X00619MA5AL2
Triac, 600 V, 800 mA, TO-92
- Manufacturer: STMICROELECTRONICS
- Product type:
- Peak Repetitive Off-State Voltage, Vdrm:600V; On State RMS Current IT(rms):800mA; Triac Case Style:TO-92; Gate Trigger Current Max (QI), Igt:-; Gate Trigger Voltage Max Vgt:-; Peak Gate Power:-; Peak
- MSL: -
- SVHC: No SVHC (25-Jun-2025)
- No. of Pins: -
- Product Range: -
- Triac Case Style: TO-92
- Thyristor Mounting: Through Hole
- Holding Current Max: -
- On State RMS Current: 800mA
- Peak On State Voltage: 1.35V
- Gate Trigger Voltage Max: -
- Operating Temperature Max: -
- Peak Non Repetitive Surge Current: -
- Peak Repetitive Off State Voltage: 600V
| Delivery and price | |
|---|---|
| Units per pack | 1000 |
| Price | 0.09 € |
| Current stock | 1000+ |
| Lead time | 30 days |
**X00619** Datasheet ## 0.8 A - 600 V sensitive gate SCR **==> picture [121 x 172] intentionally omitted <==** **----- Start of picture text -----**<br> A<br>G<br>x<br>K<br>A<br>G A<br>K K [G]<br>TO-92 (preform) TO-92 (straight)<br>A<br>G<br>A<br>Sail K<br>SOT-223<br>**----- End of picture text -----**<br> ## **Features** - On-state rms current, IT(RMS) 0.8 A - Repetitive peak off-state voltage 600 V - Triggering gate current from 30 to 200 μA - ECOPACK2 compliant ## **Applications** - Limited gate current topologies - Ground fault circuit interrupters - Overvoltage crowbar protection in power supplies - Protection in electronic ballasts - Capacitive discharge ignitions - Ignitors (lighting, oven...) ## **Description** The X00619 SCR can be used as on/off function in applications where topology does not offer high current for gate triggering. This device is optimized in forward voltage drop and inrush current capabilities for reduced power losses and high reliability in harsh environments. ## **Product status link** ~~ea~~ |**Product status link**<br>~~ea~~|**Product status link**<br>~~ea~~| |---|---| |X00619|TO92 straight leads<br>(bulk packing)| ||TO92 leads preform<br>(tape and reel or ammopack<br>packing)| ||SOT-223<br>(tape and reel packing)| |**Product summary**<br>~~ea~~|**Product summary**<br>~~ea~~| |---|---| |**IT(RMS)**|up to 0.8 A| |**VDRM/VRRM**|600 V| |**IGT**|From 30 to 200 µA| |**Tjmax.**|125 °C| **DS6289** - **Rev 4** - **December 2021** For further information contact your local STMicroelectronics sales office. www.st.com **X00619 Characteristics** ## **1 Characteristics** **Table 1. Absolute maximum ratings (limiting values, Tj = 25 °C unless otherwise specified)** |**Symbol**|**Parameters**|||**Value**|**Unit**| |---|---|---|---|---|---| |IT(RMS)|On-state RMS current (180° conduction angle)|TO-92|TL= 83 °C|0.8|A| |||SOT-223|Tamb= 107 °C||| |IT(AV)|Average on-state current (180° conduction angle)|TO-92|TL= 83 °C|0.5|A| |||SOT-223|Tamb= 107 °C||| |ITSM|Non repetitive surge peak on-state current,<br>Tjinitial = 25 °C|tp= 8.3 ms|Tj= 25 °C|10|A| |||tp= 10 ms||9|| |I2t|I2t value for fusing|tp= 10 ms|Tj= 25 °C|0.4|A2s| |dl/dt|Critical rate of rise of on-state current<br>IG= 2 x IGT, tr≤ 100 ns|F = 60 Hz|Tj= 125 °C|50|A/µs| |IGM|Peak gate current|tp= 20 µs|Tj= 125 °C|1|A| |PG(AV)|Average gate power dissipation||Tj= 125 °C|0.1|W| |Tstg|Storage junction temperature range|||-40 to +150|°C| |Tj|Operating junction temperature range|||-40 to +125|°C| **Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified)** |**Symbol**|**Parameters**||**Value**|**Unit**| |---|---|---|---|---| |IGT|VD= 12 V, RL= 140 Ω|Min.|30|µA| |||Max.|200|| |VGT||Max.|0.8|V| |VGD|VD= VDRM, RL= 3.3 kΩ, RGK= 1 kΩ, Tj= 125 °C|Min.|0.2|V| |VRG|IRG= 10 µA|Min.|5|| |IH|IT= 50 mA, RGK = 1 kΩ|Max.|5|mA| |IL|IG= 1 mA, RGK= 1 kΩ|Max.|6|mA| |dV/dt|VD= 67 % VDRM, RGK= 1 kΩ, Tj= 125 °C|Min.|40|V/µs| **Table 3. Static electrical characteristics** |**Symbol**|**Test conditions**|||**Value**|**Unit**| |---|---|---|---|---|---| |VTM|ITM= 1 A, tp= 380 µs|25 °C|Max.|1.35|V| |VTO|Threshold on-state voltage|125 °C|Max.|0.85|V| |Rd|Dynamic resistance|125 °C|Max.|245|mΩ| |IDRM<br>IRRM|VDRM= VRRM, RGK= 1 kΩ|25 °C|Max.|1|µA| ||VDRM= VRRM, RGK= 1 kΩ|125 °C||100|| **DS6289** - **Rev 4** **page 2/13** **X00619 Characteristics** ## **Table 4. Thermal resistance** |**Symbol**|**Parameters**|**Parameters**|**Parameters**|**Max.**<br>**value**|**Unit**| |---|---|---|---|---|---| |Rth(j-l)|Junction to leads (DC)||TO-92|70|°C/W| |Rth(j-c)|Junction to case (DC)||SOT-223|30|| |Rth(j-a)|Junction to ambient (DC)||TO-92|150|| ||Junction to ambient (DC)|S(1)= 5 cm2|SOT-223|60|| _1. S = Copper surface under tab._ **DS6289** - **Rev 4** **page 3/13** **X00619 Characteristics (curves)** ## **1.1 Characteristics (curves)** **==> picture [488 x 20] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 1. Maximum average power dissipation versus Figure 2. Average and DC on-state current versus case<br>average on-state current temperature (SOT-223)<br>**----- End of picture text -----**<br> **==> picture [474 x 139] intentionally omitted <==** **----- Start of picture text -----**<br> 0.6 P(W) 1.0 IT(AV)(A)<br>α = 30°, 60°, 90°, 120°, 180°, DC SOT-223 α = 30°, 60°, 90°, 120°, 180°, DC<br>0.8<br>0.4<br>0.6<br>0.4<br>0.2<br>360° 0.2<br>IT(AV)(A) α Tc(°C)<br>0.0 0.0<br>0.0 0.1 0.2 0.3 0.4 0.5 0.6 0 25 50 75 100 125<br>**----- End of picture text -----**<br> **Figure 3. Average and DC on-state current versus lead Figure 4. Average and DC on-state current versus ambient temperature (TO-92) temperature (free air convection)** **==> picture [477 x 140] intentionally omitted <==** **----- Start of picture text -----**<br> 1.0 IT(AV)(A) 1.0 IT(AV)(A)<br>TO-92 α = 30°, 60°, 90°, 120°, 180°, DC DC SOT-223<br>0.8 0.8 SCU= 5 cm²<br>0.6 0.6<br>0.4 0.4<br>0.2 0.2 α = 180° TO-92<br>Tl(°C) Tamb(°C)<br>0.0 0.0<br>0 25 50 75 100 125 0 25 50 75 100 125<br>**----- End of picture text -----**<br> **==> picture [513 x 192] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 5. Relative variation of thermal impedance junction Figure 6. Relative variation of gate trigger, holding and<br>to ambient versus pulse duration latching current versus junction temperature<br>1.00 Zth(j-a) /Rth(j-a) 1.6 IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]<br>Typical values<br>1.4<br>TO-92<br>SCU= 0.5 cm² 1.2<br>1.0<br>0.10 SOT-223 0.8 IH and IL<br>0.6<br>0.4 IGT<br>tp(s) 0.2 Tj(°C)<br>0.01<br>0.0<br>1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03<br>-40 -20 0 20 40 60 80 100 120<br>**----- End of picture text -----**<br> **DS6289** - **Rev 4** **page 4/13** **X00619 Characteristics (curves)** **Figure 7. Relative variation of holding current versus gate-cathode resistance (typical values)** **==> picture [222 x 143] intentionally omitted <==** **----- Start of picture text -----**<br> IH[RGK []][ / I] H [[][R] GK [=1kΩ]]<br>3.5<br>3.0<br>2.5<br>2.0<br>1.5<br>1.0<br>0.5<br>RGK(kΩ)<br>0.0<br>1.E-02 1.E-01 1.E+00 1.E+01 1.E+02<br>**----- End of picture text -----**<br> **Figure 9. Relative variation of static dV/dt immunity versus gate-cathode capacitance (typical values)** **==> picture [222 x 144] intentionally omitted <==** **----- Start of picture text -----**<br> dV/dt[C GK] / dV/dt[R GK=1kΩ]<br>100<br>VD= 0.67xVDRM<br>RGK = 1 kΩ<br>10<br>CGK(nF)<br>1<br>1 10<br>**----- End of picture text -----**<br> **Figure 11. Non-repetitive surge peak on-state current for sinusoidal pulse (tp< 10 ms)** **==> picture [221 x 141] intentionally omitted <==** **----- Start of picture text -----**<br> 100 ITSM(A)<br>Tj initial=25 °C<br>ITSM<br>10<br>1<br>tp(ms)<br>0<br>0.01 0.10 1.00 10.00<br>**----- End of picture text -----**<br> **Figure 8. Relative variation of static dV/dt immunity versus gate-cathode resistance (typical values)** **==> picture [222 x 143] intentionally omitted <==** **----- Start of picture text -----**<br> 100.0 dV/dt[R GK] / dV/dt[R GK=1kΩ]<br>VD= 0.67xVDRM<br>10.0<br>1.0<br>RGK(kΩ)<br>0.1<br>1.0E-01 1.0E+00 1.0E+01<br>**----- End of picture text -----**<br> **Figure 10. Surge peak on-state current versus number of cycles** **==> picture [222 x 146] intentionally omitted <==** **----- Start of picture text -----**<br> ITSM(A)<br>10<br>9<br>Non repetitive<br>8 Tj initial=25 °C tp=10ms<br>7 One cycle<br>6<br>5<br>4 Repetitive<br>3 TC = 83°C<br>2<br>1 Number of cycles<br>0<br>1 10 100 1000<br>**----- End of picture text -----**<br> **Figure 12. On-state characteristics (maximum values)** **==> picture [222 x 148] intentionally omitted <==** **----- Start of picture text -----**<br> 10.0 ITM(A)<br>1.0<br>TJ=125 C<br>TJ=25 C<br>Tj max<br>VTM(V) RVdto =245 mΩ=0.85 V<br>0.1<br>0.5 1.0 1.5 2.0 2.5 3.0<br>**----- End of picture text -----**<br> **DS6289** - **Rev 4** **page 5/13** **X00619 Characteristics (curves)** **Figure 13. Thermal resistance junction to ambient versus copper surface under tab** **==> picture [222 x 134] intentionally omitted <==** **----- Start of picture text -----**<br> Rth(j-a) (°C/W)<br>130<br>120<br>Epoxy printed circuit board<br>110 FR4, copper thickness = 35 µm<br>100<br>90<br>80<br>70<br>60<br>50<br>40<br>30<br>20<br>10 S(cm²)<br>0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br> **DS6289** - **Rev 4** **page 6/13** **X00619 Package information** ## **2 Package information** In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. ## **2.1 TO-92 package information** - Lead free plating + halogen-free molding resin - Epoxy meets UL94, V0 ## **Figure 14. TO-92 with straight leads (plastic) package outline** **==> picture [376 x 160] intentionally omitted <==** **----- Start of picture text -----**<br> c<br>A<br>a<br>B C<br>b<br>F D E<br>**----- End of picture text -----**<br> **Table 5. TO-92 with straight leads (plastic) package mechanical data** ||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**| |---|---|---|---|---|---|---| |**Ref.**|**Millimeters**|||**Inches(1)**||| ||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**| |A||1.35|||0.048|| |B|||4.70|||0.190| |C||2.54|||0.100|| |D|4.40|||0.172||| |E|12.70|||0.554||| |F|||3.70|||0.152| |a|||0.50|||0.022| |b||1.27|||0.050|| |c|||0.48|||0.019| _1. Inches dimensions given for information_ **DS6289** - **Rev 4** **page 7/13** **X00619** **TO-92 with leads preform (plastic) package information** ## **2.2 TO-92 with leads preform (plastic) package information** - Lead free plating + halogen-free molding resin - Epoxy meets UL94, V0 **Figure 15. TO-92 with leads preform (plastic) package outline** **Table 6. TO-92 with leads preform (plastic) package mechanical data** |**Ref.**<br>~~SS~~|**Dimensions**<br>~~SS~~|**Dimensions**<br>~~SS~~|**Dimensions**<br>~~SS~~|**Dimensions**<br>~~SS~~|**Dimensions**<br>~~SS~~|**Dimensions**<br>~~SS~~| |---|---|---|---|---|---|---| ||**Millimeters**<br>~~SS~~|||**Inches(1)**<br>~~SS~~||| ||**Min.**<br>~~SS~~|**Typ.**<br>~~SS~~|**Max.**<br>~~SS~~|**Min.**<br>~~SS~~|**Typ.**<br>~~SS~~|**Max.**<br>~~SS~~| |G|1.30|1.70|2.00|0.051|0.067|0.079| |H|7.69||9.69|0.303||0.381| |d|2.40||2.90|0.094||0.114| |θ|30°|40°|50°|30°|40°|50°| _1. Inches dimensions given for information_ **DS6289** - **Rev 4** **page 8/13** **X00619 SOT-223 package information** ## **2.3 SOT-223 package information** - Epoxy meets UL94, V0 - Lead free plating + halogen-free molding resin ## **Figure 16. SOT-223 package outline** **==> picture [346 x 305] intentionally omitted <==** **----- Start of picture text -----**<br> A V c<br>A1<br>B<br>e1<br>D<br>B1<br>4<br>H E<br>1 2 3<br>e<br>**----- End of picture text -----**<br> **DS6289** - **Rev 4** **page 9/13** **X00619 SOT-223 package information** **Table 7. SOT-223 package mechanical data** ||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**| |---|---|---|---|---|---|---| |**Ref.**|**Millimeters**|||**Inches(1)**||| ||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**| |A|||1.80|||0.0709| |A1||0.02|0.10||0.0008|0.0039| |B|0.60|0.70|0.85|0.024|0.0276|0.0335| |B1|2.90|3.00|3.15|0.114|0.1181|0.1240| |c|0.24|0.26|0.35|0.009|0.0102|0.0138| |D|6.30|6.50|6.70|0.248|0.2559|0.2638| |e||2.3|||0.0906|| |e1||4.6|||0.1811|| |E|3.30|3.50|3.70|0.130|0.1378|0.1457| |H|6.70|7.00|7.30|0.264|0.2756|0.2874| |V|10° max.|||||| _1. Inches only for reference_ ## **Figure 17. SOT-223 footprint (dimensions in mm)** **==> picture [160 x 155] intentionally omitted <==** **----- Start of picture text -----**<br> 3.25<br>1.32<br>5.16 7.80<br>1.32<br>2.30 0.95<br>**----- End of picture text -----**<br> **DS6289** - **Rev 4** **page 10/13** **X00619 Ordering information** ## **3** ## **Ordering information** **Figure 18. Ordering information scheme** **==> picture [300 x 209] intentionally omitted <==** **----- Start of picture text -----**<br> X 006 19 M A 1AA2<br>Sensitive SCR series<br>Current<br>006 = 0.8 A<br>Sensitivity<br>19 = 30 µA to 200 µA<br>Voltag e<br>M = 600 V<br>Package<br>A = TO-92<br>N = SOT-223<br>Packing mode<br>1AA2 = Bulk (TO-92 with straight leads)<br>2AL2 = Ammopack (TO-92 with leads preform)<br>5AL2 = Tape and reel (TO-92 with leads preform and SOT-223)<br>**----- End of picture text -----**<br> **Table 8. Ordering information** |**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**| |---|---|---|---|---|---| |X00619MA1AA2|X0619 MA|TO-92 straight leads|0.2 g|2500|Bulk| |X00619MA2AL2||TO-92 leads preform|0.2 g|2000|Ammopack| |X00619MA5AL2|||0.2 g|2000|Tape and reel| |X00619MN5AL2|X0 619 MN|SOT-223|0.12 g|1000|| **DS6289** - **Rev 4** **page 11/13** **X00619** ## **Revision history** **Table 9. Document revision history** |**Date**|**Revision**|**Changes**| |---|---|---| |26-May-2009|1|First issue.| |03-May-2012|2|Added SOT-223 package.| |03-Sep-2021|3|Inserted TO-92 with leads preform package.| |20-Dec-2021|4|UpdatedFigure 10andFigure 11.| **DS6289** - **Rev 4** **page 12/13** **X00619** ## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2021 STMicroelectronics – All rights reserved **DS6289** - **Rev 4** **page 13/13**
Updated at June 10, 2026
STMicroelectronics is a global leader in the semiconductor industry, recognized for developing highly integrated, energy-efficient solutions that power modern electronics. With a strong focus on innovation, ST provides a comprehensive portfolio of microelectronics that address the demanding requirements of industrial, automotive, communications, and consumer applications. Our extensive selection of STMicroelectronics components is built around a robust lineup of discrete semiconductors and circuit protection devices. We offer a wide variety of single MOSFETs, Schottky diodes, and fast and ultrafast recovery rectifier diodes, designed to deliver exceptional efficiency and thermal performance in power management and conversion systems. For robust circuit protection, our inventory features hundreds of transient voltage suppressors and TVS diodes that safeguard sensitive electronic components against destructive voltage spikes. In addition to core power discretes like TRIACs, SCRs, bipolar transistors, and single IGBTs, our STMicroelectronics range includes specialized integrated passive filters and MEMS sensors. Furthermore, ST offers advanced integrated passive devices, such as baluns and RF filters, which utilize high-quality monolithic RF IPD processes on glass or high-resistance silicon substrates. These components provide competitive cost structures, reduced power losses, and simplified RFIC-to-antenna matching, ensuring optimal system performance and delivering the reliability required for next-generation wireless and power designs.
About Novapart
Novapart is a B2B electronic component broker specialising in stock shortages and cost reduction. We source hard-to-find parts and identify compliant alternatives across a catalogue of 540,000+ components from 500+ manufacturers.
Learn more →Stock Shortage Specialist
When a component is unavailable, discontinued or has an unacceptable lead time, we tap into our network of vetted European and Asian distributors to source what you need — without compromising on quality or traceability.
Request a quote →Compliant Alternatives
We identify pin-to-pin, electrically equivalent substitutes that meet the same certifications (RoHS, AEC-Q100, REACH) as your original specification — validated against datasheets, not just part numbers. Often at a lower cost.
BOM Analysis service →