **Small Footprint Low-Cost Heat Sinks** 

## **270/272/280 SERIES** 

|**270/272/280 SERIES**|**270/272/280 SERIES**|**Small Footprint Low-Cost Heat Sinks**|**Small Footprint Low-Cost Heat Sinks**|||TO-220, TO-202|
|---|---|---|---|---|---|---|
||**Height Above**|**Horizontal Mounting**||**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|**Standard**|**PC Board**|**Maximum Footing**|**Solderable**|**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Tab Options**|**Convection**|**Convection**|**lbs.(grams)**|
|270-AB|0.375 (9.4)|1.750 (44.5) x 0.700 (17.8)|—|70°C @ 4W|6.0°C/W @ 400 LFM|0.0052 (2.36)|
|272-AB|0.375 (9.4)|1.750 (44.5) x 1.450 (36.8)|01,02|42°C @ 4W|3.6°C/W @ 400 LFM|0.0105 (5.72)|
|280-AB|0.375(9.4)|1.750(44.5)x 0.700(17.8)|—|70°C @ 4W|6.0°C/W @ 400 LFM|0.0048(2.18)|
|Material: Aluminum, Black Anodized|||||||



These exceptionally low-cost heat sinks can be mounted horizontally under a TO-220 or TO-202 case style with a maximum height of only 0.375 in. (9.4). For added performance, a 271 Series heat sink can also be used for double-sided heat dissipation. 

The 270-AB and 280-AB accept one power semiconductor; the 272-AB is designed for two power semiconductors. Specify solderable tab options for the 272 Series by the addition of suffix “O1” or “02” to the standard part number (i.e. 272-AB01 or 272-AB02). 

**==> picture [406 x 220] intentionally omitted <==**

**----- Start of picture text -----**<br>
NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>band144 (3.7 0.418(108) * + | 0.220(56) WS ip@ 20 AIR VELOCITY4006008001000(LFM)<br>— a Pe - TT Tt TT fT dy<br>0.530 = ogNe ee<br>0.700 F (a35) we TT Naa a<br>(178) ‘ =a ot No De reer Tl.<br>a { ~ Fe "LOIN ZS See de<br>0.144 (3.7) DIA THRU x=ae 4 |Aer7eeeelND ziag|,<br>270 SERIES 280 SERIES<br>EQg< a9 |Ye feTTPa| | |;<br>-o ol TTT TT | it |,<br>0.144 4m 9 1 2 3 4 5 6 7 8 9 1<br>1.750 DIA THRU (3.7) POWER DISSIPATION (WATTS)<br>(44.5) (TYP-2) ; 250 REF 1 875<br>va =s=01-| 64) | (9.5)<br>f__] i ~~ (44.5) 5 |<br>(1 (36.8) _ -| 0.700 r 8) — : + a<br>o |__| (17.8) SO, REF ' rr 050 REF i<br>_—_ 0.3755) » || «a— ose[~ner~~ (12.8)(12. —e i<br>f 0.040(1.0) REF (0.83<br>272 SERIES 272AB01 272AB02<br>**----- End of picture text -----**<br>


## **MECHANICAL DIMENSIONS** 

## **Dimensions: in. (mm)** 

## **289 & 290 SERIES** 

## **Low-Cost Single or Dual Package Heat Sinks** 

TO-218, TO-202, TO-220 

||**Height Above**|**Horizontal Mounting**|**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|---|---|---|---|---|---|
|**Standard**|**PC Board**|**Maximum Footing**|**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|**lbs.(grams)**|
|289-AB|0.500 (12.7)|1.000 (25.4) x 0.710 (18.1)|50°C @ 2W|9.0 C/W @ 400 LFM|0.0055 (2.49)|
|289-AP|0.500 (12.7)|1.000 (25.4) x 0.710 (18.1)|50°C @ 2W|9.0 C/W @ 400 LFM|0.0055 (2.49)|
|290-1AB|0.500 (12.7)|1.000 (25.4) x 1.180 (30.0)|44°C @ 2W|7.0 C/W @ 400 LFM|0.0082 (3.72)|
|290-2AB|0.500(12.7)|1.000(25.4)x 1.180(30.0)|44°C @ 2W|7.0 C/W @ 400 LFM|0.0081(3.67)|



Material: Aluminum, Black Anodized 

Low in cost and compact in overall dimensions, one 289 Series heat sink can accommodate one semiconductor; the 289 Series is available with a black an- 

odized finish (289-AB) or with no finish (289-AP). Two semiconductors can be mounted to the 290-2AB style. 

**==> picture [406 x 138] intentionally omitted <==**

**----- Start of picture text -----**<br>
NATURAL AND FORCED<br>289 SERIES MECHANICAL DIMENSIONS 290 SERIES CONVECTION CHARACTERISTICS<br>(1.3)<br>0.050 0.480 AIR VELOCITY (LFM)<br>orto 1 (C22! 0.080 so02 200 400<br>corti (2.8) + | 3) we EL ETT yy<br>@ 1.000 poor a| || =F+ 000 Ze22 9oeK |_|prA<br>(25-4) [| O-+© - (95.4) EB golso | | Zain<br>| e- |_| 2“ See<br>DIA THRU (cm samaamoe 0.400ri3 | - 0.150(3.8) DIA THRU FOBZ oo a| ee eee,<br>. (290-1 & -2) Y<br>0.500(12.7) (290-2 ONLY) 0.500 T 9 0 1 | |2 3 4<br>0.710 i WH Hi) 27) POWER DISSIPATION (WATTS)<br>1 1180 1 rs<br>(18.0) Ie —| fo fe Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


**34** 

`WTS001_p26-49  6/14/07  10:55 AM  Page 35` 

## **Board Level Heat Sinks** 

## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS** 

## **250 SERIES High-Performance Slim Profile Heat Sinks With Integral Clips** 

||||**250 SERIES**|**High-Performance Slim Profile Heat Sinks With Integral Clips**|**High-Performance Slim Profile Heat Sinks With Integral Clips**|
|---|---|---|---|---|---|
||||**250 SERIES**|**High-Performance Slim Profile Heat Sinks With Integral Clips**|**High-Performance Slim Profile Heat Sinks With Integral Clips**<br>MULTIWATT|
|||||**Height Above**<br>**Footprint**|**Thermal Performance at Typical Load**|
|.|oF <br>~\|2<br>|**Standard**<br>**PC Board**<br>**Dimensions**<br>**Mounting**<br>**Solderable**<br>**Mounting**<br>**Natural**<br>**Forced**<br>**P/N**<br>**in. (mm)**<br>**in. (mm)**<br>**Configuration**<br>**Tab Options**<br>**Style**<br>**Convection**<br>**Convection**<br>250-122AB<br>1.220 (31.0)<br>1.000 (25.4) x .500 (12.7)<br>Vert./Horiz.<br>No Tab<br>Clip<br>50°C @ 4W<br>3.7°C/W @ 400 LFM<br> ~~Te~~|||
||||250-122ABE-09|1.220 (31.0)<br>1.000 (25.4) x .500 (12.7)<br>Vertical<br>09|Clip<br>50°C @ 4W<br>3.7°C/W @ 400 LFM|
||||250-122ABE-25|1.380(35.1)<br>1.000(25.4)x .500(12.7)<br>Vertical<br>25|Clip<br>50°C @ 4W<br>3.7°C/W @ 400 LFM|
||||Material: Aluminum, Black Anodized|||
|**MECHANICAL DIMENSIONS**<br>**250-122AB**<br>**Dimensions: in. (mm)**<br>500<br>le[a 1.00<br>a<br>ae<br>!<br>:<br>|<br>E<br>‘<br>122REF<br>|| [|<br>nt)<br>BR,<br>es<br>by<br>a ae<br>;<br>7<br>L<br>(<br>H||||**250-122AB-09**<br>**250-122AB-25**<br>**250 SERIES**<br>-—<br>1.00 —|<br>(4)<br>+»<br>o<br>+ ey f-<br>—] [|<br>250-122AB-09<br>©.100(2.5)(PLAT<br>122<br>WITH @.125 (3.2)PAD<br>160.310<br>(31.0)<br>250-122AB-25<br>ai)<br>(79)<br>fam<br>=<br>SUGGESTED<br>TABHOLE:<br>a9<br>anf<br>ly} 1<br>prmoscoeseay<br>14<br>7<br>=<br>ic<br>|<br>032(TAB 09)<br>my<br>_ |||<br>e062<br>IF 28 a5<br>075<br>i<br>Ik-&<br>= 250<br>(05)<br>t<br>(19)<br>275<br>ean)<br>275<br>aot<br>ls<br>(7.0)|**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>AIR VELOCITY (LFM)<br>wE iop@__200<br>400600<br>80010004<br>Ext 9<br>i<br>46)<br>g<br>ma<br>e5<br>[|[|TTT<br>Pry ee<br>ws<br>i<br>ee 6iNET<br>oe<br>Fe »[oS TPT, Ss<br>i<br>t<br>6 Ee!<br>Le Wi-y<br>[_|<br>Py’<br>es<br>Be Oe **T**T }—+-—}—|+<br>ty<br>wy GZ<br>I<br>Lily F2<br>=<br>oO<br>2<br>4<br>6<br>8<br>10<br>POWERDISSIPATION(WATTS)|



## **High-Performance, High-Power Vertical Mount Heat Sinks** 

## **237 & 252 SERIES** 

|**237 & 252 SERIES**|**237 & 252 SERIES**||**High-Performance, High-Power Vertical Mount Heat Sinks**|**High-Performance, High-Power Vertical Mount Heat Sinks**|**High-Performance, High-Power Vertical Mount Heat Sinks**|**High-Performance, High-Power Vertical Mount Heat Sinks**|**High-Performance, High-Power Vertical Mount Heat Sinks**|||||
|---|---|---|---|---|---|---|---|---|---|---|---|
|**237 & 252 SERIES**|**237 & 252 SERIES**||**High-Performance, High-Power Vertical Mount Heat Sinks**|**High-Performance, High-Power Vertical Mount Heat Sinks**|**High-Performance, High-Power Vertical Mount Heat Sinks**|**High-Performance, High-Power Vertical Mount Heat Sinks**|**High-Performance, High-Power Vertical Mount Heat Sinks**||||TO-220|
||**Height Above**||**Footprint**|||||**Thermal Performance at Typical Load**||||
|**Standard**|**PC Board**||**Dimensions**||**Mounting**|**Solderable**|**Mounting**||**Natural**|**Forced**||
|**P/N**|**in. (mm)**||**in. (mm)**|**Configuration**||**Tab Options**|**Style**||**Convection**|**Convection**||
|237-167AB2|1.675 (42.5)||1.000 (25-4) x 1.000 (25.4)||Vertical|2, Twisted|Clip/Mtg Slot||46°C @ 4W|4.5°C/W @ 200 LFM|4.5°C/W @ 200 LFM|
|237-167AB3|1.675 (42.5)||1.000 (25.4) x 1.000 (25.4)||Vertical|3, Twisted|Clip/Mtg Slot||46°C @ 4W|4.5°C/W @ 200 LFM|4.5°C/W @ 200 LFM|
|237-167ABE2-24|1.675 (42.5)||1.000 (25.4) x 1.000 (25.4)||Vertical|2, Solderable|Clip/Mtg Slot||46°C @ 4W|4.5°C/W @ 200 LFM|4.5°C/W @ 200 LFM|
|252-167AB2|1.675 (42.5)||1.000 (25.4) x 1.000 (25.4)||Vertical|2, Twisted|Clip/Mtg Slot||40°C @ 4W|4.5°C/W @ 200 LFM|4.5°C/W @ 200 LFM|
|252-167AB3|1.675 (42.5)||1.000 (25.4) x 1.000 (25.4)||Vertical|3, Twisted|Clip/Mtg Slot||40°C @ 4W|4.5°C/W @ 200 LFM|4.5°C/W @ 200 LFM|
|252-167ABE2-24|1.675(42.5)||1.000(25.4)x 1.000(25.4)||Vertical|2,Solderable|Clip/MtgSlot||40°C @ 4W|4.5°C/W @ 200 LFM|4.5°C/W @ 200 LFM|
|**Order SpeedClips™ 285SC or 330SC separately for rapid component installation, lowering manufacturing costs.**||||||**Order SpeedClips™ 285SC or 330SC separately for rapid component installation, lowering manufacturing costs.**Material: Aluminum, Black Anodized|||Material: Aluminum, Black Anodized|Material: Aluminum, Black Anodized|Material: Aluminum, Black Anodized|



|**MECHANICAL DIMENSIONS**<br>**227-167**<br>**237-167AB3**<br>**252-167AB3**<br>**237-167AB3**<br>**252-167**<br>**237-167AB2**<br>**252-167AB2**<br>**237 AND 252 SERIES**<br>**237 AND 252 SERIES**<br>**Dimensions: in. (mm)**<br>**252-167AB3**<br>1.000<br>1.000<br>|<br>@54+<br>6594<br>a4<br>co—<br>oo<br>—<br>|<br>,oF<br>[==<br>wise<br>as<br>|<br>=<br>=—<br>“m<br>85) 40) |<br>4<br>H | 1.675<br>TABAVAILABLEON |————>| ABAVAILABLE<br>ON<br>f<br>H | 25)<br>ONLY<br>ONLY<br>f<br>i<br>=| @tassTwisted) |——<br>| (ataas TwisTED)<br>h<br>fh<br>4<br>|<br>1 tp<br>i<br>4<br>= /<br>1a<br>H 700<br>1<br>4ooRer |<br>H 17.8)<br>I<br>450<br>450<br>TABHOLES<br>a<br>ta<br>| C or<br>{mie<br>ol<br>500<br>100TYP,<br>375<br>24 |NI<br>27)<br>(25) >"<br>(95)<br>(2.5)<br>+O<br>4.000<br>(25.4)"|<br>3TABS(TWISTED)<br>i<br>475 (12.1) <br>ONLY<br>“ 950(24.1)|**MECHANICAL DIMENSIONS**<br>**227-167**<br>**237-167AB3**<br>**252-167AB3**<br>**237-167AB3**<br>**252-167**<br>**237-167AB2**<br>**252-167AB2**<br>**237 AND 252 SERIES**<br>**237 AND 252 SERIES**<br>**Dimensions: in. (mm)**<br>**252-167AB3**<br>1.000<br>1.000<br>|<br>@54+<br>6594<br>a4<br>co—<br>oo<br>—<br>|<br>,oF<br>[==<br>wise<br>as<br>|<br>=<br>=—<br>“m<br>85) 40) |<br>4<br>H | 1.675<br>TABAVAILABLEON |————>| ABAVAILABLE<br>ON<br>f<br>H | 25)<br>ONLY<br>ONLY<br>f<br>i<br>=| @tassTwisted) |——<br>| (ataas TwisTED)<br>h<br>fh<br>4<br>|<br>1 tp<br>i<br>4<br>= /<br>1a<br>H 700<br>1<br>4ooRer |<br>H 17.8)<br>I<br>450<br>450<br>TABHOLES<br>a<br>ta<br>| C or<br>{mie<br>ol<br>500<br>100TYP,<br>375<br>24 |NI<br>27)<br>(25) >"<br>(95)<br>(2.5)<br>+O<br>4.000<br>(25.4)"|<br>3TABS(TWISTED)<br>i<br>475 (12.1) <br>ONLY<br>“ 950(24.1)|**MECHANICAL DIMENSIONS**<br>**227-167**<br>**237-167AB3**<br>**252-167AB3**<br>**237-167AB3**<br>**252-167**<br>**237-167AB2**<br>**252-167AB2**<br>**237 AND 252 SERIES**<br>**237 AND 252 SERIES**<br>**Dimensions: in. (mm)**<br>**252-167AB3**<br>1.000<br>1.000<br>|<br>@54+<br>6594<br>a4<br>co—<br>oo<br>—<br>|<br>,oF<br>[==<br>wise<br>as<br>|<br>=<br>=—<br>“m<br>85) 40) |<br>4<br>H | 1.675<br>TABAVAILABLEON |————>| ABAVAILABLE<br>ON<br>f<br>H | 25)<br>ONLY<br>ONLY<br>f<br>i<br>=| @tassTwisted) |——<br>| (ataas TwisTED)<br>h<br>fh<br>4<br>|<br>1 tp<br>i<br>4<br>= /<br>1a<br>H 700<br>1<br>4ooRer |<br>H 17.8)<br>I<br>450<br>450<br>TABHOLES<br>a<br>ta<br>| C or<br>{mie<br>ol<br>500<br>100TYP,<br>375<br>24 |NI<br>27)<br>(25) >"<br>(95)<br>(2.5)<br>+O<br>4.000<br>(25.4)"|<br>3TABS(TWISTED)<br>i<br>475 (12.1) <br>ONLY<br>“ 950(24.1)|**MECHANICAL DIMENSIONS**<br>**227-167**<br>**237-167AB3**<br>**252-167AB3**<br>**237-167AB3**<br>**252-167**<br>**237-167AB2**<br>**252-167AB2**<br>**237 AND 252 SERIES**<br>**237 AND 252 SERIES**<br>**Dimensions: in. (mm)**<br>**252-167AB3**<br>1.000<br>1.000<br>|<br>@54+<br>6594<br>a4<br>co—<br>oo<br>—<br>|<br>,oF<br>[==<br>wise<br>as<br>|<br>=<br>=—<br>“m<br>85) 40) |<br>4<br>H | 1.675<br>TABAVAILABLEON |————>| ABAVAILABLE<br>ON<br>f<br>H | 25)<br>ONLY<br>ONLY<br>f<br>i<br>=| @tassTwisted) |——<br>| (ataas TwisTED)<br>h<br>fh<br>4<br>|<br>1 tp<br>i<br>4<br>= /<br>1a<br>H 700<br>1<br>4ooRer |<br>H 17.8)<br>I<br>450<br>450<br>TABHOLES<br>a<br>ta<br>| C or<br>{mie<br>ol<br>500<br>100TYP,<br>375<br>24 |NI<br>27)<br>(25) >"<br>(95)<br>(2.5)<br>+O<br>4.000<br>(25.4)"|<br>3TABS(TWISTED)<br>i<br>475 (12.1) <br>ONLY<br>“ 950(24.1)|**MECHANICAL DIMENSIONS**<br>**227-167**<br>**237-167AB3**<br>**252-167AB3**<br>**237-167AB3**<br>**252-167**<br>**237-167AB2**<br>**252-167AB2**<br>**237 AND 252 SERIES**<br>**237 AND 252 SERIES**<br>**Dimensions: in. (mm)**<br>**252-167AB3**<br>1.000<br>1.000<br>|<br>@54+<br>6594<br>a4<br>co—<br>oo<br>—<br>|<br>,oF<br>[==<br>wise<br>as<br>|<br>=<br>=—<br>“m<br>85) 40) |<br>4<br>H | 1.675<br>TABAVAILABLEON |————>| ABAVAILABLE<br>ON<br>f<br>H | 25)<br>ONLY<br>ONLY<br>f<br>i<br>=| @tassTwisted) |——<br>| (ataas TwisTED)<br>h<br>fh<br>4<br>|<br>1 tp<br>i<br>4<br>= /<br>1a<br>H 700<br>1<br>4ooRer |<br>H 17.8)<br>I<br>450<br>450<br>TABHOLES<br>a<br>ta<br>| C or<br>{mie<br>ol<br>500<br>100TYP,<br>375<br>24 |NI<br>27)<br>(25) >"<br>(95)<br>(2.5)<br>+O<br>4.000<br>(25.4)"|<br>3TABS(TWISTED)<br>i<br>475 (12.1) <br>ONLY<br>“ 950(24.1)|**MECHANICAL DIMENSIONS**<br>**227-167**<br>**237-167AB3**<br>**252-167AB3**<br>**237-167AB3**<br>**252-167**<br>**237-167AB2**<br>**252-167AB2**<br>**237 AND 252 SERIES**<br>**237 AND 252 SERIES**<br>**Dimensions: in. (mm)**<br>**252-167AB3**<br>1.000<br>1.000<br>|<br>@54+<br>6594<br>a4<br>co—<br>oo<br>—<br>|<br>,oF<br>[==<br>wise<br>as<br>|<br>=<br>=—<br>“m<br>85) 40) |<br>4<br>H | 1.675<br>TABAVAILABLEON |————>| ABAVAILABLE<br>ON<br>f<br>H | 25)<br>ONLY<br>ONLY<br>f<br>i<br>=| @tassTwisted) |——<br>| (ataas TwisTED)<br>h<br>fh<br>4<br>|<br>1 tp<br>i<br>4<br>= /<br>1a<br>H 700<br>1<br>4ooRer |<br>H 17.8)<br>I<br>450<br>450<br>TABHOLES<br>a<br>ta<br>| C or<br>{mie<br>ol<br>500<br>100TYP,<br>375<br>24 |NI<br>27)<br>(25) >"<br>(95)<br>(2.5)<br>+O<br>4.000<br>(25.4)"|<br>3TABS(TWISTED)<br>i<br>475 (12.1) <br>ONLY<br>“ 950(24.1)|**MECHANICAL DIMENSIONS**<br>**227-167**<br>**237-167AB3**<br>**252-167AB3**<br>**237-167AB3**<br>**252-167**<br>**237-167AB2**<br>**252-167AB2**<br>**237 AND 252 SERIES**<br>**237 AND 252 SERIES**<br>**Dimensions: in. (mm)**<br>**252-167AB3**<br>1.000<br>1.000<br>|<br>@54+<br>6594<br>a4<br>co—<br>oo<br>—<br>|<br>,oF<br>[==<br>wise<br>as<br>|<br>=<br>=—<br>“m<br>85) 40) |<br>4<br>H | 1.675<br>TABAVAILABLEON |————>| ABAVAILABLE<br>ON<br>f<br>H | 25)<br>ONLY<br>ONLY<br>f<br>i<br>=| @tassTwisted) |——<br>| (ataas TwisTED)<br>h<br>fh<br>4<br>|<br>1 tp<br>i<br>4<br>= /<br>1a<br>H 700<br>1<br>4ooRer |<br>H 17.8)<br>I<br>450<br>450<br>TABHOLES<br>a<br>ta<br>| C or<br>{mie<br>ol<br>500<br>100TYP,<br>375<br>24 |NI<br>27)<br>(25) >"<br>(95)<br>(2.5)<br>+O<br>4.000<br>(25.4)"|<br>3TABS(TWISTED)<br>i<br>475 (12.1) <br>ONLY<br>“ 950(24.1)|**MECHANICAL DIMENSIONS**<br>**227-167**<br>**237-167AB3**<br>**252-167AB3**<br>**237-167AB3**<br>**252-167**<br>**237-167AB2**<br>**252-167AB2**<br>**237 AND 252 SERIES**<br>**237 AND 252 SERIES**<br>**Dimensions: in. (mm)**<br>**252-167AB3**<br>1.000<br>1.000<br>|<br>@54+<br>6594<br>a4<br>co—<br>oo<br>—<br>|<br>,oF<br>[==<br>wise<br>as<br>|<br>=<br>=—<br>“m<br>85) 40) |<br>4<br>H | 1.675<br>TABAVAILABLEON |————>| ABAVAILABLE<br>ON<br>f<br>H | 25)<br>ONLY<br>ONLY<br>f<br>i<br>=| @tassTwisted) |——<br>| (ataas TwisTED)<br>h<br>fh<br>4<br>|<br>1 tp<br>i<br>4<br>= /<br>1a<br>H 700<br>1<br>4ooRer |<br>H 17.8)<br>I<br>450<br>450<br>TABHOLES<br>a<br>ta<br>| C or<br>{mie<br>ol<br>500<br>100TYP,<br>375<br>24 |NI<br>27)<br>(25) >"<br>(95)<br>(2.5)<br>+O<br>4.000<br>(25.4)"|<br>3TABS(TWISTED)<br>i<br>475 (12.1) <br>ONLY<br>“ 950(24.1)|**237-167AB2-24**<br>**252-167AB2-24**<br>2<br>5.<br>4 {<br>—_<br>—o+ 022rer<br>(08)<br>950<br>(24.1)<br>2TABS<br>{SOLDERABLE)<br>cy<br> |<<br>3.130<br>(24.1)_4<br>(83)|**237-167AB2-24**<br>**252-167AB2-24**<br>2<br>5.<br>4 {<br>—_<br>—o+ 022rer<br>(08)<br>950<br>(24.1)<br>2TABS<br>{SOLDERABLE)<br>cy<br> |<<br>3.130<br>(24.1)_4<br>(83)|**237-167AB2-24**<br>**252-167AB2-24**<br>2<br>5.<br>4 {<br>—_<br>—o+ 022rer<br>(08)<br>950<br>(24.1)<br>2TABS<br>{SOLDERABLE)<br>cy<br> |<<br>3.130<br>(24.1)_4<br>(83)|OrderSpeedClips™<br>Separately<br>Stainless Steel 330SC4#<br>SpringSteel 285SC 10¥|OrderSpeedClips™<br>Separately<br>Stainless Steel 330SC4#<br>SpringSteel 285SC 10¥|mS <br>ed <br>Ee <br>5 <br>Be <br>So <br>BS<br>c=<br>w<br>Su<br>09<br>ge <br>Ce)<br>c|**NATURAL AND FORCED**<br>**CONVECTION CHARACTERISTICS**<br>AIRVELOCITY (LFM)<br> 1902<br>200<br>400<br>600<br>800__10009<br>Ee<br> t+} {ff ff we<br> of<br>1Tt). Ptds 22<br> “CTT rreererr?<br>gs<br> ght et, 2s<br> ee® 2<br>a 282 ae<br>40| So<br>42s<br>Pt<br>l2a7|<br>z<br>See TT<br>3%<br>|<br>| |eae. zo<br> | Let pT Ty fay" ge<br>0<br>1<br>2<br>POWERDISSIPATION (WATTS)|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||||||||||||||
||||||||||||||||
||||||**291 SERIES**||**Labor-Saving Clip-on Heat Sinks**|||||||TO-220|
||||||||**Vertical**||||||||
||||||||**Height Above**<br>**Mounting Footprint**|||||**Thermal Performance at Typical Load**|||
||||||**Standard**||**PC Board**<br>**Dimensions**|**Mounting**||||**Natural**||**Forced**<br>**Weight**|
||||||**P/N**||**in. (mm)**<br>**in. (mm)**|**Style**||||**Convection**||**Convection**<br>**lbs. (grams)**|
||||||291-C236AB||0.860 (21.)9<br>1.100 (27.0) x 0.360 (9.1)|TO-220 (Clip)|TO-220 (Clip)|||80°C @ 2W||24°C/W @ 600 LFM<br>0.0026 (1.18)|
||||||291-H36AB||0.860(21.9)<br>1.100(27.0)x 0.360(9.1)|TO-220(Mtg. Hole)||||68°C @ 2W||16°C/W @ 600 LFM<br>0.0026(1.18))|
||||||Material: Aluminum, Black Anodized||||||||||
||||||Designed for mounting horizontally or vertically on a circuit board, 291 Series|||Designed for mounting horizontally or vertically on a circuit board, 291 Series||One type is available with a locking clip and one with a 0.140 in. (3.6) diameter|One type is available with a locking clip and one with a 0.140 in. (3.6) diameter||One type is available with a locking clip and one with a 0.140 in. (3.6) diameter||
||||||heat sinks employ a unique clip for attachment of TO-220 case styles.||heat sinks employ a unique clip for attachment of TO-220 case styles.|||mounting hole only.|||||



**==> picture [469 x 111] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS 0,360, 291 SERIES<br>NATURAL AND FORCED<br>Op! i. 1000 0.500 CONVECTION CHARACTERISTICS<br>| il (25.4) 4 (27) +<br>toa) , AIR VELOCITY: (Lew<br>+r 4. | | i | oao p2__300_600_s00_ 12001500,<br>1 wo T<br>, | | NK 88) o” g " {8 eed Amiroore Td gg<br>N \\ Li | YS Se ptAo 035<br>cn 5 a +. CK - gu TVA Pt | dag BE<br>c | (a ny, i Z|T iy 3 2 A = 88<br>. F 0.315(8.0) :| (11.8)0.465 aaZu oN 47]4 [| | 1 | 1-4 20 ce5S<br>} \ 4 ' \ BB OLSRL 201 ca36a8 | | <=<br>— Set Lo te gf? |PSE | z0<br>0.1008 | 0.420 su A See ee<br>Dimensions: in. (mm) LOCKING TABS 5) i (10-7) “2rc 0!0FL1 aes2 3TE 4TTI,5 8oO<br>291-C2 291-H POWER DISSIPATION (WATTS)<br>**----- End of picture text -----**<br>


## **MECHANICAL DIMENSIONS** 

**35** 

`WTS001_p26-49  6/14/07  10:55 AM  Page 36` 

## **Board Level Heat Sinks** | 

## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS** 

|**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**|**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**|**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**|**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**|**BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**|||||
|---|---|---|---|---|---|---|---|---|
|**Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks**<br>See also 286DB Series on Page 7.<br>**286 SERIES**||||||||TO-220|
||**Height Above**|||**Thermal Performance at Typical Load**|||||
|**Standard**|**PC Board**<br>**Maximum Footprint**|||**Natural**|**Forced**|||**Weight**|
|**P/N**|**in.(mm)**<br>**in.(mm)**|**Material**||**Convection**|**Convection**|||**lbs.(grams)**|
|286-AB|1.190 (30.2)<br>1.000 (25.4) x 0.500 (12.7)|Aluminum, Anodized||58°C @ 4W|7.4°CW @ 200 LFM|||0.0085 (3.86)|
|286-CBTE|1.190 (30.2)<br>1.000 (25.4) x 0.500 (12.7)|Copper, Black||58°C @ 4W|7.4°CW @ 200 LFM||0.0250 (11.34)||
|286-CTE|1.190(30.2)<br>1.000(25.4)x 0.500(12.7)|Copper,Tinned||58°C @ 4W|7.4°CW @ 200 LFM||0.0250(11.34)||
||||||||||
|Efficient heat removal at low cost can be achieved by inserting the 286 Series di-|Efficient heat removal at low cost can be achieved by inserting the 286 Series di-||the board. Material: 286-AB style (aluminum, black anodized), 286-CBT style||||the board. Material: 286-AB style (aluminum, black anodized), 286-CBT style||
|rectly into pre-drilled circuit boards; scored mounting tabs may be bent after in-|||(copper, black paint tin tabs), and 286-CT style (copper, tinned).||||||
|sertion to provide added stability. The 286 Series can be wavesoldered directly to|||||||||



**==> picture [90 x 7] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS<br>**----- End of picture text -----**<br>


**==> picture [34 x 6] intentionally omitted <==**

**----- Start of picture text -----**<br>
286 SERIES<br>**----- End of picture text -----**<br>


**==> picture [95 x 14] intentionally omitted <==**

**----- Start of picture text -----**<br>
NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>**----- End of picture text -----**<br>


**==> picture [68 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


## **287 SERIES** 

## **Wave-Solderable Low-Cost Heat Sinks** 

TO-220 

|||**Height Above**|**Maximum**|**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|---|---|---|---|---|---|---|
|**Standard P/N**||**PC Board**|**Footprint “A”**|**Natural**|**Forced**|**Weight**|
|**Mounting Slot**|**Mounting Hole**|**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|**lbs.(grams)**|
|287-1ABE|287-1ABH|1.180 (30.0)|1.000 (25.4) x 0.500 (12.7)|65°C @ 4W|7.8°CW @ 200 LFM|0.0090 (4.08)|
|287-2ABE|287-2ABH|1.180(30.0)|1.000(25.4)x 1.000(25.4)|55°C @ 4W|6.4°CW @ 200 LFM|0.0140(6.35)|
|Material: Aluminum, Black Anodized|||||||



Mount these cost-effective TO-220 heat sinks vertically into pre-drilled printed circuit boards. Soldered, pre-tinned tabs can be wavesoldered directly to the 

board. A 0.375 in. (9.5 mm) mounting slot allows for correct positioning of TO220 and similar semiconductor packages. 

## **MECHANICAL DIMENSIONS** 

**==> picture [194 x 61] intentionally omitted <==**

**----- Start of picture text -----**<br>
287 SERIES<br>NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>Standard P/N Dim. “A”<br>287-1AB287-2AB 0.500 (12.7)1.000 (25.4) weF MCNj g @—_ TTT200400AIR VELOCITYTeh (LFM)Ty<br>287-1ABH 0.500 (12.7) 5S olNI gett<br>287-2ABH 1.000 (25.4) ES "CONN JPT} |<br>**----- End of picture text -----**<br>


**==> picture [68 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


## **285 SC and 330 SC SpeedClips™** 

## **285 & 330 SERIES** 

Zif Socket 8 And 387 SPGA LIF 

|**Standard**<br>**Nominal Installed**<br>**For Use**<br>**P/N**<br>**Loading Force**<br>**With Series**<br>285 SC<br>10 lbs<br>232, 237, 240, 252, 667<br>330 SC<br>4 lbs<br>232,237,240,252,667|**Material**<br>Carbon Steel<br>Stainless Steel|**Weight**<br>**lbs.(grams)**<br>0.00053 (0.24)<br>0.00074(0.34)|
|---|---|---|
||||
|SpeedClips™ employ a locking safety tab for mounting. Must be ordered sepa-<br>one SpeedClip™ for each heat sink purchased. Must be purchased with heat|||
|rately for these heat sink series. Use these SpeedClips™ with our 237, 240, and<br>sinks.|||



SpeedClips™ employ a locking safety tab for mounting. Must be ordered separately for these heat sink series. Use these SpeedClips™ with our 237, 240, and 252 Series heat sinks for the lowest production assembly time and cost. Order 

## **MECHANICAL DIMENSIONS** 

|**MECHANICAL DIMENSIONS**<br>**Dimensions: in. (mm)**|_<br>rT<br>t<br>0.315<br>(80)<br>2<br>P|<br>a4-—hog"|0.590<br>ts0 <br>0.413<br>hog"|<j<br>!<br>eH<br>45)<br>-<br>Pe4|ob|**Speed**<br>**Clip**<br>**330 SC**<br>**4 lb (17.8N)**<br>**Nominal Force**<br>**Installed**|pots<br>5<br>020<br>|QF<br>'<br>(61)<br>i<br>=<br>|<br>;<br>\<br>oe<br>t +-&<br>4<br>I<br>0.190 )<br>|<br>}<br>:<br>(4.8)<br>,<br>|<br>L<br>0.425<br>0.550<br>+<br>a<br>an(2)<br>(14.0)|.|0.140<br>0.146<br>(3.6)|**Speed**<br>**Clip**<br>**285 SC**<br>**10 lb (44.5N)**<br>**Nominal Force**<br>**Installed**|
|---|---|---|---|---|---|---|---|---|---|



**36** 

`WTS001_p26-49  6/14/07  10:55 AM  Page 37` 

**Board Level Heat Sinks** ~~—~~ 

## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS** 

## **Space-Saving Heat Sinks for Small Stud-Mounted Diodes** 

## **695 SERIES** 

|**695 SERIES**|**Space-Saving Heat Sinks for Small Stud-Mounted Diodes**|**Space-Saving Heat Sinks for Small Stud-Mounted Diodes**|**Space-Saving Heat Sinks for Small Stud-Mounted Diodes**|||
|---|---|---|---|---|---|
|**695 SERIES**|**Space-Saving Heat Sinks for Small Stud-Mounted Diodes**|**Space-Saving Heat Sinks for Small Stud-Mounted Diodes**|**Space-Saving Heat Sinks for Small Stud-Mounted Diodes**||STUD-MOUNT|
||**Maximum**||**Thermal Performance at Typical Load**|||
|**Standard**|**Width**|**Height**|**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|**lbs.(grams)**|
|695-1B|1.330(33.8)|0.530(13.7)|72°C @ 4.0W|5.2°C/W @ 400 LFM|0.008(4.0)|



Mount and effectively heat sink small stud-mounted diodes with the 695 Series space-saving heat sink type. Each unit is black anodized aluminum with an 0.200 in. (5.1) dia. mounting hole centered in the base. The folded fin design 

provides good heat dissipation for use where height is limited above the printed circuit board or base plate. 

**==> picture [255 x 101] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL 695 SERIES<br>DIMENSIONS 0.625aa) 1.330<br>€ (38)<br>0.200 | 0.050 =<br>°1) DIA (1.3) |<br>€<br>0.250<br>Dimensions: in. (mm) (6.3) REF<br>**----- End of picture text -----**<br>


**NATURAL AND FORCED CONVECTION CHARACTERISTICS** 

## **260 SERIES** 

## **Cup Clips for TO-5 Case Style Semiconductors** 

**==> picture [16 x 6] intentionally omitted <==**

**----- Start of picture text -----**<br>
TO-5<br>**----- End of picture text -----**<br>


|||||**Depth of**||
|---|---|---|---|---|---|
|**Characteristics**|**TO-5**||**Model**|**Tapped Base**||
|Thermal Resistance – EpoxyInsulated|14° C/W||260-4T5E|0.093 (2.36)||
|Breakdown Voltage – EpoxyType(VAC),60 Hz|500||260-4TH5E|0.125 (3.18)||
|Recommended Operating Voltage, AC or DC||||||
|Clean Conditions: % Hipot Rating<br>Dusty Conditions: % Hipot Rating<br>DirtyConditions: % Hipot Rating|50<br>30<br>10 to 20||**Thread**<br>**Size:**|4 = #4-40 UNC<br>6 = #6-32 UNC|**Base Style:** H = hex<br>**Semiconductor**|
|Temperature Range — Continuous (C°)|-73/+149||**Mounting**|T = tapped|**Case Style:** 5 = TO-5|
||||**Style:**|S = stud|**Insulation** E = epoxy|
|||||P = plain||



## **TO-5CASE STYLE CUP CLIPS — ORDERINGGUIDE** 

|||**Outline Dimension**|||
|---|---|---|---|---|
|**Standard**|**Insulation**|**L x W x I.D.**|**Weight**|**Case**|
|**P/N**<br>260-4T5E|**Type**<br>Epoxy Insulated|**in.(mm)**<br>0.370 (9.4) x 0.380 (9.7) dia. x 0.290 (7.4)|**lbs.(grams)**<br>0.0024 (1.09)|**Style**<br>TO-5|
|260-4TH5E|Epoxy Insulated|0.400 (10.2) x 0.370 (9.4) hex. x 0.290 (7.4)|0.0031 (1.41)|TO-5|
|260-6SH5E|Epoxy Insulated|0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4)|0.0037 (1.68)|TO-5|



Materials and Finish: Cups – beryllium copper, black ebonol “C”; Bases – brass, black ebonol “C” 

## **Base Mounting Configurations** — TO-5 

**Plain Type** — Epoxy bonded, or used with #4 pan head screws. **Tapped Base** — #4-40 UNC screw (not supplied) fits tapped hole. Care should be taken not to use too long a screw, which could short against the semiconductor case. For correct screw lengths: 

Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness **Stud Mounting Base** . #6-32 UNC. Nuts and washers not supplied. Stud hole must be slightly countersunk to ensure flat mounting. 

To determine the correct mounting screw lengths, add dimensions as follows: 

Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness 

**37** 

`WTS001_p26-49  6/14/07  10:56 AM  Page 38` 

## **Board Level Heat Sinks** 

## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS** 

**==> picture [167 x 19] intentionally omitted <==**

**----- Start of picture text -----**<br>
fF 260 SERIES Epoxy Insulated For TO-5<br>**----- End of picture text -----**<br>


**==> picture [336 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
260-4T5E 260-4TH5E 260-6SH5E<br>**----- End of picture text -----**<br>


## **Thermal Links for Fused Glass Diodes** 

**258 SERIES Thermal Links for Fused Glass Diodes** DIODES **Standard Dimensions Weight P/N** 258 ~~SO~~ 0.500 (12.7) x 0.250 (6.4) x 0.340 (8.6) **in. (mm)** Aluminum **Material** DeltaCoate™ 151 on all surfaces **Finish** 0.0018 (0.82) **lbs. (grams)** except solder pads and base The thermal resistance from diode leads to chassis or heat sink is 12°C/watt, sink to ambient impedance is available, the thermal resistance from the diode when unit is mounted with TYPE 120 Joint Compound. If a 10°C/watt chassis or leads to ambient is reduced from about 150°C/watt to 22°C/watt. 

## **MECHANICAL DIMENSIONS** 

**258 SERIES Dimensions: in. (mm)** 

## **Heat Sink for Single TO-92** 

**==> picture [49 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
292 SERIES<br>**----- End of picture text -----**<br>


TO-92 **Height Above Overall Standard PC Board Fin Width Thermal Performance Weight P/N in. (mm) in. (mm) Natural Convection Finish lbs. (grams)** 292-AB 0.750 (19.1) 0. 600 (15.3) 0.225°C/W @ 0.250 W Black Anodized 0.00049 (0.22) Power semiconductors packaged in a TO-92 style plastic case can be cooled ef292-AB is effective over the typical power range of such devices. fectively at little additional cost with the addition of the 292-AB heat sink. The Material: Aluminum, Black Anodized 

## **MECHANICAL DIMENSIONS** 

**292 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS** ° € : eo “ET TT TTT TTT | 0.540 | > ants Sea2 “Coof fT TTTPP (ia (137) oofiN=o) |rr ae fsil o>.nnOc|) br (0.3) | 03) 83 Te } 52 4 | br tT TTT Se I 0.020 | | 0.030 Sua 180 (0.5) (0.8) ug | (4.6) Lom _ 3 iain 020 **Dimensions: in. (mm)** ——f \ 0.040(1.0) 1 (4.6) o POWER DISSIPATION (WATTS) 

**38** 

`WTS001_p26-49  6/14/07  10:56 AM  Page 39` 

**Board Level Heat Sinks** 

## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS** 

**==> picture [274 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink<br>**----- End of picture text -----**<br>


TO-220 and TO-218 **Standard Height Above Footprint P/N PC Board Dimensions Weight Plain Pin Without Pin in. (mm) in. (mm) lbs. (grams)** 634-10ABEP 634-10AB 1.000 (25.4) 0.640 (16.26) x 0.640 (16.26) 0.016 (7.48 634-15ABEP 634-15AB 1.500 (38.1) 0.640 (16.26) x 0.640 (16.26) 0.025 (11.21) 634-20ABEP 634-20AB 2.000 (50.8) 0.640 (16.26) x 0.640 (16.26) 0.033 (14.95) Material: Aluminum, Black Anodized. 

These slim profile unidirectional fin heat sinks offer users two assembly alternatives for vertically mounting TO-220 and TO-218 components. Models are available with or without wave- 

solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications where quick assembly is needed and space is at a premium. 

**==> picture [429 x 22] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS 634 SERIES<br>TYPICAL THERMAL PERFORMANCE<br>FOR 634-15ABP<br>**----- End of picture text -----**<br>


**==> picture [82 x 155] intentionally omitted <==**

**----- Start of picture text -----**<br>
Notes:<br>1. Thermal compound is as-<br>sumed between device<br>and heat sink.<br>2. Tab temp with longer heat<br>sink (634-20ABP) will<br>typically be about 15%<br>cooler. Tab temp with<br>shorter heat sink<br>(634- I0ABP) will typically<br>be about 25% higher.<br>Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


## **High-Efficiency Heat Sinks For Vertical Board Mounting** 

**==> picture [48 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
637 SERIES<br>**----- End of picture text -----**<br>


|**637 SERIES**||**High-Efficiency Heat Sinks For Vertical Board Mounting**|**High-Efficiency Heat Sinks For Vertical Board Mounting**|**High-Efficiency Heat Sinks For Vertical Board Mounting**|||
|---|---|---|---|---|---|---|
|**637 SERIES**||**High-Efficiency Heat Sinks For Vertical Board Mounting**|**High-Efficiency Heat Sinks For Vertical Board Mounting**|**High-Efficiency Heat Sinks For Vertical Board Mounting**||TO-220|
|||**Height Above**||**Thermal Performance at Typical Load**|||
|**Standard**||**PC Board “A”**|**Maximum Footprint**|**Natural**|**Forced**|**Weight**|
|**P/N**||**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|**lbs.(grams)**|
|637-10ABEP||1.000 (25.4)|1.375 (34.9) x 0.500 (12.7)|76°C @ 6W|5.8°C/W @ 200 LFM|0.023 (10.43)|
|637-15ABEP||1.500 (38.1)|1.375 (34.9) x 0.500 (12.7)|65°C @ 6w|5.5°C/W @ 200 LFM|0.035 (15.88)|
|637-20ABEP||2.000 (50.8)|1.375 (34.9) x 0.500 (12.7)|55°C @ 6W|4.7°C/W @ 200 LFM|0.050 (22.68)|
|637-25ABEP||2.500(63.5)|1.375(34.9)x 0.500(12.7)|48°C @ 6W|4.2°C/W @ 200 LFM|0.062(28.12)|
|Material: Aluminum, Black Anodized||Material: Aluminum, Black Anodized|||||



Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maximum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight and 

board space occupied must be minimized. Refer to the Accessory products section for thermal interface materials, thermal compounds, and other accessories products. 

**==> picture [450 x 157] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS 637 SERIES<br>(EXTRUSION PROFILE  5183) NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>t er0.500 |, REF [——— A —4_f oso _| r 0.156(40) (YP2) oo 2——200__ AIR VELOCITY (LFM}<br>es L WG y Y<br>0.625re er (1.6) oo ggpee] 0.437wren(11.1 $ +# 1.000ware cegz 80 SC KSNE[Zs ma<br>en+s!1 ===be 0.530| (13.5) ——— =o SsRSat 60 7 OfASAZ|&<phia “10,<br>‘aa. DIA THRU (TYP-3) | a —_b70 ea oa DIA a LY 49 I | © oy P| ES<br>noveworpaesewton = ugoo 2” Sl 2 ee<br>MODEL E97. 10RBP ms 62ee JZ!)7 7<br>we YAMit | | tt | |<br>°5 4 8 12 16<br>Dimensions: in. (mm) POWER DISSIPATION {WATTS}<br>**----- End of picture text -----**<br>


**39** 

`WTS001_p26-49  6/14/07  10:56 AM  Page 40` 

## **Board Level Heat Sinks** 

## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS** 

## **Labor-Saving SpeedClip™ Heat Sinks for Vertical Board Mounting** 

**667 SERIES** 

||**667 SERIES**|**Labor-Saving SpeedClip™ Heat Sinks for Vertical Board Mounting**|**Labor-Saving SpeedClip™ Heat Sinks for Vertical Board Mounting**|**Labor-Saving SpeedClip™ Heat Sinks for Vertical Board Mounting**|**Labor-Saving SpeedClip™ Heat Sinks for Vertical Board Mounting**|**Labor-Saving SpeedClip™ Heat Sinks for Vertical Board Mounting**||||
|---|---|---|---|---|---|---|---|---|---|
||**667 SERIES**|**Labor-Saving SpeedClip™ Heat Sinks for Vertical Board Mounting**|**Labor-Saving SpeedClip™ Heat Sinks for Vertical Board Mounting**|**Labor-Saving SpeedClip™ Heat Sinks for Vertical Board Mounting**|**Labor-Saving SpeedClip™ Heat Sinks for Vertical Board Mounting**|**Labor-Saving SpeedClip™ Heat Sinks for Vertical Board Mounting**|||TO-220|
||||**Height Above**||**Maximum**|**Thermal Performance at Typical Load**||||
||**Standard P/N**||**PC Board “A”**||**Footprint**|**Natural**|**Forced**||**Weight**|
|**Standoff Pin**||**Plain Pin**|**in.(mm)**||**in.(mm)**|**Convection**|**Convection**||**lbs(grams)**|
|667-10ABESP||667-10ABPP|1.000 (25.4)|1.375 (34.9) x 0.500 (12.7)|1.375 (34.9) x 0.500 (12.7)|76°C @ 6W|5.8°C/W @ 200 LFM|0.0240 (11.0)||
|667-15ABESP||667-15ABPP|1.500 (38.1)|1.375 (34.9) x 0.500 (12.7)|1.375 (34.9) x 0.500 (12.7)|66°C @ 6W|5.5°C/W @ 200 LFM|0.0340 (15.6)||
|667-20ABESP||667-20ABPP|2.000 (50.8)|1.375 (34.9) x 0.500 (12.7)|1.375 (34.9) x 0.500 (12.7)|58°C @ 6W|4.7°C/W @ 200 LFM|0.0460 (21.0)||
|667-25ABESP||667-25ABPP|2.500(63.5)|1.375|1.375(34.9)x 0.500(12.7)|48°C @ 6W|4.2°C/W @ 200 LFM|0.0580(26.2)||
|**Wave-solderable pins.**Material: Aluminum, Black Anodized|||Material: Aluminum, Black Anodized|||||||



Excellent performance, choice of wave-solderable plain pins (PP-Type) or wave-solderable hex-shaped standoff pins (SP-Type), and reduced assembly cost. **Note** : **Order 330 SC or 285 SC SpeedClip™ separately** . 

**==> picture [526 x 110] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS 667 SERIES NATURAL AND FORCED<br>(12.7)0.500 [REF] (NOMINAL)0.093(2.4) DIA STANDOFF (EXTRUSION PROFILE 8073)PLAIN CONVECTION CHARACTERISTICSAIR VELOCITY (FPM)<br>(34.9)1.375 ro| [REF] |< (18.5)0.730 —,re Pe| 0.180(4.6) [DIA] (25.4)1.000 PINS"SP" - 0.093(2.4)  [DIA] PINS"PP" i? f InstalledNominal330SCSpeedForceClip4 lb 1008060 0 aFANAS 200 400 a 600 EEEa 800 1000543<br><—_  vy rs ? PSN|} If AKRDN<br>0.062(1.6) [REF] 0.125 (3.2) DIA [Zye A(17.0)0.670 nh d = | bo 0.130 (3.3)0 m .044 (1.1) (STANDOFF) + I  |mez* 0.156(4.0) InstalledNominal285SCSpeedForce10 lbClip 40200 0 Yi77AtT| 4 A4|| | 8 | Eee | 12 tt| | 16 tt 20210<br>RAISED BOSS x 0.030 (0.8) HIGH Dimensions: in. (mm) POWER DISSIPATION (WATTS)<br>5ABP<br>P<br>667-2<br>10AB<br>6672-5ABP 667-<br>P<br>667-<br>10AB<br>C) °<br>C/WATT) °<br>HEAT SINK TEMPERATURE RISE ABOVE AMBIENT ( THERMAL RESISTANCE SINK TO AMBIENT (<br>**----- End of picture text -----**<br>


## **626 & 627 SERIES** 

## **High-Efficiency Heat Sinks for Vertical Board Mounting** 

TO-218, TO-220 

|||**Height Above**|**Maximum**|**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**|
|---|---|---|---|---|---|
|**Standard**|**Standard**|**PC Board “A”**|**Footprint**|**Natural**|**Forced**|
|**P/N**|**P/N**|**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|
|626-10ABEP|627-10ABP|1.000 (25.4)|1.375 (34.9) x .500 (12.7)|76°C @ 6W|5.8°C/W @ 200 LFM|
|626-15ABEP|627-15ABP|1.500 (38.1)|1.375 (34.9) x .500 (12.7)|65°C @ 6W|5.5°C/W @ 200 LFM|
|626-20ABEP|627-20ABP|2.000 (50.8)|1.375 (34.9) x .500 (12.7)|55°C @ 6W|4.7°C/W @ 200 LFM|
|626-25ABEP|627-25ABP|2.500(63-5)|1.375(34.9)x .500(12.7)|48°C @ 6W|4.2°C/M @ 200 LFM|
|**Wave-solderable pins.**|**Wave-solderable pins.**Material: Aluminum, Black Anodized|Material: Aluminum, Black Anodized||||



**==> picture [456 x 13] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS 626 AND 627 SERIES NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>**----- End of picture text -----**<br>


**==> picture [68 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


**40** 

`WTS001_p26-49  6/14/07  10:56 AM  Page 41` 

**Board Level Heat Sinks** 

## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS** 

## **High-Performance Heat Sinks for Vertical Board Mounting** 

## **647 SERIES** 

|**647 SERIES**||**High-Performance Heat Sinks for Vertical Board Mounting**|**High-Performance Heat Sinks for Vertical Board Mounting**|**High-Performance Heat Sinks for Vertical Board Mounting**|||
|---|---|---|---|---|---|---|
|**647 SERIES**||**High-Performance Heat Sinks for Vertical Board Mounting**|**High-Performance Heat Sinks for Vertical Board Mounting**|**High-Performance Heat Sinks for Vertical Board Mounting**||TO-220|
|||**Height Above**||**Thermal Performance at Typical Load**|||
|**Standard**||**PC Board “A”**|**Maximum Footprint**|**Natural**|**Forced**|**Weight**|
|**P/N**||**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|**lbs.(grams)**|
|647-1OABEP||1.000 (25.4)|1.650 (41.9) x 1.000 (25.4)|42°C @ 6W|3.8°C/W @ 200 LFM|0.055 (24.95)|
|647-15ABEP||1.500 (38.1)|1.650 (41.9) x 1.000 (25.4)|37°C @ 6W|3.5°C/W @ 200 LFM|0.075 (34.02)|
|647-175ABEP||1.750 (44.5)|1.650 (41.9) x 1.000 (25.4)|34°C @ 6W|3.3°C/W @ 200 LFM|0.090 (40.82)|
|647-20ABEP||2.000 (50.8)|1.650 (41.9) x 1.000 (25.4)|31°C @ 6W|3.1°C/W @ 200 LFM|0.104 (47.17)|
|647-25ABEP||2.500(63.5)|1.650(41.9)x 1.000(25.4)|25°C @ 6W|2.8°C/W @ 200 LFM|0.125(56.70)|
|Material: Aluminum, Black Anodized||Material: Aluminum, Black Anodized|||||



Wave-solderable pins on 1 in. centers for vertical mounting of larger devices on printed circuit boards. Maximum semiconductor package width: 0.625 (15.9). Refer to the Accessory 

Products section for thermal interface materials, 126 Series silicone-free thermal compounds, and other accessories products. 

## **MECHANICAL DIMENSIONS** 

**==> picture [242 x 114] intentionally omitted <==**

**----- Start of picture text -----**<br>
NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>0.156(4.0)  (ryp.o) AIR VELOCITY (LEM)<br>wee 199<br>aS “f | T TT 7 TT<br>—F Pe ol | | |lilt|<br>1.000 cinea | |NITNo TTone T<br>REF Ba gol | iWO<br>+ee)| eei of | Saoer,<br>+ 33“ PSS)<br>ones(2.4) DIA ew52 ol  [ZTorAeTTT | earasase<br>647 SERIES ; we etTPP<br>(EXTRUSION PROFILE 5195) 0 4 8 12 To16<br>**----- End of picture text -----**<br>


**==> picture [68 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


## **657 SERIES** 

## **High-Performance Heat Sinks for Vertical Board Mounting** 

TO-220, TO-247, TO-218 

||**Height Above**|**Height Above**|**Maximum**|**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|---|---|---|---|---|---|---|
|**Standard**||**PC Board “A”**|**Footprint**|**Natural**|**Forced**|**Weight**|
|**P/N**||**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|**lbs(grams)**|
|657-10ABEP||1.000 (25.4)|1.650 (41.9) x 1.000 (25.4)|41°C @ 6W|3.7°C/W @ 200 LFM|0.0515 (23.36)|
|657-15ABEP||1.500 (38.1)|1.650 (41.9) x 1.000 (25.4)|38°C @ 6W|3.3°C/W @ 200 LFM|0.0760 (34.60)|
|657-20ABEP||2.000 (50.8)|1.650 (41.9) x 1.000 (25.4)|32°C @ 6W|2.9°C/W @ 200 LFM|0.1030 (47.00)|
|657-25ABEP||2.500(63.5)|1.650(41.9)x 1.000(25.4)|25°C @ 6W|2.7°C/W @ 200 LFM|0.1250(57.00)|
|**Wave-solderable pins.**Material: Aluminum, Black Anodized|||Material: Aluminum, Black Anodized||||



**==> picture [293 x 165] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS 657 SERIES<br>—| 1:31.000 pee h— {t+—— 4 —— 0.156(4.0) TYP2<br>i 0.093<br>1.650 | |eeet—“C:iC‘CsCY | (2.4) DIA<br>(41.9)<br>| REF“0.670(17.0) 0062 oF% 1.000<br> REF 8) 5.4)<br>Sos=<br>Tt a=<br>0.144<br>(3.7) 0.850<br>DIA THRU (21.6)<br>657 SERIES<br>(EXTRUSION PROFILE 6533)<br>Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


**==> picture [95 x 14] intentionally omitted <==**

**----- Start of picture text -----**<br>
NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>**----- End of picture text -----**<br>


**41** 

`WTS001_p26-49  6/14/07  10:56 AM  Page 42` 

## **Board Level Heat Sinks** 

## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS** 

## **657 SERIES High-Performance Notched Heat Sinks for Vertical Board Mounting** 

|**657 SERIES**|**High-Performance Notched Heat Sinks for Vertical Board Mounting**|**High-Performance Notched Heat Sinks for Vertical Board Mounting**|**High-Performance Notched Heat Sinks for Vertical Board Mounting**||
|---|---|---|---|---|
|**657 SERIES**|**High-Performance Notched Heat Sinks for Vertical Board Mounting**|**High-Performance Notched Heat Sinks for Vertical Board Mounting**|**High-Performance Notched Heat Sinks for Vertical Board Mounting**|TO-220, TO-247, TO-218|
||**Height Above**|**Maximum**|**Thermal Performance at Typical Load**||
|**Standard**|**PC Board “A”**|**Footprint**|**Natural**|**Forced**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|
|657-10ABEPN|1.000 (25.4)|1.650 (41.9) x 1.000 (25.4)|41°C @ 6W|3.7°C/W @ 200 LFM|
|657-15ABEPN|1.500 (38.1)|1.650 (41.9) x 1.000 (25.4)|38°C @ 6W|3.3°C/W @ 200 LFM|
|657-20ABEPN|2.000 (50.8)|1.650 (41.9) x 1.000 (25.4)|32°C @ 6W|2.9°C/W @ 200 LFM|
|657-25ABEPN|2.500(63.5)|1.650(41.9)x 1.000(25.4)|25°C @ 6W|2.7°C/W @ 200 LFM|
|**Wave-solderable pins.**Material: Aluminum, Black Anodized||Material: Aluminum, Black Anodized|||



**MECHANICAL DIMENSIONS** —+| 

**NATURAL AND FORCED CONVECTION CHARACTERISTICS** 

**==> picture [59 x 96] intentionally omitted <==**

**----- Start of picture text -----**<br>
657 SERIES<br>657 SERIES<br>(EXTRUSION PROFILE 6533)<br>**----- End of picture text -----**<br>


**Dimensions: in. (mm)** 

## **657 SERIES** 

## **High-Performance Heat Sinks with SpeedClips™ for Vertical Board Mounting** 

TO-220, TO-247, TO-218 

|**Standard**<br>**P/N**<br>657-10ABEPSC<br>657-15ABEPSC<br>657-20ABEPSC<br>657-25ABEPSC|**Height Above**<br>**PC Board “A”**<br>**in.(mm)**<br>1.000 (25.4)<br>1.500 (38.1)<br>2.000 (50.8)<br>2.500(63.5)|**Maximum**<br>**Footprint**<br>**in.(mm)**<br>1.650 (41.9) x 1.000 (25.4)<br>1.650 (41.9) x 1.000 (25.4)<br>1.650 (41.9) x 1.000 (25.4)<br>1.650(41.9)x 1.000(25.4)|**Thermal Performance at Typical Load**<br>**Natural**<br>**Forced**<br>**Convection**<br>**Convection**<br>41°C @ 6W<br>3.7°C/W @ 200 LFM<br>38°C @ 6W<br>3.3°C/W @ 200 LFM<br>32°C @ 6W<br>2.9°C/W @ 200 LFM<br>25°C @ 6W<br>2.7°C/W @ 200 LFM|
|---|---|---|---|



**Wave-solderable pins.** Material: Aluminum, Black Anodized 

## **MECHANICAL DIMENSIONS** 

**Dimensions: in. (mm)** 

**657 SERIES** 

**NATURAL AND FORCED** INCLUDEDSPEEDCLIP™ IN ORDER **CONVECTION CHARACTERISTICS** AIR VELOCITY (LFM) b—I ash. —] | geatoc we a + H _ éa es [1 Pesrmsrsc | gist | al gg | 657-25ABPSC teas] Le (165)65 ‘ agF< ol ysisSS oP ATayeeee Widih.26 of(6.6)Clip: BOguoOatWu ol“|A7a zat|| AerUePSS]:: ——| **657 SERIES** 5B 0 **(EXTRUSION PROFILE 6533)** a 0 POWER4 DISSIPATION8 12 (WATTS)16 

## **High-Performance, High-Power Heat Sinks for Vertical Board Mounting** 

## **677 SERIES** 

|**677 SERIES**||**High-Performance, High-Power Heat Sinks for Vertical Board Mounting**|**High-Performance, High-Power Heat Sinks for Vertical Board Mounting**|||
|---|---|---|---|---|---|
|**677 SERIES**||**High-Performance, High-Power Heat Sinks for Vertical Board Mounting**|**High-Performance, High-Power Heat Sinks for Vertical Board Mounting**||TO-218, TO-220, TO-247<br>15-LEAD Multiwatt|
|||**Height Above**|**Maximum**<br>**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|**Standard**||**PC Board “A”**|**Footprint**<br>**Natural**||**Forced**|
|**P/N**<br>677-10ABEP<br>677-15ABEP<br>~~oo~~<br>~~sss‘~~|~~sss‘~~|**in.(mm)**<br>1.000 (25.4)<br>1.500 (38.1)<br>~~sss‘~~|**in.(mm)**<br>**Convection**<br>1.650 (41.9) x 1.000 (25.4)<br>52°C @ 6W<br>1.650 (41.9) x 1.000 (25.4)<br>46°C @ 6W<br>~~sss‘~~<br>ggg‘ ~~‘ggg~~||**Convection**<br>3.1°C/W @ 200 LFM<br>2.8°C/W @ 200 LFM<br>~~sss‘~~|
|677-20ABEP||2.000 (50.8)|1.650 (41.9) x 1.000 (25.4)<br>40°C @ 6W||2.5°C/W @ 200 LFM|
|677-25ABEP||2.500(63.5)|1.650(41.9)x 1.000(25.4)<br>35°C @ 6W||2.2°C/W @ 200 LFM|
|**Wave-solderable pins.**|**Wave-solderable pins.**Material: Aluminum, Black Anodized||Material: Aluminum, Black Anodized|||



## **MECHANICAL DIMENSIONS** 

**MECHANICAL DIMENSIONS 677 SERIES** | . — (41.9)1.650 i —| any)- |\— | 1.000 i (a4) 100 (25) 1.000 (25.4) **677 SERIES (EXTRUSION PROFILE 8719) Dimensions: in. (mm)** 

**NATURAL AND FORCED CONVECTION CHARACTERISTICS** 

**42** 

`WTS001_p26-49  6/14/07  10:56 AM  Page 43` 

**Board Level Heat Sinks** 

## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS** 

|**690 SERIES**<br>||**690 SERIES**<br>||**HIghest Efficiency/Lowest Unit Cost Heat Sinks**|**HIghest Efficiency/Lowest Unit Cost Heat Sinks**|**HIghest Efficiency/Lowest Unit Cost Heat Sinks**|||TO-3, TO-66, TO-220<br>Lo|TO-3, TO-66, TO-220<br>Lo|TO-3, TO-66, TO-220<br>Lo|
|---|---|---|---|---|---|---|---|---|---|
|||**Height Above**||**Thermal Performance at Typical Load**||**Semiconductor**|||**Semiconductor**|
||**Standard**|**PC Board**|**Outline Dimensions**|**Natural**|**Forced**|**Mounting**|||**Weight**|
||**P/N**|**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|**Hole Pattern**|||**lbs.(grams)**|
||690-3B|1.310 (33.3)|1.860 (47.2)-sq|44°C @ 7.5W|2.0°C/W @ 400 LFM|(1) TO-3|||0.0700 (31.75)|
||690-66B|1.310 (33.3)|1.860 (47.2)-sq|44°C @ 7.5W|2.0°C/W @ 400 LFM|(1) TO-66|||0.0700 (31.75)|
||690-220B|1.310(33.3)|1.860(47.2)-sq|44°C @ 7.5W|2.0°C/W @ 400 LFM|(2)TO-220|||0.0700(31.75)|
||Material: Aluminum, Black Anodized|||||||||



These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are available in three standard types to mount and cool one TO-3 or TO-66 metal power semiconductor type or two plastic package TO-220 power semiconductor types. For higher power 

semiconductors, the 690 Series can dissipate up to 20 watts while maintaining a mounting surface temperature rise above ambient air temperature of no more than 91°C. 

## **MECHANICAL DIMENSIONS** 

**==> picture [287 x 108] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.144 SEMICONDUCTOR MOUNTING HOLES<br>025037) DIATHRU<br>0.190 DIA THRU ost 0.440<br>all (4.8) (TYP-2) 0.960 fan’, Gita) Pe)<br>1187 (24.4) .<br>ia (| 62 (ag b 3 oa<br>1.090 aQ ¢ OOH8) 1 fom“tee7 aot<br>690 SERIES 0.430(109)L iL. 0070 9.100@5) || 9,2001) | assocAENaaXx<br>20 DIA HARU be (18) (TYP-2) O55 O18 THRU (4) es 0,190<br>(5.6) (TYP-2) : (42) 48)<br>TO-3 TO-66 *TWO TO-220’S<br>**----- End of picture text -----**<br>


**==> picture [94 x 13] intentionally omitted <==**

**----- Start of picture text -----**<br>
NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>**----- End of picture text -----**<br>


**==> picture [68 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


## **680 SERIES** 

## **Maximum Efficiency Omnidirectional Heat Sinks** 

TO-3,  TO-220 

|**Standard**<br>**P/N**<br>680-5A<br>680-75A<br>680-10A|**Height Above**<br>**PC Board “A”**<br>**in.(mm)**<br>0.500 (12.7)<br>0.750 (19.1)<br>1.000 (25.4)|**Horizontal Mounting**<br>**Footprint Dimensions**<br>**in.(mm)**<br>1.810 (46.0)-sq<br>1.810 (46.0)-sq<br>1.810 (46.0)-sq|**Thermal Performance at Typical Load**<br>**Natural**<br>**Forced**<br>**Convection**<br>**Convection**<br>70°C @ 7.5W<br>3.0°C/W @ 400 LFM<br>58°C @ 7.5W<br>2.4°C/W @ 400 LFM<br>52°C @ 7.5W<br>2.0°C/W @ 400 LFM|**Thermal Performance at Typical Load**<br>**Natural**<br>**Forced**<br>**Convection**<br>**Convection**<br>70°C @ 7.5W<br>3.0°C/W @ 400 LFM<br>58°C @ 7.5W<br>2.4°C/W @ 400 LFM<br>52°C @ 7.5W<br>2.0°C/W @ 400 LFM|**Semiconductor**<br>**Mounting**<br>**Hole Pattern**<br>(1) TO-3<br>(1) TO-3<br>(1) TO-3|**Weight**<br>**lbs.(grams)**<br>0.0700 (31.75)<br>0.0900 (40.82)<br>0.0980 (44.45)|
|---|---|---|---|---|---|---|
|680-125A|1.250 (31.8)|1.810 (46.0)-sq|45°C @ 7.5W|1.5°C/W @ 400 LFM|(1) TO-3|0.1100 (49.90)|
|680-5220|0.500 (12.7)|1.810 (46.0)-sq|7O°C @ 7.5W|3.0°C/W @ 400 LFM|(2) TO-220|0.0700 (31.75)|
|680-75220|0.750 (19.1)|1.810 (46.0)-sq|58°C @ 7.5W|2.4°C/W @ 400 LFM|(2) TO-220|0.0900 (40.82)|
|680-10220|1.000 (25.4)|1.810 (46.0)-sq|52°C @ 7.5W|2.0°C/W @ 400 LFM|(2) TO-220|0.0980 (44.45)|
|680-125220|1.250(31.8)|1.810(46.0)-sq|45°C @ 7.5W|1.5°C/W @ 400 LFM|(2)TO-220|0.1100(49.90)|



Material: Aluminum, Black Anodized 

Achieve optimum natural convection cooling per unit volume occupied above the printed circuit board for TO-3 (one semiconductor package per heat sink) or for two TO-220 style cases, when this low-cost heat sink is used. Any mounting attitude will provide free circulation of air in 

natural convection applications. These 680 Series heat sinks can also be specified without any semiconductor mounting hole pattern by specifying suffix “K” (Example: 680-5K). 

**==> picture [461 x 201] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICALDIMENSIONS (46.0)(38.1)1.500 ! 0.156(4.0) 680 SERIES CONVECTION CHARACTERISTICSNATURAL AND FORCED  AIR VELOCITY (LFM)<br>if __100 209 300_400 500.600 700 800 $00<br>; | wus (EE TAZ EP T<br>/ < [A] Sea—_ CLLys eee;z1 =<br>(46.0)1.810 ky i Cre — (38.1)1500 pp 1 one22 ofjfNV]Lowe | | oT| tt tTtb<br>ks / | 0.147 A en| eRe ff<br>SN —~67) | Big 2= 2<br>| oil] \e (4 PLACES) re y SS<br>(39.6)1.560 (8 PLACES) (33.3)1.310 (8 PLACES) =(4.8)1 REF FE0 POWERoS5 DISSIPATION10 i520(WATTS) 2,<br>SEMICONDUCTOR MOUNTING HOLES<br>A 220 K<br>0.190 4 Q aN 0440 Gy<br>#8) fl (14.2) og) OIA (2)<br>0200 woe(10.9) (80.2),1.187 0.070 4 ann“1 eo) R BLANK<br>66) DAR) 6 NI he (1.8) F— 7 0.095 NO HOLES<br>0.070; - Nw’ 45° 0.580a0.165Se oo.<br>Dimensions: in. (mm)<br>i TO-3 @y ce tay” *TWO TO-220’S 42) 7 8)<br>**----- End of picture text -----**<br>


**43** 

`WTS001_p26-49  6/14/07  10:56 AM  Page 44` 

## **Board Level Heat Sinks** 

## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS** 

**==> picture [86 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
Low-Height Heat Sinks<br>**----- End of picture text -----**<br>


## **601 & 603 SERIES** 

**601 & 603 SERIES** DO-4/DO-5 Diodes **Footprint Mounting Thermal Performance at Typical Load Standard Dimensions Height Hole Dia. Natural Forced Weight P/N in. (mm) in. (mm) in. (mm) Convection Convection lbs. (grams)** 601E 2.000 (50.8) x 1.250 (31.8) 0.562 (14.3) 0.200 (5.1) 52°C @ 5.0W 4.5°C/W @ 175 LFM 0.0500 (22.68) 601F 2.000 (50.8) x 1.250 (31.8) 0.562 (14.3) 0.270 (6.9) 52°C @ 5.0W 4.5°C/W @ 175 LFM 0.0500 (22.68) 601K 2.000 (50.8) x 1.250 (31.8) 0.562 (14.3) None 52°C @ 5.0W 4.5°C/W @ 175 LFM 0.0500 (22.68) 603K 2.000 (50.8) x 2.000 (50.8) 0.562 (14.3) None 41°C @ 5.0W 4.0°C/W @ 175 LFM 0.0810 (36.74) Material: Aluminum Alloy, Black Anodized 

Use these low-height heat sinks on printed circuit board applications for TO-66 power semiconductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient heat 

dissipation are required. The 601 and 603 Series may also be attached to enclosure panels or brackets using isolation hardware where necessary. 

## **MECHANICAL DIMENSIONS** 

**==> picture [471 x 245] intentionally omitted <==**

**----- Start of picture text -----**<br>
NATURAL AND FORCED<br>1.250 0.562 2.000 I CONVECTION CHARACTERISTICS<br>(31.75} (14.3) (60.8)<br>AIR VELOCITY (LFM}<br>E wx 1002 too<br>op te UNG<br>po—1— [ome<sfa 80>\WVxVeey | [TT tT TT ytCo<br>E ==4 — 2.000(60.8) 0.098(2.4)~— __fe a(208)0.812 i<SES)feFux6229> 70K SceeaasaDLP40oAsxsot SSeSA/S|| eet= saae ee ee<br>a ss <w if | TT tT TT tT tT Py<br>re oh TT tT | | | 7 tt<br>oe POWER DISSIPATION (WATTS)<br>603 SERIES<br>601 SERIES (EXTRUSION PROFILE 1284)<br>(EXTRUSION PROFILE 1284)<br>SEMICONDUCTOR MOUNTING HOLES<br>K E F<br>200 0,500 (12.7) 0,750 (19.1<br>(gi) DATHRU—_DIAFREE 0270 oatHru  “biarRee?<br>6. OF ANODIZE (6.9) OF ANODIZE<br>BLANK BOTH SIDES BOTH SIDES<br>NO HOLES oN4 J ou,n<br>“S ce .<br>Dimensions: in. (mm)<br>**----- End of picture text -----**<br>


## **Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors** 

## **641 SERIES** 

|**641 SERIES**|**641 SERIES**||**Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors**|**Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors**|**Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors**|**Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors**|**Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors**|TO-3|
|---|---|---|---|---|---|---|---|---|
||||**Outline**||**Mounting**|**Thermal Performance at Typical Load**|||
|**Standard**|||**Dimensions**|**Height**|**Hole**|**Natural**|**Forced**|**Weight**|
|**P/N**|||**in. (mm)**|**in. (mm)**|**Pattern**|**Convection**|**Convection**|**lbs. (grams)**|
|641A|4.125 (104.8) x||4.125 (104.8) x 3.000 (76.2)|1.000 (25.4)|(1) TO-3|36°C @ 15W|0.9°C/W @ 250 LFM|0.2900 (131.54)|
|641K|4.125||4.125(104.8)x 3.000(76.2)|1.000(25.4)|None|36°C @ 15W|0.9°C/W @ 250 LFM|0.2900(131.54)|



Available with a standard TO-3 mounting hole pattern predrilled for cost-effective mounting in limited-height applications, the 641 Series provides maximum performance in natural convection with an optimized heat sink surface area. The 641K type with an open channel area of 

1.300 in. (33.0) and no predrilled mounting holes can be adapted to meet mounting requirements for most metal case power semiconductor types. Material: Aluminum Alloy, Black Anodized. 

**==> picture [472 x 80] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL 641 SERIES NATURAL AND FORCED<br>DIMENSIONS 1.000 (EXTRUSION PROFILE 1371) 3.000 SEMICONDUCTOR MOUNTING HOLES CONVECTION CHARACTERISTICS<br>(25.4) ft E 762)1 ; on AIR VELOCITY (FM) sm<br>=r A K geme<br>0.187 ee ott ae:<br>42) . (33.9)1.335 |————— —!— | (95.3); rn)4.125 ti,0190 pyO42)fo; P139002) BLANK Faéws ee me50 a aei aC5<br>——7 0.490 74 =LZ Nene ES £8ee 30al | “4peteh3<br>(1.4) a (2.4) 2.500 —4| - 0.260 6.070 0.220 ae oh pe et<br>Dimensions: in. (mm) , (635) (6.4) 8) (66) CAP) ae on 1020 | a<br>**----- End of picture text -----**<br>


**44**
Updated at April 29, 2026
About Novapart

Novapart is a B2B electronic component broker specialising in stock shortages and cost reduction. We source hard-to-find parts and identify compliant alternatives across a catalogue of 410,000+ components from 500+ manufacturers.
Learn more →
Stock Shortage Specialist

When a component is unavailable, discontinued or has an unacceptable lead time, we tap into our network of vetted European and Asian distributors to source what you need — without compromising on quality or traceability.
Request a quote →
Compliant Alternatives

We identify pin-to-pin, electrically equivalent substitutes that meet the same certifications (RoHS, AEC-Q100, REACH) as your original specification — validated against datasheets, not just part numbers. Often at a lower cost.
BOM Analysis service →