910-40-2-23-2-B-0

PIN FIN HEAT SINK 

## 910 Series 

Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. 

These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries. 

## **Material:** AL 6063 

**Finish:** Black Anodize 

|||**CHIP**||**FORCED CONVECTION**|**FORCED CONVECTION(C/W)**|**FORCED CONVECTION(C/W)**|**FORCED CONVECTION(C/W)**|
|---|---|---|---|---|---|---|---|
||**HEIGHT**|**SIZE**|**NATURAL**|||||
|**PART #**|**(mm)**|**(mm)**|**CONVECTION**|**200 LFM**||**400 LFM**|**600 LFM**|
|**910-40-2-12-2-B-0**|12|40|9.18 C/W|2.84 C/W||1.86 C/W|1.36 C/W|
|**910-40-2-15-2-B-0**|15|40|8.71 C/W|2.64 C/W||1.65 C/W|1.18 C/W|
|**910-40-2-19-2-B-0**|18|40|8.24 C/W|2.4 C/W||1.44 C/W|.98 C/W|
|**910-40-2-21-2-B-0**|21|40|7.77 C/W|2.21 C/W||1.27 C/W|.86 C/W|
|**910-40-2-23-2-B-0**|23|40|7.63 C/W|2 C/W||1.15 C/W|.73 C/W|
|**910-40-2-28-2-B-0**|28|40|7.27 C/W|1.77 C/W||.99 C/W|.62 C/W|
|**910-40-2-33-2-B-0**|33|40|6.92 C/W|1.58 C/W||.85 C/W|.51 C/W|



## **Thermal Performance** 

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**----- Start of picture text -----**<br>
3<br>910-40-2-12-2-B-0<br>2.5<br>910-40-2-15-2-B-0<br>2<br>910-40-2-19-2-B-0<br>1.5 910-40-2-21-2-B-0<br>1 910-40-2-23-2-B-0<br>910-40-2-28-2-B-0<br>0.5<br>910-40-2-33-2-B-0<br>0<br>200 LFM 400 LFM 600 LFM<br>Forced Convection<br>C/Watt<br>**----- End of picture text -----**<br>


Thermal Solutions from **Smart** to **Finish** wakefield-vette.com 

PIN FIN HEAT SINK 

## 910 Series 

## **ASSEMBLY INSTRUCTION:** 

**STEP 1:** Center heat Sink onto BGA. Tilt and hook one side of the clip under the BGA chip. 

**STEP 2:** Press down the other side of clip to snap it onto the BGA chip. 

**STEP 3:** Make sure the stop pin is not on top of the chip set. Installation is now complete. 

Wakefield-Vette’s heat sink assembles onto chip set using the space that is between the PCB and the substrate of the solder balls. The solder balls provide a minimal gap of .5mm to .7mm. Attachment feature is below a .4mm thickness. The clipping system will not interfere or damage chip. Contact area is the edge of chip. 

## **SHOCK TEST SPECIFICATION** ： 

Wave Form ：Half sine wave Acceleration ：50 g Duration Time ：11 ms No. of Shock ：Each axis 3 times Shock Direction ：±X, ±Y, ±Z axis Reliability & Communication Testing Instruments 

## **Random Vibration Test** 

Frequency ：5 Hz to 500 Hz Acceleration ：3.13 grms P.S.D ：0.01 g2/HZ (5 Hz) 0.02 g2/HZ (20 Hz to 500 Hz) Test Axis ：X, Y, Z axis 

Test Time ：10 mins (Each axis) Total Test Time ：30 mins 

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