Cooling & Thermal Management

DC BLOWER 120 MM SQUARE 32 MM 2000 RPM

DC BLOWER 120 MM SQUARE 32 MM 2000 RPM

DC BLOWER 120 MM SQUARE 32 MM 2500 RPM

Fan / Force Cooled Heat Sink, COLDCUBE® Series, 0.12 °C/W, 82 mm, 75 mm, 100 mm

Heat Sink, BGA, FPGAs, Double Sided Adhesive, 7.93 °C/W, BGA, 45 mm, 10 mm, 45 mm

Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.51 °C/W, BGA, 28 mm, 9 mm, 28 mm

Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.12 °C/W, BGA, 38 mm, 6 mm, 38 mm

Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.38 °C/W, BGA, 40 mm, 5 mm, 40 mm

PHASE CHANGE THERMAL MATERIAL, 25.4MM

PHASE CHANGE THERMAL MATERIAL, 127MM

PHASE CHANGE THERMAL MATERIAL, RECT

PHASE CHANGE THERMAL MATERIAL, TO220

PHASE CHANGE THERMAL MATERIAL, TO247

PHASE CHANGE THERMAL MATERIAL, TO264

Fan / Force Cooled Heat Sink, BGA, Chip Set, 1.95 °C/W, 16 mm, 40 mm, 40 mm, 5.5 CFM, 26 dBA

CRYSTAL INSULATOR, RECTANGULAR, 0.1MM

CRYSTAL INSULATOR, RECTANGULAR, 0.1MM

Heat Sink, For North Bridge, 1.25 °C/W, BGA, 37.5 mm, 33 mm, 37.5 mm

Heat Sink, For North Bridge, 4.2 °C/W, BGA, 37.5 mm, 33 mm, 37.5 mm

Fan / Force Cooled Heat Sink, BGA, Chip Set, 35 mm, 35 mm

Fan / Force Cooled Heat Sink, BGA, Chip Set, 28.6 mm, 42.5 mm, 42.5 mm

Heat Sink, Universal Processor, 40 mm, 5 mm, 30 mm

Heat Sink, Component Mounted, Low Profile, Multifin, 2 °C/W, PGA, 30 mm, 16 mm, 30 mm

Heat Sink, Component Mounted, Low Profile, Multifin, 0.4 °C/W, PGA, 80 mm, 16 mm, 80 mm

Heat Sink, Component Mounted, Low Profile, Multifin, 0.3 °C/W, PGA, 100 mm, 16 mm, 100 mm

Heat Sink, 7.6 °C/W, TO-247, TO-264, 27 mm, 50 mm, 25 mm

Heat Sink, 7.6 °C/W, TO-247, TO-264, 27 mm, 50 mm, 25 mm

Heat Sink, 5.3 °C/W, TO-247, TO-264, 27 mm, 50 mm, 50 mm

Heat Sink, 5.3 °C/W, TO-247, TO-264, 27 mm, 50 mm, 50 mm

Heat Sink, 4.2 °C/W, TO-247, TO-264, 27 mm, 50 mm, 75 mm