Cooling & Thermal Management

Heat Sink, For Ball Grid Array, Standard, 12.2 °C/W, BGA, 27.8 mm, 11.2 mm, 27.8 mm

Heat Sink, For Ball Grid Array, Standard, 11 °C/W, BGA, 40 mm, 23 mm, 40 mm

Heat Sink, For Ball Grid Array, Standard, 10.5 °C/W, BGA, 27 mm, 25 mm, 27 mm

Heat Sink, For Ball Grid Array, Standard, 10 °C/W, BGA, 40 mm, 10 mm, 23.9 mm

Heat Sink, For Ball Grid Array, Standard, 9.7 °C/W, BGA, 40 mm, 10 mm, 40 mm

Heat Sink, For Ball Grid Array, Standard, 8.2 °C/W, BGA, 40 mm, 18 mm, 40 mm

Heat Sink, BGA, 28 mm, 7.5 mm, 15 mm

Heat Sink, BGA, 30 mm, 12.5 mm, 15 mm

Heat Sink, BGA, 28 mm, 7.5 mm, 17 mm

Heat Sink, BGA, 26 mm, 9 mm, 19 mm

Heat Sink, BGA, 48 mm, 17.5 mm, 27 mm

Heat Sink, BGA, 44 mm, 7.5 mm, 31 mm

Heat Sink, BGA, 44 mm, 7.5 mm, 32.5 mm

Heat Sink, BGA, 60 mm, 12.5 mm, 37.5 mm

Heat Sink, BGA, 72 mm, 12.5 mm, 42.5 mm

Heat Sink, BGA, 68 mm, 12.5 mm, 45 mm

Thermal Adhesive Tape, Bond-Ply® 100, 0.8 W/m.K, 0.005 " TH, 1" x 1" Sheet

Thermal Adhesive Tape, Bond-Ply® 100, 0.8 W/m.K, 0.005 "

Heat Sink, TO-220/218, 7.2 °C/W, TO-218, TO-220, 35 mm, 38 mm, 25.4 mm

Heat Sink, TO-220/218, 5.8 °C/W, TO-218, TO-220, TO-247, 35 mm, 50 mm, 25.4 mm

Heat Sink, TO-220, 19.94 mm, 38.1 mm, 25 mm

Heat Sink, TO-220, 19.94 mm, 38 mm, 25 mm

Heat Sink, Square, Black Anodized, 2 Clips, T0-247 & T0-264, TO-220, 19.94 mm, 38 mm, 50 mm

Heat Sink, TO-220, 19.94 mm, 38 mm, 50 mm

Heat Sink, TO-220, 19.94 mm, 38 mm, 75 mm

Heat Sink, TO-220, 19.94 mm, 38 mm, 75 mm

Heat Sink, TO-247, 20.47 mm, 38 mm, 25 mm

Heat Sink, Square, PCB, 1 Clip, T0-220 & T0-264, TO-247, 20.47 mm, 38 mm, 25 mm

Heat Sink, TO-247, 20.47 mm, 38 mm, 50 mm

Heat Sink, Square, PCB, 2 Clips, T0-220 & T0-264, TO-247, 20.47 mm, 38 mm, 50 mm