MUN123C01-SGB

**MUN123C01-SGB** 

## **uPOL MODULE** 

## **1000mA, High Efficiency uPOL Module** 

## **FEATURES: GENERAL DESCRIPTION:** Ll —oooeo ~~eee~~ ◼ High Density Fully Integration Module The MUN123C01-SGB is non-isolated dc-dc 

The MUN123C01-SGB is non-isolated dc-dc converters. The PWM switching regulator, high frequency power inductor, and most of components are integrated in one hybrid package. 

- 1000mA Output Current 

- Input Voltage Range from 4.5 V to 16 V 

- ◼ Fixed Output Voltage :3.3V 

- 88% Peak Efficiency at 12 VIN to 3.3 VOUT 

- Force PWM mode 

Other features include remote enable function, internal soft-start, non-latching over current protection, and input under voltage locked-out capability. 

- Enable Function 

- Protections (UVLO, OCP: Non-latching) 

- Internal Soft Start 

- Compact Size: 3.9mm*2.6mm*1.7mm 

- Pb-free for RoHS compliant 

- MSL 2, 260C Reflow 

## **APPLICATIONS:** ~~Lo~~ 

- DSL Modem / LCD TV 

The low profile and compact size package (3.9mm × 2.6mm x 1.7mm) is suitable for automated assembly by standard surface mount equipment. The MUN123C01-SGB is Pb-free and RoHS compliance. 

- Portable TV / Access Point Router 

## **TYPICAL APPLICATION CIRCUIT & PACKAGE SIZE:** 

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1.7mm<br>2.6mm<br>3.9mm<br>a, — ae<br>**----- End of picture text -----**<br>


**FIGURE.1 TYPICAL APPLICATION CIRCUIT** 

**FIGURE.2 HIGH DENSITY uPOL MODULE** 

1 

Rev. A1 

**MUN123C01-SGB** 

|**MUN123C01-SGB**<br>Geyntec|**MUN123C01-SGB**<br>Geyntec|**MUN123C01-SGB**<br>Geyntec|**MUN123C01-SGB**<br>Geyntec|**MUN123C01-SGB**<br>Geyntec|**MUN123C01-SGB**<br>Geyntec|
|---|---|---|---|---|---|
|**ORDER INFORMATION:**<br>~~Ct~~||||||
|**Ambient Temp. Range**||**Package**||||
|**Part Number**|||**MSL**||**Note**|
|**(°C)**||**(Pb-Free)**||||
|MUN123C01-SGB<br>-40 ~ +85||DFN|Level 2||-|
|||||||
|**Order Code**||**Packing**|||**Quantity**|
|MUN123C01-SGB||Tape and reel|||1000|



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  PIN CONFIGURATION:  Lt<br>74<br>1  BS  VOUT 6<br>4[|<br>4 4<br>2  GND  VIN  5<br>Lo _ Lo _ 4<br>4 4<br>3  FB  EN  4<br>[| [|<br>TOP VIEW<br>**----- End of picture text -----**<br>


|**Symbol**|**Pin No.**|**Description**|
|---|---|---|
|BS|1|Boot-strap pin. No need connection.|
|GND|2|Power ground pin for signal, input, and output return path. This pin needs to<br>connect to one or moregroundplanes directly.|
|FB|3|Feedback input.|
|EN|4|On/Off control pin for module.|
|VIN|5|Input pin. Decouple this pin to GND pin with 10uF ceramic cap|
|VOUT|6|Power output pin. Connect to output for the load.|



2 

Rev. A1 

**MUN123C01-SGB** 

## **ELECTRICAL SPECIFICATIONS:** 

CAUTION: Do not operate at or near absolute maximum rating listed for extended periods of time. This stress may adversely impact product reliability and result in failures not covered by warranty. 

|**Parameter**<br>~~ee~~|**Description**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|◼<br>Absolute Maximum Ratings<br>~~ee~~<br>~~a~~<br>~~ee~~||||||
|VIN to GND<br>~~ee~~<br>~~ee~~|(Note 3)|-|-|+20|V|
|EN to GND<br>~~ee~~<br>~~ee~~<br>~~ee~~|(Note 1)|-|-|VIN+0.3|V|
|Tc<br>~~ee~~<br>~~ee~~<br>~~ee~~|Case Temperature of Inductor (Note 2)|Case Temperature of Inductor (Note 2)<br>-40|-|+125|°C|
|Tj<br>~~ee~~<br>~~ee~~|Junction Temperature, Main IC(Note 2)|Junction Temperature, Main IC(Note 2)<br>-40|-|+150|°C|
|Tstg<br>~~ee~~<br>~~Ge~~|Storage Temperature<br>~~Ge~~|-40<br>~~Ge~~|-<br>~~Ge~~|+125<br>~~Ge~~|°C<br>~~Ge~~|
|Ta<br>~~ee~~|Ambient Tamperture (Note 2)<br>~~ee~~|-40<br>~~ee~~|-<br>~~ee~~|+105<br>~~ee~~|°C<br>~~ee~~|
|◼<br>Recommendation Operating Ratings<br>~~a~~<br>~~ee~~||||||
|VIN<br>~~ee~~<br>~~ee~~|Input Supply Voltage|+4.5|-|+16|V|
|VOUT<br>~~ee~~<br>~~ee~~|Adjuested Output Voltage|-|3.3|-|V|
|Ta<br>~~ee~~<br>~~a~~<br>~~a~~|Ambient Tamperture<br>|-40<br>|-<br>|+85<br>|°C<br>|
|Tc<br>~~a~~|Case Temperature of Inductor<br>|-40<br>|-<br>|+110<br>|°C<br>|
|Tj<br>~~aes~~|Junction Temperature, Main IC<br>~~es~~|-40<br>~~es~~|-<br>~~es~~|+125<br>~~es~~|°C<br>~~es~~|
|◼<br>Thermal Information<br>~~a~~||||||
|Rth(jchoke-a)|Thermal resistance from junction to<br>ambient. (Note 1)|-|50|-|°C/W|



NOTES: 

1. Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The test board size is 30mm× 30mm× 1.6mm with 4 layers 2oz. The test condition is complied with JEDEC EIJ/JESD 51 Standards. 

2. Only for over stress test, the normal operation condition bases on recommedation operating ratings. Need to consider the thermal de-rating depend on application 

3. Absolute maximum rating of VIN is from IC datasheet, please consider to set de-rating for your application. 

3 

Rev. A1 

**MUN123C01-SGB** 

## **ELECTRICAL SPECIFICATIONS: (Cont.)** ~~nnn~~ 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2oz. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. VIN = 12V, VOUT = 3.3V, Cin =10uF/25V/1210/X7R, Cout = 22uF/10V/1210/X7R. 

|**Symbol**<br>~~fs~~|**Parameter**<br>|**Conditions**<br>|**Min.**<br>|**Typ.**<br>|**Max.**<br>|**Unit**<br>|
|---|---|---|---|---|---|---|
|Switching<br>Frequency<br>~~fs~~||||1.2<br>||MHz<br>|
|◼<br>Input Characteristics<br>~~fsRe~~|||||||
|IQ(IN)|Input supply<br>bias current|VIN = 12V, IOUT = 0A<br>EN = With pull-up 100kΩto VIN<br>VOUT = 3.3V|-<br>~~ee~~|10<br>~~ee~~|-<br>~~ee~~|mA<br>~~ee~~|
|IS(IN)|Input supply<br>current<br>~~ee~~<br>~~ee~~<br>~~ee~~|IOUT = 5mA<br>VOUT = 3.3V<br>~~ee~~|-<br>~~ee~~<br>~~ee~~<br>~~ee~~|11<br>~~ee~~<br>~~ee~~<br>~~eee~~|-<br>~~ee~~<br>~~ee~~<br>~~eee~~|mA<br>~~ee~~<br>~~ee~~<br>~~eee~~|
|||IOUT = 100mA<br>VOUT = 3.3V<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee ~~<br>~~ee~~<br>~~ee~~<br>~~eee~~|37<br>~~ee~~<br> ~~ee ~~<br>~~ee~~<br>~~eee~~<br>~~eee~~|-<br>~~ee~~<br> ~~ee~~<br>~~ee~~<br>~~eee~~<br>~~eee~~|mA<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~eee~~<br>~~eee~~|
|||IOUT = 1000mA<br>VOUT = 3.3V<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee ~~<br>~~ee~~<br>~~eee~~|320<br>~~ee~~<br> ~~eee~~<br>~~ee~~<br>~~eee~~|-<br>~~ee~~<br>~~eee~~<br>~~ee~~<br>~~eee~~|mA<br>~~ee~~<br>~~eee~~<br>~~ee~~<br>~~eee~~|
|◼<br>Output Characteristics<br>~~eee eee~~<br>~~Re~~|||||||
|IOUT(DC)|Output<br>continuous<br>current range|VIN=12V, VOUT=3.3V|0|-|1000|mA|
|VO<br>~~a~~|Fixed Ouput<br>voltage 3.3V<br>~~ee~~|VIN=12V, Ta=25℃,<br>IOUT=10mA<br>~~ee~~|-1.0<br>~~ee~~|-<br>~~ee~~|+1.0<br>~~ee~~|% VO(SET)<br>~~ee~~|
|ΔVOUT<br>/ΔVIN<br>~~a~~|Line regulation<br>accuracy<br>~~ee~~|VIN = 12V to 5V<br>VOUT = 3.3V,IOUT = 1000mA<br>~~ee~~|~~ee~~|0.2<br>~~ee~~|~~ee~~|% VO(SET)<br>~~ee~~|
|ΔVOUT<br>/ΔIOUT<br>~~a~~|Load regulation<br>accuracy<br>~~ee~~|IOUT = 0A to 1000mA<br>VIN = 12 V,VOUT = 3.3V<br>~~ee~~|~~ee ~~|0.5<br> ~~ee ~~|~~ee ~~|% VO(SET)<br> ~~ee~~|
|VOUT(AC)|Output ripple<br>voltage|VIN = 5V, VOUT = 3.3V<br>IOUT = 1000mA||9||mVp-p|
|||VIN = 12V, VOUT = 3.3V<br>IOUT = 1000mA||13||mVp-p|



4 

Rev. A1 

**MUN123C01-SGB** 

## **ELECTRICAL SPECIFICATIONS: (Cont.)** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2oz. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. VIN = 12V, VOUT = 3.3V, Cin =10uF/25V/1210/X7R, Cout = 22uF/10V/1210/X7R. 

|**Symbol**<br>~~a~~|**Parameter**<br>~~ee~~|**Conditions**<br>~~ee~~|**Min.**<br>~~ee~~<br>~~ee~~|**Typ.**<br>~~ee~~|**Max.**<br>~~ee~~|**Unit**<br>~~ee~~|
|---|---|---|---|---|---|---|
|◼<br>Control Characteristics<br>~~a~~<br>~~eeee~~<br>~~ee~~<br>~~ee~~|||||||
|VEN_TH<br>~~ee~~<br>~~pf~~|Rising threshold<br>voltage<br>~~ee~~<br>~~pf~~|~~ee~~<br>~~pf~~|1.5<br>~~ee~~<br>~~pf~~|~~ee~~<br>~~pf~~|~~ee~~<br>~~pf~~|V<br>~~ee~~<br>~~pf~~|
||Falling threshold<br>voltage<br>~~pf~~<br>~~a~~|Falling threshold<br>~~pf~~<br>~~a~~|~~pf~~<br>~~a~~|~~pf~~<br>~~a~~|0.4<br>~~pf~~<br>~~a~~|V<br>~~pf~~<br>~~a~~|
|◼<br>Fault Protection<br>~~a~~|||||||
|VUVLO_TH<br>~~|~~|Input under<br>voltage lockout<br>threshold<br>~~|~~<br>~~||~~|Falling<br>~~|~~<br>~~||~~|-<br>~~|~~<br>~~||~~|~~|~~<br>~~||~~<br>~~ee~~|4.5<br>~~|~~<br>~~||~~|V<br>~~|~~<br>~~||~~|
|TOTP<br>~~a~~|Over temp<br>protection<br>~~ee~~|~~ee~~|-<br>~~ee~~|150<br>~~ee~~<br>~~ee~~|~~ee~~|℃<br>~~ee~~|
|ILIMIT_TH<br>~~ee~~|Current limit<br>threshold<br>~~ee~~|Peak value of inductor current<br>~~ee~~|1.8<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|3.0<br>~~ee~~|A<br>~~ee~~|
|ISCP<br>~~I~~|Short circuit<br>protection|Auto-recovery|-|-|-|-|



5 

Rev. A1 

**MUN123C01-SGB** 

## **TYPICAL PERFORMANCE CHARACTERISTICS:** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2oz. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. Cin =10uF/25V/1210/X7R, Cout = 22uF/10V/1210/X7R. 

The following figures provide the typical characteristic curves at VOUT=3.3V. 

|**FIG.3 EFFICIENCY V.S. LOAD CURRENT**|**FIG.3 EFFICIENCY V.S. LOAD CURRENT**|**FIG.3 EFFICIENCY V.S. LOAD CURRENT**|**FIG.3 EFFICIENCY V.S. LOAD CURRENT**|**FIG.3 EFFICIENCY V.S. LOAD CURRENT**|**FIG.3 EFFICIENCY V.S. LOAD CURRENT**|**FIG.3 EFFICIENCY V.S. LOAD CURRENT**|**FIG.4 DE-RATING CURVE AT VIN=12V**|
|---|---|---|---|---|---|---|---|
|0.60||||||||
|0.40||||||||
|0.20||||||||
|0.00||||||||
|0.20||||||||
|-0.40||||||||
|0.60||||||||
|-0.80||||||||
|-1.00||||||||
|-40|-20|0|20|40|60|80||
||||Temperature|("C)||||
||**FIG.5 VOUT vs Temperature**|**FIG.5 VOUT vs Temperature**|||**FIG.5 VOUT vs Temperature**|||
||**(VIN=12V, IOUT=0 A)**|||||||



6 

Rev. A1 

**MUN123C01-SGB** 

## **TYPICAL PERFORMANCE CHARACTERISTICS:** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2oz. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. Cin =10uF/25V/1210/X7R, Cout = 22uF/10V/1210/X7R. 

The following figures provide the typical characteristic curves at VOUT=3.3V. 

**FIG.5 OUTPUT RIPPLE FIG.6 OUTPUT RIPPLE (VIN=12V, IOUT=0 A) (VIN=12V, IOUT=1 A)** Tiga u Tek Stop ~~ee~~ ee Vy a Tf Ops rr 500mA50.0mvvs8 +7ToOus 226.600us 10.0MS/s10k points @®860mAF |\19Apr16:35:492018) = Seth sabis. **FIG.7 TRANSIENT RESPONSE FIG.8 TURN-ON (VIN=12V, 0.5A to 1A LOAD STEP) (VIN=12V, IOUT=1 A)** 

7 

Rev. A1 

**MUN123C01-SGB** 

## **TYPICAL PERFORMANCE CHARACTERISTICS:** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2oz. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. Cin =10uF/25V/1210/X7R, Cout = 22uF/10V/1210/X7R. 

The following figures provide the typical characteristic curves at VOUT=3.3V. 

**==> picture [346 x 178] intentionally omitted <==**

**----- Start of picture text -----**<br>
FIG.9 OUTPUT RIPPLE  FIG.10 OUTPUT RIPPLE<br>(VIN=5V, IOUT=0 A) (VIN=5V, IOUT=1 A)<br>I rig<br>u Tek Sto Ee<br>fh<br>| \<br>&<br>{<br>Tf<br>50.0mvs5300mAoF Gy226.600usT0Ous 10k10.0MS/spoints @®860mAJ  | 16:36:24\19Apr 2018) er ape poetks<br>FIG.11 TRANSIENT RESPONSE  FIG.12 TURN-ON<br>(VIN=5V, 0.5A to 1A LOAD STEP) (VIN=5V, IOUT=1 A)<br>**----- End of picture text -----**<br>


8 

Rev. A1 

**MUN123C01-SGB** 

## **TYPICAL PERFORMANCE CHARACTERISTICS:** 

Conditions: TA = 25 ºC, unless otherwise specified. Test Board Information: 30mm× 30mm× 1.6mm, 4 layers 2oz. The output ripple and transient response measurement is short loop probing and 20MegHz bandwidth limited. Cin =10uF/25V/1210/X7R, Cout = 22uF/10V/1210/X7R. 

The following figures provide the typical characteristic curves at VOUT=3.3V. 

|**FIG.13 OUTPUT RIPPLE**||**FIG.14 OUTPUT RIPPLE**|
|---|---|---|
|**(VIN=15V, IOUT=0 A)**<br> hun<br>it<br>gd|Tek Stop|**(VIN=15V, IOUT=1 A)**<br>~~———~~|
|u<br>{|||
|t<br>\<br>B<br>1<br>“|||
|\<br>t|||
|{||VouT|
|1<br>T<br>‘|||
|A<br>500mA 0%<br>|100s<br>10.0MS/s =@ JF \19 Apr 2018)<br>@ 50.0mves<br>UY226.600us<br>10k points<br>860mA) 16:36:40|A|ur<br>100k points|
|**FIG.15 TRANSIENT RESPONSE**||**FIG.16 TURN-ON**|
|**(VIN=15V, 0.5A to 1A LOAD STEP)**||**(VIN=15V, IOUT=1 A)**|



9 

Rev. A1 

**MUN123C01-SGB** 

## **APPLICATIONS INFORMATION:** 

## **SAFETY CONSIDERATIONS:** 

Certain applications and/or safety agencies may require fuses at the inputs of power conversion components. Fuses should also be used when there is the possibility of sustained input voltage reversal which is not current limited. For greatest safety, we recommend a fast blow fuse installed in the ungrounded input supply line. The installer must observe all relevant safety standards and regulations. For safety agency approvals, install the converter in compliance with the end-user safety standard. 

## **INPUT FILTERING:** 

The module should be connected source with low AC impedance source supply and a highly inductive in which line inductance can affect the stability of the module. It need to place an input capacitance directly to the input pin of the module, to minimize input ripple voltage and ensure module stability. 

## **OUTPUT FILTERING:** 

To reduce output ripple and improve the dynamic response as step load changes. It is need the additional capacitor. Low ESR polymer and ceramic capacitors are recommended to improve the output ripple and dynamic response of the module. 

10 

Rev. A1 

**MUN123C01-SGB** 

> **APPLICATIONS INFORMATION: (Cont.)** ~~Lo~~ 

## **LOAD TRANSIENT CONSIDERATIONS:** 

The MUN123C01-SGB integrates the compensation components to achieve good stability and fast transient responses. In some applications, adding a 100pF ceramic cap between VOUT and FB may further speed up the load transient responses and is thus recommended for applications with large load transient step requirements. 

**FIG.17 TRANSIENT RESPONSES APPLICATION** 

## **REFERENCE CIRCUIT FOR GENERAL APPLICATION:** 

Figure 18 shows the module application schematics for input voltage +12V and turn on by input voltage directly through enable resistor (R1). 

## **FIG.18 REFERENCE CIRCUIT FOR GENERAL APPLICATION** 

11 

Rev. A1 

**MUN123C01-SGB** 

## **APPLICATIONS INFORMATION: (Cont.)** 

## **RECOMMEND PCB LAYOUT:** 

Figure 19 shows recommendation PCB layout for using uPOL module, 

- ➢ C3/C4 are bypass filter for high frequency noise. 

- ➢ Design paths of main current wide and short as Make the traces of the main current paths as short and wide as possible. 

- ➢ Place the input/out capacitor as close as possible to the uPOL module pins. 

- ➢ Ensure all feedback network connections are short and direct. 

- ➢ The GND pin and should be connected to a strong ground plane for heat dissipating. 

**FIG.19 PCB LAYOUT** 

12 

Rev. A1 

**MUN123C01-SGB** 

## **APPLICATIONS INFORMATION: (Cont.)** 

## **Thermal Considerations:** 

All of thermal testing condition is complied with JEDEC EIJ/JESD 51 Standards. Therefore, the test board size is 30mm× 30mm× 1.6mm with 4 layers 2oz. The case temperature of module sensing point is shown as Figure 20. Then Rth(jchoke-a) is measured with the component mounted on an effective thermal conductivity test board on 0 LFM condition. The MUN123C01-SGB module is designed for using when the case temperature is below 125°C regardless the change of output current, input/output voltage or ambient temperature. 

Sensing point (Defined case temperature) 

**FIG 20. Case Temperature Sensing Point** 

13 

Rev. A1 

**MUN123C01-SGB** 

## **REFLOW PARAMETERS:** 

Lead-free soldering process is a standard of electronic products production. Solder alloys like Sn/Ag, Sn/Ag/Cu and Sn/Ag/Bi are used extensively to replace the traditional Sn/Pb alloy. Sn/Ag/Cu alloy (SAC) is recommended for this power module process. In the SAC alloy series, SAC305 is a very popular solder alloy containing 3% Ag and 0.5% Cu and easy to obtain. Figure 21 shows an example of the reflow profile diagram. Typically, the profile has three stages. During the initial stage from room temperature to 150°C, the ramp rate of temperature should not be more than 3°C/sec. The soak zone then occurs from 150°C to 200°C and should last for 60 to 120 seconds. Finally, keep at over 217°C for 60~150 seconds to melt the solder and make the peak temperature at the range from 255°C to 260°C (Do not exceed 30 sec). It is noted that the time of peak temperature should depend on the mass of the PCB board. The reflow profile is usually supported by the solder vendor and one should adopt it for optimization according to various solder type and various manufacturers’ formulae. 

## **FIG.21 Recommendation Reflow Profile** 

## **(Not to scale)** 

*Refer to the Classification Reflow Profile of J-STD-020. 

14 

Rev. A1 

**MUN123C01-SGB** 

## **PACKAGE OUTLINE DRAW:** 

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Unit:mm<br>**----- End of picture text -----**<br>


15 

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**MUN123C01-SGB** 

**LAND PATTERN REFERENCE:** 

RECOMMENDED LAND PATTERN 2.65 = 0.95 Ko t i P= 7 ae RECOMMENDED STENCIL PATTERN *Based on 0.1~0.15mm thickness stencil (Reference only) *Recommended solder paste coverage 55~100% 

16 

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**MUN123C01-SGB** 

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  PACKING REFERENCE:<br>DC<br>**----- End of picture text -----**<br>


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Package In Tape Loading Orientation<br>Sprocket Hole Pini<br>yg<br>| | 2.60<br>Tape Dimension<br>Pa P? nT<br>:<br>CO OO 0 0 © S<br>lal tl bl<br>i<br>| D1 pulling direction<br>A0  2.9 ±  0.10  E  1.75  ±  0.10<br>B0  4.2  ±  0.10  K0  1.88  ±  0.10<br>F  5.50  ±  0.05  P0  4.00  ±  0.10<br>W  12.00 ±0.30  P1  8.00  ±  0.10<br>D0  φ1.55 ±0.05  P2  2.00  ±  0.05<br>D1  φ1.50 ±  0.10  t  0.25  ±  0.10<br>**----- End of picture text -----**<br>


17 

Rev. A1 

**MUN123C01-SGB** 

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**----- Start of picture text -----**<br>
  PACKING REFERENCE: (Cont.)<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Unit: mm<br>Reel Dimension<br>See Detail A  TeO \<br>[ 7 \<br>\ 7<br>| | 5<br>Detail A<br>aa :<br>TOP COVER TAPE<br>.<br>N\ ME<br>; eo<br>oea n a eeVs<br>Peel Strength of Top Cover Tape<br>The peel speed shall be about 300mm/min.  é/ foeNo<br>The peel force of top cover tape is between 0.1N to 1.3N<br>**----- End of picture text -----**<br>


18 

Rev. A1 

**MUN123C01-SGB** 

> **REVISION HISTORY:** ~~Ct~~ 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|2018.08.03|P00|Release the preliminary spec|
|2018.10.24|P01|Modify the AMR ambient temperature|
|2019.1.09|P02|Modify the AMR data|
|2019.03.08|P03|Modify the Package Outline|
|2019.05.28|P04|Add SCP description|
|2022.12.23|P05|1.<br>Page 13, add information”2oz”. Correct the case<br>temperature to 125°C.<br>2.<br>Page 14, update reflow parameters and FIG.21.<br>3.<br>Page 16, change the thickness description of stencil. Add<br>note.|
|2024.12.16|A1|Synchronized with document management number|



19 

Rev. A1