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CPC1002NTR
SOLID STATE MOSFET RELAY, SPST, 0.7A/60V
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: IXYS SEMICONDUCTOR
- Product type: MOSFET Solid State Relays
- SOLID STATE MOSFET RELAY, SPST, 0.7A/60V; Contact Form:SPST-NO (1 Form A); Load Type:DC; Load Voltage Max:60V; Load Current:700mA; MOSFET Relay Package Style:SOP-4; Relay Mountin
- SVHC: No SVHC (17-Jan-2023)
- Load Type: DC
- Contact Form: SPST-NO (1 Form A)
- Load Current: 700mA
- Product Range: OptoMOS Series
- Relay Mounting: Surface Mount
- Relay Terminals: Gull Wing
- Load Voltage Max: 60V
- Isolation Voltage: 1.5kV
- I/O Capacitance Typ: 1pF
- On State Resistance Max: 0.55ohm
- MOSFET Relay Package Style: SOP-4
- Off State Leakage Current Max: 1µA
| Delivery and price | |
|---|---|
| Units per pack | 12000 |
| Price | 0.695 € |
| Current stock | 10+ |
| Lead time | 30 days |
**CPC1002N 60V Normally-Open Single-Pole 4-Pin SOP OptoMOS[®] Relay**
INTEGRATED CIRCUITS DIVISION
|**Parameter**|**Rating**|**Units**|
|---|---|---|
|Blocking Voltage|60|VP|
|Load Current|700|mADC|
|On-Resistance (max)|0.55||
|LED Current to operate|2|mA|
## **Features**
- Designed for use in Security Systems Complying with EN50130-4
- Only 2mA of LED Current Required to Operate
- Small 4-Pin SOP Package
- 100% Solid State
- High Reliability
- Arc-Free With No Snubbing Circuits
## **Description**
The CPC1002N is a miniature, normally-open (1-Form-A) DC solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. The super-efficient MOSFET switches and photovoltaic die use IXYS Integrated Circuits' patented OptoMOS architecture. The optically coupled output is controlled by the input's highly efficient infrared LED.
The CPC1002N uses IXYS Integrated Circuits' state of the art double-molded vertical construction packaging to produce one of the world’s smallest relays. The CPC1002N offers board space savings of at least 20% over the competitor’s larger 4-pin SOP relay.
- 1500Vrms Input/Output Isolation
- No EMI/RFI Generation
- Immune to Radiated EM Fields
- Tape & Reel Version Available
- Flammability Rating UL 94 V-0
## **Applications**
- Security
- Passive Infrared Detectors (PIR)
- Data Signalling
- Sensor Circuitry
- Instrumentation
- Multiplexers
- Data Acquisition
## **Approvals**
- UL Recognized Component: File E76270
- CSA Certified Component: Certificate 1172007
- EN/IEC 60950-1 Certified Component: Certificate available on our website
## **Ordering Information**
**Part # Description** CPC1002N 4-Pin SOP (100/tube) CPC1002NTR 4-Pin SOP (2000/reel) ~~————~~
## **Pin Configuration**
- Electronic Switching
- I/O Subsystems
- Meters (Watt-Hour, Water, Gas)
- Medical Equipment—Patient/Equipment Isolation
- Aerospace
- Industrial Controls
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1 4<br>+ Control DC +<br>2 3<br>– Control DC -<br>**----- End of picture text -----**<br>
## **Switching Characteristics of Normally-Open Devices**
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Form-A<br>IF<br>90%<br>10%<br>ILOAD<br>ton toff<br>**----- End of picture text -----**<br>
**1**
DS-CPC1002N-R07
**www.ixysic.com**
**CPC1002N**
INTEGRATED CIRCUITS DIVISION
## **Absolute Maximum Ratings @ 25ºC**
|**Parameter**|**Ratings**|**Units**|
|---|---|---|
|Blocking Voltage|60|VP|
|Reverse Input Voltage|5|V|
|Input Control Current<br>Peak (10ms)|50|mA|
||1|A|
|Input Power Dissipation1|70|mW|
|Total Power Dissipation2|400|mW|
|Isolation Voltage Input to Output|1500|Vrms|
|Operational Temperature|-40 to +85|°C|
|Storage Temperature|-40 to +125|°C|
_Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied._
_Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements._
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 3.33 mW / ºC
## **Electrical Characteristics @ 25ºC**
|**Parameter**|**Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|
|**Output Characteristics**|||||||
|Load Current, Continuous1|IF=2mA|IL|-|-|700|mADC|
|Peak Load Current|t=10ms|ILPK|-|-|1|AP|
|On-Resistance2|IL=100mA|RON|-|0.35|0.55||
|Off-State Leakage Current|VL=60VP|ILEAK|-|-|1|A|
|Switching Speeds<br>Turn-On<br>Turn-Off|IF=3mA, VL=10V|ton|-|1.3|5|ms|
|||toff|-|0.41|2||
|Output Capacitance|IF=0mA, VL=50V, f=1MHz|COUT|-|25|-|pF|
|**Input Characteristics**|||||||
|Input Control Current to Activate3|IL=100mA|IF|-|0.55|2|mA|
|Input Control Current to Deactivate|-|IF|0.3|-|-|mA|
|Input Voltage Drop|IF=5mA|VF|0.9|1.2|1.5|V|
|Reverse Input Current|VR=5V|IR|-|-|10|A|
|**Common Characteristics**|||||||
|Capacitance, Input to Output|VIO=0V, f=1MHz|CIO|-|1|-|pF|
1 Load current derates linearly from 700mA @ 25oC to 420mA @80oC.
2 Measurement taken within 1 second of on-time.
3 For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 3mA is recommended.
R07
**www.ixysic.com**
**2**
Saal INTEGRATED CIRCUITS DIVISION **CPC1002N** ~~a~~
## **PERFORMANCE DATA***
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Typical LED Forward Voltage Drop(N=50, IF=5mA) Typical I(N=50, IF for Switch OperationL=100mA) Typical I(N=50, IF for Switch DropoutL=100mA)<br>3530 3530 F ELL LLL 3530 F DLLLLL<br>25 25 Solo 25 ToL<br>20 20 oo 20 1<br>1510 1510 ona= 1510 7.|ee =o<br>50 50 _a fie! | | = 50 |nm [6666s$sFs_] |<br>1.17 1.19 1.21 1.23 1.25 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.45 0.50 0.55 0.60 0.65 0.70 0.75<br>LED Forward Voltage Drop (V) LED Current (mA) LED Current (mA)<br>Typical On-Resistance Distribution Typical Turn-On Time Typical Turn-Off Time<br>(N=50, IL=100mA) (N=50, IF=3mA, IL=100mA) (N=50, IF=3mA, IL=100mA)<br>35 25 25<br>30<br>20 20<br>25 fp fd Ft | ty Ft | Et<br>20 ToetoetoC(‘<i‘iRCCiC 15 Le 15<br>15 10 10<br>10 a5 =ee8 2a" “a | | io |<br>5 5<br>5 a. | = || a =<br>0 | — CLL 0 a= ||| 0 m a [iihdithld|h6i] | ~ae<br>0.32 0.33 0.34 0.35 0.36 0.37 0.38 1.0 1.1 1.2 1.3 1.4 1.5 1.6 0.38 0.39 0.40 0.41 0.42 0.43 0.44<br>On-Resistance ( ) Turn-On Time (ms) Turn-Off Time (ms<br>Device Count (N) Device Count (N) Device Count (N)<br>Device Count (N) Device Count (N) Device Count (N)<br>**----- End of picture text -----**<br>
**Typical Blocking Voltage Distribution (N=50)**
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3530 T LL<br>25 FELL LEL,<br>20151050 272|a_iie)<br>68 69 70 71 72 73 74<br>Blocking Voltage (VP)<br>Device Count (N)<br>**----- End of picture text -----**<br>
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Typical IF for Switch Operation Typical IF for Switch Dropout<br>Typical LED Forward Voltage Drop vs. Temperature vs. Temperature<br>vs. Temperature (IL=100mA) (IL=100mA)<br>1.6 1.50 1.50<br>IF=50mA<br>1.5 IF=20mA 1.25 1.25<br>IF=10mA<br>1.4 =a 1.00 Ft | | cE ht ct 1.00 Felt | ft ft tt<br><4 _ Ft | | hE Tt FT | TT Tt<br>1.3 0.75 0.75<br>= Ane ret tT ct UTC ee pf { tt ty<br>1.2 0.50 0.50<br>2 IF=5mA SS Fo[ | Ee Fe | cPhE<br>1.1 IF=2mA 0.25 0.25<br>IF=1mA<br>1.0 SSS Pt tt 0 FFT E ET| hE TE hE TE Tt 0 FFy eE TLtT TE T t Ttt<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>LED Current (mA) LED Current (mA)<br>LED Forward Voltage Drop (V)<br>**----- End of picture text -----**<br>
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department.
**www.ixysic.com**
R07
**3**
al INTEGRATED CIRCUITS DIVISION **CPC1002N** ~~Pee~~
## **PERFORMANCE DATA***
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Typical Turn-On Time Typical Turn-Off Time<br>Typical Load Current vs. Load Voltage vs. LED Forward Current vs. LED Forward Current<br>(IF=2mA) (IL=100mA) (IL=100mA)<br>600 10 0.7<br>9 A<br>500 8 0.6<br>7 PERE 0.5 At<br>400 A A | | |<br>6 0.4<br>300 5 CEEEPEEE PRESSE<br>4 Cece eet 0.3 vi tt tt ttt I<br>200 3 2 0.2 EHETPE<br>100 21 APPELLEE?2 0.1 POOEE ET<br>0 0 _ 0<br>0 0.05 0.10 0.15 0.20 0.25 0.30 0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 50<br>Load Voltage (V) LED Forward Current (mA) LED Forward Current (mA)<br>Typical On-Resistance vs. Temperature Typical Turn-On Time vs. Temperature Typical Turn-Off Time vs. Temperature<br>(IL=100mA) (IF=3mA, IL=100mA) (IF=3mA, IL=100mA)<br>1.2 2.50 1.0<br>2.25 2 0.9<br>1.0 Pett 2.00 0.8 2<br>e 0.8 + | | |tt| [|Tt[| IF=2mA 1.75 eeee 0.7 2a<br>IF=5mA 1.50 0.6<br>0.6 rt / 1.25 a el ee 0.5 2<br>1.00 0.4<br>0.4 FT|ff | Left | ldlL 0.75 ee22 a 0.3 e e ee e<br>0.2 FFT] | flltllL 0.50 ee 0.2 2<br>0.25 0.1<br>0 r ete TT LL 0 2oe ee ee 0 aPOPOL<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Typical Leakage vs. Temperature<br>Typical Maximum Load Current Typical Blocking Voltage Measured Across Pins 3&4<br>vs. Temperature vs. Temperature (VL=60V)<br>900 76 0.016<br>800 Se 74 ee ee 0.014 ee<br>700 ptt tt 72 FT oT of 0.012 ee eeee<br>600<br>0.010<br>500 70<br>400300 SEEPS2oeee IIFF=5mA=2mA 68 frEee|[rt| > 0.0080.006 EE<br>66<br>200 Pe > ae 0.004 |ff<br>1000 2ee [ee] ff | | 6462 Peeey | tte 0.0020 eea a eeS44ee<br>-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Energy Rating Curve<br>2.0<br>1.8 S000 0<br>1.6 SSCCCC [ECC]<br>1.4 EHIME<br>1.2 EP CICA CCC<br>1.0 BUH PCI CAN CCC<br>0.8<br>S00 0R 0 001 BasasA<br>0.6 FTC<br>0.4 0000<br>0.2 0000<br>0 FCCC CCC<br>10 s 100 s 1ms 10ms 100ms 1s 10s 100s<br>Time<br>Load Current (mA) Turn-On Time (ms) Turn-Off Time (ms)<br>On-Resistance () Turn-On Time (ms) Turn-Off Time (ms)<br>)P<br>A)<br>Leakage (<br>Load Current (mA) Blocking Voltage (V<br>Load Current (A)<br>**----- End of picture text -----**<br>
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department.
R07
**www.ixysic.com**
**4**
**CPC1002N**
INTEGRATED CIRCUITS DIVISION
## **Manufacturing Information**
## **Moisture Sensitivity**
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of ¢) the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** .
|**Device**<br>~~—~~|**Moisture Sensitivity Level (MSL) Classifi cation**<br>~~eee~~|
|---|---|
|CPC1002N<br>~~—~~|MSL 3<br>~~eee~~|
## **ESD Sensitivity**
This product is **ESD Sensitive** , and should be handled according to the industry standard **JESD-625** .
## **Soldering Profile**
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of **J-STD-020** must be observed.
**Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles** CPC1002N 260ºC 30 seconds 3 ~~————————E~~ **Board Wash** IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
**www.ixysic.com**
R07
**5**
**CPC1002N**
INTEGRATED CIRCUITS DIVISION
## **MECHANICAL DIMENSIONS**
## **CPC1002N**
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4.089 ± 0.025 Recommended PCB Land Pattern<br>(0.161 ± 0.001)<br>0.203 ± 0.025<br>0.60<br>(0.008 ± 0.001)<br>(0.024)<br>3.810 ± 0.025 6.096 ± 0.102<br>(0.150 ± 0.001) (0.240 ± 0.004)<br>0.559 ± 0.127<br>(0.022 ± 0.005) 3.85<br>Pin 1 0.910 ± 0.025 (0.152)<br>(0.036 ± 0.001)<br>2.54 Typ 1.54<br>(0.100 Typ) (0.061)<br>2.030 ± 0.025 as 2.54<br>(0.080 ± 0.001) Dimensions (0.10)<br>Package standoff: oe mm<br>0.064 ± 0.040 (inches)<br>0.481 (0.0025 ± 0.0015)<br>(0.019)<br>(0-0.004)0-0.1 a, (0.015 0.381 ±± 0.025 0.001) Note:1. Lead dimensions do not include plating: 1000 microinches max.<br>**----- End of picture text -----**<br>
## **CPC1002NTR Tape & Reel**
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330.2 Dia<br>(13.00 Dia)<br>W=12.00<br>Top Cover B0=4.70 (0.472)<br>Tape Thickness (0.185)<br>0.102 Max<br>(0.004 Max)<br>K(0.106)0=2.70 A(0.256)0=6.50 P1=8.00(0.315)<br>K(0.091)1=2.30<br>oe User Direction of Feed<br>Dimensions<br>Embossed mm<br>Carrier (inches)<br>Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted<br>**----- End of picture text -----**<br>
## **For additional information please visit our website at: www.ixysic.com**
IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1002N-R07 ©Copyright 2018, IXYS Integrated Circuits OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA.
**6**
6/1/2018
Updated at April 22, 2026
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