SNZF220DFT1G

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## EMI Filter with ESD Protection 

## NZF220DFT1G, SNZF220DFT1G 

## **Features** 

- 2 EMI/RFI Bi-directional “Pi” Low-Pass Filters 

- ESD Protection Meets IEC61000-4-2 

## **CIRCUIT DESCRIPTION** 

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Pin 4 Pin 5<br>Pin 3 Pin 2 Pin 1<br>(GND)<br>**----- End of picture text -----**<br>


- Diode Capacitance: 7 − 10 pF 

- Zener/Resistor Line Capacitance: 22  20% pF 

- Low Zener Diode Leakage: 1 A Maximum 

- Zener Breakdown Voltage; 6 − 8 V 

- AEC-Q101 Qualified and PPAP Capable − SNZF220DFT1G 

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SC-88A<br>DF SUFFIX<br>CASE 419A<br>**----- End of picture text -----**<br>


- S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements 

- These are Pb-Free Devices 

## **Benefits** 

- Designed to suppress EMI/RFI Noise in Systems Subjected to Electromagnetic Interference 

- Nominal Cutoff Frequency of 220 MHz (per Figure 2) 

- Small Package Size Minimizes Parasitic Inductance, Thus a More “Ideal” Low Pass Filtering Response 

## **Typical Applications** 

- Cellular Phones 

## **MARKING DIAGRAM** 

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5 4<br>FA  D<br>1 2 3<br>**----- End of picture text -----**<br>


FA = Specific Device Code D = Date Code 

= Pb-Free Package 

- Communication Systems 

- Computers 

- Portable Products with Input/Output Conductors 

**MAXIMUM RATINGS Rating Symbol Value Unit** ~~es ee es~~ Peak Power Dissipation (Note 1) PPK 14 W 8  20 s Pulse ~~es ee~~ Maximum Junction Temperature ~~eeee~~ TJ 150 ~~es~~ C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 

1. Between I/O Pins 

|**ORDERING INFORMATION**|
|---|
|**Device**<br>**Package**<br>**Shipping**†<br>NZF220DFT1G<br>SC-88A<br>(Pb-Free)<br>3000 / Tape &<br>Reel<br>**DISCONTINUED**(Note 1)<br>~~CT~~|



- SNZF220DFT1G SC-88A 3000 / Tape & (Pb-Free) Reel 

- † For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

1. **DISCONTINUED:** This device is not available. Please contact your **onsemi** representative for information. The most current information on this device may be available on www.onsemi.com. 

Publication Order Number: 

**1** 

 Semiconductor Components Industries, LLC, 2011 **September, 2025 − Rev. 10** 

**NZF220DFT1/D** 

**NZF220DFT1G, SNZF220DFT1G** 

## **ELECTRICAL CHARACTERISTICS** 

|**Symbol**<br>~~a~~|**Characteristic**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|
|VZ<br>~~a~~|Zener Breakdown Voltage, @ IZT= 1 mA|6.0|−|8.0|V|
|Ir<br>~~a~~|Zener Leakage Current, @ VR= 3 V|N/A|−|1.0|A|
|VF<br>~~a~~|Zener Forward Voltage, @ IF= 50 mA|N/A|−|1.5|V|
|Capacitance<br>~~a~~|Zener Internal Capacitance, @ 0 V Bias|7.0|−|10|pF|
|Capacitance<br>~~a~~|Zener/Resistor Array Line Capacitance<br>|17.6<br>|−<br>|26.4<br>|pF<br>|
|Resistor<br>~~GO~~|Resistance<br>~~GO~~|90<br>~~GO~~|−<br>~~GO~~|110<br>~~GO~~|~~GO~~|
|FC(Note 2)<br>~~a~~|Cutoff Frequency<br>~~a~~|−<br>~~a~~|220<br>~~a~~|−<br>~~a~~|MHz<br>~~a~~|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. 50  Source and 50  Lead Termination per Figure 2. ~~Q~~ Q 

## **APPLICATIONS INFORMATION** 

## **Suppressing Noise at the Source** 

- Filter all I/O signals leaving the noisy environment 

- Locate I/O driver circuits close to the connector 

- Use the longest rise/fall times possible for all digital signals 

## **Reducing Noise at the Receiver** 

- Filter all I/O signals entering the unit 

- Locate the I/O filters as close as possible to the connector 

## **Minimizing Noise Coupling** 

- Use multilayer PCBs to minimize power and ground inductance 

- Keep clock circuits away from the I/O connector 

- Ground planes should be used whenever possible 

- Minimize the loop area for all high speed signals 

- Provide for adequate power decoupling 

## **ESD Protection** 

- Locate the suppression devices as close to the I/O connector as possible 

- Minimize the PCB trace length to the suppression device 

- Minimize the PCB trace length for the ground return for the suppression device 

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**NZF220DFT1G, SNZF220DFT1G** 

## **FREQUENCY RESPONSE SPECIFICATION** 

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TRACKING SPECTRUM<br>OOS| SSee 8688 GENERATOR ANALYZER<br>50<br>TG OUTPUT RF INPUT NZF220DF<br>50<br>VG Vin Vout<br>TEST BOARD : fe - rt:<br>V V V<br>: :<br>[Lh cl<br>NZF220DF Test Conditions:<br>Source Impedance = 50  Q<br>Load Impedance = 50  Q<br>Input Power = 0 dB<br>Figure 1. Measurement Conditions<br>−6.30 ST<br>−10 Ne<br>POT PNT<br>−20 TUT PETE<br>a OUTPUT<br>3 dB = 220 MHz<br>a<br>−30<br>PTE EET A<br>PTT EN<br>−40 POT TY<br>−50<br>1.0 | LTT 10 TEU 100 TE 1000 3000<br>f, FREQUENCY (MHz)<br>GAIN (dB)<br>**----- End of picture text -----**<br>


**Figure 2. Typical EMI Filter Response (50  Source and 50  Lead Termination)** Q Q 

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**NZF220DFT1G, SNZF220DFT1G** 

## **REVISION HISTORY** 

|**Revision**|**Description of Changes**|**Date**|
|---|---|---|
|10|Rebranded the Data Sheet to**onsemi**format.<br>SNZF220DFT1G OPN Marked as Discontinued.|09/18/2025|



This document has undergone updates prior to the inclusion of this revision history table. The changes tracked here only reflect updates made on the noted approval dates. 

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MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**SC−88A (SC−70−5/SOT−353)** CASE 419A−02 ISSUE M 

**SCALE 2:1** 

DATE 11 APR 2023 

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## **GENERIC MARKING** 

## **DIAGRAM*** 

*This information is generic. Please refer to XXXM � device data sheet for actual part marking.Pb−Free indicator, “G” or microdot “ � ”, may � or may not be present. Some products may not follow the Generic Marking. 

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XXX = Specific Device Code 

- M = Date Code 

- = Pb−Free Package 

(Note: Microdot may be in either location) 

STYLE 4: STYLE 5: PIN 1. SOURCE 1 PIN 1. CATHODE 2. DRAIN 1/2 2. COMMON ANODE 3. SOURCE 1 3. CATHODE 2 4. GATE 1 4. CATHODE 3 5. GATE 2 5. CATHODE 4 

STYLE 1: STYLE 2: STYLE 3: PIN 1. BASE PIN 1. ANODE PIN 1. ANODE 1 2. EMITTER 2. EMITTER 2. N/C 3. BASE 3. BASE 3. ANODE 2 4. COLLECTOR 4. COLLECTOR 4. CATHODE 2 5. COLLECTOR 5. CATHODE 5. CATHODE 1 

> STYLE 9: Note: Please refer to datasheet for PIN 1. 2. ANODECATHODE 2. CATHODE style callout. If style type is not called 3. ANODE out in the datasheet refer to the device 4. 5. ANODEANODE 5. ANODE datasheet pinout or pin assignment. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

STYLE 6: STYLE 7: STYLE 8: STYLE 9: Note: Please refer to datasheet for PIN 1. 2. EMITTER 2BASE 2 PIN 1. 2. BASEEMITTER PIN 1. 2. CATHODECOLLECTOR PIN 1. 2. ANODECATHODE style callout. If style type is not called 3. EMITTER 1 3. BASE 3. N/C 3. ANODE out in the datasheet refer to the device 4. 5. COLLECTORCOLLECTOR 2/BASE 1 4. 5. COLLECTORCOLLECTOR 4. 5. BASEEMITTER 4. 5. ANODEANODE datasheet pinout or pin assignment. Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98ASB42984B** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: SC−88A (SC−70−5/SOT−353) PAGE 1 OF 1** 

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