CD-02-05-264

**ulTIMiFlux Dielectric Phase Change Thermal Material** 

## **CD-02-05** 

## 60[o] C/140[o] F PHASE-CHANGE TEMPERATURE 

## FEATURES AND BENIFITS 

- ●Low Thermal Impedance 

- ●Excellent Replacement for Thermal Greases 

- ●Thixotropic / Prevents Compound Run-Out 

- ●Excellent Mechanical & Dielectric Properties 

- ●Cost Effective  “Drop in Place” Solution 

- ●RoHS and Halogen Free Compliant 

Wakefield-Vette's _**ulTIMiFlux**_ line of thermal interface materials offer high performance, low cost, configurability and custom sizes for your thermal system needs. Thermal Interface Materials (TIM) are a secondary material installed between the heat sink and the device which are designed to improve the thermal transfer to the heat sink. Regardless of how flat or smooth the device and heat sink are, there will always be small air voids between the two surfaces. Since air is a not a great conductor of heat, a TIM replaces the air and fills the voids. There are many types of TIMs and each has its best case usages. Wakefield-Vetts’s line of dielectric phase change thermal materials are intended to fill voids between a device and the heat sink and utilizes a polyimide film to act as a thermally conductive carrier in order to deliver a uniform thickness coating of phase-change thermal compound on both sides. 

Through the development of this unique formulation, Wakefield-Vette’s phase change solution offers efficient thermal transfer by phase-changing during normal device operating temperatures while maintaining a uniform bond line thus driving out the air and adjusting for any surface imperfections or flatness conditions that may exist across the interface. This construction is useful in a wide range of electronic cooling applications from transistors, diodes or any type of heat generating non-isolated power device. 

## Standard Phase Change Pad Construction 

Phase Change Compound Polyimide Substrate Carrier Phase Change Compound 

A primary advantage of utilizing a phasechange system is the ability to drive out air from within the interface during initial device cycling causing phase change and surface wetting of the thermal compound coating. The phase-change compound is available in specific die cut patterns for common TO packages and can be placed instantly and immediately ready for component mounting. Due to it’s thixotropic formulation design, compound is held within the interface with no worries of run-out into unwanted areas during normal device/component operation. 

**www.wakefield-vette.com** 

**ulTIMiFlux Dielectric PhaseChange Thermal Material CD-02-05** 

Wakefield-Vette's phase-change product is a solvent free high performance dielectric thermal interface material that is designed to provide efficient thermal transfer by providing precision phase-change and a uniform bond line thickness across a device/component mounting interface. The pads are designed as a pre-formed thermally conductive “drop in place” solution that offers excellent thermal transfer characteristics. From an installation perspective, thermal greases are difficult to dispense as well as provide inadequate coverage and a uniform thickness across the interface most often leaving trapped air leading to poor thermal transfer. Not to mention the thermal grease clean up required in unwanted areas afterwards. 

Wakefield-Vette offers the following pad sizes and die-cut TO package sizes for ease of installation: 

|**Wakefield-Vette Part**<br>**Number**|**Description**|**Size**|
|---|---|---|
|CD-02-05-220|TO-220 Pad,0.003” thick|0.70” x 0.50”,single mountinghole|
|CD-02-05-247|TO-247 Pad,0.003” thick|0.95” x 0.75”,single mountinghole|
|CD-02-05-264|TO-264 Pad,0.003” thick|1.05” x 0.85”,single mountinghole|
|CD-02-05-025|1” x 1” Square Pad, 0.003” thick|1” x 1”, no holes|
|CD-02-05-127|5” x 5” Square Pad,0.003” thick|5” x 5”,no holes|
|CD-02-05-190|7.75” x 10.00” Rectangular Pad,<br>0.003”thick|7.75” x 10.00”, no holes|



Wakefield-Vette's phase-change product physical properties / characteristics: 

|**Property/Characteristic**|**Value**|
|---|---|
|Base Phase Change Formulation|Proprietary|
|Electrical Isolation|9200V|
|Phase Change Temperature|60oC / 140oF|
|Viscosity@ Phase Change|Thixotropic|
|Overall Thickness|0.003” +/- 10%|
|Color|Orange|
|Separator Liner / Color|White|
|Total Mass Loss, % TML|0.138|
|Collectible Volatile, Condensable Matter, % CVC|0.130|
|Water Vapor Gain, % WVR|0.021|
|Storage Condition and Temperature|Cool DryLocation at or below 35oC / 95oF|
|Shelf Life|Indefinite if storedper conditions above|
|Transit Methods / Conditions|Due to temperature sensitive design, it is recommended to ship air freight during<br>warmer months to prevent phase-change of thermal compound during long ground<br>transit (May-September)|
|Thermal Impedence|0.107 oC-in2 / Watt (@100 PSI)|
|UL Flammability Rating|UL94V-0|



Specific tests should be performed by the end user to determine the product suitability for the particular application. Contact Wakefield-Vette sales and engineering support with any inquiries. **www.wakefield-vette.com**