EESX3069M

## **EE-SX4330 Photomicrosensor (Transmissive)** ee **Ultra-Compact Slot / SMD Type / Photo IC Output (Slot width: 3 mm)** 

- 3-mm slot width x SMD x Photo IC type Contributes to making the device compact and allowing free design for a variety of applications 

**Be sure to read** _**Safety Precautions**_ on page 5. ~~Bo~~ 

## **Model Number Legend** 

## **EE-SX** @ @ @ **0** 

(1) (2) (3) (4) 

**(1) Sensing method (2) Operating mode** 

X: Transmissive 4: ON during light input 

**(3) Connecting method (4) Sensing distance** 

3: SMT 

3: 3 mm 

## **Ordering Information** 

## **Photomicrosensor** 

|**Appearance**|**Sensing**<br>**method**|**Connecting**<br>**method**|**Sensing distance**|**Aperture size**<br>**(H× W) (mm)**|**Output**<br>**type**|**Model**|**Minimum**<br>**number of**<br>**deliverable**<br>**units**<br>**(Unit: pieces)**|**Package**<br>**type**|
|---|---|---|---|---|---|---|---|---|
|5<br>6<br>4|Transmissive<br>(slot type)|SMT|**3 mm**(slot width)|Emitter<br>1.4×1.4<br>Detector<br>1×0.3|Photo IC|**EE-SX4330**|1,000|Tape reel|
|||||||**EE-SX4330-1**|100|Tape cut|



## **Ratings, Characteristics and Exterior Specifications** 

**Absolute Maximum Ratings (Ta = 25°C) Item Symbol Rated value Unit Emitter Forward current** IF 25[*1] mA **Reverse voltage** VR 5 V **Detector Power supply voltage** VCC 9 V **Output voltage** VOUT 17 V **Output current** IOUT 8 mA **Permissible output** POUT 80[*1] mW **dissipation Operating temperature** Topr -30 to +85[*1] °C **Storage temperature** Tstg -40 to +90[*1] °C **Reflow soldering** Tsol 255[ *2] °C **temperature** ~~a~~ *1. Refer to the temperature rating chart if the ambient temperature exceeds 25°C. 

## **Exterior Specifications** 

|**Connecting method**<br>SMT|**Connecting method**|**Weight (g)**<br>0.2|**Weight (g)**|**Material**<br>**Case**<br>PPS|
|---|---|---|---|---|



*2. Complete soldering within 10 seconds for reflow soldering. 

**1** 

**EE-SX4330** 

## **Electrical and Optical Characteristics (Ta = 25°C)** 

|**Item**|**Item**|**Symbol**|**Value**|**Value**|**Value**|**Unit**|**Condition**|
|---|---|---|---|---|---|---|---|
||||**MIN.**|**TYP.**|**MAX.**|||
|**Emitter**||||||||
||**Forward voltage**|VF|---|1.4|1.65|V|IF= 20 mA|
||**Reverse current**|IR|---|0.01|10|μA|VR= 5 V|
||**Peak emission wavelength**|λP|---|855|---|nm|IF= 20 mA|
|**Detector**||||||||
||**Power supply voltage**|VCC|2.2|---|7|V|---|
||**Low-level output voltage**|VOL|---|0.12|0.4|V|VCC= 2.2 to 7 V, IF= 7 mA,<br>IOL= 8 mA|
||**High-level output voltage**|IOH|---|---|10|μA|VCC=2.2 to 7 V, IF=0 mA,<br>VOH=17 V|
||**Current consumption**|ICC|---|2.8|4|mA|VCC= 7 V|
||**Peak spectral sensitivity wavelength**|λP|---|870|---|nm|VCC=2.2to7 V|
|**LED cu**|**rrent when output is ON**|IFT|---|---|3.5|mA|VCC=2.2to7 V|
|**Hysteresis**||ΔH|---|21|---|%|VCC= 2.2 to 7 V  *1|
|**Response frequency**||f|3|---|---|kHz|VCC=2.2 to 7 V, IF=5 mA,<br>IOL=8 mA*2|
|**Response delay time**||tPLH|---|2|---|μs|VCC=2.2 to 7 V, IF=5 mA,<br>IOL=8 mA*3|
|||tPHL|---|37|---|μs|VCC=2.2 to 7 V, IF=5 mA,<br>IOL=8 mA*3|
|*1.Hysteresis denotes the difference in forward LED current value, expressed in percentage, calculated from the respective forward LED currents<br>when the photo IC in turned from ON to OFF and when the photo IC in turned from OFF to ON.<br>*2.The value of the response frequency is measured by rotating the disk as shown below.<br>0.5 mm<br>2.1 mm<br>Disk<br>0.5 mm||||||||



- *1. Hysteresis denotes the difference in forward LED current value, expressed in percentage, calculated from the respective forward LED currents when the photo IC in turned from ON to OFF and when the photo IC in turned from OFF to ON. 

- *2. The value of the response frequency is measured by rotating the disk as shown below. 

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Disk<br>0.5 mm<br>0.5 mm<br>2.1 mm<br>**----- End of picture text -----**<br>


- *3. The following illustrations show the definition of response delay time. 

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Input<br>0<br>t<br>Output<br>0<br>t<br>tPHL tPLH<br>**----- End of picture text -----**<br>


**2** 

**EE-SX4330** 

## **Engineering Data (Reference value)** 

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Fig 1. Forward Current vs.  Fig 2. Forward Current vs.  Fig 3. LED Current vs.<br>Collector  Dissipation  Forward Voltage Characteristics  Supply Voltage (Typical)<br>Temperature Rating (Typical)<br>60 120 30 0.5<br>Ta = 25°C<br>Ta = -30°C RL = 4.7 kΩ<br>50 100 25 IFT ON<br>0.4<br>POUT Ta = +25°C<br>40 80 20<br>Ta = +70°C 0.3<br>30 60 15<br>IF<br>0.2 IFT OFF<br>20 40 10<br>10 20 5 0.1 IF ICCRLVCC<br>OUT<br>VOUT<br>GND<br>0 0 0 0<br>-40 -20 0 20 40 60 80 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0 1 2 3 4 5 6 7 8 9 10<br>Ambient temperature Ta (ºC) Forward voltage VF (V) Supply voltage VCC (V)<br>Fig 4.LED Current vs.  Fig 5. Low-level Output Voltage vs.  Fig 6. Low-level Output Voltage vs.<br>Ambient Temperature  Output Current (Typical) Ambient Temperature<br>Characteristics (Typical) Characteristics (Typical)<br>1 1 0.12<br>Vcc=5VRL=4.7kΩ Ta = 25VIOL CC = 8 mA= 5 VºC 0.1 IF ICCRLVOUTCC VIF CC = 7 mA= 5 V<br>IF =7 mA VOUT<br>0.75 GND<br>0.1 0.08<br>IOL=8mA<br>0.5 0.06<br>IFT ON<br>0.01 0.04<br>0.25 IF ICC VCC V CC IOL=0.5mA<br>RL IOUT 0.02<br>IFT OFF OUT OUT<br>VOUT<br>GND GND<br>0 0.001 0<br>-40 -20 0 20 40 60 80 100 1 10 -40 -20 0 20 40 60 80 100<br>Ambient temperature Ta (ºC) Output current IC (mA) Ambient temperature Ta (°C)<br>Fig 7. Current Consumption vs.  Fig 8. Response Delay Time vs.  Fig 9. Repeat Sensing Position<br>Supply Voltage (Typical) Forward Current (Typical) Characteristics (Typical)<br>4 40<br>Ta = 25ºC Ta = 25ºC<br>3.5 IF = 0 mA 35 (Center of optical axis) IF = 5 mA<br>3 30 IF ICC VCC tPLH d n = VRCCL = 4.7 kΩrepeat 20 times  = 5 V<br>2.5 25 V ROUTLOUT V R CC  L = 4.7 kΩ =5 V ON<br>GND Ta = 25ºC (OFF) Light baffle<br>2 20<br>INPUT IF<br>1.5 15 t d = 0.005mm<br>1 IF ICC VCC 10 OUTPUT t IF ICCRLVCC<br>RL tPHL tPLH OUT<br>0.5 VOUT OUT GND 5 tPHL VOUTGND<br>00 1 2 3 4 5 6 7 8 00 5 10 15 20 25 30 OFF-0.15 -0.05 0.05 0.15<br>Supply voltage VCC (V) Forward current IF (mA) (ON) Distance d (mm)<br> (mW)<br>OUT<br> (mA)F  (mA)F<br> (mA)<br>FT<br>Forward current I Forward current I LED current I<br>Output allowable dissipation P<br> (V)  (V)<br>OL OL<br> (mA)<br>FT<br>LED current I<br>Low level output voltage V Low level output voltage V<br> (μs)<br> (mA) , tPLH<br>CC PHL<br>Current consumption I Response delay time t Output transistor<br>**----- End of picture text -----**<br>


**3** 

**EE-SX4330 Dimensions and Internal Circuit** 

**(Unit: mm)** 

GD CAD Data marked products, 2D drawings and 3D CAD models are available. For CAD information, please visit our website, which is noted on the last page. 

## **Photomicrosensor** 

**EE-SX4330** ~~BE~~ (6xC0.2) 

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Ejector pin, gate mark, or flat surface<br>2.0 mm dia. or 0.5 mm recess (MAX)<br>(1) (6)<br>(2) (5)  4<br>(3) (4)<br>mB ey Ken<br>J 6<br>Aperture size (H x W)<br>Emitter Detector<br>Terminals are exposed<br>Terminals are exposed  in the end face of the board<br>1.4×1.4 1×0.3 in the end face of the board Marking<br> 3±0.2   1.5   (upper: model, lower: lot No.)  0.3 ±0.15<br> 1.4  A B<br>Optical axis<br>U  1  N  1  rst? 6OUINN  1  g<br>3.5 @@@@  1<br> 1.4   R0.3  | 5  R0.3  @@@@<br> 1   1<br>FO LT<br>A B<br>Cross section view B-B  1   1   1   1   1   1  Cross section view A-A<br>(Emitter side) (0.4) (0.4) (Detector side)<br>—  2.8  I  2.8<br>Internal circuit Recommended Soldering Pattern<br> 1<br>(1) (6)<br>0.4<br> 1<br>0.4<br> 1<br>(2) Lav (5) zig<br> 2  4  2<br>(3) (4)<br>Terminal No. Name<br>(1) Anode<br>(2)(3) Cathode<br>Power supply<br>(4)<br>voltage<br>(5) Output<br>(6) ground<br>(6xC0.2)<br>**----- End of picture text -----**<br>


Aperture size (H x W) 

Unless otherwise specified, the tolerances are ±0.2 mm. 

**4** 

**EE-SX4330** 

## **Safety Precautions** 

**To ensure safe operation, be sure to read and follow the Instruction Manual provided with the Sensor.** 

~~eS~~ **CAUTION This product is not designed or rated for ensuring safety of persons either directly or indirectly. Do not use it for such purposes.** 

## ~~Po~~ **Precautions for Safe Use Do not use the product with a voltage or current that exceeds the rated range.** 

## **Precautions for Correct Use** 

**Do not use the product in atmospheres or environments that exceed product ratings. This product is for surface mounting. Refer to Soldering Information, Storage and Baking for details.** 

**Dispose of this product as industrial waste.** 

Applying a voltage or current that is higher than the rated range may result in explosion or fire. 

**Do not miswire such as the polarity of the power** 

## **supply voltage.** 

Otherwise the product may be damaged or it may burn. 

## **Do not short-circuit the load.** 

Otherwise explosion or burning may occur. 

**This product does not resist water. Do not use the product in places where water or oil may be sprayed onto the product.** 

## **Tape and Reel** 

**Reel (Unit: mm)** * 

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21 [±0.8 dia. ]<br>2 [±0.5]<br>13 [±0.2 dia.]<br>80 [±1dia.]<br>330 [±2 dia.]<br>a =<br>Z<br>Product name<br>PHOTO MICROSENSOR<br>Lot number Quantity<br>Country of origin<br>Ld H<br>d Y<br>W1 = 13.5 [±1]<br>W2 = 17.5 [±1] W1<br>Tt<br>W2<br>**----- End of picture text -----**<br>


**5** 

**EE-SX4330** 

## **Tape (Unit: mm)** 

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1.5 dia.<br>4k4 EN12 rs7<br>+ eee<br>| |f<br>ES (6.2)<br>V K<br>O<br>G A<br>Tape Pull-out direction<br>**----- End of picture text -----**<br>


**Note:** Direction of product packing is upper figure. 

## **Tape quantity** 

1,000 pcs./reel 

100 pcs./pack * 

- EE-SX4330-1 (100 pcs./pack) has no reel, only tape is attached. 

**6** 

**EE-SX4330** 

## **Soldering Information** 

## **Reflow soldering: Temperature profile** 

**1.** The reflow soldering can be implemented in two times complying with the following diagram. All the temperatures in the product must be within the diagram. 

**2.** The recommended thickness of the metal mask for screen printing is between 0.2 and 0.25 mm. 

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260°C max.<br>255°C<br>1 to 4°C/s<br>230°C<br>10 sec max. 1 to 4°C/sec<br>150 to 180°C max.<br>40 sec max.<br>1 to 4°C/s<br>120 sec max.<br>Temperature (°C)<br>**----- End of picture text -----**<br>


## **Manual soldering** 

The manual soldering should not be applied to the products, otherwise the housing may be deformed and/or the Au plating may be peeled off by heat. 

## **Other notes** 

The use of infrared lamp causes the temperature at the resin to rise particularly too high. 

All the temperatures in the product must be within the above diagram. Do not immerse the resin part into the solder. Even if within the above temperature diagram, there is a possibility that the gold wire in the products is broken in case that the deformation of PC board gives stress to the products. 

Please confirm the conditions (including material and method of flux and cleaning) of the reflow soldering fully by actual solder reflow machine prior to the mass production use. 

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Time (s)<br>**----- End of picture text -----**<br>


## **Storage** 

## **Storage conditions** 

To protect the product from the effects of humidity until the package is opened, dry-box storage is recommended. If this is not possible, store the product under the following conditions: 

Temperature: 10 to 30 °C 

Humidity: 60% RH max. 

## **Treatment after open** 

**1.** Reflow soldering must be done within 48 hours stored at the conditions of humidity 60% RH or less and temperature 10 to 30°C. 

**2.** If the product must be stored after it is unpacked, store it in a dry box or reseal it in a moisture-proof package with desiccant at a temperature of 10 to 30°C and a humidity of 60% RH or less. Even then, mount the product within one week. 

## **Baking** 

In case that it could not carry out the above treatment, it is able to mount by the following baking treatment. However baking treatment shall be limited only 1 time. 

- Recommended conditions: 60°C for 24 to 48 hours (reeled one) 100°C for 8 to 24 hours (loose one) 

**7** 

Please check each region's Terms & Conditions by region website. 

## **OMRON Corporation Device & Module Solutions Company** 

## **Regional Contact** 

**Americas Europe** https://components.omron.com/us https://components.omron.com/eu **Asia-Pacific China** https://components.omron.com/ap https://components.omron.com.cn **Korea Japan** https://components.omron.com/kr https://components.omron.com/jp 

© OMRON Corporation 2023  All Rights Reserved. In the interest of product improvement, specifications are subject to change without notice. 

**Cat. No. E615-E1-01** 

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