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678-39-C
HEAT SINK, ALUMINIUM, TO-PACKAGE, SMD
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: WAKEFIELD THERMAL
- Product type: Natural Convection Heat Sinks
- Thermal Resistance:0.6°C/W; Packages Cooled:TO-220, TO-247, TO-264; External Width - Metric:60mm; External Height - Metric:24.89mm; External Length - Metric:38.6 01AC3583
- SVHC: No SVHC (21-Jan-2025)
- Product Range: 678 Series
- Packages Cooled: TO-220, TO-247, TO-264
- Heat Sink Material: Aluminum
- Thermal Resistance: 0.6°C/W
- External Width - Metric: 60mm
- External Height - Metric: 24.89mm
- External Length - Metric: 38.6mm
- External Width - Imperial: 2.36"
- External Diameter - Metric: -
- External Height - Imperial: 0.98"
- External Length - Imperial: 1.52"
- External Diameter - Imperial: -
| Delivery and price | |
|---|---|
| Units per pack | 1000 |
| Price | 7.07 € |
| Current stock | 100+ |
| Lead time | 30 days |
Datasheet
Universal 678 Series Vertical Heat Sink for Power Devices ## = **678-39-S & 678-39-C** |**Part Number**|**Description**|**Length**|**Width**|**Thermal Resistance@ Forced Air Flow**| |---|---|---|---|---| |678-39-S|Universal Heat Sink for TO Devices w/Screw<br>Hole,Black Anodize|1.520"<br>(38.61mm)|2.362"<br>(60.00mm)|0.6°C/W@600 LFM| |678-39-C|Universal Heat Sink for TO Devices w/ Clip,<br>Black Anodize|1.520"<br>(38.61mm)|2.362"<br>(60.00mm)|0.6°C/W@600 LFM| Wakefield-Vette introduces **Universal 678 series** , high performance, low cost and versatile heat sink with screw or clip for all kinds of standard packages. This type of heat sink provides both vertical and horizontal mounting options on PCB to accommodate natural and forced convection cooling method. ## **SPECIFICATIONS** - Heat Sink: Aluminum Alloy 6063-T5 or Equivalent with either degreased or black anodized finish - Spring Clip: Music Wire, Per ASTM A228 with bright nickel plating - Solder Foot: Cold-rolled Steel, Per ASTM A-366 with pure tin over copper strike. RoHS compliant. - Insulator (Optional): t-Global H48-1, L37-3F and H48-6S. The thickness of the insulating material not to exceed 10 mil (0.01”). ## **FEATURES AND BENIFITS** **Minimum assembly cost and labor-** Spring Clips make the mounting holes and fasteners obsolete in assembly operations & reduce costs. **Design Flexibility-** Universal mountable and “one fits all” give designers total freedom to fit their packaging designs with ideal device pak style and to orient the heat sink to meet their power dissipations with optimized cooling method. (see page 2 of data sheet) ## **THERMAL PERFORMANCE** **www.wakefield-vette.com** Page 1 of 2 Universal 678 Series Vertical Heat Sink for Power Devices ## **678-39-S & 678-39-C** |**Part Number**|**Description**|**Length**|**Width**|**Thermal Resistance@ Forced Air Flow**| |---|---|---|---|---| |678-39-S|Universal Heat Sink for TO Devices w/Screw<br>Hole,Black Anodize|1.520"<br>(38.61mm)|2.362"<br>(60.00mm)|0.6°C/W@600 LFM| |678-39-C|Universal Heat Sink for TO Devices w/ Clip,<br>Black Anodize|1.520"<br>(38.61mm)|2.362"<br>(60.00mm)|0.6°C/W@600 LFM| ## _**One Heat Sink for all Packages**_ ## **SOT-227 Package** ## **CPC40055ST Package** ## **CPC1998J Package** - **System level** – 2 screws - **Natural convection** – Vertical - **Board level** – 2 solder pins - **Natural convection** – Vertical - **Spring Clip** - **Board level** – 2 solder pins - **Natural convection** – Vertical - **Spring Clip** ## **CPC1968 and TO-264 Package** ## **L4970A Package** - **Board level** – 2 solder pins - **Natural convection** – Vertical - **Spring Clip** - **Board level** – 2 solder pins - **Natural convection** – Vertical - **Screw attachment** ## **KBU Package** ## **TO-247 and TO-220 Package** - **Board level** – 2 solder pins - **Natural convection** – Vertical - **Screw attachment or Spring Clip** - **Board level** – 2 solder pins - **Natural convection** – Vertical - **Screw attachment or Spring Clip** **www.wakefield-vette.com** Page 2 of 2
Updated at April 29, 2026
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