2821778-2

## **CHIPCONNECT CABLE ASSEMBLIES** 

Internal Faceplate-to-Processor Cable Assemblies for Intel® Omni-Path Architecture 100 Series 

TE Connectivity’s (TE) ChipConnect internal faceplate-to-processor cable assemblies are designed for Intel Omni-Path Architecture (OPA), which can directly transmit signals from the processor to the faceplate. ChipConnect cable assemblies mate directly mate with Intel Xeon® Phi™ processors and Intel Xeon Scalable processors on the board and Intel Omni-Path Internal Faceplate Transition (IFT) connector at the faceplate for 25 Gbps speeds. 

These cable assemblies reduce system design costs by eliminating the need to use costlier, lower-loss printed circuit board (PCB) materials. System design is made easier by reducing the complexity of PCB laminates and routing, as well as retimers. 

## APPLICATIONS 

- Data Center & Networking Equipment 

   - Servers 

   - Routers 

   - High Performance Computing (HPC) 

DATA AND DEVICES /// CHIPCONNECT CABLE ASSEMBLIES 

**ChipConnect Cable Assemblies** 

Our ChipConnect cable assembly solution is specifi cally designed to address the overall trend towards internal cabling to reduce PCB cost and optimize system performance. This internal cabling system is off ered in multiple confi gurations that can support applications at 25 Gbps. 

## MEET LATEST INTEL CPU PROCESSOR DESIGN 

- Enable Intel Omni-Path Architecture (OPA) by mating directly with Intel Xeon Phi processors and Intel Xeon Scalable processors on the board and IFT connectors at the faceplate for 25 Gbps speeds 

Intel Omni-Path Internal Faceplateto-Processor (IFP) Plug - _mates to IFT connector_ 

## FULL SOLUTION PARTNER 

- TE is one of two Intel-qualifi ed suppliers off ering these fi rst-generation cable assemblies (100 Series) and is also a development partner for future-generation Intel designs 

- In addition to these cable assemblies, we off er the compatible LGA 3647 sockets and hardware required for Intel OPA 

## CHOOSE YOUR CONFIGURATION 

**==> picture [126 x 15] intentionally omitted <==**

**----- Start of picture text -----**<br>
Linear Card Edge (LEC) Receptacle<br>-  mates to Intel processors<br>**----- End of picture text -----**<br>


- ChipConnect cable assemblies are available in standard lengths and breakouts, but can be customized for specifi c applications 

- Take advantage of our broad range of high speed solutions such as Sliver internal cabled interconnects and STRADA Whisper board-to-board connectors to create a custom connection on the board or faceplate 

## **Key Features** 

- Cables provide 4x and 8x high speed data transmission lanes 

- Straight and right-angle (left/right exit) Linear Edge Connector (LEC) cable plugs to accommodate cable routing 

## **Intel Omni-Path Architecture** 

**==> picture [145 x 178] intentionally omitted <==**

**----- Start of picture text -----**<br>
Processor (featuring LGA 3647<br>Socket & Hardware*)<br>ChipConnect Cable Assembly*<br>IFT Connectors<br>/<br>QSFP28 Plugs*<br>**----- End of picture text -----**<br>


- to LGA 3647 socket P1) and B (mate to LGA 3647 socket P0) versions 

- Bail latch with pull tab on LEC plug and spring latching on IFP plug provides secure connections 

- Mid-board copper chip-to-I/O interconnect reduces host system board trace lengths and PCB cost 

- Assemblies utilize TE bulk cable 30 AWG 85 Ohms TurboTwin 25 Gbps primary pair cable 

## **Specifi cations** 

- Product spec: 108-130015 

**==> picture [84 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
*Products off ered by TE<br>**----- End of picture text -----**<br>


DATA AND DEVICES /// CHIPCONNECT CABLE ASSEMBLIES 

PAGE 2 

**ChipConnect Cable Assemblies** 

## PRODUCT OFFERING 

**==> picture [528 x 38] intentionally omitted <==**

**----- Start of picture text -----**<br>
Number  LEC  IFP  Assembly  Breakout<br>IFP Style Part Number<br>of Ports Configuration Configuration Length (mm) Length (mm)<br>**----- End of picture text -----**<br>


|**IFP Style**|**Number**<br>**of Ports**|**LEC**<br>**Confguration**|**IFP**<br>**Confguration**|**Assembly**<br>**Length (mm)**|**Breakout**<br>**Length (mm)**|**Part Number**|
|---|---|---|---|---|---|---|
||||||||
|A|2|Straight|Flat|142|75|2821719-3|
|||||208|104.5|2821719-1|
|||||405|104.5|2821719-2|
|||||460|104.5|2821719-4|
||||Inverted|208|104.5|2821720-1|
|||||405|104.5|2821720-2|
|B|1|Straight|Flat|150|N/A|2821721-1|
||||Inverted|160|N/A|2821722-1|
|||||205|N/A|2821722-2|
|||||242|N/A|2821722-3|
|||||465|N/A|2821722-4|
|||Left Angle|Flat|142|N/A|2821723-4|
|||||335|N/A|2821723-1|
|||||371|N/A|2821723-2|
|||||460|N/A|2821723-5|
|||||515|N/A|2821723-3|
||||Inverted|178|N/A|2821724-1|
|||||235|N/A|2821724-2|
|||||318|N/A|2821724-3|
|||||419|N/A|2821724-4|
|||||439|N/A|2821724-5|
|||||500|N/A|2821724-6|
|||Right Angle|Flat|142|N/A|2821778-1|
|||||460|N/A|2821778-2|
||||Inverted|235|N/A|2821725-1|
|||||370|N/A|2821725-2|
|||||500|N/A|2821725-3|



Cable lengths exceeding 439mm are not part of our standard offering and have not been qualified by Intel 

DATA AND DEVICES /// CHIPCONNECT CABLE ASSEMBLIES 

PAGE 3 

**ChipConnect Cable Assemblies** 

## **TE Technical Support Center** 

USA: 1.800.522.6752 Canada: 1 .905.475.6222 Mexico: 52.0.55.1106.0800 Latin/S. America:    54.0.11.4733.2200 Germany: 49.0.6251.133.1999 UK: 44.0.800.267666 France: 33.0.1.3420.8686 Netherlands: 31.0.73.6246.999 China: 86.0.400.820.6015 

## **te.com** 

ChipConnect, TE Connectivity, TE, TE Connectivity (logo) and Every Connection Counts are trademarks. Intel is a trademark. 

All other logos, products and/or company names referred to herein might be trademarks of their respective owners. 

The information given herein, including drawings, illustrations and schematics which are intended for illustration purposes only, is believed to be reliable. However, TE Connectivity makes no warranties as to its accuracy or completeness and disclaims any liability in connection with its use. TE Connectivity‘s obligations shall only be as set forth in TE Connectivity‘s Standard Terms and Conditions of Sale for this product and in no case will TE Connectivity be liable for any incidental, indirect or consequential damages arising out of the sale, resale, use or misuse of the product. Users of TE Connectivity products should make their own evaluation to determine the suitability of each such product for the specific application. 

©2017 TE Connectivity Ltd. family of companies. All Rights Reserved. 

**==> picture [73 x 42] intentionally omitted <==**

**1-1773930-8  10/17   DND** 

DATA AND DEVICES /// CHIPCONNECT CABLE ASSEMBLIES