BWCU00201212900M02
Choke, Common Mode, 90 ohm, 330 mA, 0805 [2012 Metric]
- Manufacturer: PULSE ELECTRONICS
- Product type: SMD Common Mode Chokes / Filters
- SVHC: No SVHC (04-Feb-2026)
- Impedance: 90ohm
- Inductance: -
- Product Range: BWCU-02 Series
- Product Width: 1.25mm
- Qualification: -
- Product Height: 1.2mm
- Product Length: 2.05mm
- DC Current Rating: 330mA
- DC Resistance Max: 0.35ohm
- Inductor Case / Package: 0805 [2012 Metric]
- Operating Temperature Max: 105°C
- Operating Temperature Min: -40°C
| Delivery and price | |
|---|---|
| Units per pack | 8000 |
| Price | 0.052 € |
| Current stock | 1000+ |
| Lead time | 30 days |
## **EMI Common Mode Choke** ## **BWCU Series** ## **Overview** An EMI common mode choke (CMC) for power lines is a passive component specifically designed to suppress electromagnetic interference (EMI) in power supply circuits A full series of common mode choke is designed for excellent noise attenuation with compact sizing for use in wide range of applications. Both standard series and custom designs are available. ## **Benefits** 1. EMI/RFI Suppression 2. Improved Signal Integrity 3. Effectively suppresses noise over a wide frequency spectrum, including low-frequency and high-frequency EMI. 4. Common mode chokes are compact and suitable for applications where space is limited. ## **Applications** 1. USB line for personal computers and peripheral 2. IEEE 1394 line for personal computers, DVC, STB 3. LVDS, panel line for liquid display panels, graph card,etc ## **Product Information** **Series Size Code (JIS/EIA) Impedance (Ω)** BWCU 1608/0603 22 ~ 2200 2012/0805 1210/0504 3216/1206 2520/1008 3225/1210 ## **BWCU00201212 Series Specification** **1 Scope:** This specification applies to BWCU Wire Wound Common Mode Choke Coil ~~_|~~ **==> picture [122 x 21] intentionally omitted <==** **----- Start of picture text -----**<br> 2 [Part Numbering: ]<br>_|<br>**----- End of picture text -----**<br> **==> picture [66 x 19] intentionally omitted <==** **----- Start of picture text -----**<br> 3 Rating:<br>_|<br>**----- End of picture text -----**<br> Operating Temperature: - 40 ℃ ~ 105 ℃ (Including self - temperature rise) Storage Temperature: - 40 ℃ ~ 105 ℃ (The storage temperature range is for after the assembly) **==> picture [134 x 84] intentionally omitted <==** **----- Start of picture text -----**<br> 4 Marking:<br>_|<br>No Marking<br>**----- End of picture text -----**<br> **==> picture [182 x 22] intentionally omitted <==** **----- Start of picture text -----**<br> 5 [Standard Testing Condition]<br>_|<br>**----- End of picture text -----**<br> ||Unless otherwise specified|In case of doubt| |---|---|---| |Temperature|OrdinaryTemperature(15 to 35℃)|20 to 30℃| |Humidity|OrdinaryHumidity(25 to 85% RH)|50 to 80 %RH| ## **BWCU00201212 Series Specification** ## **6 Configuration and Dimensions and Unit Weight:** ## **7 Electrical Characteristics:** |||||**Rated**|**Withstanding**|**Insulation**||| |---|---|---|---|---|---|---|---|---| |**Part No.**|**Z**|**RDC**|**IDC**|**Voltage**|**Voltage**|**Resistance**|**Tolerance**|**Test Freq.**| ||**(Ω)**|**(Ω)Max.**|**(mA)**|**(Vdc)**|**(Vdc)**|**(MΩ)(min)**|**(±%)**|**(MHz)**| |BWCU00201212300□02|30|0.2|450|50|125|10|M,Y|100| |BWCU00201212670□02|67|0.25|400|50|125|10|M,Y|100| |BWCU00201212750□02|75|0.3|360|50|125|10|M,Y|100| |BWCU00201212900□02|90|0.35|330|50|125|10|M,Y|100| |BWCU00201212121□02|120|0.3|400|50|125|10|M,Y|100| |BWCU00201212161□02|160|0.35|350|50|125|10|M,Y|100| |BWCU00201212181□02|180|0.35|330|50|125|10|M,Y|100| |BWCU00201212201□02|200|0.35|330|50|125|10|M,Y|100| |BWCU00201212221□02|220|0.35|310|50|125|10|M,Y|100| |BWCU00201212261□02|260|0.4|300|50|125|10|M,Y|100| |BWCU00201212301□02|300|0.4|290|50|125|10|M,Y|100| |BWCU00201212361□02|360|0.45|280|50|125|10|M,Y|100| |BWCU00201212371□02|370|0.45|280|50|125|10|M,Y|100| |BWCU00201212391□02|390|0.45|280|50|125|10|M,Y|100| |BWCU00201212491□02|490|0.55|170|50|125|10|M,Y|100| |BWCU00201212501□02|500|0.55|170|50|125|10|M,Y|100| |BWCU00201212601M02|600|0.6|140|50|125|10|M,Y|100| |BWCU00201212671□02|670|0.6|140|50|125|10|M,Y|100| |BWCU00201212801□02|800|0.88|300|50|125|10|M,Y|100| |BWCU00201212901□02|900|0.6|80|50|125|10|M,Y|100| |BWCU00201212921□02|920|0.75|80|50|125|10|M,Y|100| |BWCU00201212102□02|1000|0.8|150|50|125|10|M,Y|100| |BWCU00201212202□02|2000|2.2|150|50|125|10|M,Y|100| **NOTE: □-tolerance M=±20%/Y=±25%** 1.Operating temperature range - 40℃ ~ 105℃(Including self - temperature rise) - 2.RDC: SINGLE WIRE TEST VALUE 3.IDC for Inductance drop 10% from its value without current. ## **BWCU00201212 Series Specification** ## **8 BWCU00201212 Series** **8.1 Construction:** ## **8.2 Material List:** |NO|PART|MATERIAL| |---|---|---| |1|WIRE|Grade 180| |2|COVER SHEET|FERRITE CORE| |3|CORE|FERRITE CORE| |4|TERMINAL|Ag/Cu/Ni/Sn| ## **BWCU00201212 Series Specification** ## 9 **Common Mode Choke / RELIABILITY TEST** ## **1-1.Environmental Performance** |**No**|**Item**|**Specification**|**Test Method**||| |---|---|---|---|---|---| |1-1-1|Temperature Cycle|Appearance: No Damage|One cycle:||| |||Impedance: within±20% of|Step<br>Temperature(℃)||Time(min)| |||initial value|1<br>-40±3||30| ||||2<br>25±2||3| ||||3<br>105±3||30| ||||4<br>25±2||3| ||||Total: 5 cycles||| ||||Measured After Exposure in The Room Condition For 1hrs||| |1-1-2|High Temperature Resistance||Temperature: 105±3℃||| ||||Time: 1000Hrs||| ||||Measured After Exposure In The Room Condition For 1Hrs||| |1-1-3|Low Temperature Resistance||Temperature: -40±3℃||| ||||Time: 1000Hrs||| ||||Measured After Exposure In The Room Condition For 1Hrs||| |1-1-4|Humidity Load Life|There should be no evidence|Temperature: 40±2℃||| |||of short or open circle|Relative Humidity: 90~95%||| ||||Load: Allowed DC Current||| ||||Time: 96Hrs||| |**1-2.Mechanical Performance**|||||| |**No**|**Item**|**Specification**|**Test Method**||| |1-2-1|Resistance To Soldering Heat|Appearance: No Damage|1. The device should be reflow soldered on PCB||| ||||(peak 260℃±5℃for 10 seconds)||| ||||2. Solder Composition: Sn/Ag3.0/Cu0.5||| ||||3. Test time: 6 minutes||| |1-2-2|Solder ability|The electrodes shall be|1. Pre-Heating: 150℃,1min.||| |||at least 95% covered|2. Solder Composition: Sn/Ag3.0/Cu0.5||| |||with new solder coating|3. Solder Temperature: 245±5℃.||| ||||4. Immersion Time: 4±1 sec.||| |1-2-3|Commponent Adhesion|Commponent Adhesion1 Lbs. For 1210 Size|The device should be reflow soldered (245±5℃For||| ||(Push Test)|2 Lbs. For other|10 seconds) to a tinned copper substrate. A force guauge||| ||||should be applied to the side of the component.||| ||||The device must withstand a minimum force of 2 pounds||The device must withstand a minimum force of 2 pounds| ||||without a failure of the termination attached to component||| ## **BWCU00201212 Series Specification** Temp. scope R.T.~150°C | 150°C ~200 ove NOTE: Pie BF Fal] 1.Re-flow possible times: within 2times 2.Nitrogen adopted is recommended while in re-flow ## **BWCU00201212 Series Specification** **10 Packaging:** ~~_|~~ **10.1 Packaging -Cover Tape** The force for tearing off cover tape is 10 to 100 grams in the arrow direction. **==> picture [141 x 12] intentionally omitted <==** **----- Start of picture text -----**<br> 10.2 Packaging Quantity<br>**----- End of picture text -----**<br> **==> picture [146 x 31] intentionally omitted <==** **----- Start of picture text -----**<br> TYPE PCS/REEL<br>201212 2000<br>**----- End of picture text -----**<br> ## **10.3 Reel Dimensions** **==> picture [246 x 42] intentionally omitted <==** **----- Start of picture text -----**<br> Dimensions in mm<br>TYPE A B C D<br>201212 178±1 60±0.5 12±0.5 1.5±0.5<br>**----- End of picture text -----**<br> ## **BWCU00201212 Series Specification** ## **10 Packaging: 10.4 Tape Dimensions in mm** |**TYPE**|**A**|**B**|**D**|**E**|**F**|**H**|**I**|**P**|**P0**|**P2**| |---|---|---|---|---|---|---|---|---|---|---| |**201212**|**8**|**1.50**|**2.25**|**3.5**|**1.75**|**1.35**|**0.24**|**4**|**4**|**2**| - **11 Note:** 1. Please make sure that your product has been evaluated and confirmed against your specifications when our product is mounted to your product. 2. Do not knock nor drop. 3. All the items and parameters in this product specification have been prescribed on the premise that our product is used for the purpose,under the condition and in the environment agreed upon between you and us. You are requested not to use our product deviating from such agreement. 4.The storage period is less than 12 months. Be sure to follow the storage conditions (Temperature: 5 to 40°C, Humidity: 10 to 75% RHor less). If the storage period elapses, the soldering of the terminal electrodes may deteriorate. 5.Do not use or store in locations where there are conditions such as gas corrosion (salt, acid, alkali, etc.). 6. The moisture sensitivity level (MSL) of products is classified as level 1. ## **BWCU00201212 Series Specification** **==> picture [59 x 12] intentionally omitted <==** **----- Start of picture text -----**<br> 12 Graph:<br>**----- End of picture text -----**<br> ## **BWCU00201212 Series Specification** ## **BWCU00201212 Series Specification** **==> picture [109 x 9] intentionally omitted <==** **----- Start of picture text -----**<br> BWCU00201212601 □ 02<br>**----- End of picture text -----**<br>
Updated at June 5, 2026
Pulse Electronics, a YAGEO company, is a global leader in the design and manufacturing of passive electronic components. With a legacy of innovation dating back to 1956, the company provides essential technology for the communications, computing, industrial, transportation, and IoT sectors. Pulse is recognized worldwide for delivering high-performance solutions that power advanced applications, ranging from 5G networks and electric vehicles to data centers and smart grids. The company's extensive product portfolio is heavily anchored in power and networking magnetics. This includes a comprehensive range of power inductors engineered for exceptional efficiency and reliability in demanding environments. To address complex electromagnetic compatibility challenges, Pulse also manufactures highly effective EMC and RFI suppression solutions, such as common mode chokes and filters, alongside specialized toroidal and RF inductors designed to ensure clean power delivery and optimal signal integrity. Beyond traditional magnetics, Pulse excels in the development of advanced wireless and power conversion components. Their connectivity solutions feature a wide array of high-performance RF antennas and single-band chip antennas tailored for modern connected devices. Furthermore, to support sophisticated power architectures, Pulse provides a broad spectrum of transformers—encompassing PCB-mounted designs, current sensing transformers, and precise pulse transformers—equipping engineers with robust, industry-proven components for power isolation and measurement.
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