Z0103MNT1G
Triac, 600 V, 1 A, SOT-223, 1.3 V, 8 A, 7 mA
- Manufacturer: LITTELFUSE
- Product type:
- Peak Repetitive Off-State Voltage, Vdrm:600V; On State RMS Current IT(rms):1A; Triac Case Style:SOT-223; Gate Trigger Current Max (QI), Igt:5mA; Gate Trigger Voltage Max Vgt:1.3V; Peak Gate Powe
- MSL: MSL 1 - Unlimited
- SVHC: No SVHC (15-Jan-2018)
- No. of Pins: 3Pins
- Product Range: -
- Triac Case Style: SOT-223
- Thyristor Mounting: Surface Mount
- Holding Current Max: 7mA
- On State RMS Current: 1A
- Peak On State Voltage: 1.8V
- Gate Trigger Voltage Max: 1.3V
- Operating Temperature Max: 125°C
- Peak Non Repetitive Surge Current: 8A
- Peak Repetitive Off State Voltage: 600V
| Delivery and price | |
|---|---|
| Units per pack | 1000 |
| Price | 0.273 € |
| Current stock | 500+ |
| Lead time | 30 days |
**Thyristors** Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN ~~Pb 7)~~ ## ~~Z0103MN, Z0107MN, Z0109MN~~ ## **Description** ~~Lo~~ Designed for use in solid state relays, MPU interface, TTL logic and other light industrial or consumer applications. Supplied in surface mount package for use in automated manufacturing. ## **Features** ~~Lo~~ - Sensitive Gate Trigger • Surface Mount Package Current in Four Trigger • These are Pb−Free Modes Devices - Blocking Voltage to 600 V - Glass Passivated Surface for Reliability and Uniformity ## **Pin Out** eee 4 1 2 3 ## **Functional Diagram** =ee **==> picture [243 x 133] intentionally omitted <==** **----- Start of picture text -----**<br> MT 2 MT 1<br>G<br>ee<br>Additional Information<br>Lo<br>Gi<br>Datasheet Resources Samples<br>**----- End of picture text -----**<br> © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/26/19 **Thyristors** Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN **==> picture [93 x 32] intentionally omitted <==** **==> picture [507 x 274] intentionally omitted <==** **----- Start of picture text -----**<br> Maximum Ratings (TJ = 25°C unless otherwise noted)<br>Rating Symbol Value Unit<br>Peak Repetitive Off−State Voltage (Note 1) VDRM, V<br>(RGK = IK, TJ− 40 to +125°C, Sine Wave, 50 to 60 Hz) VRRM 600<br>On-State RMS Current (Full Sine Wave 50 to 60 Hz; TC = 80°C) IT (RMS) 1.0 A<br>Peak Non−repetitive Surge Current (One Full Cycle Sine Wave, 60 Hz, TC = 25ºC) IT (RMS) 8.0 A<br>Circuit Fusing Considerations (t = 8.3 ms) I [2] t 0.4 A2s<br>Average Gate Power (TC = 80°C, t ≤ 8.3 ms) PG(AV) 1.0 W<br>Peak Gate Current (t ≤ 20 s, TJ = +125°C) IGM 1.0 A<br>Operating Junction Temperature Range @ Rated VRRM and VDRM TJ -40 to +110 °C<br>Storage Temperature Range Tstg -40 to +150 °C<br>Thermal Characteristics<br>Rating Symbol Value Unit<br>Thermal Resistance, Junction−to−Ambient PCB Mounted per Figure 1 R8JA 156 °C/W<br>Thermal Resistance, Junction−to−Tab Measured on MT2 Tab Adjacent to Epoxy R8JT 25 °C/W<br>Maximum Device Temperature for Soldering Purposes for 10 Secs Maximum TL 260 °C<br>**----- End of picture text -----**<br> - Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded. |**Electrical Characteristics -OFF**(TJ= 25°C unless otherwise noted)|**Electrical Characteristics -OFF**(TJ= 25°C unless otherwise noted)|||||| |---|---|---|---|---|---|---| |**Characteristic**||**Symbol**|**Min**|**Typ**|**Max**|**Unit**| |Peak Repetitive Forward or Reverse Blocking Current (Note 3)<br>(VAK= Rated VDRMor VRRM, RGK= 1000 kQ|TJ= 25°C<br>TJ= 125°C|IDRM,|-<br>-|-<br>-|5.0<br>500|μA| © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/26/19 **Thyristors** Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN **==> picture [93 x 32] intentionally omitted <==** **Electrical Characteristics - ON** (TJ = 25°C unless otherwise noted; Electricals apply in both directions) **==> picture [506 x 393] intentionally omitted <==** **----- Start of picture text -----**<br> Characteristic Symbol Min Typ Max Unit<br>Peak On−State Voltage (IDuty Cycle ≤2%) TM = ±11 A Peak, Pulse Width ≤2 ms, VTM − − 1.8 V<br>Z0103MN MT2(+), G(+) 0.15 − 3.0<br>Gate Trigger Current MT2(+), G(−) 0.15 − 3.0<br>(Continuous dc) (VD = 12 V, RL = 30 Ohms) MT2(−), G(−) IGT 0.15 − 3.0 mA<br>MT2(−), G(+) 0.25 − 5.0<br>Z0107MN MT2(+), G(+) 0.15 − 5.0<br>Gate Trigger Current (Continuous dc) MT2(+), G(−)MT2(−), G(−) IGT 0.150.15 −− 5.05.0 mA<br>(VD = 12 V, RL = 30 Ohms) MT2(−), G(+) 0.25 − 7.0<br>Z0109MN MT2(+), G(+) 0.15 − 10<br>Gate Trigger Current (Continuous dc) MT2(+), G(−)MT2(−), G(−) IGT 0.150.15 −− 1010 mA<br>(VD = 12 V, RL = 30 Ohms) MT2(−), G(+) 0.25 − 10<br>Z0103MN MT2(+), G(+) − − 7.0<br>Latching Current (VD = 12 V, IG = 1.2 x IGT) MT2(+), G(−)MT2(−), G(−) IL −− −− 7.015 mA<br>ALL TYPES MT2(−), G(+) − − 7.0<br>Z0107MN MT2(+), G(+) − − 10<br>Latching Current (VD = 12 V, IG = 1.2 x IGT) MT2(−), G(−)MT2(+), G(−) IL −− −− 2010 mA<br>ALL TYPES MT2(−), G(+) − − 10<br>Z0109MN MT2(+), G(+) − − 15<br>Latching Current (VD = 12 V, IG = 1.2 x IGT) MT2(−), G(−)MT2(+), G(−) IL −− −− 2515 mA<br>ALL TYPES MT2(−), G(+) − − 15<br>Electrical Characteristics - ON (TJ = 25°C unless otherwise noted; Electricals apply in both directions) Continued<br>Gate Trigger Voltage (Continuous dc) (VD = 12 Vdc, RL = 30 Ohms) VGT − − 1.3 V<br>Gate−Controlled Turn−On Time, (VD = Rated VDRM, ITM = 16 A Peak, IG = 30 mA) tgt 0.2 − 10 μs<br>**----- End of picture text -----**<br> © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/26/19 **Thyristors** Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN **==> picture [93 x 32] intentionally omitted <==** ## **Dynamic Characteristics** |**Dynamic Characteristics**||||||| |---|---|---|---|---|---|---| |**Characteristic**||**Symbol**|**Min**|**Typ**|**Max**|**Unit**| |Rate of Change of Commutating Current||||||| |(VD= 400 V, ITM= 0.84 A, Commutating dv/dt = 1.5 V/µs,||dv/dt|1.6|−|−|A/ms| |Gate Open, TJ= 110ºC, f = 250 Hz, with Snubber)||||||| |Critical Rate of Rise of On−State Current<br>(TC= 110°C, IG= 2 x IGT, RGK= 1 kΩ)|Z0103MN<br>Z0107MN<br>Z0109MN|di/dt|10<br>20<br>50|30<br>60<br>75|_<br>_<br>_|V/µs| |Repetitive Critical Rate of Rise of On−State Current,||||||| |TJ= 125ºC Pulse Width = 20 µs, IPKmax = 15 A,|||−|−|20|A/µs| |diG/dt = 1 A/µs, f = 60 Hz||||||| ## **Voltage Current Characteristic of SCR** **==> picture [245 x 95] intentionally omitted <==** **----- Start of picture text -----**<br> Symbol Parameter<br>VDRM Peak Repetitive Forward Off State Voltage<br>IDRM Peak Forward Blocking Current<br>VRRM Peak Repetitive Reverse Off State Voltage<br>IRRM Peak Reverse Blocking Current<br>VTM Maximum On State Voltage<br>IH Holding Current<br>**----- End of picture text -----**<br> **==> picture [223 x 137] intentionally omitted <==** **----- Start of picture text -----**<br> +C urrent<br>Quadrant 1<br>Main Terminal 2 +<br>V TM<br>on stat e<br>IH<br>IRR M at VRR M<br>off stat e +V oltage<br>IH IDR M at VDR M<br>Quadrant 3Main Terminal 2 V TM<br>**----- End of picture text -----**<br> ## **Quadrant Definitions for a Triac** **==> picture [244 x 237] intentionally omitted <==** **----- Start of picture text -----**<br> MT2 POSITIVE<br>(Positive Half Cycle)<br>+<br>(+) MT 2 (+) MT 2<br>Quadrant II ( ) IGT (+) IGT Quadrant I<br>GA TE GA TE<br>MT 1 MT 1<br>RE F RE F<br>IGT +I GT<br>( ) MT 2 ( ) MT 2<br>Quadrant III ( ) IGT (+) IGT Quadrant IV<br>GA TE GA TE<br>MT 1 MT 1<br>RE F RE F<br>MT2 NEGA TIVE<br>(Negative Half Cycle)<br>**----- End of picture text -----**<br> All polarities are referenced to MT1. With in phase signals (using standard AC lines) quadrants I and III are used **Figure 1. PCB for Thermal Impedance and Power Testing of SOT-223** **==> picture [130 x 203] intentionally omitted <==** **----- Start of picture text -----**<br> 0.15<br>3.8<br>0.079<br>2.0<br>0.244<br>0.091 0.091 6.2<br>2.3 2.3<br>0.079<br>2.0<br>inches<br>0.059 0.059 0.059<br>0.984 1.5 1.5 1.5 mm<br>25.0<br>0.096 0.096 0.096<br>2.44 2.44 2.44<br>0.059 0.059<br>1.5 1.5<br>0.472<br>12.0<br>**----- End of picture text -----**<br> BOARD MOUNTED VERTICALLY IN CINCH 8840 EDGE CONNECTOR. BOARD THICKNESS = 65 MIL., FOIL THICKNESS = 2.5 MIL. MATERIAL: G10 FIBERGLASS BASE EPOXY © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/26/19 **Thyristors** Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN **==> picture [93 x 32] intentionally omitted <==** **==> picture [243 x 20] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 2. On-State Characteristics<br>**----- End of picture text -----**<br> **==> picture [244 x 171] intentionally omitted <==** **----- Start of picture text -----**<br> 10<br>1.0<br>0.1<br>TYPICAL AT TJ = 110°C<br>MAX AT TJ = 110°C<br>MAX AT TJ = 25°C<br>0.01<br>0 1.0 2.0 3.0 4.0 5.0<br>vT<br>IT<br>**----- End of picture text -----**<br> **==> picture [243 x 20] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 3. Junction to Ambient Thermal Resistance vs<br> Copper Tab Area<br>**----- End of picture text -----**<br> **==> picture [244 x 171] intentionally omitted <==** **==> picture [244 x 194] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 4. Current Derating, Minimum Pad Size Reference:<br> Ambient Temperature<br>110<br>100 α<br>30° α<br>90 60°<br>α = CONDUCTION<br>80 90° ANGLE<br>dc<br>70<br>α = 180°<br>60 120°<br>50<br>MINIMUM FOOTPRINT<br>40 50 OR 60 Hz<br>30<br>20<br>0 0.1 0.2 0.3 0.4 0.5<br>IT(RMS)<br>)<br>°<br>TEMPERATURE ( C<br>TA , MAXIMUM ALLOWABLEA MBIENT<br>**----- End of picture text -----**<br> **==> picture [243 x 19] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 5. Current Derating, 1.0 cm Square Pad Reference:<br> Ambient Temperature<br>**----- End of picture text -----**<br> **==> picture [244 x 170] intentionally omitted <==** **Figure 6. Current Derating, 2.0 cm Square Pad Reference: Ambient Temperature** **==> picture [243 x 20] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 7. Current Derating Reference: MT2 Tab<br>**----- End of picture text -----**<br> **==> picture [505 x 171] intentionally omitted <==** © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/26/19 **Thyristors** Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN **==> picture [93 x 32] intentionally omitted <==** **==> picture [243 x 20] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 8. Power Dissipation<br>**----- End of picture text -----**<br> **==> picture [244 x 20] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 9. Thermal Response, Device Mounted on Figure 1<br> Printed Circuit Board<br>**----- End of picture text -----**<br> **==> picture [505 x 171] intentionally omitted <==** **==> picture [504 x 19] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 10. Simplified Test Circuit to Measure the Critical Rate of Rise of Commutating Voltage (dv/dt)c<br>**----- End of picture text -----**<br> **==> picture [505 x 171] intentionally omitted <==** **----- Start of picture text -----**<br> LL 1N4007<br>200 VRMS<br>ADJUST FOR MEASURE<br>ITM, 60 Hz VAC I RS<br>CHARGE<br>CHARGE TRIGGER CONTROL - 200 V<br>CS ADJUST FOR +<br>MT2 dv/dt(c)<br>1N914 51<br>MT1<br>CL G<br>c [. See AN1048 for additional information.]<br>TRIGGER CONTROL<br>**----- End of picture text -----**<br> **Figure 11. Typical Commutating dv/dt vs Current Crossing Rate and Junction Temperature** **Figure 12. Typical Commutating dv/dt vs Junction Temperature at 0.8 Amps RMS** **==> picture [505 x 170] intentionally omitted <==** © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/26/19 **Thyristors** Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN **==> picture [93 x 32] intentionally omitted <==** **==> picture [243 x 20] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 13. Exponential Static dv/dt versus Gate −<br> Main Terminal 1 Resistance<br>**----- End of picture text -----**<br> **==> picture [243 x 20] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 14. Typical Gate Trigger Current Variation<br>**----- End of picture text -----**<br> **==> picture [505 x 171] intentionally omitted <==** **==> picture [243 x 19] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 15. Typical Holding Current Variation<br>**----- End of picture text -----**<br> **==> picture [243 x 19] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 16. Gate Trigger Voltage Variation<br>**----- End of picture text -----**<br> **==> picture [505 x 170] intentionally omitted <==** © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/26/19 **Thyristors** Surface Mount – 600V > Z0103MN, Z0107MN, Z0109MN **==> picture [93 x 32] intentionally omitted <==** ## **Dimensions** **==> picture [224 x 144] intentionally omitted <==** **----- Start of picture text -----**<br> D<br>b1<br>4<br>HE E<br>12 3<br>b<br>e1<br>e<br>C<br>A<br>0.08 (0003)<br>A1 L L1<br>**----- End of picture text -----**<br> **==> picture [245 x 183] intentionally omitted <==** **----- Start of picture text -----**<br> Inches Millimeters<br>Dim<br>Min Nom Max Min Nom Max<br>A --- --- 0.071 --- --- 1.80<br>A1 0.001 0.003 0.005 0.02 0.07 0.13<br>b 0.026 0.030 0.033 0.66 0.75 0.84<br>b1 0.114 0.118 0.122 2.90 3.00 3.10<br>c 0.009 0.011 0.014 0.23 0.29 0.35<br>D 0.260 0.260 0.264 6.60 6.60 6.71<br>E 0.130 0.138 0.146 3.30 3.50 3.70<br>e --- 0.091 --- --- 2.30 ---<br>e1 0.030 0.037 0.045 0.75 0.95 1.15<br>L1 0.059 0.069 0.079 1.50 1.75 2.00<br>HE 0.268 0.276 0.283 6.80 7.00 7.20<br>ø 0° --- 10° 0° --- 10°<br>**----- End of picture text -----**<br> **==> picture [244 x 196] intentionally omitted <==** **----- Start of picture text -----**<br> Soldering Footprint<br>3.8<br>0.15<br>2.0<br>0.079<br>6.3<br>2.3 2.3<br>0.248<br>0.091 0.091<br>2.0<br>0.079<br>0.0591.5 SCALE 6:1 inchesmm<br>**----- End of picture text -----**<br> ## **Part Marking System** **==> picture [133 x 113] intentionally omitted <==** **----- Start of picture text -----**<br> SOT 223<br>10XMN<br>CASE 318 E YMAXX<br>STYLE 11<br>10XMN =Device Code<br>x =3, 7, and 9<br>Y =Year<br>M =Month<br>A =Assembly Site<br>XX =Lot Serial Code<br>G =Pb-Free Package<br>**----- End of picture text -----**<br> (Note: Microdot may be in either location) 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. ## **Ordering Information** |**Device**|**Package**|**Shipping**| |---|---|---| |Z0103MNT1G|SOT-223<br>(Pb-Free)|| |Z0107MNT1G|SOT-223<br>(Pb-Free)|1000 /<br>Tape & Reel| |Z0109MNT1G|SOT-223<br>(Pb-Free)|| |||**Pin Assignment**|| |---|---|---|---| ||1|Main|Terminal 1| ||2|Main|Terminal 2| ||3||Gate| ||4|Main|Terminal 2| **Disclaimer Notice** - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at: www.littelfuse.com/disclaimer-electronics © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/26/19
Updated at June 8, 2026
Founded in 1927 and headquartered in Chicago, Illinois, Littelfuse is a premier global manufacturer of circuit protection, power control, and sensing technologies. Widely recognized for pioneering the first small, fast-acting protective fuse, the company has grown into an industry leader whose highly reliable components are essential to modern industrial, transportation, and consumer electronics applications worldwide. At the core of the Littelfuse portfolio is an expansive and industry-leading range of circuit protection solutions. This encompasses a massive selection of traditional fuses, fuse holders, and resettable PTC thermistor fuses designed to safely interrupt overcurrent conditions. To defend against electrical overstress, Littelfuse also provides advanced transient voltage suppression (TVS) technologies, including thousands of specialized TVS diodes, TVS varistors, and gas discharge tubes (GDTs) that ensure robust defense against voltage spikes and environmental hazards. Beyond its foundational protection components, Littelfuse manufactures a diverse array of discrete semiconductors, sensors, and switching devices. Engineers rely on their high-performance thyristors, including TRIACs and SCRs, alongside power-efficient Schottky diodes and MOSFETs for demanding power control applications. Complemented by precision proximity sensors and highly reliable reed and solid-state relays, Littelfuse delivers the critical building blocks required for secure, efficient, and complete system design.
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