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MUN3CAD01-SC
Non Isolated POL DC/DC Converter, Micro Module, 4 W, 800 mV, 4 V, 1 A
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: CYNTEC
- Product type: DC / DC Non Isolated Board Mount Converters - Adjustable Output
- SVHC: No SVHC (21-Jan-2025)
- Depth: 2.9mm
- Width: 2.3mm
- Height: 1.05mm
- Product Range: -
- Output Power Max: 4W
- Output Current Max: 1A
- Output Voltage Max: 4V
- Output Voltage Min: 800mV
- Input Voltage DC Max: 5.5V
- Input Voltage DC Min: 2.7V
- DC / DC Converter Type: Micro Module
- Power Supply Applications: -
- DC / DC Converter Output Type: Adjustable
| Delivery and price | |
|---|---|
| Units per pack | 500 |
| Price | 2.37 € |
| Current stock | 1000+ |
| Lead time | 30 days |
Datasheet
## **uPOL MODULE**
## **1A, High Efficiency uPOL Module**
## **MUN3CAD01-SC**
## **FEATURES:** ~~=|~~
- High Density Integration Module
- 1A Output Current
- 93% Peak Efficiency at 3.3VIN
- Input Voltage Range from 2.7V to 5.5V
- Output Voltage Range from 0.8V to 4.0V
- ◼ Enable Function
- Automatic Power Saving/PWM Mode
- Protections (UVLO, OCP: Non-latching)
- Internal Soft Start
- Compact Size: 2.9mm*2.3mm*1.05mm
- Pb-free for RoHS compliant
## **GENERAL DESCRIPTION:**
The uPOL module is non-isolated dc-dc converter that can deliver up to 1A of output current. The PWM switching regulator, high frequency power inductor, input/output bulk capacitors are integrated in one hybrid package.
The module has automatic operation with PWM mode and power saving mode according to loading. Other features include remote enable function, internal soft-start, non-latching over current protection, short circuit protection and input under voltage locked-out capability.
- MSL 2, 260 ℃ Reflow
## **APPLICATIONS:**
- Single Li-Ion Battery-Powered Equipment
- LDOs Replacement
- ◼ Cell Phones / PDAs / Palmtops
The low profile and compact size package (2.9mm × 2.3mm x 1.05mm) is suitable for automated assembly by standard surface mount equipment. The module is Pb-free and RoHS
compliance.
## **TYPICAL APPLICATION CIRCUIT & PACKAGE SIZE:** ~~0~~ 0a
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Enable<br>**----- End of picture text -----**<br>
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ON<br>OFF(GND)<br>EN<br>V IN V OU T<br>(+) (+)<br>LDS MODULE RFB_top CFB<br>VIN FB VOUT<br>GN D<br>2.7V ~ 5.5V OF Adjusted<br>RFB_bot<br>(-) (-)<br>oo<br>FIG.1 TYPICAL APPLICATION CIRCUIT<br>**----- End of picture text -----**<br>
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FIG.2 HIGH DENSITY LOW PROFILE<br>uPOL MODULE<br>**----- End of picture text -----**<br>
TABLE 1. OUTPUT VOLTAGE SETTING
|Vout|1.0V|1.2V|1.5V|||1.8V|2.5V|3.3V|
|---|---|---|---|---|---|---|---|---|
|RFB_top(Ω)||||100k|||||
|RFB_bot(Ω)|150k|100k|66.5k|66.5k||50k|31.6k|22.1k|
1
Rev.A1
## **MUN3CAD01-SC**
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ORDER INFORMATION:<br>ee<br>Ambient Temp. Range Package<br>Part Number MSL Note<br>(°C) (Pb-Free)<br>MUN3CAD01-SC -40 ~ +85 DFN Level 2 -<br>————EEE<br>Order Code Packing Quantity<br>MUN3CAD01-SC Tape and reel 2000<br>eeee<br>PIN CONFIGURATION:<br>a<br>**----- End of picture text -----**<br>
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EN (1) (6) VOUT<br>GND (2) (5) FB<br>VIN (3) (4) GND<br>TOP VIEW<br>**----- End of picture text -----**<br>
## **PIN DESCRIPTION:** a
|**Symbol**|**Pin No.**|**Description**|
|---|---|---|
|EN|1|On/Off control pin for module.<br>EN = LOW, the module is off.<br>EN = HIGH, the module is on.<br>Do not float.|
|GND|2, 4|Power ground pin for signal, input, and output return path. This pin<br>needs to connect one or moregroundplane directly.|
|VIN|3|Power input pin. It needs to connect input rail.|
|FB|5|Feedback input. Connect to output through a voltage dividing resistors<br>for adjusting output voltage. Place those resistors as closely as possible<br>to thispin.|
|VOUT|6|Power output pin. Connect to output for the load.|
2
Rev.A1
**MUN3CAD01-SC**
> **ELECTRICAL SPECIFICATIONS:** ~~a~~
CAUTION: Do not operate at or near absolute maximum rating listed for extended periods of time. This stress may adversely impact product reliability and result in failures not covered by warranty.
|**Parameter**<br>~~es~~<br>~~ee~~|**Description**<br>~~es~~<br>|**Min.**<br>~~es~~<br>|**Typ.**<br>~~es~~<br>|**Max.**<br>~~es~~<br>|**Unit**<br>~~es~~<br>|
|---|---|---|---|---|---|
|◼<br>Absolute Maximum Ratings<br>~~eses~~<br>~~eeeses~~<br>~~es~~<br>~~es~~||||||
|VIN to GND<br>~~eees~~<br>~~es~~<br>~~es~~|Note 1<br>~~es~~<br><br>|-<br>~~es~~<br>~~es~~<br><br>~~es~~<br>|-<br>~~es~~<br><br>~~es~~<br>|+6.0<br>~~es~~<br><br>~~es~~<br>|V<br>~~es~~<br><br>|
|VOUT to GND<br>~~es~~<br>~~es~~<br>~~es~~<br>~~es~~|Note 1<br>~~es~~<br>~~es~~<br><br>|-<br>~~es~~<br>~~es~~<br>~~es~~<br>~~es~~<br><br>~~es~~<br>|-<br>~~es~~<br>~~es~~<br>~~es~~<br><br>~~es~~<br>|+6.0<br>~~es~~<br>~~es~~<br>~~es~~<br><br>~~es~~<br>|V<br>~~es~~<br>~~es~~<br><br>|
|EN to GND<br>~~es~~<br>~~es~~<br>~~es~~|Note 1<br><br>~~es~~<br>|-<br>~~es~~<br><br>~~es~~<br>~~es~~<br>~~es~~<br>|-<br><br>~~es~~<br>~~es~~<br>~~es~~<br>|VIN+0.6<br><br>~~es~~<br>~~es~~<br>~~es~~<br>|V<br><br>~~es~~<br>|
|Tc<br>~~es~~<br>~~es~~<br>~~ee~~<br>~~ee~~|Case Temperature of Inductor<br><br>~~ee~~<br>~~**ee**~~<br>|-<br>~~es~~<br><br>~~es~~<br>~~ee~~<br>|-<br>~~es~~<br><br>~~es~~<br>~~ee~~<br>|+110<br>~~es~~<br><br>~~es~~<br>~~ee~~<br>|°C<br><br>~~ee~~<br>|
|Tj<br>~~es~~<br>~~ee~~<br>~~ee~~|Junction Temperature<br>~~ee~~<br>~~**ee**~~<br>|-40<br>~~es~~<br>~~ee~~<br>|-<br>~~es~~<br>~~ee~~<br>|+150<br>~~es~~<br>~~ee~~<br>|°C<br>~~ee~~<br>|
|Tstg<br><br>~~ee~~<br>~~ee~~|Storage Temperature<br>~~ee~~<br>~~**ee**~~<br>|-40<br>~~ee~~<br><br>~~ee~~|-<br>~~ee~~<br><br>~~ee~~|+125<br>~~ee~~<br><br>~~ee~~|°C<br>~~ee~~<br><br>~~ee~~|
|ESD Rating<br><br>~~ee~~|Human Body Model (HBM)<br>~~**ee**~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~es~~|2k<br>~~ee~~<br>~~ee~~<br>~~ee~~|V<br>~~ee~~<br>~~ee~~|
||Machine Model (MM)<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee ~~<br>~~ee~~<br>~~es~~<br>~~ee~~|200<br> ~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|V<br> ~~ee~~<br>~~ee~~|
||Charge Device Model (CDM)<br>~~ee~~|-<br>~~ee ~~<br>~~ee~~<br>~~ee~~|-<br> ~~es ~~<br>~~ee~~<br>~~ee~~|1k<br> ~~ee~~<br>~~ee~~<br>~~ee~~|V<br>~~ee~~|
|◼<br>Recommendation Operating Ratings<br>~~ee ee ee~~<br>~~ce~~<br>~~es ee~~||||||
|VIN<br>~~es ee~~<br>~~es~~|Input Supply Voltage<br>~~ee~~<br>~~ee~~|+2.7|-|+5.5|V|
|VOUT<br>~~es ee~~<br>~~es~~<br>~~ee~~<br>~~a~~|Output Voltage<br>~~ee~~<br>~~ee~~<br>~~es~~|+0.8<br>~~es~~<br>~~ee~~|-<br>~~es~~<br>~~es~~|+4.0<br>~~es~~<br>~~es~~|V<br>~~es~~|
|Ta<br>~~es~~<br>~~ee~~<br>~~a~~|Ambient Temperature<br>~~ee~~<br>~~es~~|-40<br>~~es~~<br>~~ee~~|-<br>~~es~~<br>~~es~~|+85<br>~~es~~<br>~~es~~|°C<br>~~es~~|
|◼<br>Thermal Information<br>~~eees~~<br>~~ee~~<br>~~eses~~<br>~~a~~||||||
|Rth(jchoke-a)<br>~~a~~|Thermal resistance from junction to<br>ambient. (Note 1)|-<br>~~ee~~|70<br>~~es ~~|-<br> ~~es~~|°C/W|
NOTES:
1. Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The test board size is 30mm× 30mm× 1.6mm with 2 layers, 1oz. The test condition is complied with JEDEC EIJ/JESD 51 Standards.
3
Rev.A1
**MUN3CAD01-SC**
> **ELECTRICAL SPECIFICATIONS: (Cont.)** ~~Fe~~ Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2Oz . The output ripple and transient response measurement is short loop probing and 20MHz bandwidth limited.
Vin = 3.3V, Vout = 1.8V, unless otherwise specified.
|**Symbol**<br>~~a ee~~<br>~~eo~~|**Parameter**<br>~~ee~~|**Conditions**<br>~~ee~~|**Min.**<br>~~ee~~|**Typ.**<br>~~ee~~|**Max.**<br>~~ee~~|**Unit**<br>~~ee~~|
|---|---|---|---|---|---|---|
|◼<br>Input Characteristics<br>~~eo~~|||||||
|ISD(IN)<br>~~eo~~|Input shutdown<br>current|Vin = 3.3V,<br>EN = GND|-|0.3|1|uA|
|I(IN)<br>~~a~~|Input supply<br>current<br>~~eee~~|Vin = 3.3V, Iout = 0A<br>EN = VIN<br>Vout = 1.8V<br>~~eee~~|-<br>~~eee~~|75<br>~~eee~~|-<br>~~eee~~|uA<br>~~eee~~|
|IS(IN)<br>~~ce~~|Input supply<br>current|Vin = 3.3V, EN = VIN<br>~~es~~<br>~~ee~~|-<br>~~es~~|~~es~~|-<br>~~es~~<br>~~ee~~|-<br>~~es~~<br>~~ee~~|
|||Iout = 5mA<br>Vout = 1.8V<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|3<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|mA<br>~~ee~~<br>~~ee~~|
|||Iout = 100mA<br>Vout = 1.8V<br>~~ee~~|-<br>~~ee~~|66<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|mA<br>~~ee~~<br>~~ee~~<br>~~ee~~|
|||Iout = 1000mA<br>Vout = 1.8V<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|730<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|mA<br>~~ee~~<br>~~ee~~<br>~~ee~~|
|◼<br>Output Characteristics<br>~~eeee~~<br>~~ce~~|||||||
|IOUT(DC)<br>~~ce~~|Output<br>continuous<br>current range|Vin=3.3V, Vout=1.8V|0|-<br>~~ee ~~|1000<br> ~~ee~~|mA<br>~~ee~~|
|VO(SET)|Ouput Voltage<br>set Point|With 0.5% tolerance for external<br>resistor used to set output<br>voltage|With 0.5% tolerance for external<br>-3.0||+3.0|% VO(SET)|
|ΔVOUT<br>/ΔVIN|Line regulation<br>accuracy|Vin = 3.3V to 5V<br>Vout = 1.8V, Iout = 200mA<br>Vout = 1.8V,Iout = 1000mA|-|0.1|1.0|% VO(SET)|
|ΔVOUT<br>/ΔIOUT<br>~~a~~|Load regulation<br>accuracy|Iout = 200mA to 1000mA<br>Vin = 3.3V,Vout = 1.8V|-|0.5<br>~~ee~~|1.0|% VO(SET)|
|VOUT(AC)<br>~~a~~|Output ripple<br>voltage<br>~~a~~|Vin = 3.3V, Vout = 1.8V<br>EN = VIN<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|
|||IOUT = 5mA,<br>~~ee~~|~~ee~~<br>~~ee~~<br>~~ee~~|20<br>~~ee~~<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~|mVp-p<br>~~ee~~|
|||IOUT = 1000mA,<br>~~ee~~<br>~~ee~~|~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|15<br> ~~ee~~<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~|mVp-p<br>~~ee~~|
|COUT(MAX)<br>~~a ~~|Maximum<br>capacitive load<br> ~~a~~|Iout = 1000mA, ESR≧1 m<br>~~ee~~|~~ee~~<br>~~ee~~|~~ee~~|150|uF|
4
Rev.A1
**MUN3CAD01-SC**
> **ELECTRICAL SPECIFICATIONS: (Cont.)** ~~Ln~~
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2Oz . The output ripple and transient response measurement is short loop probing and 20MHz bandwidth limited.
Vin = 3.3V, Vout = 1.8V, unless otherwise specified.
|**Symbol**<br>~~a~~|**Parameter**<br>~~eees~~|**Conditions**<br>~~es~~|**Min.**<br>~~es~~|**Typ.**<br>~~es~~|**Max.**<br>~~es~~|**Unit**<br>~~es~~|
|---|---|---|---|---|---|---|
|◼<br>Control Characteristics<br>~~a~~<br>~~eees~~<br>~~a~~|||||||
|VREF<br>~~a~~<br>~~a~~|Referance<br>voltage<br>~~a~~<br>~~a~~<br>~~ee~~|~~a~~<br>~~a~~<br>~~ee~~|0.588<br>~~a~~<br>~~a~~<br>~~ee~~|0.6<br>~~a~~<br>~~a~~<br>~~ee~~|0.612<br>~~a~~<br>~~a~~<br>~~ee~~|V<br>~~a~~<br>~~a~~<br>~~ee~~|
|FOSC<br>~~——~~|Oscillator<br>frequency<br>~~——~~|PWM Operation<br>~~——~~|-<br>~~——~~|3.0<br>~~——~~|-<br>~~——~~|MHz<br>~~——~~|
|VEN_TH<br>~~——~~|Enable rising<br>threshold<br>voltage<br>~~——~~|~~——~~|1.5<br>~~——~~|-<br>~~——~~|-<br>~~——~~|V<br>~~——~~|
||Enable falling<br>threshold<br>voltage<br>~~——~~|~~——~~|-<br>~~——~~|-<br>~~——~~|0.4<br>~~——~~|V<br>~~——~~|
|◼<br>Fault Protection<br>~~a~~<br>~~aeee~~<br>~~ee~~<br>~~a~~|||||||
|VUVLO_TH<br>~~a~~<br>~~ae~~<br>~~a~~<br>~~I~~|Input under<br>voltage lockout<br>threshold<br>~~a~~<br>~~ee~~<br>~~eees~~|Falling,<br>~~a~~<br>~~ee~~<br>~~es~~|-<br>~~a~~<br>~~ee~~<br>~~es~~|2.5<br>~~a~~<br>~~ee~~<br>~~ee~~<br>~~es~~|-<br>~~a~~<br>~~ee~~<br>~~es~~|V<br>~~a~~<br>~~ee~~<br>~~es~~|
|TOTP<br>~~ae~~<br>~~a ~~<br>~~I~~|Over temp<br>protection<br>~~ee~~<br> ~~eees~~|~~ee~~<br>~~es~~|-<br>~~ee~~<br>~~es~~|160<br>~~ee~~<br>~~ee~~<br>~~es~~|-<br>~~ee~~<br>~~es~~|℃<br>~~ee~~<br>~~es~~|
|ILIMIT_TH<br> <br>~~I~~|Current limit<br>threshold<br> ~~eees~~|Peak value of inductor current,<br>~~es~~|1.3<br>~~es~~|-<br>~~es~~|2.5<br>~~es~~|A<br>~~es~~|
5
Rev.A1
**MUN3CAD01-SC**
## **TYPICAL PERFORMANCE CHARACTERISTICS: (1.0VOUT)**
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2Oz . The output ripple and transient response measurement is short loop probing and 20MHz bandwidth limited. The following figures provide the typical characteristic curves at 1.0Vout.
**==> picture [403 x 379] intentionally omitted <==**
**----- Start of picture text -----**<br>
FIG.3 EFFICIENCY V.S. LOAD CURRENT FIG.4 DE-RATING CURVE AT 3.3VIN<br>Ur : ail u ‘<br>VOUT VOUT<br>t Ch1 Pk-Pk<br>\. t 25.4mV + Chi<br>1<br>a<br>jo.omvaal aT A Chi J 11.6mV :<br>@i 10.omvaw W4oons| A Chi 7 1.80mv<br>FIG.5 OUTPUT RIPPLE FIG.6 OUTPUT RIPPLE<br>(3.3VIN, IOUT=5mA) (3.3VIN, IOUT=1000mA)<br>= Trig’d<br>VOUT<br>t « VOUT<br>: amen mem) Ch1 Pk—-Pk , J+<br>4 30.0mvV 4<br>IOUT<br>EN<br> Saag -SoomauMraoOnST A Chi 16- omv se Me SO a<br>FIG.7 TRANSIENT RESPONSE FIG.8 TURN-ON<br>(5.0VIN, 50% to 100% LOAD STEP) (3.3VIN, IOUT=1000mA)<br>**----- End of picture text -----**<br>
6
Rev.A1
**MUN3CAD01-SC**
## **TYPICAL PERFORMANCE CHARACTERISTICS: (1.2VOUT)**
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2Oz . The output ripple and transient response measurement is short loop probing and 20MHz bandwidth limited. The following figures provide the typical characteristic curves at 1.2Vout.
~~Oe~~ **FIG.9 EFFICIENCY V.S. LOAD CURRENT FIG.10 DE-RATING CURVE AT 3.3VIN** uv vu; **VOUT VOUT** KL!\ ae |i it2 \ }i bh cht 24.8mvPk~Pk **VOUT** i} Ch113.6mVPk-Pk Gy i0-omv~w Lait A Chi J 11.6mv 10.0mVV\i sara A Chi J 1.80mv **FIG.11 OUTPUT RIPPLE FIG.12 OUTPUT RIPPLE (3.3VIN, IOUT=5mA) (3.3VIN, IOUT=1000mA)** | f | ; t **VOUT VOUT** Ch1 Pk-Pk ; i ‘ **IOUT** { | 14.4mv WSS WIP STATINS Par Weare Urea IAC Waar ed We i ee toot etaeemeed 4 7 15-6m¥ t **EN** Chit ad-omv thei SoommSaMrgaoeT a hr i8 onv @ { ur FS50.800Hs) 21Sep10:28:262016 iit “Soomy Achat a0 amacoomeif al Chi 720mv **FIG.13 TRANSIENT RESPONSE FIG.14 TURN-ON (5.0VIN, 50% to 100% LOAD STEP) (3.3VIN, IOUT=1000mA)**
7
Rev.A1
**MUN3CAD01-SC**
## **TYPICAL PERFORMANCE CHARACTERISTICS: (1.5VOUT)**
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2Oz . The output ripple and transient response measurement is short loop probing and 20MHz bandwidth limited. The following figures provide the typical characteristic curves at 1.5Vout.
**==> picture [465 x 360] intentionally omitted <==**
**----- Start of picture text -----**<br>
QO FIG.15 EFFICIENCY V.S. LOAD CURRENT FIG.16 DE-RATING CURVE AT 3.3VIN<br>VOUT VOUT<br>4 Chi Pk-Pk t Tae *<br>1 4 a a<br>t { rE Ue Fel i fj Ff<br>Gill 10-omva4 Lari A Chi F 11 6mv 70.0mVVN Latter: A Chi J 1.80mv<br>FIG.17 OUTPUT RIPPLE FIG.18 OUTPUT RIPPLE<br>(3.3VIN, IOUT=5mA) (3.3VIN, IOUT=1000mA)<br>ee<br>VOUT VOUT<br>1<br>.: : - , : " Chi Pk-Pk<br>: : £ : : | 31.6mv<br>Pot tt IOUT * tbibibeeed| = «Ch13.6mvVMax tT<br>a nen Se a eee _ J) 718-omv f<br>EN<br>a+ F550,800n5| joss :<br>@il100Vwch2}2 000 oMaooms AY Chl J 720mv<br>FIG.19 TRANSIENT RESPONSE FIG.20 TURN-ON<br>(5.0VIN, 50% to 100% LOAD STEP) (3.3VIN, IOUT=1000mA)<br>**----- End of picture text -----**<br>
8
Rev.A1
**MUN3CAD01-SC**
## **TYPICAL PERFORMANCE CHARACTERISTICS: (1.8VOUT)**
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2Oz . The output ripple and transient response measurement is short loop probing and 20MHz bandwidth limited. The following figures provide the typical characteristic curves at 1.8Vout.
**==> picture [475 x 360] intentionally omitted <==**
**----- Start of picture text -----**<br>
a FIG.21 EFFICIENCY V.S. LOAD CURRENT FIG.22 DE-RATING CURVE AT 3.3VIN<br>eo | | a: :<br>VOUT VOUT<br>: Chi Pk-P . j Chi Pk-Pk<br>; rt A. / 23.4mv : 14.4mv<br>[ iH q |<br>} . } |<br>:<br>10.0mV\\ M20.0us Al Chl FS 11.6mv 10.0mVV& M400ns_ A Chi Fs 1.80mV<br>FIG.23 OUTPUT RIPPLE FIG.24 OUTPUT RIPPLE<br>(3.3VIN, IOUT=5mA) (3.3VIN, IOUT=1000mA)<br>Tek Run = Trig’d - - - -<br>t{ 4<br>VOUT £« VOUT i<br>Ch1 Pk—Pk<br>£ i i<br>IOUT<br>: t | Chi Min a ; _<br>EN<br>i++ 550.800p5) jo2e12 . . it ie<br>1.00V WCh2) 2.00V %M2.00ms A Chl s 720mvV<br>FIG.25 TRANSIENT RESPONSE FIG.26 TURN-ON<br>(5.0VIN, 50% to 100% LOAD STEP) (3.3VIN, IOUT=1000mA)<br>**----- End of picture text -----**<br>
9
Rev.A1
**MUN3CAD01-SC**
## **TYPICAL PERFORMANCE CHARACTERISTICS: (2.5VOUT)**
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2Oz . The output ripple and transient response measurement is short loop probing and 20MHz bandwidth limited. The following figures provide the typical characteristic curves at 2.5Vout.
**==> picture [453 x 367] intentionally omitted <==**
**----- Start of picture text -----**<br>
Ge FIG.27 EFFICIENCY V.S. LOAD CURRENT FIG.28 DE-RATING CURVE AT 3.3VIN<br>ul : v,<br>VOUT VOUT<br>i I t \<br>oN i ee EW as ics faa |<br>chi} ORT TE wi20- Ops ry eaBTD bai GD 10.omvs M400ns A Chi J 1.80mv<br>FIG.29 OUTPUT RIPPLE FIG.30 OUTPUT RIPPLE<br>(3.3VIN, IOUT=5mA) (3.3VIN, IOUT=1000mA)<br>Tek Run = Trig’d<br>VOUT<br>|£€<br>.Ch1 Pk—Pk VOUT<br>IOUT + - 25.2mvV rf :<br>+ + + Chi Min {<br>EN<br>tie -350.800us) jose t<br>@il 1.00 ach? “500 aM2-0oms, A Chl J 1.26<br>FIG.31 TRANSIENT RESPONSE FIG.32 TURN-ON<br>(5.0VIN, 50% to 100% LOAD STEP) (3.3VIN, IOUT=1000mA)<br>**----- End of picture text -----**<br>
10
Rev.A1
**MUN3CAD01-SC**
## **TYPICAL PERFORMANCE CHARACTERISTICS: (3.3VOUT)**
Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2Oz . The output ripple and transient response measurement is short loop probing and 20MHz bandwidth limited. The following figures provide the typical characteristic curves at 3.3Vout.
**FIG.33 EFFICIENCY V.S. LOAD CURRENT FIG.34 DE-RATING CURVE AT 5.0VIN** Stop fekstop_|__| ~~J~~ +4 -| Ch1 Pk-Pk - | chi + 4 + 4 :{ +{ + j T | + ; i0.omvva,20.ous) Al Chi 711.6mv Gil10.0omvanlfaoons)Al chi “eomv 48.40 % | 3109:34:19Mar 2015 48.40 % | 3109:46:2Mar **FIG.35 OUTPUT RIPPLE FIG.36 OUTPUT RIPPLE (3.3VIN, IOUT=5mA) (3.3VIN, IOUT=1000mA)** = Trig’d Tek Prevu rif + | + { **VOUT VOUT** a Ch1 Pk—-Pk 1 1 **IOUT** t i 25.2mv + 4 t | chi Min : + 4 —30.0mvV : : **EN** 4 4 20.0mv\a@ib) soOmA uM400us)Al Chl +10.0mv Chi 2.00V ‘aig 5.00 V M2.00msAl Chi +[marx)] tiey F550. 800ps] jose 49.80%) **FIG.37 TRANSIENT RESPONSE FIG.38 TURN-ON (5.0VIN, 50% to 100% LOAD STEP) (3.3VIN, IOUT=1000mA)**
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## **APPLICATIONS INFORMATION:**
## **REFERENCE CIRCUIT FOR GENERAL APPLICATION:**
**==> picture [458 x 295] intentionally omitted <==**
**----- Start of picture text -----**<br>
The Figure 39 shows the module application schematics for input voltage +5V or +3.3V and turn on by<br>input voltage directly through enable resistor (REN).<br>Enable<br>ON<br>OFF(GND)<br>EN<br>VIN VOUT<br>(+) (+)<br>VOUT<br>VIN GND FB Co 1.8Vo<br>3.3V / 5.0V Option/0402<br>: [i]<br>(-) (-)<br>_—ti |,<br>FIG.39 TYPICAL APPLICATION FOR PWM OPERATION<br>100k/020 1<br>100pF/0201<br>50k/020 1<br>**----- End of picture text -----**<br>
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> **APPLICATIONS INFORMATION: (Cont.)** ~~|~~
## **SAFETY CONSIDERATIONS:**
Certain applications and/or safety agencies may require fuses at the inputs of power conversion components. Fuses should also be used when there is the possibility of sustained input voltage reversal which is not current limited. For greatest safety, we recommend a fast blow fuse installed in the ungrounded input supply line. The installer must observe all relevant safety standards and regulations. For safety agency approvals, install the converter in compliance with the end-user safety standard.
## **OUTPUT FILTERING:**
To reduce output ripple and improve the dynamic response as the step load changes, an additional capacitor at the output must be connected. Low ESR polymer and ceramic capacitors are recommended to improve the output ripple and dynamic response of the module.
## **PROGRAMMING OUTPUT VOLTAGE:**
The module has an internal 0.6V ± 2% reference voltage. The output voltage can be programed by the dividing resistor RFB which respects to FB pin and GND pin. The output voltage can be calculated as shown in Equation 1 and the resistor according to typical output voltage is shown in TABLE 1.
**==> picture [309 x 38] intentionally omitted <==**
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> **APPLICATIONS INFORMATION: (Cont.)** ~~a~~
## **RECOMMENDATION LAYOUT GUIDE:**
In order to achieve stable, low losses, less noise or spike, and good thermal performance some layout considerations are necessary. The recommendation layout is shown as Figure 40.
1. The ground connection between pin 2 and 4 should be a solid ground plane under the module. It can be connected one or more ground plane by using several Vias.
2. Place high frequency ceramic capacitors between pin 3 (VOUT), and pin 2, 4 (GND) for output side, as close to module as possible to minimize high frequency noise.
3. Keep the RFB_top ,RFB_bot , and CFF connection trace to the module pin 5 (FB) short.
4. Use large copper area for power path (VIN, VOUT, and GND) to minimize the conduction loss and enhance heat transferring. Also, use multiple Vias to connect power planes in different layer.
**FIG.40 RECOMMENDATION LAYOUT (TOP LAYER)**
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## **APPLICATIONS INFORMATION: (Cont.)**
## **Thermal Considerations:**
All of thermal testing condition is complied with JEDEC EIJ/JESD 51 Standards. Therefore, the test board size is 30mm× 30mm× 1.6mm with 2 layers. The case temperature of module sensing point is shown as Figure 41. Then Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The MUN3CAD01-SC module is designed for using when the case temperature is below 110°C regardless the change of output current, input/output voltage or ambient temperature.
**FIG.41 Case Temperature Sensing Point**
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## **REFLOW PARAMETERS:** ~~Cn~~
Lead-free soldering process is a standard of electronic products production. Solder alloys like Sn/Ag, Sn/Ag/Cu and Sn/Ag/Bi are used extensively to replace the traditional Sn/Pb alloy. Sn/Ag/Cu alloy (SAC) is recommended for this power module process. In the SAC alloy series, SAC305 is a very popular solder alloy containing 3% Ag and 0.5% Cu and easy to obtain. Figure 36 shows an example of the reflow profile diagram. Typically, the profile has three stages. During the initial stage from room temperature to 150°C, the ramp rate of temperature should not be more than 3°C/sec. The soak zone then occurs from 150°C to 200°C and should last for 60 to 120 seconds. Finally, keep at over 217°C for 60 seconds limit to melt the solder and make the peak temperature at the range from 240°C to 250°C. It is noted that the time of peak temperature should depend on the mass of the PCB board. The reflow profile is usually supported by the solder vendor and one should adopt it for optimization according to various solder type and various manufacturers’ formulae.
**FIG.42 Recommendation Reflow Profile**
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℃<br>**----- End of picture text -----**<br>
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> **PACKAGE OUTLINE DRAWING:** ~~ee~~
**==> picture [52 x 9] intentionally omitted <==**
**----- Start of picture text -----**<br>
Unit: mm<br>**----- End of picture text -----**<br>
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## **LAND PATTERN REFERENCE:**
Unit:mm
RECOMMENDED STENCIL PATTERN BASED ON 125um THICK STENCIL
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**==> picture [461 x 14] intentionally omitted <==**
**----- Start of picture text -----**<br>
PACKING REFERENCE: CT<br>**----- End of picture text -----**<br>
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**----- Start of picture text -----**<br>
|||||||||
|---|---|---|---|---|---|---|---|
|Unit: mm|
|Package In Tape Loading Orientation|
|PIN1|
|OO|OO|D|
|iis|||
|Tape Dimension|
|,|2)|Pe|rn|oo|
|||QR|060|0|6|o-|.|
|A0|2.62|±|0.10|E1|1.75|±|0.10|
|B0|3.22|±|0.10|K0|1.35|±|0.10|
|F|3.50|±|0.05|P0|4.00|±|0.10|
|W|8.0|±|0.30|P1|2.00|±|0.05|
|D0|φ1.5 +0.10/-0.00|P2|4.00|±|0.10|
|D1|φ1.00|±|0.10|t|0.25|±|0.1|
**----- End of picture text -----**<br>
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## **PACKING REFERENCE: (Cont.)** Conic
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**----- Start of picture text -----**<br>
Unit: mm<br>Reel Dimension<br>See Detail A —<br>Detail A<br>q iay a“<br>———s17842 8 :<br>Peel Strength of Top Cover Tape<br>The peel speed shall be about 300mm/min.<br>The peel force of top cover tape shall between 0.1N to 1.0N<br>**----- End of picture text -----**<br>
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## **MUN3CAD01-SC**
> **REVERSION HISTORY:** ~~Cn~~
|**Date**|**Revision**|**Changes**|
|---|---|---|
|2015.01.08|00|Initial released.|
|2015.03.31|01|Official released.|
|2015.06.24|02|Add REFLOW PARAMETERS|
|2015.09.17|03|Upgrade Input shutdown current|
|2016.03.29|04|UpgradeCompact Size 1.0mmà1.05mm|
|2016.09.19|05|Add ORDER INFORMATION<br>Upgrade Current limit threshold|
|2016.12.27|05|Page 1 Revision Rev 04. Change to Rev 05.|
|2017.3.29|06|Add VOUT=3.3V Performance Characteristics|
|2018.12.27|07|Upgrade line regulation and load regulation|
|2024.12.16|A1|Synchronized with document management number|
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Updated at June 9, 2026
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