TLP3549(D4,TP5,F(O

TLP3549,TLP3549F 

Photocouplers Photorelay 

## **TLP3549,TLP3549F** 

## **1. Applications** 

- Mechanical relay replacements 

- Factory Automation (FA) 

- Programmable Logic Controllers (PLCs) 

- Measuring Instruments 

- ATE (Automatic Test Equipment) 

## **2. General** 

The TLP3549 and TLP3549F photorelay consist of a photo MOSFET optically coupled to an infrared LED. It is housed in a 8-pin DIP package. The low ON-state resistance and the high permissible ON-state current of the TLP3549 and TLP3549F make it suitable for power line control applications. 

## **3. Features** 

- (1) Normally opened (1-Form-A) 

- (2) OFF-state output terminal voltage: 600 V (min) 

- (3) Trigger LED current: 5.0 mA (max) 

- (4) ON-state current: 0.6 A (max) (A connection) 

- (5) ON-state resistance: 2 Ω (max) (A connection) 

- (6) Isolation voltage: 2500 Vrms (min) 

- (7) Safety standards 

   - UL-recognized: UL 1577, File No.E67349 

cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 

- UL-recognized: UL 508, File No.E499232 **(Note 1)** 

VDE-approved: EN 60747-5-5 **(Note 2)** 

Note 1: Please refer Absolute Maximum Ratings (UL-recognized UL 508) for UL 508 products. Note 2: When a VDE approved type is needed, please designate the **Option (D4)** . 

## **4. Mechanical Parameters** 

|Characteristics|7.62-mm Pitch<br>TLP3549|10.16-mm Pitch<br>TLP3549F|Unit|
|---|---|---|---|
|Creepage distances|7.0 (min)|8.0 (min)|mm|
|Clearance distances|7.0 (min)|8.0 (min)||
|Internal isolation thickness|0.4 (min)|0.4 (min)||



Start of commercial production 2016-05 

©2026 

1 

2026-04-07 Rev.5.0.A 

Toshiba Electronic Devices & Storage Corporation 

TLP3549,TLP3549F 

## **5. Packaging (Note)** 

**==> picture [409 x 336] intentionally omitted <==**

**----- Start of picture text -----**<br>
TLP3549 TLP3549(LF1,TP1) TLP3549(LF5,TP5)<br><< S 9 “of<br>11-10C4S 11-10C401S 11-10C405S<br>TLP3549F TLP3549F(LF4,TP4)<br>11-10C402S 11-10C404S<br>**----- End of picture text -----**<br>


Note: Through-hole type: TLP3549, TLP3549F Lead forming option: (LF1), (LF4), (LF5) Taping option: (TP1), (TP4), (TP5) 

## **6. Pin Assignment** 

**==> picture [40 x 77] intentionally omitted <==**

**----- Start of picture text -----**<br>
1: N.C.<br>2: Anode<br>3: Cathode<br>4: N.C.<br>5: Drain<br>6: Source<br>7: Source<br>8: Drain<br>**----- End of picture text -----**<br>


©2026 Toshiba Electronic Devices & Storage Corporation 

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TLP3549,TLP3549F 

## **7. Internal Circuit** 

## **8. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 )** 

||Characteristics|Symbol|Note|Rating|Unit|
|---|---|---|---|---|---|
|LED|Input forward current<br>~~pf~~|IF<br>~~pf~~|~~pf~~|30<br>~~pf~~|mA<br>~~pf~~|
||Input forward current derating<br>(Ta ≥25)<br>~~a~~|∆IF/∆Ta<br>~~a~~|~~a~~|-0.3<br>~~a~~|mA/<br>~~a~~|
||Input forward current (pulsed)<br>(100µs pulse, 100 pps)<br>~~a~~|IFP<br>~~a~~|~~a~~|1<br>~~a~~|A<br>~~a~~|
||Input reverse voltage<br>~~a~~|VR<br>~~a~~|~~a~~|5<br>~~a~~|V<br>~~a~~|
||Input power dissipation<br>~~a~~|PD<br>~~a~~|~~a~~|50<br>~~a~~|mW<br>~~a~~|
||Input power dissipation derating<br>(Ta ≥25)<br>~~a~~|∆PD/∆Ta<br>~~a~~|~~a~~|-0.5<br>~~a~~|mW/<br>~~a~~|
||Junction temperature<br>~~a~~|Tj<br>~~a~~|~~a~~|125<br>~~a~~|<br>~~a~~|
|Detector|OFF-state output terminal voltage<br>~~a~~|VOFF<br>~~a~~|~~a~~|600<br>~~a~~|V<br>~~a~~|
||ON-state current (A connection)|ION|(Note 1)|0.6|A|
||ON-state current (B connection)|||0.6||
||ON-state current (C connection)|||1.2||
||ON-state current derating (A connection)<br>(Ta ≥25)|∆ION/∆Ta|(Note 1)|-6<br>~~pe~~|mA/|
||ON-state current derating (B connection)<br>(Ta ≥25)|||-6||
||ON-state current derating (C connection)<br>(Ta ≥25)|||-12||
||ON-state current (pulsed)<br>(t = 100 ms, duty = 1/10)<br>~~a~~|IONP<br>~~a~~|~~a~~|1.8<br>~~a~~|A<br>~~a~~|
||Output power dissipation<br>~~a~~|PO<br>~~a~~|~~a~~|750<br>~~a~~|mW<br>~~a~~|
||Output power dissipation derating<br>(Ta ≥25)<br>~~a~~|∆PO/∆Ta<br>~~a~~|~~a~~|-7.5<br>~~a~~|mW/<br>~~a~~|
||Junction temperature<br>~~a~~|Tj<br>~~a~~|~~a~~|125<br>~~a~~|<br>~~a~~|
|Common|Storage temperature<br>~~a~~|Tstg<br>~~a~~|~~a~~|-55 to 125<br>~~a~~|<br>~~a~~<br>~~a~~<br>~~a~~|
||Operating temperature<br>~~a~~|Topr<br>~~a~~|~~a~~|-40 to 85<br>~~a~~||
||Lead soldering temperature<br>(10 s)<br>~~a~~|Tsol<br>~~a~~|~~a~~|260<br>~~a~~||
||Isolation voltage<br>AC, 60 s, R.H.≤60 %<br>~~a~~|BVS<br>~~a~~|(Note 2)<br>~~a~~|2500<br>~~a~~|Vrms<br>~~a~~|



Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). 

Note 1: For an application circuit example, see Chapter 16.2. 

Note 2: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together. 

©2026 

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2026-04-07 Rev.5.0.A 

Toshiba Electronic Devices & Storage Corporation 

TLP3549,TLP3549F 

## **9. Recommended Operating Conditions (Note)** 

|Characteristics|Symbol|Note|Min|Typ.|Max|Unit|
|---|---|---|---|---|---|---|
|Supply voltage|VDD||||480|V|
|Input forward current|IF|||5|25|mA|
|ON-state current (A connection)|ION||||0.6|A|
|Operating temperature|Topr||-40||85||



Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this data sheet should also be considered. 

## **10. Absolute Maximum Ratings (UL-recognized: UL 508) (Note) (Unless otherwise** 

**specified, Ta = 25 )** 

||Characteristics|Symbol<br>~~GG~~|Note<br>~~GG~~|Rating|Unit|
|---|---|---|---|---|---|
|LED|Input forward current<br>~~a~~|IF<br>~~a~~<br>~~GG~~|~~a~~<br>~~GG~~|30<br>~~a~~|mA<br>~~a~~|
||Input forward current derating<br>(Ta ≥25)<br>~~a~~|∆IF/∆Ta<br>~~GG~~<br>~~a~~|~~GG~~<br>~~a~~|-0.3<br>~~a~~|mA/<br>~~a~~|
||Input forward current (pulsed)<br>(100µs pulse, 100 pps)<br>~~a~~|IFP<br>~~a~~|~~a~~|1<br>~~a~~|A<br>~~a~~|
||Input reverse voltage<br>~~a~~|VR<br>~~a~~|~~a~~|5<br>~~a~~|V<br>~~a~~|
||Input power dissipation<br>~~a~~|PD<br>~~a~~|~~a~~|50<br>~~a~~|mW<br>~~a~~|
||Input power dissipation derating<br>(Ta ≥25)<br>~~a~~|∆PD/∆Ta<br>~~a~~|~~a~~|-0.5<br>~~a~~|mW/<br>~~a~~|
||Junction temperature<br>~~a~~|Tj<br>~~a~~|~~a~~|105<br>~~a~~|<br>~~a~~|
|Detector<br>~~pO~~|OFF-state output terminal voltage<br>~~a~~|VOFF<br>~~a~~|~~a~~|600<br>~~a~~|V<br>~~a~~|
||ON-state current (A connection)|ION|(Note 1)<br>~~|~~|0.6|A|
||ON-state current (B connection)|||0.6||
||ON-state current (C connection)<br>~~pO~~|||1.2<br>~~|~~||
||ON-state current derating (A connection)<br>(Ta ≥25)<br>~~pO~~|∆ION/∆Ta|(Note 1)<br>~~|~~|-6<br>~~|~~|mA/|
||ON-state current derating (B connection)<br>(Ta ≥25)<br>~~pO~~|||-6<br>~~|~~||
||ON-state current derating (C connection)<br>(Ta ≥25)|||-12||
||ON-state current (pulsed)<br>(t = 100 ms, duty = 1/10)<br>~~a~~|IONP<br>~~a~~<br>~~G~~|~~a~~<br>~~G~~|1.8<br>~~a~~|A<br>~~a~~|
||Output power dissipation<br>~~a~~|PO<br>~~a~~<br>~~G~~|~~a~~<br>~~G~~|750<br>~~a~~|mW<br>~~a~~|
||Output power dissipation derating<br>(Ta ≥25)<br>~~a~~|∆PO/∆Ta<br>~~G~~<br>~~a~~|~~G~~<br>~~a~~|-7.5<br>~~a~~|mW/<br>~~a~~|
||Junction temperature<br>~~a~~|Tj<br>~~a~~|~~a~~|105<br>~~a~~|<br>~~a~~|
|Common|Storage temperature<br>~~GG~~|Tstg<br>~~GG~~|~~GG~~|-55 to 125<br>~~GG~~|<br>~~GG~~|
||Case temperature<br>~~a~~|Tc<br>~~a~~|~~a~~|105<br>~~a~~|<br>~~a~~|
||Operating temperature<br>~~a~~|Topr<br>~~a~~<br>~~G~~|~~a~~<br>~~G~~|-40 to 85<br>~~a~~|<br>~~a~~|
||Lead soldering temperature<br>(10 s)<br>~~a~~|Tsol<br>~~a~~<br>~~G~~|~~a~~<br>~~G~~|260<br>~~a~~|<br>~~a~~|
||Isolation voltage<br>(AC, 60 s, R.H.≤60 %)<br>~~a~~|BVS<br>~~G~~<br>~~a~~|(Note 2)<br>~~G~~<br>~~a~~|2500<br>~~a~~|Vrms<br>~~a~~|



Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. 

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). 

Note 1: For an application circuit example, see Chapter 16.2. 

Note 2: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together. 

©2026 

4 

2026-04-07 Rev.5.0.A 

Toshiba Electronic Devices & Storage Corporation 

TLP3549,TLP3549F 

## **11. Recommended Operating Conditions (UL-recognized: UL 508) (Note)** 

|Characteristics|Symbol|Note|Min|Typ.|Max|Unit|
|---|---|---|---|---|---|---|
|Supply voltage|VDD||||480|V|
|Input forward current|IF|(Note 1)||5|19.5|mA|
|ON-state current(A connection)|ION|(Note 1)|||0.4|A|
|Operating temperature|Topr||-20||85||



Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this data sheet should also be considered. Note 1: The above recommended operating conditions are at Ta = 60 . 

However, within the derating range of the characteristic curves of "IF - Ta", "ION - Ta", it can be used up to 85 . 

## **12. Electrical Characteristics (Unless otherwise specified, Ta = 25 )** 

||Characteristics|Symbol|Note|Test Condition|Min|Typ.|Max|Unit|
|---|---|---|---|---|---|---|---|---|
|LED<br>~~po~~<br>~~po~~|Input forward voltage<br>~~es~~<br>~~po~~|VF<br>~~es~~|~~es~~|IF= 10 mA<br>~~es~~|1.50<br>~~es~~|1.64<br>~~es~~|1.80<br>~~es~~|V<br>~~es~~|
||Input reverse current<br>~~po~~<br>~~po~~|IR||VR= 5 V|||10|µA|
||Input capacitance<br>~~po~~<br>~~po~~|Ct||V = 0 V, f = 1 MHz||70||pF|
|Detector<br>~~po~~<br>~~pf~~|OFF-state current<br>~~po~~<br>~~pf~~|IOFF<br>~~pf~~<br>~~ee~~|~~pf~~<br>~~es~~|VOFF= 600 V<br>~~pf~~|<br>~~pf~~|0.05<br>~~pf~~|10<br>~~pf~~|µA<br>~~pf~~|
||Output capacitance<br>~~pf~~<br>~~es~~|COFF<br>~~pf~~<br>~~es~~<br>~~ee~~|~~pf~~<br>~~es~~<br>~~es~~|V = 0 V, f = 1 MHz<br>~~pf~~<br>~~es~~|<br>~~pf~~<br>~~es~~|4300<br>~~pf~~<br>~~es~~|<br>~~pf~~<br>~~es~~|pF<br>~~pf~~<br>~~es~~|



## **13. Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25 )** 

|Characteristics|Symbol|Note|Test Condition|Min|Typ.|Max|Unit|
|---|---|---|---|---|---|---|---|
|Trigger LED current|IFT||ION= 0.6 A||0.23|5.0|mA|
|Return LED current|IFC||IOFF= 1µA|0.01|0.17|||
|ON-state resistance (A connection)|RON|(Note 1)|ION= 0.6 A, IF= 5 mA, t < 1 s||1.35|2|Ω|
|ON-state resistance (B connection)|||ION= 0.6 A, IF= 2 mA, t < 1 s|||1||
|ON-state resistance (C connection)|||ION= 1.2 A, IF= 2 mA, t < 1 s|||0.5||



Note 1: For an application circuit example, see Chapter 16.2. 

## **14. Isolation Characteristics (Unless otherwise specified, Ta = 25 )** 

|Characteristics|Symbol|Note|Test Condition|Min|Typ.|Max|Unit|
|---|---|---|---|---|---|---|---|
|Total capacitance (input to output)|CS|(Note 1)|VS= 0 V, f = 1 MHz||0.8||pF|
|Isolation resistance|RS|(Note 1)|VS= 500 V, R.H.≤60 %|5×1010|1014||Ω|
|Isolation voltage|BVS|(Note 1)|AC, 60 s|2500|||Vrms|



Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together. 

## **15. Switching Characteristics (Unless otherwise specified,  Ta = 25 )** 

|Characteristics|Symbol|Note|Test Condition|Min|Typ.|Max|Unit|
|---|---|---|---|---|---|---|---|
|Turn-on time|tON||See Fig. 15.1.<br>RL= 200Ω, VDD= 20 V, IF= 5 mA||0.8|3.0|ms|
|Turn-off time|tOFF||||0.07|1.0||



**Fig. 15.1 Switching Time Test Circuit and Waveform** 

©2026 

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2026-04-07 Rev.5.0.A 

Toshiba Electronic Devices & Storage Corporation 

TLP3549,TLP3549F 

## **16. Characteristics Curves and Circuit Connections** 

## **16.1. Characteristics Curves (Note)** 

**Fig. 16.1.1 IF - Ta** 

**Fig. 16.1.3 IF - VF** 

**Fig. 16.1.5 RON - Ta** 

**Fig. 16.1.2 ION - Ta** 

**Fig. 16.1.4 ION - VON** 

**Fig. 16.1.6 IFT - Ta** 

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TLP3549,TLP3549F 

## **Fig. 16.1.7 tON, tOFF - IF** 

**Fig. 16.1.8 tON, tOFF - Ta** 

**Fig. 16.1.9 IOFF - Ta** 

Note: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. 

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TLP3549,TLP3549F 

## **16.2. Circuit Connections** 

**Fig. 16.2.1 A Connection** 

**Fig. 16.2.2 B Connection** 

**Fig. 16.2.3 C Connection** 

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Toshiba Electronic Devices & Storage Corporation 

TLP3549,TLP3549F 

## **17. Soldering and Storage** 

## **17.1. Precautions for Soldering** 

The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. 

- When using soldering reflow. 

   - The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.) 

Reflow soldering must be performed once or twice. 

The mounting should be completed with the interval from the first to the last mountings being 2 weeks. 

## **Fig. 17.1.1 An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used** 

- When using soldering flow 

   - Preheat the device at a temperature of 150  (package surface temperature) for 60 to 120 seconds. Mounting condition of 260  within 10 seconds is recommended. 

   - Flow soldering must be performed once. 

- When using soldering Iron 

   - Complete soldering within 10 seconds for lead temperature not exceeding 260  or within 3 seconds not exceeding 350  

Heating by soldering iron must be done only once per lead. 

## **17.2. Precautions for General Storage** 

- Avoid storage locations where devices may be exposed to moisture or direct sunlight. 

- Follow the precautions printed on the packing label of the device for transportation and storage. 

- Keep the storage location temperature and humidity within a range of 5  to 35  and 45 % to 75 %, respectively. 

- Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. 

- Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. 

- When restoring devices after removal from their packing, use anti-static containers. 

- Do not allow loads to be applied directly to devices while they are in storage. 

- If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. 

©2026 

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Toshiba Electronic Devices & Storage Corporation 

TLP3549,TLP3549F 

## **18. Land Pattern Dimensions (for reference only)** 

(Unit: mm) 

TLP3549 

**==> picture [48 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
TLP3549F<br>**----- End of picture text -----**<br>


**Fig. 18.1 Lead forming and taping option** (LF1), (TP1), (LF5), (TP5) 

**Fig. 18.2 Lead forming and taping option** (LF4), (TP4) 

## **19. Marking** 

**==> picture [42 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
TLP3549<br>**----- End of picture text -----**<br>


**==> picture [48 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
TLP3549F<br>**----- End of picture text -----**<br>


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TLP3549,TLP3549F 

## **20. EN 60747-5-5 Option (D4) Specification** 

- Part number: TLP3549, TLP3549F **(Note)** 

- The following part naming conventions are used for the devices that have been qualified according to option (D4) of EN 60747. 

Example: TLP3549(D4,TP1,F 

D4: EN 60747 option TP1: Tape type F: [[G]]/RoHS COMPATIBLE **(Note 1)** 

Note: Use TOSHIBA standard type number for safety standard application. e.g., TLP3549(D4,TP1,F → TLP3549 

- Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS  compatibility. 

RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on  the restriction of the use of certain hazardous substances in electrical and electronic equipment. 

**Fig. 20.1 EN 60747 Insulation Characteristics** 

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TLP3549,TLP3549F 

**Table Insulation Related Specifications (Note)** 

|Insulation Related Parameters|Symbol|TLP3549|TLP3549F|
|---|---|---|---|
|Minimum creepage distance|Cr|7.0 mm|8.0 mm|
|Minimum clearance|Cl|7.0 mm|8.0 mm|
|Minimum insulation thickness|ti|0.4 mm|0.4 mm|
|Comparative tracking index|CTI|175|175|



Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e.g., at a standard distance between soldering eye centers of 7.5 mm). If this is not permissible, the user shall take suitable measures. 

Note: This photocoupler is suitable for **safe electrical isolation** only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits. 

## **Fig. 20.2 Marking on Packing for EN 60747** 

## TLP3549 

## TLP3549F 

**==> picture [423 x 24] intentionally omitted <==**

**----- Start of picture text -----**<br>
Fig. 20.3 Marking of EN 60747-5-5 option Fig. 20.4 Marking of EN 60747-5-5 option<br>(VDE-approved) (Note) (VDE-approved) (Note)<br>**----- End of picture text -----**<br>


Note: The above marking is applied to the photocouplers that have been qualified according to option (D4) of EN 60747. 

©2026 Toshiba Electronic Devices & Storage Corporation 

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TLP3549,TLP3549F 

## **Fig. 20.5 Measurement Procedure** 

©2026 Toshiba Electronic Devices & Storage Corporation 

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Rev.5.0.A 

TLP3549,TLP3549F 

## **21. Ordering Information** 

When placing an order, please specify the part number, tape type and quantity as shown in the following example. 

Example) TLP3549(TP1,F  1500 pcs 

Part number: TLP3549 

Tape type: TP1 [[G]]/RoHS COMPATIBLE: F **(Note)** 

Quantity (must be a multiple of 1500): 1500 pcs 

Note: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS  compatibility. 

RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on  the restriction of the use of certain hazardous substances in electrical and electronic equipment. 

## **22. Ordering Information (Example of Item Name)** 

|Item Name<br>~~a~~|Packaging (Note 1)<br>~~ee~~|VDE Option|Packing (MOQ)|
|---|---|---|---|
|TLP3549(F<br>~~a~~<br>~~a~~|TH<br>~~ee~~||Magazine (50 pcs)|
|TLP3549(LF1,F<br>~~a ~~|LF1<br> ~~eG~~|~~eG~~|Magazine (50 pcs)<br>~~eG~~|
|TLP3549(LF5,F<br>~~a~~|LF5||Magazine (50 pcs)|
|TLP3549(TP1,F<br>~~a ~~|LF1<br> ~~eG~~|~~eG~~|Tape and reel (1500 pcs)<br>~~eG~~|
|TLP3549(TP5,F<br>~~a~~|LF5<br>~~eG~~|~~eG~~|Tape and reel (1500 pcs)<br>~~eG~~|
|TLP3549F(F<br>~~a~~|TH, Wide forming||Magazine (50 pcs)|
|TLP3549F(LF4,F<br>~~a ~~|LF4, Wide forming<br> ~~eG~~|~~eG~~|Magazine (50 pcs)<br>~~eG~~|
|TLP3549F(TP4,F<br>~~a~~|LF4, Wide forming<br>~~eG~~|~~eG~~|Tape and reel (1000 pcs)<br>~~eG~~|
|TLP3549(D4,F<br>~~a~~|TH|EN 60747-5-5|Magazine (50 pcs)|
|TLP3549(D4,LF1,F<br>~~a ~~|LF1<br> ~~eG~~|EN 60747-5-5<br>~~eG~~|Magazine (50 pcs)<br>~~eG~~|
|TLP3549(D4,LF5,F<br>~~a~~|LF5<br>~~eG~~|EN 60747-5-5<br>~~eG~~|Magazine (50 pcs)<br>~~eG~~|
|TLP3549(D4,TP1,F<br>~~a~~|LF1|EN 60747-5-5|Tape and reel (1500 pcs)|
|TLP3549(D4,TP5,F<br>~~a ~~|LF5<br> ~~eG~~|EN 60747-5-5<br>~~eG~~|Tape and reel (1500 pcs)<br>~~eG~~|
|TLP3549F(D4,F<br>~~a~~|TH, Wide forming<br>~~eG~~|EN 60747-5-5<br>~~eG~~|Magazine (50 pcs)<br>~~eG~~|
|TLP3549F(D4LF4,F<br>~~a~~<br>~~LR~~|LF4, Wide forming<br>~~eG~~|EN 60747-5-5<br>~~eG~~|Magazine (50 pcs)<br>~~eG~~|
|TLP3549F(D4TP4,F<br>~~LR~~|LF4, Wide forming<br>~~eG~~|EN 60747-5-5<br>~~eG~~|Tape and reel (1000 pcs)<br>~~eG~~|



Note 1: TH: Through-hole, LF/TP: Lead forming for surface mount 

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## **Package Dimensions** 

Unit: mm 

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**----- Start of picture text -----**<br>
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Weight: 0.54 g (typ.) 

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Package Name(s)<br>TOSHIBA: 11-10C4S<br>**----- End of picture text -----**<br>


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## **Package Dimensions** 

Unit: mm 

**==> picture [155 x 342] intentionally omitted <==**

**----- Start of picture text -----**<br>
TLP3549(LF1,TP1)<br>8 7<br>L|__[]<br>.<br>Ye SP<br>1 2<br>9.664<br>2.544 0.25<br>Weight: 0.53 g (typ.)<br>Package Name(s)<br>TOSHIBA: 11-10C401S<br>**----- End of picture text -----**<br>


Weight: 0.53 g (typ.) 

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## **Package Dimensions** 

Unit: mm 

**==> picture [87 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
TLP3549(LF5,TP5)<br>**----- End of picture text -----**<br>


## Weight: 0.53 g (typ.) 

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Package Name(s)<br>TOSHIBA: 11-10C405S<br>**----- End of picture text -----**<br>


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## **Package Dimensions** 

Unit: mm 

**==> picture [48 x 8] intentionally omitted <==**

**----- Start of picture text -----**<br>
TLP3549F<br>**----- End of picture text -----**<br>


Weight: 0.54 g (typ.) 

Package Name(s) TOSHIBA: 11-10C402S 

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## **Package Dimensions** 

Unit: mm 

**==> picture [93 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
TLP3549F(LF4,TP4)<br>**----- End of picture text -----**<br>


## Weight: 0.53 g (typ.) 

**==> picture [155 x 25] intentionally omitted <==**

**----- Start of picture text -----**<br>
Package Name(s)<br>TOSHIBA: 11-10C404S<br>**----- End of picture text -----**<br>


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## **RESTRICTIONS ON PRODUCT USE** 

Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA". Hardware, software and systems described in this document are collectively referred to as "Product". 

- TOSHIBA reserves the right to make changes to the information in this document and related Product without notice. 

- This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. 

- Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. **TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.** 

- **PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE").** Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, Class 3 medical devices, equipment used for automobiles, and military vehicles and munitions. **IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT.** For details, please contact your TOSHIBA sales representative or contact us via our website. 

- Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. 

- Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. 

- The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. 

- **ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.** 

- GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. 

- Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. 

- Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. **TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.** 

https://toshiba.semicon-storage.com/ 

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