SRVUD620CTT4G
Fast / Ultrafast Diode, 200 V, 6 A, Dual Common Cathode, 1.2 V, 35 ns, 50 A
- Manufacturer: ONSEMI
- Product type: Fast & Ultrafast Recovery Rectifier Diodes
- SVHC: No SVHC (25-Jun-2025)
- No. of Pins: 3 Pin
- Product Range: -
- Qualification: AEC-Q101
- Diode Case Style: TO-252 (DPAK)
- Diode Configuration: Dual Common Cathode
- Forward Voltage Max: 1.2V
- Forward Surge Current: 50A
- Reverse Recovery Time: 35ns
- Average Forward Current: 6A
- Operating Temperature Max: 175°C
- Repetitive Peak Reverse Voltage: 200V
| Delivery and price | |
|---|---|
| Units per pack | 2500 |
| Price | 0.164 € |
| Current stock | 10+ |
| Lead time | 30 days |
**Share Feedback DATA SHEET** Your Opinion Matters **www.onsemi.com** ~~oe~~ ## **-** Switch mode Power Rectifier ## **ULTRAFAST RECTIFIER 6.0 AMPERES 200 VOLTS** ## **DPAK Surface Mount Package** ## **DPAK** **CASE 369C** ## MURD620CT, NRVUD620CT, 1 SRVUD620CT, SNRVUD620CT 3 4 1 4 3 ~~ee~~ **MARKING DIAGRAMS** AYWW AYWW U U 620TG S620TG ~~4) 4)~~ A = Assembly Location* Y = Year WW = Work Week U620T = Device Code (MURD/NRVUD/ SNRVUD620CT) US620T = Device Code (SRVUD620CT) G = Pb-Free Package These state-of-the-art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. ## **Features** - Ultrafast 35 Nanosecond Recovery Time - Low Forward Voltage Drop - Low Leakage - ESD Rating: - ♦ Human Body Model = 3B (> 8 kV) - ♦ Machine Model = C (> 400 V) - NRVUD, SRVUD and SNRVUD Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable - The Assembly Location Code (A) is front side optional. In cases where the Assembly Location is stamped in the package bottom (molding ejecter pin), the front side assembly code may be blank. - These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant ## **Mechanical Characteristics:** ## **ORDERING INFORMATION** - Case: Epoxy, Molded |**Device**|**Package**|**Shipping**†| |---|---|---| |MURD620CTT4G|DPAK<br>(Pb-Free)|2,500 /<br>Tape & Reel| |SRVUD620CTT4G|DPAK<br>(Pb-Free)|2,500 /<br>Tape & Reel| |SNRVUD620CTT4G|DPAK<br>(Pb-Free)|2,500 /<br>Tape & Reel| - Weight: 0.4 Gram (Approximately) - Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable - Lead and Mounting Surface Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds ## **DISCONTINUED** (Note 1) |MURD620CTG|DPAK<br>(Pb-Free)|75 Units / Rail| |---|---|---| |NRVUD620CTG|DPAK<br>(Pb-Free)|75 Units / Rail| |NRVUD620CTT4G|DPAK<br>(Pb-Free)|2,500 /<br>Tape & Reel| |NRVUD620CTG-VF01|DPAK<br>(Pb-Free)|2,500 /<br>Tape & Reel| - For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1. **DISCONTINUED:** These devices are not recommended for new design. Please contact your **onsemi** representative for information. The most current information on these devices may be available on www.onsemi.com. Publication Order Number: **MURD620CT/D** **1** © Semiconductor Components Industries, LLC, 2016 **October, 2025 − Rev. 16** **MURD620CT, NRVUD620CT, SRVUD620CT, SNRVUD620CT** ## **MAXIMUM RATINGS** |**MAXIMUM RATINGS**|||| |---|---|---|---| |**Rating**|**Symbol**|**Value**|**Unit**| |Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|200|V| |Average Rectified Forward Current<br>(TC= 140°C)<br>Per Diode<br>Per Device|IF(AV)|3.0<br>6.0|A| |Peak Repetitive Forward Current<br>(Square Wave, Duty = 0.5, TC= 145°C)<br>Per Diode|IF|6.0|A| |Non-Repetitive Peak Surge Current<br>(Surge Applied at Rated Load Conditions Halfwave, 60 Hz)|IFSM|50|A| |Operating Junction and Storage Temperature Range|TJ, Tstg|−65 to +175|°C| Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. ## **THERMAL CHARACTERISTICS** (Per Diode) |**THERMAL CHARACTERISTICS**(Per Diode)|||| |---|---|---|---| |**Characteristic**|**Symbol**|**Value**|**Unit**| |Thermal Resistance, Junction-to-Case|R JC|9|°C/W| |Thermal Resistance, Junction-to-Ambient (Note 1)|R JA|80|°C/W| 1. Rating applies when surface mounted on the minimum pad sizes recommended. **ELECTRICAL CHARACTERISTICS** (Per Diode) ~~a~~ **Characteristic Symbol Value Unit** Maximum Instantaneous Forward Voltage Drop (Note 2) vF V (iF = 3 Amps, TC = 25 ° C) 1 (iF = 3 Amps, TC = 125 ° C) 0.96 (iF = 6 Amps, TC = 25 ° C) 1.2 (iF = 6 Amps, TC = 125 ° C) 1.13 ~~po~~ Maximum Instantaneous Reverse Current (Note 2) iR A (TJ = 25 ° C, Rated dc Voltage) 5 (TJ = 125 ° C, Rated dc Voltage) 250 ~~a~~ Maximum Reverse Recovery Time trr ns (IF = 1 Amp, di/dt = 50 Amps/ s, VR = 30 V, TJ = 25 ° C) 35 (IF = 0.5 Amp, iR = 1 Amp, IREC = 0.25 A, VR = 30 V, TJ = 25 ° C) 25 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product ~~i~~ Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Pulse Test: Pulse Width = 300 s, Duty Cycle ≤ 2.0%. > **www.onsemi.com Share Feedback** ~~Qe”~~ **2** Your Opinion Matters **MURD620CT, NRVUD620CT, SRVUD620CT, SNRVUD620CT** ## **TYPICAL CHARACTERISTICS** **==> picture [493 x 602] intentionally omitted <==** **----- Start of picture text -----**<br> 100 100<br>70 Soe eee ———— TJ = 175 ° C<br>a 10 a —<br>a e e —————<br>50<br>Os 1 =—— 150 SS ° C S S<br>100 ° C<br>30<br>20 PTTPEETT Ty 0.1 eea ESS ===<br>0.01<br>25 ° C<br>SSSSSSS8888993 0 == === = ===—<br>10 0.001<br>Coc ==<br>Se<br>7.0<br>aeee 0.0001<br>ee) 7 ee 0 20 40 60 80 100 120 140 160 180 200<br>5.0 ee VR, REVERSE VOLTAGE (V)<br>Pt 7A) Figure 2. Typical Leakage Current* (Per Leg)<br>3.0 PL tTTT| |ETdt 175 |TL °C | AAALAY TJ A = 25 | °C | * The curves shown are typical for the highest voltage device in thevoltage grouping. Typical reverse current for lower voltage selections<br>2.0 Saeeeee/)/ sone can be estimated from these curves if VR is sufficiently below rated<br>VR.<br>SRSSRer 150 °C / ss 100 eee °C 14<br>1.0 13 5.0 SINE<br>12 10 WAVE<br>0.7 S SEe | 11 EEE<br>ee ee ee 10 ee IPK/IAV = 20 dc<br>0.5 en 9.0 Hfee 7<br>Pt tT TT ue gE Tt 8.0 iYA<br>7.0 SQUARE<br>0.3 POE 6.0 a 74 aa WAVE<br>0.2 PLEEE 5.0 LeFP ee<br>4.0<br>ee oe 3.0 227 ee T J = 175 °C<br>2.0<br>0.1 PTE Egg<br>1.0 DW 20 maa<br>0 0.2 0.4 0.6 0.8 1.0 1.2 1.4<br>0 Peeee<br>vF, INSTANTANEOUS VOLTAGE (V) 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10<br>Figure 1. Typical Forward Voltage (Per Leg) IF(AV), AVERAGE FORWARD CURRENT (A)<br>Figure 3. Average Power Dissipation (Per Leg)<br>8.0 4.0<br>RATED VOLTAGE APPLIED RATED VOLTAGE APPLIED<br>7.0 R JC = 9 °C/W 3.5 R JA = 80 °C/W<br>pe fo<br>6.0 PT TT TJ = 175 °C 3.0 Pf tt SURFACE MOUNTED ON<br>5.0 PIN NL 2.5 SS MIN. PAD SIZE RECOMMENDED<br>dc<br>4.0 po} 2.0<br>SINE WAVE<br>dc<br>3.0 |EN OR W N 1.5 CEEER T J = 175 °C<br>SQUARE WAVE<br>2.0 _ ~ 1.0 SINE WAVE SSN<br>aN eee OR<br>1.0 0.5 SQUARE WAVE<br>Ne ee “SL<br>0 0<br>PE EEE EEK LE _ |TSA<br>100 110 120 130 140 150 160 170 180 0 20 40 60 80 100 120 140 160 180 200<br>TC, CASE TEMPERATURE ( ° C) TA, AMBIENT TEMPERATURE ( ° C)<br>A)<br>, REVERSE CURRENT (<br>IR<br>, INSTANTANEOUS FORWARD CURRENT (AMPS)<br>iF<br>, AVERAGE POWER DISSIPATION (WATTS)<br>F(AV)<br>P<br>, AVERAGE FORWARD CURRENT (AMPS) , AVERAGE FORWARD CURRENT (AMPS)<br>IF(AV) IF(AV)<br>**----- End of picture text -----**<br> **Figure 4. Current Derating, Case (Per Leg)** **Figure 5. Current Derating, Ambient (Per Leg)** **www.onsemi.com 3** ~~—~~ **Share Feedback** Your Opinion Matters **MURD620CT, NRVUD620CT, SRVUD620CT, SNRVUD620CT** **TYPICAL CHARACTERISTICS** **==> picture [245 x 178] intentionally omitted <==** **----- Start of picture text -----**<br> 100<br>TJ = 25 ° C<br>S S<br>(a a<br>A | | | | | ft | ff<br>10<br>NSaennne0n<br>SS=SSSaSaa<br>| | | | ft | tf ft<br>1 PEE [LTT] | yy<br>0 10 20 30 40 50 60 70 80 90 100<br>VR, REVERSE VOLTAGE (V)<br>C, CAPACITANCE (pF)<br>**----- End of picture text -----**<br> **Figure 6. Typical Capacitance (Per Leg)** > **www.onsemi.com Share Feedback** ~~Tee~~ **4** (DQS~“‘i‘CS™S Your Opinion Matters **MURD620CT, NRVUD620CT, SRVUD620CT, SNRVUD620CT** ## **REVISION HISTORY** |**Revision**|**Description of Changes**|**Date**| |---|---|---| |16|Rebranded the Data Sheet to**onsemi**format. MURD620CTG, NRVUD620CTG,<br>NRVUD620CTT4G, NRVUD620CTG-VF01 OPN marked as Discontinued.|10/15/2025| This document has undergone updates prior to the inclusion of this revision history table. The changes tracked here only reflect updates made on the noted approval dates. **www.onsemi.com** **Share Feedback** Your Opinion Matters **5** MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** **==> picture [45 x 52] intentionally omitted <==** **----- Start of picture text -----**<br> 4<br>1 [2]<br>3<br>SCALE 1:1<br>**----- End of picture text -----**<br> **==> picture [130 x 29] intentionally omitted <==** **----- Start of picture text -----**<br> DPAK−3 6.10x6.54x2.28, 2.29P<br>CASE 369C<br>ISSUE K<br>**----- End of picture text -----**<br> **==> picture [81 x 7] intentionally omitted <==** **----- Start of picture text -----**<br> DATE 14 MAY 2026<br>**----- End of picture text -----**<br> **==> picture [31 x 48] intentionally omitted <==** Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98AON10527D** Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. **DESCRIPTION: DPAK−3 6.10x6.54x2.28, 2.29P PAGE 1 OF 2** **onsemi** and are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. www.onsemi.com © Semiconductor Components Industries, LLC, 2011 DATE 13 MAY 2026 **DPAK−3 6.10x6.54x2.28, 2.29P** CASE 369C ISSUE K **==> picture [128 x 173] intentionally omitted <==** **----- Start of picture text -----**<br> GENERIC<br>MARKING DIAGRAM*<br>XXXXXXG AYWW<br>ALYWW XXX<br>XXXXXG<br>IC Discrete<br>XXXXXX = Device Code<br>A = Assembly Location<br>L = Wafer Lot<br>Y = Year<br>WW = Work Week<br>G = Pb−Free Package<br>**----- End of picture text -----**<br> *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ � ”, may or may not be present. Some products may not follow the Generic Marking. **==> picture [316 x 77] intentionally omitted <==** **----- Start of picture text -----**<br> STYLE 1: STYLE 2: STYLE 3: STYLE 4: STYLE 5:<br>PIN 1. BASE PIN 1. GATE PIN 1. ANODE PIN 1. CATHODE PIN 1. GATE<br>2. COLLECTOR 2. DRAIN 2. CATHODE 2. ANODE 2. ANODE<br>3. EMITTER 3. SOURCE 3. ANODE 3. GATE 3. CATHODE<br>4. COLLECTOR 4. DRAIN 4. CATHODE 4. ANODE 4. ANODE<br>STYLE 6: STYLE 7: STYLE 8: STYLE 9: STYLE 10:<br>PIN 1. MT1 PIN 1. GATE PIN 1. N/C PIN 1. ANODE PIN 1. CATHODE<br>2. MT2 2. COLLECTOR 2. CATHODE 2. CATHODE 2. ANODE<br>3. GATE 3. EMITTER 3. ANODE 3. RESISTOR ADJUST 3. CATHODE<br>4. MT2 4. COLLECTOR 4. CATHODE 4. CATHODE 4. ANODE<br>**----- End of picture text -----**<br> Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98AON10527D** Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. **DESCRIPTION: DPAK−3 6.10x6.54x2.28, 2.29P PAGE 2 OF 2** **onsemi** and are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. www.onsemi.com © Semiconductor Components Industries, LLC, 2011 **onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. 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Updated at June 8, 2026
onsemi is a premier global supplier of intelligent power and sensing technologies, driving disruptive innovations across the automotive, industrial, and cloud infrastructure markets. Recognized for their commitment to sustainability and reliable supply chains, the company accelerates advancements in vehicle electrification, industrial automation, and 5G networks by solving the industry's most complex design challenges. At the core of their portfolio is an industry-leading selection of discrete semiconductors. This extensive range features thousands of high-performance bipolar transistors, single and dual MOSFETs, and a comprehensive array of diodes, including Zener, Schottky, and fast-recovery rectifiers. Engineered for superior thermal performance and energy efficiency, these foundational components are critical for demanding power conversion, switching, and signal conditioning applications. Beyond essential discretes, onsemi provides a robust suite of advanced power management and circuit protection solutions. Their lineup includes intelligent power modules, single IGBTs, and transient voltage suppression (TVS) diodes designed to safeguard sensitive circuitry. Complimented by integrated passive filters, AC/DC LED driver ICs, and specialized sub-2.4GHz RF transceivers, onsemi equips engineers with the scalable, high-quality technologies needed to build a cleaner, smarter, and more connected world.
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