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CCI

Found 5 products. Showing up to 30 products per page.

Subcategories

Cooling & Thermal Management

Price range

00C845401A: Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.6 °C/W, 25 mm, 9.4 mm, 25 mm
CCI 00C845401A

Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.6 °C/W, 25 mm, 9.4 mm, 25 mm

1.46 EUR/unit
CCI02: Heat Sink, BGA, FPGAs, Double Sided Adhesive, 7.93 °C/W, BGA, 45 mm, 10 mm, 45 mm
CCI CCI02

Heat Sink, BGA, FPGAs, Double Sided Adhesive, 7.93 °C/W, BGA, 45 mm, 10 mm, 45 mm

2.25 EUR/unit
CCI08: Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.51 °C/W, BGA, 28 mm, 9 mm, 28 mm
CCI CCI08

Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.51 °C/W, BGA, 28 mm, 9 mm, 28 mm

1.91 EUR/unit
CCI10: Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.12 °C/W, BGA, 38 mm, 6 mm, 38 mm
CCI CCI10

Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.12 °C/W, BGA, 38 mm, 6 mm, 38 mm

1.41 EUR/unit
CCI11: Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.38 °C/W, BGA, 40 mm, 5 mm, 40 mm
CCI CCI11

Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.38 °C/W, BGA, 40 mm, 5 mm, 40 mm

1.3 EUR/unit

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When a component is unavailable, discontinued or has an unacceptable lead time, we tap into our network of vetted European and Asian distributors to source what you need — without compromising on quality or traceability.

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Compliant Alternatives

We identify pin-to-pin, electrically equivalent substitutes that meet the same certifications (RoHS, AEC-Q100, REACH) as your original specification — validated against datasheets, not just part numbers. Often at a lower cost.

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