MUN3CAD01-SB

**MUN3CAD01-SB** 

## **uPOL MODULE** 

## **1.0A, High Efficiency uPOL Module** 

## **FEATURES:** ~~Te~~ 

◼ High Density Integration Module 

- 1.0A Output Current 

- 92% Peak Efficiency at 3.3VIN 

- Input Voltage Range from 2.5V to 5.5V 

- Output Voltage Range from 0.8V to 4.0V 

- ◼ Enable Function 

- Automatic Power Saving/PWM Mode 

- Protections (UVLO, OCP: Non-latching) 

- ◼ Internal Soft Start 

- Compact Size: 2.5mm*2.0mm*1.1mm 

- Pb-free for RoHS compliant 

## **GENERAL DESCRIPTION:** |=—« ~~[ee]~~ 

The uPOL module is non-isolated dc-dc converter that can deliver up to 1.0A of output current. The PWM switching regulator, high frequency power inductor, input/output bulk capacitors are integrated in one hybrid package. 

The module has automatic operation with PWM mode and power saving mode according to loading. Other features include remote enable function, internal soft-start, non-latching over current protection, short circuit protection and input under voltage locked-out capability. 

- MSL 2, 260 ℃ Reflow 

## **APPLICATIONS:** 

- Single Li-Ion Battery-Powered Equipment 

- ◼ LDOs Replacement ◼ Cell Phones / PDAs / Palmtops 

The low profile and compact size package (2.5mm × 2.0mm x 1.1mm(max)) is suitable for automated assembly by standard surface mount equipment. The module is Pb-free and 

RoHS compliance. 

## **TYPICAL APPLICATION CIRCUIT & PACKAGE SIZE:** ee ~~e~~ 

**==> picture [449 x 241] intentionally omitted <==**

**----- Start of picture text -----**<br>
VIN=2.5V~5.5V  VOUT=1.8V<br>VIN  LX  VOUT<br>Cin  R1  CFB<br>10uF/6.3V  100k  10PF<br>COUT<br>10uF/6.3V<br>J EN  FB<br>R2<br>49.9k<br>GND  GND<br>l | @e<br>FIG.1 TYPICAL APPLICATION CIRCUIT  FIG.2 HIGH DENSITY LOW PROFILE<br>uPOL MODULE<br>TABLE 1. OUTPUT VOLTAGE SETTING<br>Vout  1.0V  1.2V  1.5V  1.8V  2.5V  3.3V<br>RFB_top( Ω )  100k<br>RFB_bot( Ω )  150k  100k  66.5k  50k  31.6k  22.1k<br>**----- End of picture text -----**<br>


Rev.A0 

1 

## **- MUN3CAD01 SB** 

~~EE~~ **ORDER INFORMATION:** _ 

**Ambient Temp. Range Package Part Number MSL Note (°C) (Pb-Free)** MUN3CAD01-SB -40 ~ +85 QFN Level 2 - **Order Code Packing Quantity** MUN3CAD01-SB Tape and reel 2000 

~~a~~ **PIN CONFIGURATION:** 

## **TOP VIEW** 

~~(I~~ **PIN DESCRIPTION:** 

|**Symbol**|**Pin No.**|**Description**|
|---|---|---|
|EN|1|On/Off control pin for module.<br>EN = LOW, the module is off.<br>EN = HIGH, the module is on.<br>Do not float.|
|GND|2, 6|Power ground pin for signal, input, and output return path. This pin<br>needs to connect one or moregroundplane directly.|
|FB|3|Feedback input. Connect to output through a voltage dividing resistors<br>for adjusting output voltage. Place those resistors as closely as possible<br>to thispin.|
|LX|4, 5|Switch output. Connect to thermal exposed pad of LX for heat<br>transferring.|
|VIN|7|Power input pin. It needs to connect input rail.|
|VOUT|8|Power output pin. Connect to output for the load.|



Rev.A0 

2 

## **- MUN3CAD01 SB** 

## **ELECTRICAL SPECIFICATIONS:** 

CAUTION: Do not operate at or near absolute maximum rating listed for extended periods of time. This stress may adversely impact product reliability and result in failures not covered by warranty. 

|**Parameter**<br>~~a~~<br>~~oO~~|**Description**<br>|**Min.**<br>|**Typ.**<br>|**Max.**<br>|**Unit**<br>|
|---|---|---|---|---|---|
|◼<br>Absolute Maximum Ratings<br>~~oO~~||||||
|VIN to GND<br>~~oOa~~|Note 1<br>~~a~~|-<br>~~a~~|-<br>~~a~~|+6.0<br>~~a~~|V<br>~~a~~|
|VOUT to GND<br>~~a~~|Note 1<br>~~a~~<br>~~a~~|-<br>~~a~~|-<br>~~a~~|+6.0<br>~~a~~|V<br>~~a~~|
|EN to GND<br>~~a~~|Note 1|-|-|VIN+0.6|V|
|Tc<br>~~a~~|Case Temperature of Inductor|-|-|+110|°C|
|Tj<br>~~a ~~|Junction Temperature<br> ~~a~~|-40|-|+150|°C|
|Tstg<br>~~a~~|Storage Temperature<br>~~a~~<br>~~a~~|-40<br>~~a~~<br>~~a~~<br>~~OO~~|-<br>~~a~~<br>~~a~~<br>~~OO~~|+125<br>~~a~~<br>~~a~~|°C<br>~~a~~<br>~~a~~|
|ESD Rating<br>~~oO~~|Human Body Model (HBM)<br>~~a~~|-<br>~~a~~<br>~~OO~~<br>~~OO~~|-<br>~~a~~<br>~~OO~~<br>~~OO~~|2k<br>~~a~~|V<br>~~a~~|
||Machine Model (MM)<br>~~a~~|-<br>~~OO~~<br>~~a~~<br>~~OO~~|-<br>~~OO~~<br>~~a~~<br>~~OO~~|200<br>~~a~~|V<br>~~a~~|
||Charge Device Model (CDM)<br>~~OO~~|-<br>~~OO~~<br>~~OO~~|-<br>~~OO~~<br>~~OO~~|1k<br>~~OO~~|V<br>~~OO~~|
|◼<br>Recommendation Operating Ratings<br>~~OO~~<br>~~oO~~||||||
|VIN<br>~~oOa~~|Input Supply Voltage<br>~~OO~~|+2.5<br>~~OO~~|-<br>~~OO~~|+5.5<br>~~OO~~|V<br>~~OO~~|
|VOUT<br>~~a~~|Output Voltage|+0.8|-|+4.0|V|
|Ta<br>~~a~~|Ambient Temperature|-40|-|+85|°C|
|◼<br>Thermal Information||||||
|Rth(jchoke-a)<br>~~a ~~|Thermal resistance from junction to<br>ambient. (Note 1)<br> ~~ee~~|-<br>~~ee~~|54.1<br>~~ee~~|-<br>~~ee~~|°C/W<br>~~ee~~|



NOTES: 

1. Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The test board size is 30mm× 30mm× 1.6mm with 4 layers, 1oz. The test condition is complied with JEDEC EIJ/JESD 51 Standards. 

Rev.A0 

3 

**- MUN3CAD01 SB** 

## ~~Goyer~~ 

## **ELECTRICAL SPECIFICATIONS: (Cont.)** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2Oz . 

The output ripple and transient response measurement is short loop probing and 20MHz bandwidth limited. Vin = 3.3V, Vout = 1.2V, unless otherwise specified. 

|**Symbol**<br>~~a~~|**Parameter**<br>~~ee~~|**Conditions**<br>~~ee~~|**Min.**<br>~~ee~~<br>~~es~~|**Typ.**<br>~~ee~~<br>~~es~~|**Max.**<br>~~ee~~|**Unit**<br>~~ee~~|
|---|---|---|---|---|---|---|
|◼<br>Input Characteristics<br>~~a~~<br>~~eeee~~<br>~~es~~<br>~~es~~<br>~~aeeee~~<br>~~ee~~<br>~~a~~|||||||
|ISD(IN)<br>~~a~~<br>~~a~~|Input shutdown<br>current<br>~~ee~~<br>~~ee~~|Vin = 3.3V,<br>EN = GND<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|0.3<br>~~ee~~<br>~~ee~~|1<br>~~ee~~<br>~~ee~~<br>~~ee~~|uA<br>~~ee~~<br>~~ee~~<br>~~ee~~|
|I(IN)<br>~~a ~~<br>~~a~~<br>~~|)~~|Input supply<br>current<br> ~~ee~~<br>~~ee~~<br>~~|)~~|Vin = 3.3V, Iout = 0A<br>EN = VIN, Vout = 1.2V<br>~~ee~~<br>~~ee~~<br>|-<br>~~ee~~<br>~~ee~~<br>~~es~~<br>|75<br>~~ee~~<br>~~ee~~<br>|-<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|uA<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>|
|IS(IN)<br>~~|)~~|Input supply<br>current<br>~~ee~~<br>~~|) ~~|Vin = 3.3V, EN = VIN<br>~~ee~~<br>~~es~~<br>~~Ferre~~|-<br>~~ee ~~<br>~~es~~<br>~~es~~<br>~~Ferre~~|~~ee~~<br>~~es~~<br>~~Ferre~~|-<br>~~ee~~<br>~~es~~<br>~~Ferre~~|-<br>~~ee~~<br>~~es~~<br>~~Ferre~~|
|||Iout = 5mA<br>Vout = 1.2V<br>~~Ferre~~<br>~~TIT~~|-<br>~~es~~<br>~~Ferre~~<br>~~TIT~~|3<br>~~Ferre~~<br>~~TITTEE~~|-<br>~~Ferre~~<br>~~TEE~~|mA<br>~~Ferre~~<br>~~TEE~~|
|||Iout = 100mA<br>Vout = 1.2V<br>~~Ferre~~<br>~~TIT~~|-<br>~~es~~<br>~~Ferre~~<br>~~TIT~~|45<br>~~Ferre~~<br>~~TITTEE~~|-<br>~~Ferre~~<br>~~TEE~~|mA<br>~~Ferre~~<br>~~TEE~~|
|||Iout = 1000mA<br>Vout = 1.2V<br> ~~Ferre~~<br>~~TIT~~<br>~~ee~~|-<br>~~es~~<br>~~Ferre~~<br>~~TIT~~<br>~~ee~~|480<br>~~Ferre~~<br>~~TITTEE~~<br>~~ee~~|-<br>~~Ferre~~<br>~~TEE~~<br>~~ee~~|mA<br>~~Ferre~~<br>~~TEE~~<br>~~ee~~|
|◼<br>Output Characteristics<br>~~es~~<br>~~|) ~~<br>~~ee~~<br>~~eeee~~|||||||
|IOUT(DC)<br>~~ee~~<br>~~ee~~|Output<br>continuous<br>current range<br>~~ee~~<br>~~ee~~|Vin=3.3V, Vout=1.2V<br>~~ee~~<br>~~ee~~|0<br>~~ee~~<br>~~eee~~|-<br>~~ee~~<br>~~eee~~|1000<br>~~ee~~<br>~~eee~~|mA<br>~~ee~~<br>~~eee~~|
|VO(SET)<br>~~ee~~<br>~~ee~~<br>~~a~~|Ouput Voltage<br>set Point<br>~~ee~~<br>~~ee~~<br>|With 0.5% tolerance for<br>external resistor used to set<br>output voltage<br>~~ee~~<br>~~ee~~|-2.0<br>~~ee~~<br>~~eee~~<br>~~TT~~|~~ee ~~<br>~~eee~~<br>~~TT~~|+2.0<br> ~~ee~~<br>~~eee~~<br>~~TT~~|% VO(SET)<br>~~ee~~<br>~~eee~~|
|ΔVOUT<br>/ΔVIN<br>~~ee~~<br>~~|~~<br>~~a~~|Line regulation<br>accuracy<br>~~ee~~<br>~~fT~~<br>|Vin = 3.3V to 5V<br>Vout = 1.2V, Iout = 10mA<br>Vout = 1.2V,Iout = 1000mA<br>~~ee~~<br>~~fT~~|-<br>~~eee~~<br>~~fT~~<br>~~TT~~|0.1<br>~~eee~~<br>~~fT~~<br>~~TT~~|1<br>~~eee~~<br>~~fT~~<br>~~TT~~|% VO(SET)<br>~~eee~~<br>~~fT~~|
|ΔVOUT<br>/ΔIOUT<br>~~a ~~<br>~~SSS~~|Load regulation<br>accuracy<br> ~~a~~<br>~~SSS~~|Iout = 10mA to 1000mA<br>Vin = 3.3V,Vout = 1.2V<br>~~SSS~~|-<br>~~TT~~<br>~~SSS~~|0.5<br>~~TT~~<br>|1.5<br>~~TT~~<br>~~=—~~|% VO(SET)<br>~~=—~~|
|VOUT(AC)<br>~~SSS~~<br>~~ln~~|Output ripple<br>voltage<br>~~SSS~~|Vin = 3.3V, Vout = 1.2V<br>EN = VIN<br>~~SSS~~|-<br>~~SSS~~|-<br>|-<br>~~=—~~|-<br>~~=—~~|
|||IOUT = 5mA,<br>~~SSS~~|~~SSS~~|30<br>|~~=—~~|mVp-p<br>~~=—~~|
|||IOUT = 1000mA,<br>~~SSS~~<br>~~ee~~|~~SSS~~<br>~~ee~~|10<br><br>~~ee~~|~~=—~~<br>~~ee~~|mVp-p<br>~~=—~~<br>~~ee~~|
|COUT(MAX)<br>~~SSS~~<br>~~ln~~|Maximum<br>capacitive load<br>~~SSS~~|Iout = 1000mA,<br>ESR≧1 m<br>~~SSS~~<br>~~ee~~|~~SSS ~~<br>~~ee~~|<br>~~ee~~|150<br> ~~=—~~<br>~~ee~~|uF<br>~~=—~~<br>~~ee~~|



Rev.A0 

4 

## ~~Goyer~~ 

## **- MUN3CAD01 SB** 

## **ELECTRICAL SPECIFICATIONS: (Cont.)** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2Oz . 

The output ripple and transient response measurement is short loop probing and 20MHz bandwidth limited. Vin = 3.3V, Vout = 1.2V, unless otherwise specified. 

|**Symbol**<br>~~aa~~|**Parameter**<br>~~aa~~|**Conditions**<br>~~aa~~|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|◼<br>Control Characteristics|||||||
|VREF<br>~~a~~|Referance<br>voltage<br>~~aee~~|~~ee~~|0.588<br>~~ee~~<br>~~ee~~|0.6<br>~~ee~~<br>~~ee~~|0.612<br>~~ee~~|V<br>~~ee~~|
|FOSC<br>~~a~~|Oscillator<br>frequency<br>~~ee~~|PWM Operation<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|3.0<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|MHz<br>~~ee~~|
|VEN_TH<br>~~pe~~|Enable rising<br>threshold<br>voltage<br>~~pe~~|~~pe~~|1.5<br>~~ee~~<br>~~pe~~|-<br>~~ee~~<br>~~pe~~|-<br>~~pe~~|V<br>~~pe~~|
||Enable falling<br>threshold<br>voltage<br>~~pe~~<br>~~PE~~|~~pe~~<br>~~PE~~|-<br>~~pe~~<br>~~PE~~|-<br>~~pe~~<br>~~PE~~|0.4<br>~~pe~~<br>~~PE~~|V<br>~~pe~~<br>~~PE~~|
|◼<br>Fault Protection<br>~~ee~~<br>~~a~~|||||||
|VUVLO_TH<br>~~a~~<br>~~a~~|Input under<br>voltage lockout<br>threshold<br>~~a ~~<br>|Falling,<br> ~~ee~~<br>|-<br>~~ee~~<br>|2.5<br>~~ee~~<br>|-<br>~~ee~~<br>~~ee~~<br>|V<br>~~ee~~<br>~~ee~~<br>|
|TOTP<br>~~a~~|Over temp<br>protection<br>~~ee~~|~~ee~~|-<br>~~ee~~<br>~~ee~~|160<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|℃<br>~~ee~~<br>~~ee~~|
|ILIMIT_TH<br>~~a~~|Current limit<br>threshold<br>~~ee~~|Peak value of inductor current,<br>~~ee~~|1.3<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|~~ee~~|A<br>~~ee~~|



Rev.A0 

5 

## **- MUN3CAD01 SB** 

## **TYPICAL PERFORMANCE CHARACTERISTICS: (1.0VOUT)** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2Oz . 

The output ripple and transient response measurement is short loop probing and 20MHz bandwidth limited. The following figures provide the typical characteristic curves at 1.0Vout. 

**==> picture [400 x 367] intentionally omitted <==**

**----- Start of picture text -----**<br>
FIG.3 EFFICIENCY V.S. LOAD CURRENT  FIG.4 DE-RATING CURVE AT 3.3VIN<br>_ = —— — — Tek stop i<br>VOUT  VOUT<br>seuecueae:40.0us 25.0MS/s @.  ce400ns 2.50GS/s @.<br>Giey0.00000s 10k points _14.8mv +¥0.00000s 10k points _2.40mV<br>Value27.2mv Mean27.0m Min26.8m Max27.2m Std283 Dev 14:36:37 @ Peak-Peak value7.20mv Mean7.30m Min7.20m Max7.60m Std2004 Dev<br>FIG.5 OUTPUT RIPPLE  FIG.6 OUTPUT RIPPLE<br>(3.3VIN, IOUT=5mA) (3.3VIN, IOUT=1000mA)<br>peepnpgnihogennegegen rig’d<br>t<br>Rc,od Ch13 1.6mvPk—Pk VOUT  5<br>bebe CAT MAX Aw a i Pee Pee<br>: : } : | 13.6mv ;<br>esee eer ns Cs: MLL Ld rs ‘<br>EN<br>20.0mvV\s@ib)so0mAOuM|400us|Al Chl + 10.0mv :<br>G++ £550. 800us| 2 Sep 201 SoomvV SCH? 2.00 SM2.cOm A Chit FS<br>FIG.7 TRANSIENT RESPONSE  FIG.8 TURN-ON<br>(5.0VIN, 50% to 100% LOAD STEP) (3.3VIN, IOUT=1000mA)<br>**----- End of picture text -----**<br>


Rev.A0 

6 

## **- MUN3CAD01 SB** 

## **TYPICAL PERFORMANCE CHARACTERISTICS: (1.2VOUT)** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2Oz . 

The output ripple and transient response measurement is short loop probing and 20MHz bandwidth limited. Vin = 3.3V, Vout = 1.2V, unless otherwise specified. 

**==> picture [424 x 367] intentionally omitted <==**

**----- Start of picture text -----**<br>
FIG.9 EFFICIENCY V.S. LOAD CURRENT  FIG.10 DE-RATING CURVE AT 3.3VIN<br>VOUT  VOUT<br>beeches<br>|I!j| ji<br>40.0ps 25.0Ms/s  @ SF | 400ns 250G5/s = S<br>Value Mean Min Max Std Dev ] wee2:58. value Mean Min Max Std Dev 16:40:12<br>FIG.11 OUTPUT RIPPLE  FIG.12 OUTPUT RIPPLE<br>(3.3VIN, IOUT=5mA) (3.3VIN, IOUT=1000mA)<br> Run = Trig’d<br>VOUT<br>VOUT<br>Ch1 Pk-Pk li<br>IOUT  | 14.4mv setidiall Iathiielil: Meieihiiall Ualiiadhdl Eaiiaihel” “oihdielhdl: iieiidiedl Talila Wiiaiiiiedl \eihiiail<br>q t + Chi Min |<br>: : t : : 4 —15.6mV + - - -<br>EN<br>+ | t<br>Chi,20.0mV\a@ie)SOOmAOUM|400us)Al Chl 7 i0.0mv f<br>21Sep 2016 I<br>Gy F550.800ps 10:28:26 fi fuamy toch. o.oo. M2 0c A Chi # 320<br>FIG.13 TRANSIENT RESPONSE  FIG.14 TURN-ON<br>(5.0VIN, 50% to 100% LOAD STEP) (3.3VIN, IOUT=1000mA)<br>**----- End of picture text -----**<br>


Rev.A0 

7 

**- MUN3CAD01 SB** 

## **TYPICAL PERFORMANCE CHARACTERISTICS: (1.5VOUT)** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2Oz . 

The output ripple and transient response measurement is short loop probing and 20MHz bandwidth limited. Vin = 3.3V, Vout = 1.5V, unless otherwise specified. 

**FIG.15 EFFICIENCY V.S. LOAD CURRENT FIG.16 DE-RATING CURVE AT 3.3VIN** it Tek Stop it **VOUT VOUT** 40.0usbiuas25.0MS/s @r i 2.50G5/s @r value Gy0.00000s 10k points __5.40mv [712 May 2021 0.000005 10k points _5.4omv Peak-Peak 17.2mv Mean15.2m Min14.0m Max16.0m Std1.06m Dev 16:45:58 @ Peak-Peak value4.80mv Mean6.22m 4.80mMin Max10.8m Std1.73m Dev **FIG.17 OUTPUT RIPPLE FIG.18 OUTPUT RIPPLE (3.3VIN, IOUT=5mA) (3.3VIN, IOUT=1000mA) VOUT** : : ‘ , : * Chi Pk-Pk Fp fee sencoreinme teense a tt _ _ ; CO Os ' : : : : + : hihh bbc bbchs **IOUT** bbb btbiebittelbbit) CAT Max : : t : t | 13.6mv ; : t : : : t : : : : 3 chi Min : i : : : : L : : | -18.0mVv . . . } ; 20-omvv Algal SoomA Sur a0ous| A Chi 716.omv Sa 1-00 ch2- 00 VSM oomis) A Ch1 7 21Sep 2016 ivy |-550.800us 10:28:48 **FIG.19 TRANSIENT RESPONSE FIG.20 TURN-ON (5.0VIN, 50% to 100% LOAD STEP) (3.3VIN, IOUT=1000mA)** 

Rev.A0 

8 

## **- MUN3CAD01 SB** 

## **TYPICAL PERFORMANCE CHARACTERISTICS: (1.8VOUT)** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2Oz . 

The output ripple and transient response measurement is short loop probing and 20MHz bandwidth limited. Vin = 3.3V, Vout = 1.8V, unless otherwise specified. 

**FIG.21 EFFICIENCY V.S. LOAD CURRENT FIG.22 DE-RATING CURVE AT 3.3VIN** — - - i - — - — Tek stop — - - i - — - **VOUT VOUT** 40.0us 25.0MS/s @r 400ns 2.50GS/s @r Urr0.00000s__10k points__5.40mv Ur 0.00000 s__10k points__5.40mv value14.0mv Mean15.6m Min14.0m Max17.6m Std1.30m Dev 16:46:07 @ Peak-Peak value4.80mv Mean5.52m 4.80mMin Max7.20m Std955 Dev **FIG.23 OUTPUT RIPPLE FIG.24 OUTPUT RIPPLE (3.3VIN, IOUT=5mA) (3.3VIN, IOUT=1000mA)** = Trig’d - = ~~—~~ = — ~ — **VOUT VOUT** eei Ch19 38-4mvPk-Pk : f 4 : : **IOUT** + j= (18.8mv fai totate tate fbb ptt fate tito botetettidibotate bento t ' **EN** + 20.0mV\i@ie) SOOMAQsIM 400us| Al Chl F 10.0mv ; : t . 21 Sep 2016 : + T.00V SiCh2) 2.00V %iM2.00ms A Chi S **FIG.25 TRANSIENT RESPONSE FIG.26 TURN-ON (5.0VIN, 50% to 100% LOAD STEP) (3.3VIN, IOUT=1000mA)** 

Rev.A0 

9 

## **- MUN3CAD01 SB** 

## **TYPICAL PERFORMANCE CHARACTERISTICS: (2.5VOUT)** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2Oz . 

The output ripple and transient response measurement is short loop probing and 20MHz bandwidth limited. Vin = 3.3V, Vout = 2.5V, unless otherwise specified. 

**==> picture [406 x 367] intentionally omitted <==**

**----- Start of picture text -----**<br>
FIG.27 EFFICIENCY V.S. LOAD CURRENT  FIG.28 DE-RATING CURVE AT 3.3VIN<br>VOUT  VOUT<br>40.0ys 25.0MS/S @r 400ns 2.50GS/s @r<br>Value id» 0.00000s__10k points _8.00mv (@ io.omves SS _id|e0.00000s 10k points __3.00mv<br>19.2mv Mean16.5m Min15.2m Max18.0m Std1.40m Dev 16:57:50 @ Peak—-Peak value6.80mv Mean6.18m 4.40mMin Max8.40m Std1.15m Dev<br>FIG.29 OUTPUT RIPPLE  FIG.30 OUTPUT RIPPLE<br>(3.3VIN, IOUT=5mA) (3.3VIN, IOUT=1000mA)<br>= Trig’d<br>VOUT<br>viii : Ch1 Pk-Pk VOUT<br>IOUT<br>: : i : | 25.2mv 1 , . faves eawes wewers weer wares<br>a a | 730.0mv EN  foo s : ome<br>20.0mV\si@i) eeSOOMAQSIM/400us|Gy £550.800ps)Al ChleeF 10.0mVv,| 21Septo:20482016 4 vorowen1.00V3 wen%Ch2) Fara2.00VSareea‘SM2.00msy Wrarsrare: ari ;A Chlj Ss i1.26V<br>FIG.31 TRANSIENT RESPONSE  FIG.32 TURN-ON<br>(5.0VIN, 50% to 100% LOAD STEP) (3.3VIN, IOUT=1000mA)<br>**----- End of picture text -----**<br>


Rev.A0 

10 

## **- MUN3CAD01 SB** 

## **TYPICAL PERFORMANCE CHARACTERISTICS: (3.3VOUT)** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2Oz . 

The output ripple and transient response measurement is short loop probing and 20MHz bandwidth limited. Vin = 5.0V, Vout = 3.3V, unless otherwise specified. 

**==> picture [414 x 365] intentionally omitted <==**

**----- Start of picture text -----**<br>
FIG.33 EFFICIENCY V.S. LOAD CURRENT  FIG.34 DE-RATING CURVE AT 5.0VIN<br>— - - i - — — Tek stop _ : : — - -<br>VOUT  VOUT<br>40.0us 25.0MS/s @r 400ns 2.50GS/s @s<br>UY 0.00000 s__10k points __8.00mv U*0.00000s__10k points__5.60mv<br>22.0mv 22.2m 22.0m 22.4m 283yu @ Peak—Peak 5.20mv 6.04m 5.20m 6.80m 548y<br>FIG.35 OUTPUT RIPPLE  FIG.36 OUTPUT RIPPLE<br>(5.0VIN, IOUT=5mA) (5.0VIN, IOUT=1000mA)<br>; ~ - Trig’d Tek Prevu<br>VOUT<br>VOUT<br>cht Pk-Pk : : : : : : : : : :<br>IOUT<br>\ pause t \ agunevESTRENON i ~30.0mv : : EN  : : : t : : : :<br>20.0mv\ai@ie) soomA uM 400us) Al Chl + 10.0mv ; : : : : + : : : :<br>—<br>Gy 21 Sep 2016 einen ppt<br>F550. 800ys 10:29:48 Chi, 2.00V Si@ie) 5.00V “iMi2.00oms A| Chl s<br>49.80%<br>FIG.37 TRANSIENT RESPONSE  FIG.38 TURN-ON<br>(5.0VIN, 50% to 100% LOAD STEP) (3.3VIN, IOUT=1000mA)<br>**----- End of picture text -----**<br>


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## ~~Geyntee~~ 

## **- MUN3CAD01 SB** 

## **APPLICATIONS INFORMATION:** 

## **REFERENCE CIRCUIT FOR GENERAL APPLICATION:** 

The Figure 39 shows the module application schematics for input voltage +5V or +3.3V and turn on by input voltage directly through enable resistor (REN). 

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VIN=2.5V~5.5V<br>VOUT=1.8V<br>VIN  LX  VOUT<br>Cin  R1  CFB<br>10uF/6.3V  100k  10P<br>F  COUT<br>10uF/6.3V X2<br>EN  FB<br>R2<br>49.9k<br>GND  GND<br>F<br>**----- End of picture text -----**<br>


**FIG.39 TYPICAL APPLICATION FOR PWM OPERATION** 

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## **APPLICATIONS INFORMATION: (Cont.)** 

## **SAFETY CONSIDERATIONS:** 

Certain applications and/or safety agencies may require fuses at the inputs of power conversion components. Fuses should also be used when there is the possibility of sustained input voltage reversal which is not current limited. For greatest safety, we recommend a fast blow fuse installed in the ungrounded input supply line. The installer must observe all relevant safety standards and regulations. For safety agency approvals, install the converter in compliance with the end-user safety standard. 

## **INPUT FILTERING:** 

The module should be connected to a low AC impedance source supply and a highly inductive source or line inductance can affect the stability of the module. An input capacitor must be placed directly to the input pin of the module, to minimize input ripple voltage and ensure module stability. 

## **OUTPUT FILTERING:** 

To reduce output ripple and improve the dynamic response as the step load changes, an additional capacitor at the output must be connected. Low ESR polymer and ceramic capacitors are recommended to improve the output ripple and dynamic response of the module. 

## **PROGRAMMING OUTPUT VOLTAGE:** 

The module has an internal 0.6V ± 2% reference voltage. The output voltage can be programed by the dividing resistor R1 and R2 which respects to VOUT pin and FB pin. The output voltage can be calculated as shown in Equation 1 and the resistor according to typical output voltage is shown in TABLE 1. 

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## **- MUN3CAD01 SB** 

## **APPLICATIONS INFORMATION: (Cont.)** 

## **RECOMMENDATION LAYOUT GUIDE:** 

In order to achieve stable, low losses, less noise or spike, and good thermal performance some layout considerations are necessary. The recommendation layout is shown as Figure 40. 

1. The ground connection between pin 2 and 6 should be a solid ground plane under the module. It can be connected one or more ground plane by using several Vias. 

2. Place high frequency ceramic capacitors between pin 7 (VIN), and pin 2, 6 (GND) for output side, as close to module as possible to minimize high frequency noise. 

3. Place high frequency ceramic capacitors between pin 8 (VOUT), and pin 2, 6 (GND) for output side, as close to module as possible to minimize high frequency noise. 

4. Keep the R1 ,R2 , and CFB connection trace to the module pin 3 (FB) short. 

5. Use large copper area for power path (VIN, VOUT, and GND) to minimize the conduction loss and enhance heat transferring. Also, use multiple Vias to connect power planes in different layer. 

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R1<br>|<br>CFB<br>LX<br>R2<br>GND  LX  FB<br>GND<br>w= ,<br>GND  GND<br>CIN<br>VIN  EN  COUT<br>VOUT<br>VIN<br>VOUT<br>**----- End of picture text -----**<br>


**FIG.40 RECOMMENDATION LAYOUT (TOP LAYER)** 

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## **- MUN3CAD01 SB** 

## **APPLICATIONS INFORMATION: (Cont.)** 

## **Thermal Considerations:** 

All of thermal testing condition is complied with JEDEC EIJ/JESD 51 Standards. Therefore, the test board size is 30mm× 30mm× 1.6mm with 4 layers 2oz. The case temperature of module sensing point is shown as Figure 41. Then Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The MUN3CAD01-SB module is designed for using when the case temperature is below 110°C regardless the change of output current, input/output voltage or ambient temperature. 

Sensing point (Defined case temperature) 

**FIG.41 Case Temperature Sensing Point** 

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## **REFLOW PARAMETERS:** 

Lead-free soldering process is a standard of electronic products production. Solder alloys like Sn/Ag, Sn/Ag/Cu and Sn/Ag/Bi are used extensively to replace the traditional Sn/Pb alloy. Sn/Ag/Cu alloy (SAC) is recommended for this power module process. In the SAC alloy series, SAC305 is a very popular solder alloy containing 3% Ag and 0.5% Cu and easy to obtain. Figure 42 shows an example of the reflow profile diagram. Typically, the profile has three stages. During the initial stage from room temperature to 150°C, the ramp rate of temperature should not be more than 3°C/sec. The soak zone then occurs from 150°C to 200°C and should last for 60 to 120 seconds. Finally, keep at over 217°C for 60~150 seconds to melt the solder and make the peak temperature at the range from 255°C to 260°C (Do not exceed 30 sec). It is noted that the time of peak temperature should depend on the mass of the PCB board. The reflow profile is usually supported by the solder vendor and one should adopt it for optimization according to various solder type and various manufacturers’ formulae. 

## **FIG.42 Recommendation Reflow Profile** 

## **(Not to scale)** 

## ***Refer to the Classification Reflow Profile of J-STD-020.** 

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> ~~[Ld]~~ **PACKAGE OUTLINE DRAWING:** 

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Unit: mm<br>**----- End of picture text -----**<br>


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-<br>MUN3CAD01 SB<br>Goyer —ssss—S—CS<br>**----- End of picture text -----**<br>


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( LAND PATTERN REFERENCE:<br>Unit: mm  1.70<br>— _——s x<br>oS<br>RECOMMENDED LAND PATTERN<br>0.65. _, 0.30<br>ie<br>ee oe<br>(oR)<br>; Se<br>§ Sb<br>*RECOMMENDED STENCIL PATTERN*<br>*Based on 0.1~0.15mm thickness stencil (Reference only)<br>*Recommended solder paste coverage 55~100%<br>**----- End of picture text -----**<br>


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~~|~~ **PACKING REFERENCE:** 

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Unit: mm<br>Package In Tape Loading Orientation<br>ot<br>oa<br>Tape Dimension<br>P1  P0  P2  t<br>D0  +<br>E1<br>F  5 9 0|9 q W<br>B0<br>D1  A0  pulling direction  K0<br>ieee |<br>carrier cavity<br>Z| 7 .—<br>A0  2.32  ±  0.10  E1  1.75  ±  0.10<br>B0  2.82  ±  0.10  K0  1.15  ±  0.10<br>F  3.50  ±  0.05  P0  4.00  ±  0.10<br>W  8.00 +0.30/-0.10  P1  2.00  ±  0.05<br>D0  φ1.50 +0.1/-0.0  P2  4.00  ±  0.10<br>D1  φ1.0 Min.  t  0.25  ±  0.05<br>**----- End of picture text -----**<br>


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## ~~Goyer~~ 

## **PACKING REFERENCE: (Cont.)** 

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Unit: mm<br>Reel Dimension<br>See Detail A<br> 2.2± 0.5<br>{@p) &<br>\ y Detail A<br>178± 2<br>— +0.5<br>— 60 0<br>Peel Strength of Top Cover Tape<br>0.15<br>12±<br>0.5<br>9±<br>**----- End of picture text -----**<br>


The peel speed shall be about 300mm/min. 

The peel force of top cover tape shall between 0.1N to 1.0N 

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## **REVISION HISTORY:** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|2020.05.13|00|1、Initial released.|
|2020.06.03|01|1、Upgrade output current 1A to 1.2A|
|2020.07.23|02|1、Upgrade Rth(jchoke-a)|
|2020.10.13|03|1、Update IOUT(DC)1000mA→1200mA<br>2、Upgrade Lead pattern information|
|2020.10.13|04|1、Update IOUT(DC)1200mA→1000mA|
|2021.11.16|05|1、Update IS(IN)610mA→480mA|
|2022.02.23|06|1、Update P/N<br>2、Modify typo in efficiency curve|
|2022.06.07|07|1、Update De-rating Curve|
|2022.12.19|08|1、Page 15, add test board information”2oz”. Change board<br>size from 2 layers to 4 layers.<br>2、Page 16, update reflow parameters and FIG.42.<br>3、Page 18, change the thickness description of stencil and<br>add note.|
|2024.12.16|A1|1、Synchronized with document management number|



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