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MUN12AD03-SH
Non Isolated POL DC/DC Converter, Micro Module, 15 W, 600 mV, 5 V, 3 A
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- Manufacturer: CYNTEC
- Product type: DC / DC Non Isolated Board Mount Converters - Adjustable Output
- SVHC: No SVHC (21-Jan-2025)
- Depth: 3.5mm
- Width: 3.5mm
- Height: 1.7mm
- Product Range: -
- Output Power Max: 15W
- Output Current Max: 3A
- Output Voltage Max: 5V
- Output Voltage Min: 600mV
- Input Voltage DC Max: 16V
- Input Voltage DC Min: 4.5V
- DC / DC Converter Type: Micro Module
- Power Supply Applications: -
- DC / DC Converter Output Type: Adjustable
| Delivery and price | |
|---|---|
| Units per pack | 500 |
| Price | 4.41 € |
| Current stock | 500+ |
| Lead time | 30 days |
Datasheet
**MUN12AD03-SH** **uPOL Module** ## **uPOL MODULE** ## **3A, High Efficiency** ## **FEATURES:** ~~=~~ ◼ High Density uPOL Module - 3A Output Current - 91% Peak Efficiency at 12VIN - Input Voltage Range from 4.5V to 16V - Output Voltage Range from 0.6V to 5.0V - Enable / PGOOD Function - Automatic Power Saving/PWM Mode - Protections (OCP: Non-latching, OTP) - Adjustable Soft Start Function - Compact Size: 3.5mm*3.5mm*1.7mm - Pb-free for RoHS compliant - MSL 2, 260℃ Reflow ## **APPLICATIONS:** - Point of Load Conversion - LDOs Replacement - Set Top Box / DSL Modem / AP Router - Industrial Personal Computer ## =—| ## **GENERAL DESCRIPTION:** The uPOL module is non-isolated dc-dc converter that can deliver up to 3A of output current. The PWM switching regulator, high frequency power inductor are integrated in one hybrid package. It only needs input/output capacitors and one voltage dividing resistor to perform properly. The module has automatic operation with PWM mode and power saving mode according to loading, through constant on-time control, the module offers a simpler control loop and faster transient response. Other features include remote enable function, internal soft-start, non-latching over current protection, power good, input under voltage locked-out capability. The low profile and compact size package (3.5mm × 3.5mm x 1.7mm) is suitable for automated assembly by standard surface mount equipment. The uPOL module is Pb-free and RoHS compliance. **==> picture [465 x 295] intentionally omitted <==** **----- Start of picture text -----**<br> TYPICAL APPLICATION CIRCUIT & PACKAGE:<br>ee<br>VBia s 1.7mm(Max)<br>EN<br>RPG VP GOOD<br>EN P GOOD<br>VIN VOUT 3.5mm<br>3.5mm<br>VIN Vout<br>uP OL Module<br>RFB_T<br>C IN SS FB COUT<br>CSS GND RFB_B<br>Li %<br>FIGURE.1 Typical Application Circuit FIGURE.2 High Density Low Profile<br>uPOL Module<br>1 Rev.A1<br>**----- End of picture text -----**<br> Rev.A1 ## **MUN12AD03-SH** **==> picture [461 x 14] intentionally omitted <==** **----- Start of picture text -----**<br> ORDER INFORMATION: Fe<br>**----- End of picture text -----**<br> ||**Ambient Temp. Range**|**Package**||| |---|---|---|---|---| |**Part Number**|||**MSL**|**Note**| ||**(°C)**|**(Pb-Free)**||| |MUN12AD03-SH|-40 ~ +85|QFN|Level 2|-| |||||| |**Order Code**||**Packing**||**Quantity**| |MUN12AD03-SH||Tape and reel||1000| > **PIN CONFIGURATION:** ~~|~~ **==> picture [476 x 202] intentionally omitted <==** **----- Start of picture text -----**<br> o. P| (11) GND - 4<br>SS (1) (8) VIN<br>L | a L |<br>TT<br>-4-4<br>FB (2) (7) EN<br>L<br>| (— a<br>(10) GND |<br>PGOOD (3) ra | | - 4 (6) NC<br>PJ;<br>- 4 oe - 4<br>VOUT (4) (5) GND<br>L | | a L |<br>(9) VOUT<br>**----- End of picture text -----**<br> **TOP VIEW** 2 Rev.A1 **MUN12AD03-SH** ## **PIN DESCRIPTION:** |**Symbol**|**Pin No.**|**Description**| |---|---|---| |SS|1|Leave SS pin floating for default 1ms soft-start time. For longer than 1ms<br>soft-start time, connect a capacitor from SS to GND.<br>Tss(ms)=Css(nF)*0.6V/4uA| |FB|2|Feedback input. Connect an external resistor divider to set the output<br>voltage.| |PGOOD|3|Power Good indicator. The pin output is an open drain that can connect to<br>Vout byresistor.| |VOUT|4, 9|Power output pin. Connect to output for the load.| |GND|5, 10, 11|Power ground pin for signal, input, and output return path. This pin<br>needs to be connected to one or moregroundplane directly.| |NC|6|No connection| |EN|7|On/Off control pin for module.<br>EN = LOW, the module is off.<br>EN = HIGH, the module is on.<br>Do not float.| |VIN|8|Power input pin. It needs to be connected to input rail.| 3 Rev.A1 **MUN12AD03-SH** ## **ELECTRICAL SPECIFICATIONS:** CAUTION: Do not operate at or near absolute maximum rating listed for an extended period of time. This stress may adversely impact product reliability and result in failures outside of warranty. |**Parameter**<br>~~ee~~|**Description**|**Min.**|**Typ.**|**Max.**|**Unit**| |---|---|---|---|---|---| |◼<br>Absolute Maximum Ratings<br>~~ee~~<br>~~a~~|||||| |VIN to GND<br>~~ee~~<br>~~es~~|~~ee~~|-<br>~~ee~~|-<br>~~ee~~|+18.0<br>~~ee~~|V<br>~~ee~~| |VOUT to GND<br>~~es~~||-|-|+6.5|V| |FB to GND<br>~~es~~<br>~~a~~<br>~~es~~||-|-|+4.0|V| |EN to GND<br>~~es~~||-|-|VIN+0.3|V| |PGOOD to GND<br>~~es~~<br>~~a~~||-|-|+18.0|V| |Tc<br>~~a~~<br>~~a~~<br>~~es~~|Case Temperature of Inductor|-|-|+110|°C| |Tj<br>~~a~~<br>~~es~~<br>~~ee~~|Junction Temperature<br>~~ee~~|-40<br>~~ee~~|-<br>~~ee~~|+125<br>~~ee~~|°C<br>~~ee~~| |Tstg<br>~~es~~<br>~~ee~~|Storage Temperature<br>~~ee~~|-40<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|+125<br>~~ee~~|°C<br>~~ee~~| |ESD Rating<br>~~ee~~|Human Body Model (HBM)<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|-<br>~~ee~~|2k<br>~~ee~~|V<br>~~ee~~| ||Machine Model (MM)<br>~~es~~|-<br>~~ee~~<br>~~es~~<br>~~ee~~|-<br>~~es~~|200<br>~~es~~|V<br>~~es~~| ||Charge Device Model (CDM)<br>~~es~~|-<br>~~es~~<br>~~ee~~|-<br>~~es~~|500<br>~~es~~|V<br>~~es~~| |◼<br>Recommendation Operating Ratings<br>~~ee~~<br>~~a~~|||||| |VIN<br>~~a~~<br>~~ee~~|Input Supply Voltage<br>~~a~~|+4.5<br>~~a~~|-<br>~~a~~|+16.0<br>~~a~~|V<br>~~a~~| |VOUT<br>~~ee~~<br>~~ee~~|Adjusted Output Voltage|+0.6|-|+5.0|V| |PGOOD<br>~~ee~~<br>~~ee~~<br>~~es~~|Power Good Voltage|-|-|+16.0|V| |Ta<br>~~ee~~<br>~~es~~|Ambient Temperature|-40|-|+85|°C| |◼<br>Thermal Information<br>~~es~~<br>~~a~~|||||| |Rth(jchoke-a)|Thermal resistance from junction to<br>ambient. (Note 1)|-|28.2|-|°C/W| NOTES: 1. Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The test board size is 30mm× 30mm× 1.6mm with 4 layers, 2oz. The test condition is complied with JEDEC EIJ/JESD 51 Standards. 4 Rev.A1 **MUN12AD03-SH** ## **ELECTRICAL SPECIFICATIONS: (Cont.)** Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 42mm× 42mm× 1.6mm, 4 layers, 2oz. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. Cin = 10uF/16V/1206*2, Cout = 47uF/6.3V/0805*2. |~~ee~~|~~ee~~|||||| |---|---|---|---|---|---|---| |**Symbol**<br>~~ee~~|**Parameter**<br>~~ee~~|**Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**| |◼<br>Input Characteristics<br>~~ee~~<br>~~ee~~<br>~~|~~||||||| |ISD(IN)<br>~~es~~<br>~~Bf~~|Input shutdown<br>current<br>~~es~~<br>~~Bf~~|Vin =12V, EN = GND<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~|5.5<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~|uA<br>~~es~~<br>~~es~~| |IS(IN)<br>~~es~~<br>~~Bf~~|Input supply current<br>~~es~~<br>~~Bf~~|Vin =12V,EN = VIN<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~|-<br>~~es~~<br>~~es~~| |||Iout = 0A,Vout = 3.3V<br>~~es~~|-<br>~~es~~|0.15<br>~~es~~|-<br>~~es~~|mA<br>~~es~~| |||Iout = 10mA,Vout = 3.3V<br>~~es~~|-<br>~~es~~|3.2<br>~~es~~|-<br>~~es~~|mA<br>~~es~~| |||Iout = 3A,Vout = 3.3V<br>~~es~~|-<br>~~es~~|0.96<br>~~es~~|-<br>~~es~~|A<br>~~es~~| |◼<br>Output Characteristics<br>~~Bf es~~<br>~~ee~~||||||| |IOUT(DC)<br>~~ee~~<br>~~a~~|Output continuous<br>current range<br>~~ee~~|~~ee~~<br>~~ee ee~~|0<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|3<br>~~ee~~<br>~~ee~~|A<br>~~ee~~<br>~~ee~~| |ΔVOUT<br>/ΔVIN<br>~~ee~~<br>~~a~~|Line regulation<br>accuracy<br>~~ee~~<br>~~ee~~|Vin = 5V to 16V<br>Vout = 3.3V, Iout = 0A<br>Vout = 3.3V,Iout = 3A<br>~~ee~~<br>~~ee ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|0.5<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|% VO(SET)<br>~~ee~~<br>~~ee~~| |ΔVOUT<br>/ΔIOUT<br>~~ee~~<br>~~a~~|Load regulation<br>accuracy<br>~~ee~~<br>~~ee~~|Iout = 0A to 3A<br>Vin = 12V,Vout = 3.3V<br>~~ee~~<br>~~ee ee~~<br>~~ee~~|-2<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|+3<br>~~ee~~<br>~~ee~~<br>~~ee~~|% VO(SET)<br>~~ee~~<br>~~ee~~| |VOUT(AC)<br>~~SS~~|Output ripple voltage<br>~~ee~~<br>~~SS~~|Vin = 12V, Vout = 3.3V<br>EN = VIN<br>~~ee~~<br>~~SS~~|-<br>~~ee ~~<br>~~SS~~<br>~~ee~~|-<br> ~~ee~~<br>~~SS~~<br>~~ee~~|-<br>~~ee~~<br>~~SS~~<br>~~ee~~|-<br>~~SS~~| |||Output ripple voltage<br>Iout = 10mA<br>~~SS~~<br>~~ee~~|-<br>~~SS~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|22<br>~~SS~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~SS~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|mVp-p<br>~~SS~~<br>~~ee~~| |||Iout = 3A<br>~~SS~~<br>~~ee~~|-<br>~~SS~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|13<br>~~SS~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|-<br>~~SS~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|mVp-p<br>~~SS~~<br>~~ee~~| |◼<br>Dynamic Characteristics<br>~~ee~~<br>~~ee~~<br>~~a~~<br>~~eeee~~||||||| |ΔVOUT-DP<br>~~a~~|Voltage change for<br>positive load step<br>~~a~~<br>~~ee~~|Iout = 1.5 A to 3A<br>Current slew rate = 0.15A/uS<br>Vin = 12V,Vout = 3.3V<br>~~a~~<br>~~ee~~|-<br>~~a~~<br>~~ee~~<br>~~ee~~|50<br>~~a~~<br>~~ee~~<br>~~ee~~|-<br>~~a~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|mVp-p<br>~~a~~<br>~~ee~~<br>~~ee~~<br>~~ee~~| |ΔVOUT-DN<br>~~ee~~|Voltage change for<br>negative load step<br>~~ee~~|Iout = 3A to 1.5A<br>Current slew rate = 0.15A/uS<br>Vin = 12V,Vout = 3.3V<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|50<br>~~ee ~~<br>~~ee~~|-<br> ~~ee~~<br>~~ee~~<br>~~ee~~|mVp-p<br>~~ee~~<br>~~ee~~<br>~~ee~~| |◼ Control Characteristics<br>~~ee~~<br>~~|~~<br>~~pf[fff~~||||||| |VREF<br>~~pf~~<br>~~ee~~<br>~~a~~|Referance voltage<br>~~pf~~<br>~~es~~|PWM Mode<br>~~[fff~~|0.591<br>~~[fff~~<br>~~ee~~|0.600<br>~~[fff~~<br>~~ee~~|0.609<br>~~[fff~~<br>~~ee~~|V<br>~~ee~~| |||PFM Mode<br>~~[fff~~<br>~~ee~~<br>~~es~~|0.591<br>~~[fff~~<br>~~ee~~<br>~~ee~~<br>~~es~~|0.600<br>~~[fff~~<br>~~ee~~<br>~~ee~~<br>~~es~~|0.618<br>~~[fff~~<br>~~ee~~<br>~~ee~~<br>~~es~~|V<br>~~ee~~<br>~~ee~~<br>~~es~~| |FOSC<br>~~pf~~<br>~~ee~~<br>~~a~~|Oscillator frequency<br>~~pf ~~<br>~~es~~|PWM Operation<br> ~~[fff~~<br>~~es~~|-<br>~~[fff~~<br>~~ee~~<br>~~es~~|1.0<br>~~[fff~~<br>~~ee~~<br>~~es~~|-<br>~~[fff~~<br>~~ee~~<br>~~es~~|MHz<br>~~ee~~<br>~~es~~| |VUVLO<br>~~ee~~<br>~~a~~<br>~~es~~|Input UVLO threshold<br>~~es~~<br>~~ee~~|Input UVLO threshold<br>~~es~~<br>~~se~~|-<br>~~ee ~~<br>~~es~~<br>~~se~~|-<br> ~~ee ~~<br>~~es~~|4.5<br> ~~ee ~~<br>~~es~~|V<br> ~~ee~~<br>~~es~~| |VPGL<br>~~es~~|PGOOD output low<br>~~ee~~|IPGOOD=4mA<br>~~se~~|0.04<br>~~se~~|0.15|0.3|V| |VEN_TH<br>~~es ~~<br>~~pf~~<br>~~a~~|Enable rising<br>threshold voltage<br> ~~ee~~<br>~~pf~~<br>~~ee~~|~~se~~<br>~~pf~~<br>~~ee~~|1.5<br>~~se~~<br>~~pf~~<br>~~ee~~<br>~~ee eee~~|-<br>~~pf~~<br>~~ee~~<br>~~eee~~|-<br>~~pf~~<br>~~ee~~<br>~~eee~~|V<br>~~pf~~<br>~~ee~~<br>~~eee~~| ||Enable falling<br>threshold voltage<br>~~pf~~<br>~~ee~~|~~pf~~<br>~~ee~~|-<br>~~pf~~<br>~~ee~~<br>~~ee eee~~|-<br>~~pf~~<br>~~ee~~<br>~~eee~~|0.4<br>~~pf~~<br>~~ee~~<br>~~eee~~|V<br>~~pf~~<br>~~ee~~<br>~~eee~~| |TOTP<br>~~a~~<br>~~ee~~|Over temp protection<br>~~ee~~|rotection<br>~~ee~~|-<br>~~ee~~<br>~~ee eee~~|150<br>~~ee~~<br>~~eee~~|-<br>~~ee~~<br>~~eee~~|°C<br>~~ee~~<br>~~eee~~| |OCP<br>~~ee~~|Protection Output<br>Current||3.8|-|5.2|A| 5 Rev.A1 **MUN12AD03-SH** ## **TYPICAL PERFORMANCE CHARACTERISTICS: (1.0VOUT)** Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 42mm× 42mm× 1.6mm, 4 layers, 2oz. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. Cin = 10uF/16V/1206*2, Cout = 47uF/6.3V/0805*2. The following figures are the typical characteristic curves at 1.0Vout. **==> picture [440 x 380] intentionally omitted <==** **----- Start of picture text -----**<br> FIG.3 Efficiency V.S. Load Current FIG.4 De-rating Curve at 12Vin<br>it Tek Stop T MOHAN<br>VOUT VOUT<br>er ora |-feaM I ;_ 1 Pf<br>P| 50.0kS/s @r; 2.00yS 500MS/s @r-<br>10.0mvay fiey34.0800ms 10k points 3.00mV @ 10.0mvvy tiey34.0800ms 10K points -6.20mV<br>Value Mean Min Max Std Dev value Mean Min Max Std Dev<br>Peak-Peak _9.60mV__9.60m 9.60m 9.60m 0.00 Peak-Peak__6.80mV__7.82m 6.00m 9.60m 142m<br>FIG.5 Output Ripple FIG.6 Output Ripple<br>(12Vin, Iout=0A) (12Vin, Iout=3A)<br>cee (ees A Tek Stop cee eee: A<br>VOUT<br>VOUT<br>IOUT PGOOD<br>an Baty ptt od aad PATE SGPT A MAE dy PB BIE ANY<br>EN<br>100ys 10,0MS/s [i wa di : :<br>20.0mv % GY-256,0000)s 10k points 15.2mV : :<br>Value53,6m¥ Mean32,1m Min8.00m Max68.8m Std25.4m Dev @ iv i) 1.00ms 1.00MS/s f<br>27,.2mV 17.0m 2.40m 35.2m 12.0m 5.00V G+¥4,000000ps 10k points 2.00<br>-26.4mV -15.1m -35.2m 800p 13.6m V<br>FIG.7 Transient Response FIG.8 Turn-on<br>(12Vin, 50% to 100% Load Step) (12Vin, Iout=3A)<br>**----- End of picture text -----**<br> 6 Rev.A1 **MUN12AD03-SH** ## **TYPICAL PERFORMANCE CHARACTERISTICS: (1.8VOUT)** Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 42mm× 42mm× 1.6mm, 4 layers, 2oz. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. Cin = 10uF/16V/1206*2, Cout = 47uF/6.3V/0805*2. The following figures are the typical characteristic curves at 1.8Vout. **FIG.9 Efficiency V.S. Load Current FIG.10 De-rating Curve at 12Vin** Tek Stop Tek Stop T —_dJH|_[,T!__!—— **VOUT VOUT** [_7_: foo} 20.0ms 50.0kS/s @r 2.00us 500MS/s @ 10.0mv4 tiey40.0000us 10k points 4.20mV @ 10.0mvs4 tey40.0000us 10k points — value Mean Min Max Std Dev Value Mean Min Max Std Dev @ Peak—-Peak __12.0mV__11.7m **FIG.11 Output Ripple** 10.8m 12.4m 429 @® Peak-Peak__8.00mV__8.54m **FIG.12 Output Ripple** 7.20m 10.4m 701 **(12Vin, Iout=0A) (12Vin, Iout=3A)** Stop ~~A cee~~ eee ~~|~~ Tek Stop ~~A eenseee A~~ **VOUT VOUT IOUT PGOOD EN** 100ys 10,0MS/s [i wa sd : (DZone Dlr 242.00005s tokpoints _——_15.2mV @Peak-Peak Value Mean Min Max Std Dev @ ax —-69.636.8 **m** VV¥ 6634 **.** 73 **m** 64,832.0 **m** 7036 **.** 48 **m 1.** 41 **9m** @ 5.00iwv¥ fy48 tev1.00ms 1.00MS/s f @win -32.8m¥ -32.3m -34.4m -29.6m 1.31m 4 000000) 10k points 2.009 **FIG.13 Transient Response FIG.14 Turn-on (12Vin, 50% to 100% Load Step) (12Vin, Iout=3A)** 7 Rev.A1 **MUN12AD03-SH** ## **TYPICAL PERFORMANCE CHARACTERISTICS: (3.3VOUT)** Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 42mm× 42mm× 1.6mm, 4 layers, 2oz. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. Cin = 10uF/16V/1206*2, Cout = 47uF/6.3V/0805*2. The following figures are the typical characteristic curves at 3.3Vout. **FIG.15 Efficiency V.S. Load Current FIG.16 De-rating Curve at 12Vin** : i : : Tekstop i ~~ee~~ **VOUT VOUT** |Meng, | | PA ~~pT~~ AAA AAAAA ALAA AAA AA A 510.000110.0ms **10** 0KS/sk points __2.40mv@-r (@_ioomvvy 510.2. **0** 0ys00) _15 **0** k0MS/s points___2.40mv@r ~~_19,2im 0.2m 8.8m 0.8m Peak-Peak 6m 4.1m 6m 4.3m 39~~ **FIG.17 Output Ripple FIG.18 Output Ripple (12Vin, Iout=0A) (12Vin, Iout=3A)** ~~ES Ss asA~~ Tek Stop ~~a SeeesA~~ **VOUT VOUT PGOOD IOUT EN** 100s 10.0MS/s D7 oe meee 1 vi @D_ 100A G¥-256.0000s 10k points 44.0miv Value Mean Min Max Std Dey 104m 103m 98.0m 110m 1.68m @ 20v w 1.00ms 1.00MS/s tf 54.0mV¥-50.0mV -49.8m53,6 -54.0m50.0m -46.0m58.0m 1.28m144m 5.00V Gv4.000000)s 10k points 2.00¥ **FIG.19 Transient Response FIG.20 Turn-on (12Vin, 50% to 100% Load Step) (12Vin, Iout=3A)** 8 Rev.A1 **MUN12AD03-SH** ## **TYPICAL PERFORMANCE CHARACTERISTICS: (5.0VOUT)** Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 42mm× 42mm× 1.6mm, 4 layers, 2oz. The output ripple and transient response are measured by short loop probing and limited to 20MHz bandwidth. Cin = 10uF/16V/1206*2, Cout = 47uF/6.3V/0805*2. The following figures are the typical characteristic curves at 5.0Vout. **FIG.21 Efficiency V.S. Load Current FIG.22 De-rating Curve at 12Vin** i Tek Stop _ - i - : **VOUT VOUT** Me aNi ty PLATA AIAN AAT —_iditv0.0000010.0ms 10kT00KS/spoints _4.4omv3 (@_io.omvey div2.00us0.00000s s1 **0** k0MS/s points SOD ~~9.6m 9.6m 9.6m 9.6m 0.00 Peak—Peak 8.4m 9.3m 8.4m 0.4m 640~~ **FIG.23 Output Ripple FIG.24 Output Ripple (12Vin, Iout=0A) (12Vin, Iout=3A)** ~~Sees es ns~~ Tek Stop ~~ES ee es~~ **VOUT VOUT PGOOD IOUT** ; pied + TPR APS Sh ehhh **EN** 100ys 10,0N8/s 7 / reianieahs oe We DTA 2 tie 254.0000ys 10k points 2.08.4 ; Value Mean Min Max Std Dev gL0mY 2.0m 1.0m 3.0m Lim 5.00V G¥4.000000is _10kpoints __2.00V -79.0mV__-79.0m __——-79.0m_——-79.0m ~——_—0.00 **FIG.25 Transient Response FIG.26 Turn-on (12Vin, 50% to 100% Load Step) (12Vin, Iout=3A)** 9 Rev.A1 **MUN12AD03-SH** > **APPLICATIONS INFORMATION:** ~~CT~~ ## **REFERENCE CIRCUIT FOR GENERAL APPLICATION:** Figure 27 show the module application schematics for input voltage +12V. **==> picture [438 x 174] intentionally omitted <==** **----- Start of picture text -----**<br> VBia s<br>EN R PG<br>100k/0402 VP GOOD<br>Enable/Disable control<br>EN P GOOD<br>VIN VOUT<br>VIN Vout<br>u P OL Module<br>RFB_T<br>C IN SS FB S e tting COUT<br>10uF/16V/1206*2 C SS GND Output Volta ge 47uF/6 .3V/0805 *2<br>DNP /0402 RFB_B<br>**----- End of picture text -----**<br> **FIG.27 Reference Circuit for General Application** 10 Rev.A1 **MUN12AD03-SH** ## **APPLICATIONS INFORMATION: (Cont.)** ## **RECOMMENDATION LAYOUT GUIDE:** In order to achieve stable, low losses, less noise or spike, and good thermal performance some layout considerations are necessary. The recommendation layout is shown as Figure 28. 1. The ground connection between pin 5, 10 and 11 should be a solid ground plane under the module. It can be connected one or more ground plane by using several Vias. 2. Place high frequency ceramic capacitors between pin 4 and 9 (VOUT), and pin 5, 10 and 11 (GND) for output side, as close to module as possible to minimize high frequency noise. 3. Keep the RFB_T and RFB_B connection trace to the module pin 2 (FB) short. 4. Use large copper area for power path (VIN, VOUT, and GND) to minimize the conduction loss and enhance heat transferring. Also, use multiple Vias to connect power planes in different layer. **FIG.28 Recommendation Layout** 11 Rev.A1 **MUN12AD03-SH** > **APPLICATIONS INFORMATION: (Cont.)** ~~|~~ ## **SAFETY CONSIDERATIONS:** Certain applications and/or safety agencies may require fuses at the inputs of power conversion components. Fuses should also be used when there is the possibility of sustained input voltage reversal which is not current limited. For greatest safety, we recommend a fast blow fuse installed in the ungrounded input supply line. The installer must observe all relevant safety standards and regulations. For safety agency approvals, install the converter in compliance with the end-user safety standard. ## **INPUT FILTERING:** The module should be connected to a source supply of low AC impedance and high inductance in which line inductance can affect the module stability. An input capacitor must be placed as near as possible to the input pin of the module so to minimize input ripple voltage and ensure module stability. ## **OUTPUT FILTERING:** To reduce output ripple and improve the dynamic response as the step load changes, an additional capacitor at the output must be connected. Low ESR polymer and ceramic capacitors are recommended to improve the output ripple and dynamic response of the module. ## **PROGRAMMING OUTPUT VOLTAGE:** The module has an internal 0.6V ± 1.5% reference voltage. The output voltage can be programmed by the dividing resistor (RFB_T and RFB_B). The output voltage can be calculated by Equation 1, resistor choice may be referred to TABLE 1. **==> picture [311 x 37] intentionally omitted <==** |VOUT (V)|RFB_T(k)|RFB_B(k)| |---|---|---| |1.0|100|150| |1.2|100|100| |1.8|100|50| |3.3|100|22.1| |5.0|100|13.7| **TABLE 1 Resistor values for common output voltages** 12 Rev.A1 **MUN12AD03-SH** > **APPLICATIONS INFORMATION: (Cont.)** ~~Fe~~ ## **THERMAL CONSIDERATIONS:** All of thermal testing condition is complied with JEDEC EIJ/JESD 51 Standards. Therefore, the test board size is 42mm× 42mm× 1.6mm with 4 layers 2oz. The case temperature of module sensing point is shown as Figure 29. Then Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The MUN12AD03-SH power module is designed for using when the case temperature is below 110°C regardless the change of output current, input/output voltage or ambient temperature. **Sensing Point (Defined case temperature)** **Figure 29. Case Temperature Sensing Point** 13 Rev.A1 **MUN12AD03-SH** ## **REFLOW PARAMETERS:** ~~|~~ Lead-free soldering process is a standard of electronic products production. Solder alloys like Sn/Ag, Sn/Ag/Cu and Sn/Ag/Bi are used extensively to replace the traditional Sn/Pb alloy. Sn/Ag/Cu alloy (SAC) is recommended for this power module process. In the SAC alloy series, SAC305 is a very popular solder alloy containing 3% Ag and 0.5% Cu and easy to obtain. Figure 30 shows an example of the reflow profile diagram. Typically, the profile has three stages. During the initial stage from room temperature to 150°C, the ramp rate of temperature should not be more than 3°C/sec. The soak zone then occurs from 150°C to 200°C and should last for 60 to 120 seconds. Finally, keep at over 217°C for 60~150 seconds to melt the solder and make the peak temperature at the range from 255°C to 260°C (Do not exceed 30 sec). It is noted that the time of peak temperature should depend on the mass of the PCB board. The reflow profile is usually supported by the solder vendor and one should adopt it for optimization according to various solder type and various manufacturers’ formulae. **FIG.30 Recommendation Reflow Profile** ## **(Not to scale)** ## ***Refer to the Classification Reflow Profile of J-STD-020.** 14 Rev.A1 **MUN12AD03-SH** > **PACKAGE OUTLINE DRAWING:** ~~a~~ **==> picture [49 x 9] intentionally omitted <==** **----- Start of picture text -----**<br> Unit: mm<br>**----- End of picture text -----**<br> 15 Rev.A1 **MUN12AD03-SH** > **LAND PATTERN REFERENCE:** ~~Ln~~ **==> picture [52 x 9] intentionally omitted <==** **----- Start of picture text -----**<br> Unit: mm<br>**----- End of picture text -----**<br> ## RECOMMENDED LAND PATTERN ## RECOMMENDED STENCIL PATTERN* *Based on 0.1~0.15mm thickness stencil (Reference only) *Recommended solder paste coverage 55~100% 16 Rev.A1 **MUN12AD03-SH** **==> picture [461 x 14] intentionally omitted <==** **----- Start of picture text -----**<br> PACKING REFERENCE: Ce<br>**----- End of picture text -----**<br> |Unit: mm<br>**Package In Tape Loading Orientation**<br>**Tape Dimension**<br>PIN 4<br>Sprocket Hole<br>g<br>3.50<br>=<br>8<br>Unit:mm<br>Do<br>Po<br>2<br>LI<br>|<br>|<br>|<br>090090 00<br>0J9 0 BO<br>Le<br>8} /[|<br>Fl<br>io]<br>[ef<br>*<br>|<br>i<br>pulling direction<br>Ko<br>carrier cavity ||Unit: mm<br>**Package In Tape Loading Orientation**<br>**Tape Dimension**<br>PIN 4<br>Sprocket Hole<br>g<br>3.50<br>=<br>8<br>Unit:mm<br>Do<br>Po<br>2<br>LI<br>|<br>|<br>|<br>090090 00<br>0J9 0 BO<br>Le<br>8} /[|<br>Fl<br>io]<br>[ef<br>*<br>|<br>i<br>pulling direction<br>Ko<br>carrier cavity ||Unit: mm<br>**Package In Tape Loading Orientation**<br>**Tape Dimension**<br>PIN 4<br>Sprocket Hole<br>g<br>3.50<br>=<br>8<br>Unit:mm<br>Do<br>Po<br>2<br>LI<br>|<br>|<br>|<br>090090 00<br>0J9 0 BO<br>Le<br>8} /[|<br>Fl<br>io]<br>[ef<br>*<br>|<br>i<br>pulling direction<br>Ko<br>carrier cavity || |---|---|---| ||A0|3.80±0.10<br>E<br>1.75±0.10| ||B0|3.80±0.10<br>K0<br>1.88±0.10| ||F|5.50±0.05<br>P0<br>4.00±0.10| ||W|12.0±0.30<br>P1<br>8.00±0.10| ||D0|φ1.5 +0.10/-0.00<br>P2<br>2.00±0.05| ||D1|φ1.5±0.10<br>t<br>0.25±0.1| 17 Rev.A1 **MUN12AD03-SH** ## **PACKING REFERENCE: (Cont.)** **==> picture [353 x 184] intentionally omitted <==** **----- Start of picture text -----**<br> Unit: mm<br>Reel Dimension<br>See Detail A ==<br>\<br>| _ | |<br>| -)<br>Detail A<br>Ge =<br>**----- End of picture text -----**<br> ## **Peel Strength of Top Cover Tape** The peel speed shall be about 300mm/min. The peel force of top cover tape shall be between 0.1N to 1.3N 18 Rev.A1 **MUN12AD03-SH** > **REVISION HISTORY:** ~~CT~~ |**Date**|**Revision**|**Changes**| |---|---|---| |2015.09.11|00|Release the preliminary specification.| |2015.11.13|01|Change recommendation reflow profile| |2016.01.12|02|Update POD dimension| |2016.03.30|03|Change PGOOD pin description| |2016.06.28|04|Modify land pattern reference| |2017.03.24|05|Add PGOOD sink current spec| |2022.12.19|06|1. Page 13, add test board information”2oz”.<br>2. Page 14, update reflow parameters and FIG.30.<br>3. Page 16, change the thickness description of stencil. Add note<br>and unit.| |2024.12.16|A1|Synchronized with document management number| 19 Rev.A1
Updated at June 9, 2026
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