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647-15ABPE
HEAT SINK
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: WAKEFIELD THERMAL
- Product type: Natural Convection Heat Sinks
- Thermal Resistance:6.17°C/W; Packages Cooled:TO-220; External Width - Metric:41.9mm; External Height - Metric:38.1mm; External Length - Metric:25.4mm; External Diameter - Metric:-; Heat Sin 80K7229
- Thermal Resistance: 6.17°C/W
| Delivery and price | |
|---|---|
| Units per pack | 1000 |
| Price | 1.92 € |
| Current stock | 1000+ |
| Lead time | 30 days |
Datasheet
## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**
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Slim Profile Unidirectional Fin Vertical Mount Heat Sink<br>**----- End of picture text -----**<br>
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634 SERIES<br>**----- End of picture text -----**<br>
|**634 SERIES**|**Slim Profile Unidirectional Fin Vertical Mount Heat Sink**|**Slim Profile Unidirectional Fin Vertical Mount Heat Sink**|**Slim Profile Unidirectional Fin Vertical Mount Heat Sink**||
|---|---|---|---|---|
|**634 SERIES**|**Slim Profile Unidirectional Fin Vertical Mount Heat Sink**|**Slim Profile Unidirectional Fin Vertical Mount Heat Sink**|**Slim Profile Unidirectional Fin Vertical Mount Heat Sink**|_TO-220 and TO-218_|
|**Standard**||**Height Above**|**Footprint**||
|**Plain Pin**|**P/N**<br>**Without Pin**|**PC Board**<br>**in.(mm)**|**Dimensions**<br>**in.(mm)**|**Weight**<br>**lbs.(grams)**|
|634-10ABEP|634-10AB|1.000 (25.4)|0.640 (16.26) x 0.640 (16.26)|0.016 (7.48|
|634-15ABEP|634-15AB|1.500 (38.1)|0.640 (16.26) x 0.640 (16.26)|0.025 (11.21)|
|634-20ABEP|634-20AB|2.000(50.8)|0.640(16.26)x 0.640(16.26)|0.033(14.95)|
|Material: Aluminum, Black Anodized.|||||
These slim profile unidirectional fin heat sinks offer users two assembly alternatives for vertisolderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications cally mounting TO-220 and TO-218 components. Models are available with or without wavewhere quick assembly is needed and space is at a premium.
## **MECHANICAL DIMENSIONS**
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Notes:<br>1. Thermal compound is as-<br>sumed between device<br>and heat sink.<br>2. Tab temp with longer heat<br>sink (634-20ABP) will<br>typically be about 15%<br>cooler. Tab temp with<br>shorter heat sink<br>(634- I0ABP) will typically<br>be about 25% higher.<br>**----- End of picture text -----**<br>
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634 SERIES<br>TYPICAL THERMAL PERFORMANCE<br>FOR 634-15ABP<br>**----- End of picture text -----**<br>
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Dimensions: in. (mm)<br>**----- End of picture text -----**<br>
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637 SERIES<br>**----- End of picture text -----**<br>
## **High-Efficiency Heat Sinks For Vertical Board Mounting**
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TO-220<br>**----- End of picture text -----**<br>
||**Height Above**||**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|---|---|---|---|---|---|
|**Standard**|**PC Board “A”**|**Maximum Footprint**|**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|**lbs.(grams)**|
|637-10ABEP|1.000 (25.4)|1.375 (34.9) x 0.500 (12.7)|76°C @ 6W|5.8°C/W @ 200 LFM|0.023 (10.43)|
|637-15ABEP|1.500 (38.1)|1.375 (34.9) x 0.500 (12.7)|65°C @ 6w|5.5°C/W @ 200 LFM|0.035 (15.88)|
|637-20ABEP|2.000 (50.8)|1.375 (34.9) x 0.500 (12.7)|55°C @ 6W|4.7°C/W @ 200 LFM|0.050 (22.68)|
|637-25ABEP|2.500(63.5)|1.375(34.9)x 0.500(12.7)|48°C @ 6W|4.2°C/W @ 200 LFM|0.062(28.12)|
|Material: Aluminum, Black Anodized|Material: Aluminum, Black Anodized|||||
Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maximum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight and
board space occupied must be minimized. Refer to the Accessory products section for thermal interface materials, thermal compounds, and other accessories products.
**MECHANICAL DIMENSIONS 637 SERIES (EXTRUSION PROFILE 5183) NATURAL AND FORCED CONVECTION CHARACTERISTICS**
**Dimensions: in. (mm)**
**39**
**Board Level Heat Sinks**
## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**
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667 SERIES Labor-Saving SpeedClip™Heat Sinks for Vertical Board Mounting TO-220<br>Height Above Maximum Thermal Performance at Typical Load<br>Standard P/N PC Board “A” Footprint Natural Forced Weight<br>ssc‘ Standoff Pin Plain Pin in. (mm) in. (mm) Convection Convection lbs (grams)<br>zs te 4 ee 667-10ABESP 667-10ABPP 1.000 (25.4) 1.375 (34.9) x 0.500 (12.7) ggg 76°C @ 6W ‘gg 5.8°C/W @ 200 LFM 0.0240 (11.0)<br>667-15ABESP 667-15ABPP 1.500 (38.1) 1.375 (34.9) x 0.500 (12.7) 66°C @ 6W 5.5°C/W @ 200 LFM 0.0340 (15.6)<br>667-20ABESP 667-20ABPP 2.000 (50.8) 1.375 (34.9) x 0.500 (12.7) 58°C @ 6W 4.7°C/W @ 200 LFM 0.0460 (21.0)<br>667-25ABESP 667-25ABPP 2.500 (63.5) 1.375 (34.9) x 0.500 (12.7) 48°C @ 6W 4.2°C/W @ 200 LFM 0.0580 (26.2)<br>Wave-solderable pins. Material: Aluminum, Black Anodized<br>Excellent performance, choice of wave-solderable plain pins (PP-Type) or wave-solderable hex-shaped standoff pins (SP-Type), and reduced assembly cost.<br>Note : Order 330 SC or 285 SC SpeedClip™separately .<br>MECHANICAL DIMENSIONS 667 SERIES NATURAL AND FORCED<br>0.500 ih. IA (EXTRUSION PROFILE 8073) CONVECTION CHARACTERISTICS<br>(12.7) [EF] (NOMINAL) STANDOFF PLAIN AIR VELOCITY (FPM)<br>PINS PINS 0 200 400 600 800 1000<br>"SP" "PP" 100 5<br>7: rr - oe CrDIRYLIYLL<br>(34.9) [EF] (4.6) IA 80 4<br>(18.5) (25.4) (2.4) [DIA] 60 3<br>40 2<br>u k ; a @ 0.044 (1.1) (STANDOFF) 4.0001 © A “rare!“tit, HORA PRIEEETes<br>20 1<br>(1.6) EF 0.125 (3.2) DIAI A(17.0) — 0.130 (3.3) (4.0) Installed vomit 0 0 A 4 8 12 16 200<br>RAISED BOSS x 0.030 (0.8) HIGH Dimensions: in. (mm) POWER DISSIPATION (WATTS)<br>5ABP<br>P<br>667-2<br>10AB<br>6672-5ABP 667-<br>P<br>667-<br>10AB<br>C) °<br>C/WATT) °<br>HEAT SINK TEMPERATURE RISE ABOVE AMBIENT ( THERMAL RESISTANCE SINK TO AMBIENT (<br>**----- End of picture text -----**<br>
## **626 & 627 SERIES High-Efficiency Heat Sinks for Vertical Board Mounting**
|**626 & 627 SERIES**|**High-Efficiency Heat Sinks for Vertical Board Mounting**<br>**626 & 627 SERIES**|**High-Efficiency Heat Sinks for Vertical Board Mounting**|**High-Efficiency Heat Sinks for Vertical Board Mounting**|||_TO-218, TO-220_|
|---|---|---|---|---|---|---|
|||**Height Above**|**Maximum**|**Thermal Performance at Typical Load**|||
|**Standard**|**Standard**|**PC Board “A”**|**Footprint**|**Natural**||**Forced**|
|**P/N**|**P/N**|**in.(mm)**|**in.(mm)**|**Convection**|**Convection**||
|626-10ABEP|627-10ABP|1.000 (25.4)|1.375 (34.9) x .500 (12.7)|76°C @ 6W|5.8°C/W @ 200 LFM||
|626-15ABEP|627-15ABP|1.500 (38.1)|1.375 (34.9) x .500 (12.7)|65°C @ 6W|5.5°C/W @ 200 LFM||
|626-20ABEP|627-20ABP|2.000 (50.8)|1.375 (34.9) x .500 (12.7)|55°C @ 6W|4.7°C/W @ 200 LFM||
|626-25ABEP|627-25ABP|2.500(63-5)|1.375(34.9)x .500(12.7)|48°C @ 6W|4.2°C/M @ 200 LFM||
|**Wave-solderable pins.**Material: Aluminum, Black Anodized||Material: Aluminum, Black Anodized|||||
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MECHANICAL DIMENSIONS 626 AND 627 SERIES NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>**----- End of picture text -----**<br>
**Dimensions: in. (mm)**
**40**
## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**
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647 SERIES High-Performance Heat Sinks for Vertical Board Mounting<br>**----- End of picture text -----**<br>
|**647 SERIES**|**High-Performance Heat Sinks for Vertical Board Mounting**|**High-Performance Heat Sinks for Vertical Board Mounting**|**High-Performance Heat Sinks for Vertical Board Mounting**|||
|---|---|---|---|---|---|
|**647 SERIES**|**High-Performance Heat Sinks for Vertical Board Mounting**|**High-Performance Heat Sinks for Vertical Board Mounting**|**High-Performance Heat Sinks for Vertical Board Mounting**||_TO-220_|
||**Height Above**||**Thermal Performance at Typical Load**|||
|**Standard**|**PC Board “A”**|**Maximum Footprint**|**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|**lbs.(grams)**|
|647-1OABEP|1.000 (25.4)|1.650 (41.9) x 1.000 (25.4)|42°C @ 6W|3.8°C/W @ 200 LFM|0.055 (24.95)|
|647-15ABEP|1.500 (38.1)|1.650 (41.9) x 1.000 (25.4)|37°C @ 6W|3.5°C/W @ 200 LFM|0.075 (34.02)|
|647-175ABEP|1.750 (44.5)|1.650 (41.9) x 1.000 (25.4)|34°C @ 6W|3.3°C/W @ 200 LFM|0.090 (40.82)|
|647-20ABEP|2.000 (50.8)|1.650 (41.9) x 1.000 (25.4)|31°C @ 6W|3.1°C/W @ 200 LFM|0.104 (47.17)|
|647-25ABEP|2.500(63.5)|1.650(41.9)x 1.000(25.4)|25°C @ 6W|2.8°C/W @ 200 LFM|0.125(56.70)|
|Material: Aluminum, Black Anodized||||||
Wave-solderable pins on 1 in. centers for vertical mounting of larger devices on printed circuit boards. Maximum semiconductor package width: 0.625 (15.9). Refer to the Accessory
Products section for thermal interface materials, 126 Series silicone-free thermal compounds, and other accessories products.
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MECHANICAL DIMENSIONS<br>re|<br>4 res [4]<br>|<br>‘Bay,<br>OU<br>HOLENGT<br>MCIDEL GH<br>Dimensions: in. (mm)<br>**----- End of picture text -----**<br>
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NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>- {fr bindita rs oe AReeVELODTY Fie<br>a =i<br>ni 5 ea<br>— jt re 3i “a a,<br>na oy a8 7 Zot TT:<br>647 SERIES “ ee |,<br>(EXTRUSION PROFILE 5195) rr<br>**----- End of picture text -----**<br>
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657 SERIES High-Performance Heat Sinks for Vertical Board Mounting<br>**----- End of picture text -----**<br>
_TO-220, TO-247, TO-218_
||**Height Above**|**Maximum**|**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|---|---|---|---|---|---|
|**Standard**|**PC Board “A”**|**Footprint**|**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|**lbs(grams)**|
|657-10ABEP|1.000 (25.4)|1.650 (41.9) x 1.000 (25.4)|41°C @ 6W|3.7°C/W @ 200 LFM|0.0515 (23.36)|
|657-15ABEP|1.500 (38.1)|1.650 (41.9) x 1.000 (25.4)|38°C @ 6W|3.3°C/W @ 200 LFM|0.0760 (34.60)|
|657-20ABEP|2.000 (50.8)|1.650 (41.9) x 1.000 (25.4)|32°C @ 6W|2.9°C/W @ 200 LFM|0.1030 (47.00)|
|657-25ABEP|2.500(63.5)|1.650(41.9)x 1.000(25.4)|25°C @ 6W|2.7°C/W @ 200 LFM|0.1250(57.00)|
|**Wave-solderable pins.**Material: Aluminum, Black Anodized||Material: Aluminum, Black Anodized||||
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MECHANICAL DIMENSIONS 657 SERIES NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>—s fay. REF — -/}—— ‘= = be 0.058fa) TYP [2] AIR VELOGITY (FPA)<br>|<br>7 op meee we woe Pall Ang 24 pa<br>‘aso a a<br>iat)| REF a| i ze = | feesG72. ABP<br>| farefir AE Bd(iat) REF , | (354)bee wesp" 2 724; ar<br>.<br>} Pe urP= gh | aSea=<br>| J HB oe)<br>a - | a5 | ae | =<br>head | mn | ee , i eee<br>Gary EAA THR "gia | TH owl T T T T | T<br>z 0 ’ 5 F: *<br>MEAT CSSSIPATED (WATTS!<br>657 SERIES<br>(EXTRUSION PROFILE 6533)<br>Dimensions: in. (mm)<br>**----- End of picture text -----**<br>
**41**
**Board Level Heat Sinks**
## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**
## **High-Performance Notched Heat Sinks for Vertical Board Mounting**
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657 SERIES<br>**----- End of picture text -----**<br>
|**657 SERIES**|**High-Performance Notched Heat Sinks for Vertical Board Mounting**|**High-Performance Notched Heat Sinks for Vertical Board Mounting**|**High-Performance Notched Heat Sinks for Vertical Board Mounting**||
|---|---|---|---|---|
|**657 SERIES**|**High-Performance Notched Heat Sinks for Vertical Board Mounting**|**High-Performance Notched Heat Sinks for Vertical Board Mounting**|**High-Performance Notched Heat Sinks for Vertical Board Mounting**|_TO-220, TO-247, TO-218_|
||**Height Above**|**Maximum**|**Thermal Performance at Typical Load**||
|**Standard**|**PC Board “A”**|**Footprint**|**Natural**|**Forced**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|
|657-10ABEPN|1.000 (25.4)|1.650 (41.9) x 1.000 (25.4)|41°C @ 6W|3.7°C/W @ 200 LFM|
|657-15ABEPN|1.500 (38.1)|1.650 (41.9) x 1.000 (25.4)|38°C @ 6W|3.3°C/W @ 200 LFM|
|657-20ABEPN|2.000 (50.8)|1.650 (41.9) x 1.000 (25.4)|32°C @ 6W|2.9°C/W @ 200 LFM|
|657-25ABEPN|2.500(63.5)|1.650(41.9)x 1.000(25.4)|25°C @ 6W|2.7°C/W @ 200 LFM|
|**Wave-solderable pins.**Material: Aluminum, Black Anodized|||||
## **MECHANICAL DIMENSIONS**
**657 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS** kad ia | jas af| a ee! ae Saeed Te eae 1 fe I aera | 7a" 1"a | | + 4 es **e** r] a aS f I lag = ea | mi Lat = 7 ri 4; TPA escictien|a **657 SERIES** ieCO bele ee a 1 /. **(EXTRUSION PROFILE 6533)** : i [ te
**Dimensions: in. (mm)**
## **High-Performance Heat Sinks with SpeedClips™for Vertical Board Mounting**
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657 SERIES<br>**----- End of picture text -----**<br>
|**657 SERIES**|**High-Performance Heat Sinks with SpeedClips™for Vertical Board Mounting**|**High-Performance Heat Sinks with SpeedClips™for Vertical Board Mounting**|**High-Performance Heat Sinks with SpeedClips™for Vertical Board Mounting**||
|---|---|---|---|---|
|**657 SERIES**|**High-Performance Heat Sinks with SpeedClips™for Vertical Board Mounting**|**High-Performance Heat Sinks with SpeedClips™for Vertical Board Mounting**|**High-Performance Heat Sinks with SpeedClips™for Vertical Board Mounting**|_TO-220, TO-247, TO-218_|
||**Height Above**|**Maximum**|**Thermal Performance at Typical Load**||
|**Standard**|**PC Board “A”**|**Footprint**|**Natural**|**Forced**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|
|657-10ABEPSC|1.000 (25.4)|1.650 (41.9) x 1.000 (25.4)|41°C @ 6W|3.7°C/W @ 200 LFM|
|657-15ABEPSC|1.500 (38.1)|1.650 (41.9) x 1.000 (25.4)|38°C @ 6W|3.3°C/W @ 200 LFM|
|657-20ABEPSC|2.000 (50.8)|1.650 (41.9) x 1.000 (25.4)|32°C @ 6W|2.9°C/W @ 200 LFM|
|657-25ABEPSC|2.500(63.5)|1.650(41.9)x 1.000(25.4)|25°C @ 6W|2.7°C/W @ 200 LFM|
|**Wave-solderable pins.**|**Wave-solderable pins.**Material: Aluminum, Black Anodized||||
## **MECHANICAL DIMENSIONS**
**657 SERIES**
**NATURAL AND FORCED** oy coo REF I +}—— A ani INCLUDSPE **ED** CLIP™IN ORDER **CONVECTION CHARACTERISTICS** AIR VELOCITY (LFM) jiy ee| b— 4)a —} | yhee moTTT__wma,TT (41.9) | FS 540 t I a6) es __|/657-20A8PSC| pee 670 1000 ad gy L/_bs7-26aapsc | Ag OY (17.0) REF 062 REF (13.7) (25.4) L 65 4 ag INS pam gcoe 1 (1.6) Sea (16.5) vt 49 ; Re AI oot] eS | usm su) Jee] 4 PQ—— mmoicin26 (6.6) 5Ga 20) “YBZaSS —__ LC **657 SERIES** Bu Aas | re **(EXTRUSION PROFILE 6533)** = 0 POWER4 DISSIPATION8 12 (WATTS)i **Dimensions: in. (mm)**
## **High-Performance, High-Power Heat Sinks for Vertical Board Mounting**
## **677 SERIES**
|**677 SERIES**|**High-Performance, High-Power Heat Sinks for Vertical Board Mounting**|**High-Performance, High-Power Heat Sinks for Vertical Board Mounting**|**High-Performance, High-Power Heat Sinks for Vertical Board Mounting**||_TO-218, TO-220, TO-247_<br>_15-LEAD Multiwatt_|
|---|---|---|---|---|---|
||**Height Above**|**Maximum**|**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|**Standard**|**PC Board “A”**|**Footprint**|**Natural**||**Forced**|
|**P/N**|**in.(mm)**|**in.(mm)**|**Convection**||**Convection**|
|677-10ABEP|1.000 (25.4)|1.650 (41.9) x 1.000 (25.4)|52°C @ 6W||3.1°C/W @ 200 LFM|
|677-15ABEP|1.500 (38.1)|1.650 (41.9) x 1.000 (25.4)|46°C @ 6W||2.8°C/W @ 200 LFM|
|677-20ABEP|2.000 (50.8)|1.650 (41.9) x 1.000 (25.4)|40°C @ 6W||2.5°C/W @ 200 LFM|
|677-25ABEP|2.500(63.5)|1.650(41.9)x 1.000(25.4)|35°C @ 6W||2.2°C/W @ 200 LFM|
|**Wave-solderable pins.**|**Wave-solderable pins.**Material: Aluminum, Black Anodized|||||
## **MECHANICAL DIMENSIONS**
**MECHANICAL DIMENSIONS 677 SERIES** —§$<——.— fhir[|] —7 L = f uu **677 SERIES (EXTRUSION PROFILE 8719) Dimensions: in. (mm)**
**NATURAL AND FORCED CONVECTION CHARACTERISTICS**
**42**
## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**
## **HIghest Efficiency/Lowest Unit Cost Heat Sinks**
**690 SERIES**
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||||||||
|---|---|---|---|---|---|---|
|TO-3, TO-66, TO-220|
|Height Above|Thermal Performance at Typical Load|Semiconductor|
|Standard|PC Board|Outline Dimensions|Natural|Forced|Mounting|Weight|
|P/N|in. (mm)|in. (mm)|Convection|Convection|Hole Pattern|lbs. (grams)|
|690-3B|1.310 (33.3)|1.860 (47.2)-sq|44°C @ 7.5W|2.0°C/W @ 400 LFM|(1) TO-3|0.0700 (31.75)|
|690-66B|1.310 (33.3)|1.860 (47.2)-sq|44°C @ 7.5W|2.0°C/W @ 400 LFM|(1) TO-66|0.0700 (31.75)|
|690-220B|1.310 (33.3)|1.860 (47.2)-sq|44°C @ 7.5W|2.0°C/W @ 400 LFM|(2) TO-220|0.0700 (31.75)|
|Material: Aluminum, Black Anodized|
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semiconductors, the 690 Series can dissipate up to 20 watts while maintaining a mounting surface temperature rise above ambient air temperature of no more than 91°C.
These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are available in three standard types to mount and cool one TO-3 or TO-66 metal power semiconductor type or two plastic package TO-220 power semiconductor types. For higher power
## **MECHANICAL DIMENSIONS**
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NATURAL AND FORCED<br>SEMICONDUCTOR MOUNTING HOLES<br>CONVECTION CHARACTERISTICS<br>REF aie, inn 7] Dek tly|<br>“+ rigs | ER sstatunn = SES<br>ea7 | ia te TS i, STP oe Mae Ae Ge Ea ee<br>i “e tn Oe ie, — i a os eer fe a Sa<br>Dy + W i ie oe cin I | ams em) arate | a ree ot oe oe ee al 1 oe |<br>— “ly: os | : ia Wd (He Tees mht le timo) Sed of te<br>= af = mal I ae a] a sgt. [is ti | pb<br>AT a i_ aa 690 SERIES LO ep isa 4 || 5 ty Oetimki | arm Th, [OE)] lagaa 7 Meha- | eeECE Pe]err<br>EOF rail tint incs| | fi sian! | HERS ae . i]<br>TO-3 TO-66 *TWO TO-220’S<br>Dimensions: in. (mm)<br>**----- End of picture text -----**<br>
## **680 SERIES**
## **Maximum Efficiency Omnidirectional Heat Sinks**
_TO-3, TO-220_
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||||||||
|---|---|---|---|---|---|---|
|Height Above|Horizontal Mounting|Thermal Performance at Typical Load|Semiconductor|
|Standard|PC Board “A”|Footprint Dimensions|Natural|Forced|Mounting|Weight|
|P/N|in. (mm)|in. (mm)|Convection|Convection|Hole Pattern|lbs. (grams)|
|680-5A|0.500 (12.7)|1.810 (46.0)-sq|70°C @ 7.5W|3.0°C/W @ 400 LFM|(1) TO-3|0.0700 (31.75)|
|680-75A|0.750 (19.1)|1.810 (46.0)-sq|58°C @ 7.5W|2.4°C/W @ 400 LFM|(1) TO-3|0.0900 (40.82)|
|680-10A|1.000 (25.4)|1.810 (46.0)-sq|52°C @ 7.5W|2.0°C/W @ 400 LFM|(1) TO-3|0.0980 (44.45)|
|680-125A|1.250 (31.8)|1.810 (46.0)-sq|45°C @ 7.5W|1.5°C/W @ 400 LFM|(1) TO-3|0.1100 (49.90)|
|680-5220|0.500 (12.7)|1.810 (46.0)-sq|7O°C @ 7.5W|3.0°C/W @ 400 LFM|(2) TO-220|0.0700 (31.75)|
|680-75220|0.750 (19.1)|1.810 (46.0)-sq|58°C @ 7.5W|2.4°C/W @ 400 LFM|(2) TO-220|0.0900 (40.82)|
|680-10220|1.000 (25.4)|1.810 (46.0)-sq|52°C @ 7.5W|2.0°C/W @ 400 LFM|(2) TO-220|0.0980 (44.45)|
|680-125220|1.250 (31.8)|1.810 (46.0)-sq|45°C @ 7.5W|1.5°C/W @ 400 LFM|(2) TO-220|0.1100 (49.90)|
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Material: Aluminum, Black Anodized
Achieve optimum natural convection cooling per unit volume occupied above the printed circuit board for TO-3 (one semiconductor package per heat sink) or for two TO-220 style cases, when this low-cost heat sink is used. Any mounting attitude will provide free circulation of air in
natural convection applications. These 680 Series heat sinks can also be specified without any semiconductor mounting hole pattern by specifying suffix “K” (Example: 680-5K).
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NATURAL AND FORCED<br>MECHANICAL CONVECTION CHARACTERISTICS<br>DIMENSIONS L msic] JL. oeoy 680 SERIES uP VELOCITY pe<br>nits Fied<br>-<br>errWt — oe.a=Tener 7<br>ia] aPuoe Giana) r| gy AF , PACS DATO FATTER<br>SEMICONDUCTOR MOUNTING HOLES<br>A 220 K<br>| *s Leki ir<br>ne my aa<br>4 a EE<br>aay OOF «Gyia, BGA areHe F # s a esg A MOErr HOLES:<br>we} F * Bal<br>ao, rs re ee)<br>Dimensions: in. (mm) i A gy o . ata ‘ Ha BE<br>TO-3 *TWO TO-220’S<br>**----- End of picture text -----**<br>
**43**
**Board Level Heat Sinks**
## **BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS**
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601 & 603 SERIES Low-Height Heat Sinks<br>**----- End of picture text -----**<br>
|**601 & 603 SERIES**|**Low-Height Heat Sinks**<br>**601 & 603 SERIES**|**Low-Height Heat Sinks**||||_DO-4/DO-5 Diodes_|
|---|---|---|---|---|---|---|
||**Footprint**||**Mounting**|**Thermal Performance at Typical Load**|||
|**Standard**|**Dimensions**|**Height**|**Hole Dia.**|**Natural**|**Forced**|**Weight**|
|**P/N**|**in.(mm)**|**in.(mm)**|**in.(mm)**|**Convection**|**Convection**|**lbs.(grams)**|
|601E|2.000 (50.8) x 1.250 (31.8)|0.562 (14.3)|0.200 (5.1)|52°C @ 5.0W|4.5°C/W @ 175 LFM|0.0500 (22.68)|
|601F|2.000 (50.8) x 1.250 (31.8)|0.562 (14.3)|0.270 (6.9)|52°C @ 5.0W|4.5°C/W @ 175 LFM|0.0500 (22.68)|
|601K|2.000 (50.8) x 1.250 (31.8)|0.562 (14.3)|None|52°C @ 5.0W|4.5°C/W @ 175 LFM|0.0500 (22.68)|
|603K|2.000(50.8)x 2.000(50.8)|0.562(14.3)|None|41°C @ 5.0W|4.0°C/W @ 175 LFM|0.0810(36.74)|
Material: Aluminum Alloy, Black Anodized
Use these low-height heat sinks on printed circuit board applications for TO-66 power semidissipation are required. The 601 and 603 Series may also be attached to enclosure panels or conductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient heat brackets using isolation hardware where necessary.
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MECHANICAL DIMENSIONS<br>NATURAL AND FORCED<br>CONVECTION CHARACTERISTICS<br>| :i t ee a——|; a=ceeteeHisa Reeee ee ee ee<br>E+ — ats | hom i. Bad | FS often te (a<br>' | “We| - if deeeeete;<br>= | Is I FAG Cag alk fi ii<br>603 SERIES<br>601 SERIES (EXTRUSION PROFILE 1284)<br>(EXTRUSION PROFILE 1284)<br>SEMICONDUCTOR MOUNTING HOLES<br>K E F<br>‘on aesLean) BET cad THR peesaca<br>\. yee \. SoTRanrs<br>va ‘SS<br>Dimensions: in. (mm)<br>**----- End of picture text -----**<br>
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641 SERIES Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors<br>**----- End of picture text -----**<br>
_TO-3_
|||**Outline**||**Mounting**|**Thermal Performance at Typical Load**|**Thermal Performance at Typical Load**||
|---|---|---|---|---|---|---|---|
|**Standard**||**Dimensions**|**Height**|**Hole**|**Natural**|**Forced**|**Weight**|
|**P/N**||**in. (mm)**|**in. (mm)**|**Pattern**|**Convection**|**Convection**|**lbs. (grams)**|
|641A|4.125 (104.8) x|4.125 (104.8) x 3.000 (76.2)|1.000 (25.4)|(1) TO-3|36°C @ 15W|0.9°C/W @ 250 LFM|0.2900 (131.54)|
|641K|4.125|4.125(104.8)x 3.000(76.2)|1.000(25.4)|None|36°C @ 15W|0.9°C/W @ 250 LFM|0.2900(131.54)|
Available with a standard TO-3 mounting hole pattern predrilled for cost-effective mounting in limited-height applications, the 641 Series provides maximum performance in natural convection with an optimized heat sink surface area. The 641K type with an open channel area of
1.300 in. (33.0) and no predrilled mounting holes can be adapted to meet mounting requirements for most metal case power semiconductor types. Material: Aluminum Alloy, Black Anodized.
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MECHANICAL 641 SERIES NATURAL AND FORCED<br>DIMENSIONS 7al (EXTRUSION PROFILE 1371) k SikhFla ai SEMICONDUCTOR MOUNTING HOLES CONVECTION CHARACTERISTICS sae Aa<br>. ; = | A K Hf ees<br>sons Fan am, [i orons ieCEL oeoF Ctoa ahae e ee<br>i a eel nn sary 1 “sl aan i =a \ —— 1<br>Dimensions: in. (mm)<br>**----- End of picture text -----**<br>
**44**
Updated at April 29, 2026
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