TLP4590A(D4TP1,F(O

TLP4590A,TLP4590AF 

Photocouplers Photorelay 

## TLP4590A,TLP4590AF 

## 1. Applications 

- Heating, ventilation and air conditioning (HVAC) 

- Security Systems 

- Factory Automation (FA) 

- Power supplies 

- Measuring Instruments 

- Mechanical relay replacements 

## 2. General 

The TLP4590A and TLP4590AF photorelay consists of a photo MOSFET optically coupled to an infrared light emitting diode. It is housed in a 6-pin DIP package. 

The TLP4590A and TLP4590AF are suitable for replacement of mechanical relays in many applications which require space savings. 

## 3. Features 

- (1) Normally closed (1-Form-B) 

- (2) OFF-state output terminal voltage: 60 V (min) 

- (3) Trigger LED current: 2 mA (max) 

- (4) ON-state current: 1.2 A (max) (Ta = 25 ) 

- (5) ON-state resistance: 0.6 Ω (max) 

- (6) Isolation voltage: 5000 Vrms (min) 

   - UL-recognized: UL 1577, File No.E67349 

cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 

VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1) 

(Note 1):When a VDE approved type is needed, please designate the Option (D4) . 

## 4. Mechanical Parameters 

|Characteristics|7.62-mm pitch<br>TLP4590A|10.16-mm pitch<br>TLP4590AF|Unit|
|---|---|---|---|
|Creepage distances|7.0 (min)|8.0 (min)|mm|
|Clearance distances|7.0 (min)|8.0 (min)||
|Internal isolation thickness|0.3 (min)|0.3 (min)||



Start of commercial production 2021-03 

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TLP4590A,TLP4590AF 

## 5. Packaging (Note) 

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**----- Start of picture text -----**<br>
TLP4590A TLP4590A(LF1,TP1) TLP4590A(LF5,TP5)<br><< ‘f ‘oS<br>11-7A8S 11-7A801S 11-7A805S<br>TLP4590AF TLP4590AF(LF4,TP4)<br>ay<br>11-7A804S<br>11-7A802S<br>**----- End of picture text -----**<br>


Note: Through-hole type: TLP4590A, TLP4590AF : Lead forming option: (LF1), (LF4), (LF5) : Taping option: (TP1), (TP4), (TP5) 

## 6. Pin Assignment 

**==> picture [41 x 47] intentionally omitted <==**

**----- Start of picture text -----**<br>
1: Anode<br>2: Cathode<br>4: Drain D1<br>5: Source<br>6: Drain D2<br>**----- End of picture text -----**<br>


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## 7. Internal Circuit 

## 8. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 

) 

|a|Characteristics<br>|Symbol<br><br>~~GG~~|Note<br><br>~~GG~~|Rating<br>|Unit<br>|
|---|---|---|---|---|---|
|LED<br>|Input forward current<br>~~a~~|IF<br>~~a~~<br>~~GG~~|~~a~~<br>~~GG~~|20<br>~~a~~|mA<br>~~a~~|
||Input forward current derating<br>(Ta ≥58<br>)<br>~~<I~~|∆IF/∆Ta<br>~~GG~~<br>~~<I~~|~~GG~~<br>~~<I~~|-0.3<br>~~<I~~|mA/<br>~~<I~~|
||Input forward current (pulsed)<br>(100µs pulse, 100 pps)<br>~~a~~|IFP<br>~~a~~|~~a~~|1<br>~~a~~|A<br>~~a~~|
||Input reverse voltage<br>~~a~~|VR<br>~~a~~|~~a~~|6<br>~~a~~|V<br>~~a~~|
||Input power dissipation<br>~~a~~<br>~~<~~|PD<br>~~a~~|~~a~~|50<br>~~a~~<br>~~c)~~|mW<br>~~a~~<br>~~c)~~|
||Input power dissipation derating<br>(Ta≥25<br>)<br>~~a~~<br>~~<~~|∆PD/∆Ta<br>~~a~~|~~a~~|-0.5<br>~~a~~<br>~~c)~~|mW/<br>~~a~~<br>~~c)~~|
||Junction temperature<br>~~<~~<br>~~Gc~~|Tj<br>~~Gc~~|~~Gc~~|125<br>~~c)~~<br>~~Gc~~|~~c)~~<br>~~Gc~~|
|Detector<br>~~pO~~<br>~~pO~~|OFF-state output terminal voltage<br>~~a~~<br>~~pO~~|VOFF<br>~~a~~<br>~~ne~~|~~a~~<br>~~|~~|60<br>~~a~~<br>~~|~~|V<br>~~a~~|
||ON-state current(A connection)<br>~~——~~<br>~~pO~~|ION<br>~~——~~<br>~~ne~~|(Note 1)<br>~~——~~<br>~~|~~<br>~~|~~|1200<br>~~——~~<br>~~|~~|mA<br>~~——~~|
||ON-state current(B connection)<br>~~——~~<br>~~pO~~<br>~~pO~~|||1200<br>~~——~~<br>~~|~~<br>~~|~~||
||ON-state current(C connection)<br>~~——~~<br>~~pO~~<br>~~pO~~|||2400<br>~~——~~<br>~~|~~<br>~~|~~||
||ON-state current derating(A connection)<br>(Ta ≥25<br>)<br>~~pO~~<br>~~pO~~<br>~~———~~|∆ION/∆Ta<br>~~ne~~<br>~~|~~|(Note 1)<br>~~|~~<br>~~|~~<br>~~|~~<br>~~|~~|-12.0<br>~~|~~<br>~~|a~~<br>~~|~~|mA/<br>~~|~~|
||ON-state current derating(B connection)<br>(Ta ≥25<br>)<br>~~pO~~<br>~~———~~|||-12.0<br>~~|~~<br>~~|~~<br>~~|~~||
||ON-state current derating(C connection)<br>(Ta ≥25<br>)<br>~~———~~|||-24.0<br>~~|~~<br>~~|~~||
||ON-state current (pulsed)<br>(t = 100 ms, duty = 1/10)<br>~~a~~|IONP<br>~~a~~|~~|~~<br>~~a~~|3<br>~~|~~<br>~~a~~|A<br>~~a~~|
||Output power dissipation<br>~~a~~|PO<br>~~a~~|~~a~~|750<br>~~a~~|mW<br>~~a~~|
||Output power dissipation derating<br>(Ta≥25<br>)<br>~~«cd~~|∆PO/∆Ta<br>~~«cd~~|~~«cd~~|-7.50<br>~~«cd~~|mW/<br>~~«cd~~|
||Junction temperature<br>~~cc~~|Tj<br>~~cc~~|~~cc~~<br>~~Gc~~|125<br>~~cc~~<br>~~Gc~~|~~cc~~<br>~~Gc~~|
|Common|Storage temperature<br>~~a~~|Tstg<br>~~a~~|~~a~~<br>~~Gc~~|-55 to 125<br>~~a~~<br>~~Gc~~|~~a~~<br>~~Gc~~|
||Operating temperature<br>~~Gc~~|Topr<br>~~Gc~~|~~Gc~~<br>~~Gc~~|-40 to 110<br>~~Gc~~<br>~~Gc~~|~~Gc~~<br>~~Gc~~|
||Lead soldering temperature<br>(10 s)<br>~~Dc~~|Tsol<br>~~Dc~~|~~Dc~~|260<br>~~Dc~~|~~Dc~~|
||Isolation voltage<br>(AC, 60 s, R.H.≤60 %)<br>~~a~~|BVS<br>~~a~~|(Note 2)<br>~~a~~|5000<br>~~a~~|Vrms<br>~~a~~|



Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. 

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). 

Note 1: For an application circuit example, see Chapter 15. 

Note 2: This device is considered as a two-terminal device: All pins on the LED side are shorted together, and all pin on the photodetector side are shorted together. 

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) 

## 9. Electrical Characteristics (Unless otherwise specified, Ta = 25 

||Characteristics|Symbol|Note|Test Condition|Min|Typ.|Max|Unit|
|---|---|---|---|---|---|---|---|---|
|LED<br>~~pO~~|Input forward voltage<br>~~pO~~|VF||IF= 10 mA|1.1|1.27|1.4|V|
||Input reverse current<br>~~pO~~<br>~~es~~<br>~~a~~|IR<br>~~es~~|~~es~~|VR= 6 V<br>~~es~~|~~es~~<br>~~|~~|~~es~~<br>~~|~~|10<br>~~es~~|µA<br>~~es~~|
||Input capacitance<br>~~po~~<br>~~a~~|Ct<br>~~po~~|~~po~~|V = 0 V, f = 1 MHz<br>~~po~~|~~po~~<br>~~|~~|70<br>~~po~~<br>~~|~~|~~po~~|pF<br>~~po~~|
|Detector|OFF-state current<br>~~a~~|IOFF||VOFF= 60 V, IF= 5 mA|~~|~~|~~|~~|10|µA|
||OFF-state current<br>~~es~~|IOFF<br>~~es~~|~~es~~|VOFF= 40 V, IF= 2 mA<br>~~es~~|~~es~~|~~es~~|1<br>~~es~~|µA<br>~~es~~|
||Output capacitance<br>~~SO~~|COFF<br>~~SO~~|~~SO~~|V = 0 V, f = 1 MHz, IF= 5 mA<br>~~SO~~|~~SO~~|550<br>~~SO~~|~~SO~~|pF<br>~~SO~~|



## 10. Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25 °C ) 

|Characteristics|Symbol|Note|Test Condition|Min|Typ.|Max|Unit|
|---|---|---|---|---|---|---|---|
|Trigger LED current<br>~~pe~~|IFC<br>~~pe~~|~~pe~~|IOFF= 10µA<br>~~pe~~|~~pe~~|0.3<br>~~pe~~|2<br>~~pe~~|mA<br>~~pe~~|
|Return LED current<br>~~pe~~<br>~~po~~<br>~~po~~|IFT<br>~~pe~~|~~pe~~|ION= 1200 mA<br>~~pe~~<br>~~ee~~|0.01<br>~~pe~~<br>~~ee~~<br>~~ee~~|~~pe~~<br>~~ee~~<br>~~ee~~|~~pe~~<br>~~ee~~|mA<br>~~pe~~|
|ON-state resistance(A connection)<br>~~po~~<br>~~po~~<br>~~po~~|RON|(note 1)|ION= 1200 mA<br>~~ee~~|~~ee~~<br>~~ee~~<br>~~ee~~|0.3<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.6<br>~~ee~~|Ω|
|ON-state resistance(B connection)<br>~~po~~<br>~~po~~<br>~~po~~|||ION= 1200 mA<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.2<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~||
|ON-state resistance(C connection)<br>~~po~~<br>~~po~~|||ION= 2400 mA<br>~~ee~~|~~ee ~~<br>~~ee~~<br>~~ee~~|0.1<br> ~~ee~~<br>~~ee~~<br>~~ee~~|~~ee~~||



note 1: For an application circuit example, see Chapter 15. 

## 11. Isolation Characteristics (Unless otherwise specified, Ta = 25 

## ) 

|Characteristics|Symbol|Note|Test Condition|Min|Typ.|Max|Unit|
|---|---|---|---|---|---|---|---|
|Total capacitance (input to output)|CS|(Note 1)|VS= 0 V, f = 1 MHz||0.9||pF|
|Isolation resistance<br>~~a ~~<br>~~po~~|RS<br> ~~Oe~~|(Note 1)<br>~~Oe~~|VS= 500 V, R.H.≤60 %<br>~~Oe~~|12×<br>1010<br>~~Oe~~|1014<br>~~Oe~~|~~Oe~~|Ω<br>~~Oe~~|
|Isolation voltage<br>~~po~~|BVS|(Note 1)|AC, 60 s|5000|||Vrms|



Note 1: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6 are shorted together. 

12. Switching Characteristics (Unless otherwise specified,  Ta = 25 °C ) 

|Characteristics|Symbol|Note|Test Condition|Min|Typ.|Max|Unit|
|---|---|---|---|---|---|---|---|
|Turn-on time|tON||See Fig. 12.1.<br>RL= 200Ω, VDD= 20 V, IF= 5 mA||0.3|2|ms|
|Turn-off time|tOFF||See Fig. 12.1.<br>RL= 200Ω, VDD= 20 V, IF= 5 mA||2|3|ms|



Fig. 12.1 Switching Time Test Circuit and Waveform 

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TLP4590A,TLP4590AF 

## 13. Characteristics Curves (Note) 

Fig. 13.1 IF - Ta 

Fig. 13.3 IF - VF 

Fig. 13.5 RON - Ta 

Fig. 13.2 ION - Ta 

Fig. 13.4 ION - VON 

Fig. 13.6 IFC - Ta 

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Fig. 13.7 tON, tOFF - IF 

Fig. 13.8 tON, tOFF - Ta 

Fig. 13.9 IOFF - Ta 

Fig. 13.10 IOFF - VOFF 

Fig. 13.11 IOFF - IF 

Note: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. 

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## 14. Circuit Connections 

Fig. 14.1 A connection 

Fig. 14.2 B connection 

Fig. 14.3 C connection 

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## 15. Soldering and Storage 

## 15.1. Precautions for Soldering 

The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective 

of whether a soldering iron or a reflow soldering method is used. 

- When using soldering reflow. 

   - The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.) 

Reflow soldering must be performed once or twice. 

The mounting should be completed with the interval from the first to the last mountings being 2 weeks. 

## An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used 

- When using soldering flow 

Preheat the device at a temperature of 150 °C (package surface temperature) for 60 to 120 seconds. Mounting condition of 260 °C within 10 seconds is recommended. Flow soldering must be performed once. 

- When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260 °C or within 3 seconds not exceeding 350 °C 

Heating by soldering iron must be done only once per lead. 

## 15.2. Precautions for General Storage 

- Avoid storage locations where devices may be exposed to moisture or direct sunlight. 

- Follow the precautions printed on the packing label of the device for transportation and storage. 

- Keep the storage location temperature and humidity within a range of 5 °C to 35 °C and 45 % to 75 %, respectively. 

- Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. 

- Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. 

- When restoring devices after removal from their packing, use anti-static containers. 

- Do not allow loads to be applied directly to devices while they are in storage. 

- If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. 

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## 16. Marking 

## TLP4590A 

## TLP4590AF 

## 17. Ordering Information (Example of Item Name) 

|Item Name|Packaging (Note 1)|VDE Option|Packing (MOQ)|
|---|---|---|---|
|TLP4590A(F|TH||Magazine (50 pcs)|
|TLP4590A(LF1,F|LF1||Magazine (50 pcs)|
|TLP4590A(LF5,F|LF5||Magazine (50 pcs)|
|TLP4590A(TP1,F|LF1||Tape and reel (1500 pcs)|
|TLP4590A(TP5,F|LF5||Tape and reel (1500 pcs)|
|TLP4590A(D4,F|TH|EN 60747-5-5|Magazine (50 pcs)|
|TLP4590A(D4LF1,F|LF1|EN 60747-5-5|Magazine (50 pcs)|
|TLP4590A(D4LF5,F|LF5|EN 60747-5-5|Magazine (50 pcs)|
|TLP4590A(D4TP1,F|LF1|EN 60747-5-5|Tape and reel (1500 pcs)|
|TLP4590A(D4TP5,F|LF5|EN 60747-5-5|Tape and reel (1500 pcs)|
|TLP4590AF(F|TH, Wide forming||Magazine (50 pcs)|
|TLP4590AF(LF4,F|LF4, Wide forming||Magazine (50 pcs)|
|TLP4590AF(TP4,F|LF4, Wide forming||Tape and reel (1000 pcs)|
|TLP4590AF(D4,F|TH, Wide forming|EN 60747-5-5|Magazine (50 pcs)|
|TLP4590AF(D4LF4F|LF4, Wide forming|EN 60747-5-5|Magazine (50 pcs)|
|TLP4590AF(D4TP4F|LF4, Wide forming|EN 60747-5-5|Tape and reel (1000 pcs)|



Note 1: TH: Through-hole, LF: Lead forming for surface mount 

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## Package Dimensions 

Unit: mm 

**==> picture [48 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
TLP4590A<br>**----- End of picture text -----**<br>


## Weight: 0.4 g (typ.) 

Package Name(s) TOSHIBA: 11-7A8S 

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## Package Dimensions 

Unit: mm 

**==> picture [93 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
TLP4590A(LF1,TP1)<br>**----- End of picture text -----**<br>


Weight: 0.39 g (typ.) 

**==> picture [148 x 25] intentionally omitted <==**

**----- Start of picture text -----**<br>
Package Name(s)<br>TOSHIBA: 11-7A801S<br>**----- End of picture text -----**<br>


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## Package Dimensions 

Unit: mm 

**==> picture [93 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
TLP4590A(LF5,TP5)<br>**----- End of picture text -----**<br>


Weight: 0.39 g (typ.) 

Package Name(s) TOSHIBA: 11-7A805S 

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TLP4590A,TLP4590AF 

## Package Dimensions 

Unit: mm 

**==> picture [54 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
TLP4590AF<br>**----- End of picture text -----**<br>


Weight: 0.4 g (typ.) 

**==> picture [148 x 25] intentionally omitted <==**

**----- Start of picture text -----**<br>
Package Name(s)<br>TOSHIBA: 11-7A802S<br>**----- End of picture text -----**<br>


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## Package Dimensions 

Unit: mm 

**==> picture [99 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
TLP4590AF(LF4,TP4)<br>**----- End of picture text -----**<br>


## Weight: 0.39 g (typ.) 

**==> picture [148 x 24] intentionally omitted <==**

**----- Start of picture text -----**<br>
Package Name(s)<br>TOSHIBA: 11-7A804S<br>**----- End of picture text -----**<br>


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## RESTRICTIONS ON PRODUCT USE 

Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA". Hardware, software and systems described in this document are collectively referred to as "Product". 

- TOSHIBA reserves the right to make changes to the information in this document and related Product without notice. 

- This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. 

- Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. 

- **PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE").** Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, Class 3 medical devices, equipment used for automobiles, and military vehicles and munitions. **IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.** For details, please contact your TOSHIBA sales representative or contact us via our website. 

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- ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. 

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https://toshiba.semicon-storage.com/ 

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