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FF300R08W2P2B11ABOMA1
IGBT Module, Half Bridge, 200 A, 1 V, 150 °C, Module
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- Manufacturer: INFINEON
- Product type: IGBT Modules
- SVHC: No SVHC (27-Jun-2018)
- Product Range: EasyPack Series
- IGBT Technology: IGBT EDT2
- IGBT Termination: Press Fit
- Power Dissipation: -
- IGBT Configuration: Half Bridge
- Transistor Mounting: Panel
- DC Collector Current: 200A
- Power Dissipation Pd: -
- Transistor Case Style: Module
- Operating Temperature Max: 150°C
- Junction Temperature Tj Max: 150°C
- Continuous Collector Current: 200A
- Collector Emitter Voltage Max: 750V
- Collector Emitter Voltage V(br)ceo: 750V
- Collector Emitter Saturation Voltage: 1V
- Collector Emitter Saturation Voltage Vce(on): 1V
| Delivery and price | |
|---|---|
| Units per pack | 5 |
| Price | 37.91 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
**FF300R08W2P2_B11A EasyPACK[™] module** ## **EasyPACK[™] module with EDT2 IGBT and diode and PressFIT / NTC** ## **Features** - Electrical features - Blocking voltage 750 V - Low V CE,sat - Low switching losses - Low Qg and Crss - Low inductive design - T = 150°C vj,op - Mechanical features - 4.2 kV DC 1 second insulation - High creepage and clearance distances - High power density - Integrated NTC temperature sensor - PressFIT contact technology - RoHS compliant - UL 94 V0 module frame ## **Potential applications** - Automotive applications - (Hybrid) electrical vehicles (H)EV - Motor drives ## **Product validation** - Qualified according to AQG 324 ## **Description** The FF300R08W2P2_B11A is a very compact and flexible product offering integrated isolation for the main inverter of hybrid and electric vehicles. The module uses the benchmark EDT2 IGBT generation allowing 750V blocking voltage and IcN of 300A.The chipset has benchmark current density combined with short circuit ruggedness for reliable inverter operation under harsh environmental conditions. The EDT2 IGBTs also show excellent light load power losses, which helps to improve system efficiency over a real driving cycle. The EDT2 IGBT was optimized for applications with switching frequencies in the range of 10 kHz.The EasyPACK[TM] package is qualified for automotive applications and is validated according to AQG 324. Its high power cycling capability as well as the high creepage and clearance distances add to the product reliability. The power module comes with PressFIT Pins for the signal terminals to avoid additional time consuming selective solder processes, which provides cost savings on system level and increases system reliability. |**Type**<br>—|**Package**|**Marking**| |---|---|---| |FF300R08W2P2_B11A<br>—|EasyPACK™2B Module|SP005424885| Please read the Important Notice and Warnings at the end of this document Datasheet **www.infineon.com** Revision 1.01 2021-09-13 **FF300R08W2P2_B11A EasyPACK[™] module** **==> picture [105 x 47] intentionally omitted <==** ## **Table of contents** ## **Table of contents** ||**Description**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1| |---|---| ||**Features**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1| ||**Potential applications**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1| ||**Product validation**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1| ||**Table of contents**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2| |**1**|**Package**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3| |**2**|**IGBT, Inverter**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3| |**3**|**Diode, Inverter**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5| |**4**|**NTC-Thermistor**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6| |**5**|**Characteristics diagrams**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7| |**6**|**Circuit diagram**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10| |**7**|**Package outlines**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11| |**8**|**Module label code**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12| ||**Revision history**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13| ||**Disclaimer**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14| Datasheet Revision 1.01 2021-09-13 2 **FF300R08W2P2_B11A EasyPACK[™] module** **==> picture [105 x 47] intentionally omitted <==** ## **1 Package** ## **1 Package** |**1**<br>**Package**|**1**<br>**Package**|**1**<br>**Package**|**1**<br>**Package**|**1**<br>**Package**| |---|---|---|---|---| |**Table 1**<br>**Maximum rated values**||||| |**Parameter**|**Symbol**|**Note or test condition**|**Values**|**Unit**| |Maximum RMS module DC-<br>terminal current**_1)_**|_I_t,rms|_T_terminal= 105 °C,_T_c= 65 °C|25|A| _1)_ ItRMS: Current per pin, continous, steady state. Verified by characterization / design not by test |**Table 2**<br>**Insulation coordination**|**Table 2**<br>**Insulation coordination**|**Table 2**<br>**Insulation coordination**|**Table 2**<br>**Insulation coordination**|**Table 2**<br>**Insulation coordination**| |---|---|---|---|---| |**Parameter**|**Symbol**|**Note or test condition**|**Values**|**Unit**| |Isolation test voltage|_V_ISOL||4.2|kV| |Internal isolation||basic insulation (class 1, IEC 61140)|Al2O3|| |Creepage distance|_d_creep|terminal to heatsink|11.5|mm| |Creepage distance|_d_creep|terminal to terminal|6.3|mm| |Clearance|_d_clear|terminal to heatsink|10.0|mm| |Clearance|_d_clear|terminal to terminal|5.0|mm| |Comparative tracking index|_CTI_||> 200|| |**Table 3**<br>**Characteristic values**|**Table 3**<br>**Characteristic values**|**Table 3**<br>**Characteristic values**||||| |---|---|---|---|---|---|---| |**Parameter**|**Symbol**|**Note or test condition**|**Values**|||**Unit**| ||||**Min.**|**Typ.**|**Max.**|| |Stray inductance module|_L_s,CE|||8.0||nH| |Module lead resistance,<br>terminals - chip|_R_CC'+EE'|T = 25°C, per switch||4.00||mΩ| |Storage temperature|_T_stg||-40||125|°C| |Weight|_G_|||41||g| ## **2 IGBT, Inverter** **Table 4 Maximum rated values** |**Parameter**|**Symbol**|**Note or test condition**|**Note or test condition**|**Values**|**Unit**| |---|---|---|---|---|---| |Collector-emitter voltage|_V_CES||_T_vj= 25 °C|750|V| |Implemented collector<br>current|_I_CN|||300|A| |Continuous DC collector<br>current|_I_C,nom|_T_vj,max= 150 °C|_T_h= 65 °C|200|A| |Repetitive peak collector<br>current|_I_CRM|_t_P= 1 ms||600|A| |Gate-emitter peak voltage|_V_GES|||±20|V| Datasheet Revision 1.01 2021-09-13 3 **FF300R08W2P2_B11A EasyPACK[™] module** **==> picture [105 x 47] intentionally omitted <==** ## **2 IGBT, Inverter** |**Table 5**<br>**Characteristic values**|**Table 5**<br>**Characteristic values**|**Table 5**<br>**Characteristic values**|||||| |---|---|---|---|---|---|---|---| |**Parameter**|**Symbol**|**Note or test condition**||**Values**|||**Unit**| |||||**Min.**|**Typ.**|**Max.**|| |Collector-emitter saturation<br>voltage|_V_CE,sat|_I_C= 200 A,_V_GE= 15 V|_T_vj= 25 °C||1.00|1.18|V| ||||_T_vj= 125 °C||0.99||| ||||_T_vj= 150 °C||0.98||| |Gate threshold voltage|_V_GE,th|_I_C= 6.4 mA, VCE= VGE|_T_vj= 25 °C|4.9|5.8|6.5|V| |Gate charge|_Q_G|_V_GE= 15 V,_V_CE= 400 V|||2.9||µC| |Internal gate resistor|_R_G,int||_T_vj= 25 °C||1.1||Ω| |Input capacitance|_C_ies|_f_= 1 MHz,_V_CE= 50 V,<br>_V_GE= 0 V|_T_vj= 25 °C||53.0||nF| |Output capacitance|_C_oes|_f_= 1 MHz,_V_CE= 50 V,<br>_V_GE= 0 V|_T_vj= 25 °C||0.7||nF| |Reverse transfer capacitance|_C_res|_f_= 1 MHz,_V_CE= 50 V,<br>_V_GE= 0 V|_T_vj= 25 °C||0.20||nF| |Collector-emitter cut-of<br>current|_I_CES|_V_CE= 750 V,_V_GE= 0 V|_T_vj= 25 °C|||1.0|mA| |Gate-emitter leakage current|_I_GES|_V_GE= 0 V|_T_vj= 25 °C|||10|nA| |Turn-on delay time,<br>inductive load|_t_d,on|_I_C= 200 A,_V_CE= 400 V,<br>_V_GE= 15 V,_R_G,on= 2.4 Ω|_T_vj= 25 °C||0.21||µs| ||||_T_vj= 125 °C||0.23||| ||||_T_vj= 150 °C||0.24||| |Rise time, inductive load|_t_r|_I_C= 200 A,_V_CE= 400 V,<br>_V_GE= 15 V,_R_G,on= 2.4 Ω|_T_vj= 25 °C||0.03||µs| ||||_T_vj= 125 °C||0.04||| ||||_T_vj= 150 °C||0.04||| |Turn-of delay time,<br>inductive load|_t_d,of|_I_C= 200 A,_V_CE= 400 V,<br>_V_GE= 15 V,_R_G,of= 5.1 Ω|_T_vj= 25 °C||0.70||µs| ||||_T_vj= 125 °C||0.80||| ||||_T_vj= 150 °C||0.80||| |Fall time, inductive load|_t_f|_I_C= 200 A,_V_CE= 400 V,<br>_V_GE= 15 V,_R_G,of= 5.1 Ω|_T_vj= 25 °C||0.06||µs| ||||_T_vj= 125 °C||0.10||| ||||_T_vj= 150 °C||0.10||| |Turn-on energy loss per<br>pulse|_E_on|_I_C= 200 A,_V_CE= 400 V,<br>_L_σ= 20 nH,_V_GE= 15 V,<br>_R_G,on= 2.4 Ω|_T_vj= 25 °C||4.4||mJ| ||||_T_vj= 125 °C||7.0||| ||||_T_vj= 150 °C,<br>_di/dt_= 6360 A/µs||7.6||| |Turn-of energy loss per<br>pulse|_E_of|_I_C= 200 A,_V_CE= 400 V,<br>_L_σ= 20 nH,_V_GE= 15 V,<br>_R_G,of= 5.1 Ω|_T_vj= 25 °C||7.3||mJ| ||||_T_vj= 125 °C||10.7||| ||||_T_vj= 150 °C,<br>_du/dt_= 2530 V/µs||11.5||| Datasheet Revision 1.01 2021-09-13 4 **FF300R08W2P2_B11A EasyPACK[™] module** **==> picture [105 x 47] intentionally omitted <==** ## **3 Diode, Inverter** ## **Characteristic values (continued)** ||||||||| |---|---|---|---|---|---|---|---| |**Table 5**<br>**Characteristic values (continued)**|||||||| |**Parameter**|**Symbol**|**Note or test condition**||**Values**|||**Unit**| |||||**Min.**|**Typ.**|**Max.**|| |SC data|_I_SC|_V_CC= 400 V,_V_GE= 15 V|_t_P≤ 6.0 µs,<br>_T_vj= 25 °C||3800||A| ||||_t_P≤ 4.0 µs,<br>_T_vj= 150 °C||3000||| |Thermal resistance, junction<br>to case|_R_th,j-c|per IGBT|||0.09||K/W| |Thermal resistance, junction<br>to heatsink|_R_th,j-h|per IGBT,λpaste= 3 W /(m*K) /λgrease= 3 W/<br>(m*K)|||0.25||K/W| |Temperature under<br>switching conditions|_T_vj,op|||-40||150|°C| ## **3 Diode, Inverter** |**3**<br>**Diode, Inverter**|**3**<br>**Diode, Inverter**|**3**<br>**Diode, Inverter**|||| |---|---|---|---|---|---| |**Table 6**<br>**Maximum rated values**|||||| |**Parameter**|**Symbol**|**Note or test condition**||**Values**|**Unit**| |Repetitive peak reverse<br>voltage|_V_RRM||_T_vj= 25 °C|750|V| |Implemented forward<br>current|_I_FN|||300|A| |Continuous DC forward<br>current|_I_F,nom|||200|A| |Repetitive peak forward<br>current|_I_FRM|_t_P= 1 ms||600|A| |I2t - value|_I_2_t_|_V_R= 400 V,_t_P= 50 ms|_T_vj= 125 °C|15770|A²s| ||||_T_vj= 150 °C|13180|| |**Table 7**<br>**Characteristic values**|**Table 7**<br>**Characteristic values**|**Table 7**<br>**Characteristic values**|||||| |---|---|---|---|---|---|---|---| |**Parameter**|**Symbol**|**Note or test condition**||**Values**|||**Unit**| |||||**Min.**|**Typ.**|**Max.**|| |Forward voltage|_V_F|_I_F= 200 A|_T_vj= 25 °C||1.30|1.47|V| ||||_T_vj= 125 °C||1.20||| ||||_T_vj= 150 °C||1.15||| |Peak reverse recovery<br>current|_I_rm|_I_F= 200 A,_V_CE= 400 V,<br>_V_GE= -8 V|_T_vj= 25 °C||200||A| ||||_T_vj= 125 °C||294||| ||||_T_vj= 150 °C,<br>_-di_F_/dt_= 7250 A/µs||321||| Datasheet Revision 1.01 2021-09-13 5 **FF300R08W2P2_B11A EasyPACK[™] module** **==> picture [105 x 47] intentionally omitted <==** ## **4 NTC-Thermistor** |**Table 7**<br>**Characteristic values (continued)**|**Table 7**<br>**Characteristic values (continued)**|**Table 7**<br>**Characteristic values (continued)**|||||| |---|---|---|---|---|---|---|---| |**Parameter**|**Symbol**|**Note or test condition**||**Values**|||**Unit**| |||||**Min.**|**Typ.**|**Max.**|| |Recovered charge|_Q_r|_I_F= 200 A,_V_CE= 400 V,<br>_V_GE= -8 V|_T_vj= 25 °C||11.0||µC| ||||_T_vj= 125 °C||24.0||| ||||_T_vj= 150 °C,<br>_-di_F_/dt_= 7250 A/µs||29.0||| |Reverse recovery energy|_E_rec|_I_F= 200 A,_V_CE= 400 V,<br>_V_GE= -8 V,_R_G= 2.4 Ω|_T_vj= 25 °C||3.34||mJ| ||||_T_vj= 125 °C||7.02||| ||||_T_vj= 150 °C,<br>_-di_F_/dt_= 7250 A/µs||8.51||| |Thermal resistance, junction<br>to case|_R_th,j-c|per diode|||0.17||K/W| |Thermal resistance, junction<br>to heatsink|_R_th,j-h|per diode,λpaste= 3 W /(m*K) /λgrease= 3 W/<br>(m*K)|||0.36||K/W| |Temperature under<br>switching conditions|_T_vj,op|||-40||150|°C| ## **4 NTC-Thermistor** |**4**<br>**NTC-Thermistor**|**4**<br>**NTC-Thermistor**|**4**<br>**NTC-Thermistor**||||| |---|---|---|---|---|---|---| |**Table 8**<br>**Characteristic values**||||||| |**Parameter**|**Symbol**|**Note or test condition**|**Values**|||**Unit**| ||||**Min.**|**Typ.**|**Max.**|| |Rated resistance|_R_25|_T_NTC= 25 °C||5||kΩ| |Deviation of R100|_ΔR/R_|_T_NTC= 100 °C,_R_100= 493 Ω|-5||5|%| |Power dissipation|_P_25|_T_NTC= 25 °C|||20|mW| |B-value|_B_25/50|R2= R25exp[B25/50(1/T2-1/(298,15 K))]||3375||K| |B-value|_B_25/80|R2= R25exp[B25/80(1/T2-1/(298,15 K))]||3433||K| |B-value|_B_25/100|R2= R25exp[B25/100(1/T2-1/(298,15 K))]||3411||K| Datasheet Revision 1.01 2021-09-13 6 **FF300R08W2P2_B11A EasyPACK[™] module** **5 Characteristics diagrams** **==> picture [105 x 47] intentionally omitted <==** ## **5 Characteristics diagrams** ## **output characteristic (typical), IGBT, Inverter** IC = f(VCE) VGE = -8 V / +15 V **output characteristic (typical), IGBT, Inverter** IC = f(VCE) T = 25 °C vj **==> picture [539 x 311] intentionally omitted <==** **----- Start of picture text -----**<br> 600 600<br>550 550<br>500 500<br>450 450<br>400 400<br>350 350<br>300 300<br>250 250<br>200 200<br>150 150<br>100 100<br>50 50<br>0 0<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 0.4 0.8 1.2 1.6 2.0<br>transfer characteristic (typical), IGBT, Inverter switching losses (typical), IGBT, Inverter<br>IC = f(VGE) E = f(IC)<br>VCE = 20 V RG,off = 5.1 Ω, RG,on = 2.4 Ω, VCE = 400 V, VGE = -8 V / +15 V<br>**----- End of picture text -----**<br> **==> picture [539 x 262] intentionally omitted <==** **----- Start of picture text -----**<br> 600 25<br>525<br>20<br>450<br>375<br>15<br>300<br>10<br>225<br>150<br>5<br>75<br>0 0<br>5 6 7 8 9 10 11 0 50 100 150 200 250 300 350 400<br>**----- End of picture text -----**<br> Datasheet Revision 1.01 2021-09-13 7 **FF300R08W2P2_B11A EasyPACK[™] module** **==> picture [105 x 47] intentionally omitted <==** ## **5 Characteristics diagrams** ## **Switching losses (typical), IGBT, Inverter** ## E = f(RG) ## **transient thermal impedance , IGBT, Inverter** Zth = f(t) VCE = 400 V, VGE = -8 V / +15 V, IC = 200 A **==> picture [228 x 253] intentionally omitted <==** **----- Start of picture text -----**<br> 32<br>28<br>24<br>20<br>16<br>12<br>8<br>4<br>0<br>0 2 4 6 8 10 12 14 16 18 20<br>**----- End of picture text -----**<br> ## **Reverse bias safe operating area (RBSOA), IGBT, Inverter** **==> picture [229 x 253] intentionally omitted <==** **----- Start of picture text -----**<br> 1<br>0.1<br>0.01<br>0.001<br>0.001 0.01 0.1 1 10<br>**----- End of picture text -----**<br> **forward characteristic of (typical), Diode, Inverter** IF = f(VF) ## IC = f(VCE) Tvj = 150 °C, RG,off = 5.1 Ω, VGE = -8 V / +15 V **==> picture [539 x 262] intentionally omitted <==** **----- Start of picture text -----**<br> 650 600<br>600<br>550 500<br>500<br>450<br>400<br>400<br>350<br>300<br>300<br>250<br>200<br>200<br>150<br>100 100<br>50<br>0 0<br>400 450 500 550 600 650 700 750 800 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8<br>**----- End of picture text -----**<br> Datasheet Revision 1.01 2021-09-13 8 **FF300R08W2P2_B11A EasyPACK[™] module** **==> picture [105 x 47] intentionally omitted <==** ## **5 Characteristics diagrams** ## **switching losses (typical), Diode, Inverter** Erec = f(IF) RGon = RGon(IGBT) , VCE = 400 V **==> picture [228 x 253] intentionally omitted <==** **----- Start of picture text -----**<br> 16<br>14<br>12<br>10<br>8<br>6<br>4<br>2<br>0<br>0 100 200 300 400<br>**----- End of picture text -----**<br> **transient thermal impedance , Diode, Inverter** Zth = f(t) **==> picture [228 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 1<br>0.1<br>0.01<br>0.001<br>0.001 0.01 0.1 1 10<br>**----- End of picture text -----**<br> ## **Switching losses (typical), Diode, Inverter** Erec = f(RG) VCE = 400 V, IF = 200 A **==> picture [229 x 253] intentionally omitted <==** **----- Start of picture text -----**<br> 12<br>11<br>10<br>9<br>8<br>7<br>6<br>5<br>4<br>3<br>2<br>1<br>0 2 4 6 8 10 12 14 16 18 20<br>**----- End of picture text -----**<br> **temperature characteristic (typical), NTC-Thermistor** R = f(TNTC) **==> picture [229 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 100000<br>10000<br>1000<br>100<br>0 20 40 60 80 100 120 140 160<br>**----- End of picture text -----**<br> Datasheet Revision 1.01 2021-09-13 9 **FF300R08W2P2_B11A EasyPACK[™] module** ## **6 Circuit diagram** **==> picture [167 x 14] intentionally omitted <==** **----- Start of picture text -----**<br> 6 Circuit diagram<br>**----- End of picture text -----**<br> **==> picture [166 x 225] intentionally omitted <==** **----- Start of picture text -----**<br> 1 C1<br>G1 7<br>E1<br>3<br>T1<br>G2 4}<br>E2<br>T2<br>2<br>**----- End of picture text -----**<br> **Figure 2** Datasheet Revision 1.01 2021-09-13 10 **FF300R08W2P2_B11A EasyPACK[™] module** **7 Package outlines** **7** **==> picture [105 x 47] intentionally omitted <==** ## **Package outlines** **==> picture [227 x 132] intentionally omitted <==** **----- Start of picture text -----**<br> Infineon GYYWW<br>FxxxRxxW2 xx EasyPIM TM 0001<br>- Pin-Grid 3,2mm<br>- Tolerance of PCB hole pattern � 0,1<br>- Hole specification for contacts see AN 2009-01<br>- Diameters of drill �1,15mm and copper thickness in hole 25-50�m<br>0,5 0,2<br> � � 0,35<br>16,4 1,4 �<br>12<br>**----- End of picture text -----**<br> **==> picture [514 x 341] intentionally omitted <==** **----- Start of picture text -----**<br> 51 � 0,15 - Tolerance of PCB hole pattern � 0,1<br>- Hole specification for contacts see AN 2009-01<br>- Diameters of drill �1,15mm and copper thickness in hole 25-50�m<br>PCB hole pattern<br>26,5<br>21,25<br>1 16<br>C1 12,8<br>E1 G1 9,6<br>6,4<br>3,2<br>0<br>3<br>� 2,3 � 0,1 x8,5+0,3 2 3,2<br>4,5 � 0,1 6,4<br>2216,,74 � � 00,,32 T1 T2 G2 E2 1 9,612,816<br>56,7 � 0,3<br>21,25<br>26,5<br>4x � 2,8<br>2x � 9 according to screw head / washer<br>Drawing: W00175000<br>ISO 8015 principle of independency edges general tolerances surface<br>dimensions ISO 14405 GG<br>target geometry according CAD file DIN ISO 1. DIN 16742-TG6 DIN EN ISO<br>with general tolerances 1 method of least-squares 13715 2. DIN ISO 2768-mk 1302<br>All dimensions refer to module in delivery condition<br>25,5 24 20,8 17,6 8 1,6 0 1,6 8 11,2 20,8 24 25,5<br>0,15 0,3 0,5<br> � � (53) �<br>42,5 48 62,8<br>**----- End of picture text -----**<br> ## **Figure 3** Datasheet Revision 1.01 2021-09-13 11 **FF300R08W2P2_B11A EasyPACK[™] module** **==> picture [105 x 47] intentionally omitted <==** ## **8 Module label code** ## **8 Module label code** |**Module label code**|**Module label code**|**Module label code**|**Module label code**|**Module label code**|**Module label code**| |---|---|---|---|---|---| |Code format|Data Matrix||Barcode Code128||| |Encoding|ASCII text||Code Set A||| |Symbol size|16x16||23 digits||| |Standard|IEC24720 and IEC16022||IEC8859-1||| ||||||| |Code content|_Content_<br>Module serial number<br>Module material number<br>Production order number<br>Date code (production year)<br>Date code (production week)<br>_Dig_<br>1 –<br>6 -<br>12<br>20<br>22|_it_<br>5<br>11<br>- 19<br>– 21<br>– 23|||_Example_<br>71549<br>142846<br>55054991<br>15<br>30| |Example|71549142846550549911530<br>71549142846550549911530||||| ||||||| |**Packing label code**|||||| |Code format|Barcode Code128||||| |Encoding|Code Set A||||| |Symbol size|34 digits||||| |Standard|IEC8859-1||||| ||||||| |Code content|_Content_<br>Module serial number<br>Module material number<br>Production order number<br>Date code (production year)<br>Date code (production week)<br>_Ide_<br>X<br>1T<br>S<br>9D<br>Q|_ntifier_||_Digit_<br>2 – 9<br>12 – 19<br>21 – 25<br>28 – 31<br>33 – 34|_Example_<br>95056609<br>2X0003E0<br>754389<br>1139<br>15| |Example|X950566091T2X0003E0S754389D1139Q15||||| ## **Figure 4** Datasheet Revision 1.01 2021-09-13 12 **FF300R08W2P2_B11A EasyPACK[™] module** **==> picture [105 x 47] intentionally omitted <==** ## **Revision history** ## **Revision history** |**Revision history**||| |---|---|---| |**Document revision**|**Date of release**|**Description of changes**| |V1.0|2020-07-24|Target Datasheet| |1.00|2021-07-29|Final datasheet| |1.01|2021-09-13|Layout correction| Datasheet Revision 1.01 2021-09-13 13 ## **Trademarks** All referenced product or service names and trademarks are the property of their respective owners. **Edition 2021-09-13 IMPORTANT NOTICE Published by** The information given in this document shall in no event be regarded as a guarantee of conditions or **Infineon Technologies AG** characteristics (“Beschaffenheitsgarantie”). **81726 Munich, Germany** With respect to any examples, hints or any typical values stated herein and/or any information regarding **© 2021 Infineon Technologies AG** the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities **All Rights Reserved.** of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. **Do you have a question about any aspect of this document?** In addition, any information given in this document is **Email: erratum@infineon.com** subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning **Document reference** customer’s products and any use of the product of **IFX-AAK248-003** Infineon Technologies in customer’s applications. ## **WARNINGS** Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application.
Updated at April 28, 2026
Infineon Technologies is a globally recognized leader in semiconductor solutions, renowned for driving innovation in power management, energy efficiency, and modern mobility. With a strong legacy of engineering excellence, the company provides highly reliable components designed to meet the rigorous demands of industrial, automotive, and advanced commercial applications. The core of our Infineon portfolio is centered on their industry-leading discrete semiconductors. We offer an extensive selection of single and dual MOSFETs, alongside a robust range of single IGBTs and advanced IGBT modules. These flagship power transistors are essential for high-efficiency power conversion and motor control, providing engineers with superior thermal performance and minimized switching losses. Beyond advanced field-effect transistors, the selection includes a comprehensive array of diodes and rectifiers, heavily featuring Schottky diodes, as well as fast-recovery and RF/PIN diodes. This power foundation is further supported by bipolar transistors, intelligent power modules, and thyristor SCR modules, delivering the critical building blocks required for complex power system designs. To support broader system integration, the portfolio also encompasses specialized solutions such as solid-state relays, AC/DC LED driver ICs, and Bluetooth communications modules. From high-power industrial rectifiers to wireless connectivity adapters, Infineon equips designers with the precision components needed to build efficient, scalable, and fully connected electronic systems.
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