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Cooling & Thermal Management

Found 4320 products. Showing up to 30 products per page (144 pages).

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637-15ABEP: Heat Sink, For Board Level Power Semiconductor, 11 °C/W, TO-220, 34.9 mm, 38.1 mm, 12.7 mm
Wakefield 637-15ABEP

Heat Sink, For Board Level Power Semiconductor, 11 °C/W, TO-220, 34.9 mm, 38.1 mm, 12.7 mm

637303B03000: HEAT SINK EXTRUSION, 1.88°C/W
Boyd 637303B03000

HEAT SINK EXTRUSION, 1.88°C/W

6391BG: Heat Sink, TO-220/218, 12.9 °C/W, TO-218, TO-220, 16.26 mm, 38.1 mm, 16.26 mm
Boyd 6391BG

Heat Sink, TO-220/218, 12.9 °C/W, TO-218, TO-220, 16.26 mm, 38.1 mm, 16.26 mm

6396BG: Heat Sink, Square, PCB, With Radial Fins, 5.6 °C/W, TO-218, TO-220, 41.91 mm, 25.4 mm, 25.4 mm
Boyd 6396BG

Heat Sink, Square, PCB, With Radial Fins, 5.6 °C/W, TO-218, TO-220, 41.91 mm, 25.4 mm, 25.4 mm

6399BG: Heat Sink, TO-220/218, 3.3 °C/W, TO-220, 41.91 mm, 50 mm, 25.4 mm
Boyd 6399BG

Heat Sink, TO-220/218, 3.3 °C/W, TO-220, 41.91 mm, 50 mm, 25.4 mm

6400BG: Heat Sink, TO-220/218, 2.7 °C/W, TO-218, TO-220, TO-247, 41.91 mm, 63.5 mm, 25.4 mm
Boyd 6400BG

Heat Sink, TO-220/218, 2.7 °C/W, TO-218, TO-220, TO-247, 41.91 mm, 63.5 mm, 25.4 mm

642-45AB: HEAT SINK, ALUMINIUM, 35MM, BGA
Wakefield 642-45AB

HEAT SINK, ALUMINIUM, 35MM, BGA

647-10-ABEP: Heat Sink, For Board Level Power Semiconductor, 3.8 °C/W, TO-220, 41.9 mm, 25.4 mm, 25.4 mm
Wakefield 647-10-ABEP

Heat Sink, For Board Level Power Semiconductor, 3.8 °C/W, TO-220, 41.9 mm, 25.4 mm, 25.4 mm

65-00-GEL25NS-0030-M: Thermally Conductive Material, Dispensable Gel, Urethane2.5W/m.K
Chomerics 65-00-GEL25NS-0030-M

Thermally Conductive Material, Dispensable Gel, Urethane2.5W/m.K

65-00-GEL30-0010: Thermally Conductive Material, Dispensable Gel, Silicone, 3.5W/m.K
Chomerics 65-00-GEL30-0010

Thermally Conductive Material, Dispensable Gel, Silicone, 3.5W/m.K

65-00-GEL37-0010: Thermally Conductive Material, Dispensable Gel, Silicone, 3.7W/m.K
Chomerics 65-00-GEL37-0010

Thermally Conductive Material, Dispensable Gel, Silicone, 3.7W/m.K

65-00-GEL75-0010: Thermally Conductive Material, Dispensable Gel, Silicone, 7.5W/m.K
Chomerics 65-00-GEL75-0010

Thermally Conductive Material, Dispensable Gel, Silicone, 7.5W/m.K

65-00-TC50-0010: Thermally Conductive Material, Dispensable Putty, 5W/m.K
Chomerics 65-00-TC50-0010

Thermally Conductive Material, Dispensable Putty, 5W/m.K

65-02-GEL30-0030: Thermally Conductive Material, Dispensable Gel, Silicone, 3.5W/m.K
Chomerics 65-02-GEL30-0030

Thermally Conductive Material, Dispensable Gel, Silicone, 3.5W/m.K

65-02-GEL75-0030: Thermally Conductive Material, Dispensable Gel, Silicone, 7.5W/m.K
Chomerics 65-02-GEL75-0030

Thermally Conductive Material, Dispensable Gel, Silicone, 7.5W/m.K

65-02-TC50-0030: Thermally Conductive Material, Dispensable Putty, 5W/m.K
Chomerics 65-02-TC50-0030

Thermally Conductive Material, Dispensable Putty, 5W/m.K

656053B07000G: HEAT SINK EXTRUSION, 0.47°C/W, LED
Boyd 656053B07000G

HEAT SINK EXTRUSION, 0.47°C/W, LED

658-25ABT4E: HEAT SINK, ALUMINIUM, 27.9MM
Wakefield 658-25ABT4E

HEAT SINK, ALUMINIUM, 27.9MM