BGX13S22GA-V21

## **BGX13S Blue Gecko Xpress** _**Bluetooth**_ **[®] SiP Module Data Sheet** 

The BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module family of serial replacement modules eliminate Bluetooth firmware development complexity with a serial interface that can operate as a raw data stream or control the device through a command API. The BGX13S can facilitate a device-to-device cable replacement link or communicate with mobile devices through the Xpress Bluetooth mobile library. The device integrates a Bluetooth 5 compliant stack to future-proof applications as Bluetooth 5 adoption increases. 

The device is targeted for applications where ultra-small size, reliable high performance RF, low-power consumption, and fast time-to-market are key requirements. At 6.5 × 6.5 × 1.4 mm the BGX13S module fits applications where size is a constraint. BGX13S also integrates a high-performance, ultra-robust antenna, which requires minimal PCB, plastic, and metal clearance. The total PCB area required by BGX13S is only 51 mm[2] . The BGX13S has Bluetooth, CE, full FCC, Japan and South-Korea certifications. 

## **KEY FEATURES** 

- Bluetooth 5 low energy compliant 

- Serial interface with hardware flow control 

- GPIO control through command API 

- Integrated antenna 

- TX power up to 8 dBm 

- Encrypted bonding and connectivity 

- Operates as central or peripheral 

- Onboard Bluetooth stack 

- Centralized OTA through mobile app library 

BGX13S SIP modules can be used in a wide variety of applications: 

- Health, sports and wellness devices 

- Industrial, home and building automation 

- Smart phone, tablet and PC accessories 

**==> picture [299 x 201] intentionally omitted <==**

**----- Start of picture text -----**<br>
Serial interface Bluetooth  Radio<br>controller<br>Bluetooth 5  Radio<br>compliant  transceiver<br>Command<br>stack<br>parser<br>Chip<br>Raw data  Timers antenna<br>stream<br>buffers<br>OTA  Matching<br>manager network<br>control<br>RX/TX and flow<br>GPIO  control<br>**----- End of picture text -----**<br>


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Preliminary Rev. 0.5 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Ordering Information 

## **1.  Ordering Information** 

**Table 1.1.  Ordering Information** 

|**Ordering Code**|**Protocol Stack**|**Frequency Band**<br>**@ Max TX Power**|**Antenna**|**GPIO**|**Packaging**|
|---|---|---|---|---|---|
|BGX13S22GA-V21R|Bluetooth Low<br>Energy|2.4 GHz @ 8 dBm|Built-in|8|Reel|
|BGX13S22GA-V21|Bluetooth Low<br>Energy|2.4 GHz @ 8 dBm|Built-in|8|Tray|



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## **Table of Contents** 

|**1.**|**Ordering Information**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 2**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**2.**|**Electrical Specifications .**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 5**|
||2.1  Electrical Characteristics .|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 5|
||2.1.1  Absolute Maximum Ratings|||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 5|
||2.1.2  Operating Conditions|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 6|
||2.1.3  Power Consumption.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 7|
||2.1.4  2.4 GHz RF Transceiver||Characteristics|||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|. 8|
||2.1.5  Non-Volatile Configuration Storage.||||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.12|
||2.1.6  General-Purpose I/O (GPIO) .||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.13|
|**3.**|**Typical Connection Diagrams**||**.**|**.**|**.**|**.**<br>**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 14**|
||3.1  Typical BGX13S Connections||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.14|
|**4.**|**Layout Guidelines**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**<br>**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 15**|
||4.1  Layout Guidelines<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.15|
||4.2  Effect of PCB Width .<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.16|
||4.3  Effect of Plastic and Metal Materials||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.17|
||4.4  Effects of Human Body .<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.17|
||4.5  2D Radiation Pattern Plots|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.18|
|**5.**|**Pin Definitions .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**20**|
||5.1  BGX13S Device Pinout.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.20|
|**6.**|**Functional Overview**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.23**|
||6.1  Introduction.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.23|
||6.2  Communication Use Cases|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.23|
||6.3  Embedded Interface.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.23|
||6.4  Command Mode and Streaming Mode|||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.23|
||6.5  Command API.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.24|
||6.6  GPIO Control .<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.24|
||6.7  Device Configuration<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.24|
||6.8  Security Features.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.24|
||6.9  OTA .<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.24|
||6.10  Direct Test Mode Support|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.24|
|**7.**|**Package Specifications**<br>**.**|**.**|**.**|**.**|**.**|**.**<br>**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.25**|
||7.1   BGX13S Package Marking|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.25|
||7.2  BGX13S Package Dimensions||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.26|
||7.3   BGX13S Recommeded PCB Land Pattern||||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.29|
|**8.**|**Tape and Reel Specifications**||**.**|**.**|**.**|**.**<br>**.**|**.**||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 32**|
||8.1  Tape and Reel Packaging .|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.32|



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Preliminary Rev. 0.5 |  3 

|8.2  Reel and Tape Specifications|8.2  Reel and Tape Specifications|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.32|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|8.3  Orientation and Tape Feed|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.33|
|8.4  Tape and Reel Box Dimensions .||||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.34|
|8.5  Moisture Sensitivity Level .|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.34|
|**9.  Soldering Recommendations**||**.**|**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**. 35**|
|9.1  Soldering Recommendations|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.35|
|**10.  Certifications .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**|**36**|
|10.1  Certifications Pending.<br>.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.36|
|**11.  Revision History.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**|**37**|



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Preliminary Rev. 0.5 |  4 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Electrical Specifications 

## **2.  Electrical Specifications** 

## **2.1  Electrical Characteristics** 

All electrical parameters in all tables are specified under the following conditions, unless stated otherwise: 

- Typical values are based on TAMB = 25 °C and VBAT = 3.3 V, by production test and/or technology characterization. 

- Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output power-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna. 

- Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise. 

Refer to for more details about operational supply and temperature limits. 

## **2.1.1  Absolute Maximum Ratings** 

Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx. 

**Table 2.1.  Absolute Maximum Ratings** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Storage temperature range|TSTG||-50|—|150|°C|
|Voltage on any supply pin|VDDMAX||-0.3|—|3.8|V|
|Voltage ramp rate on any<br>supply pin|VDDRAMPMAX||—|—|1|V / µs|
|DC voltage on any GPIO pin|VDIGPIN||-0.3|—|IOVDD+0.3|V|
|Maximum RF level at input|PRFMAX2G4||—|—|10|dBm|
|Total current into supply pins|IVDDMAX|Source|—|—|200|mA|
|Total current into VSS<br>ground lines|IVSSMAX|Sink|—|—|200|mA|
|Current per I/O pin|IIOMAX|Sink|—|—|50|mA|
|||Source|—|—|50|mA|
|Current for all I/O pins|IIOALLMAX|Sink|—|—|200|mA|
|||Source|—|—|200|mA|
|Junction temperature|TJ||-40|—|105|°C|



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Preliminary Rev. 0.5  |  5 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Electrical Specifications 

## **2.1.2  Operating Conditions** 

The following subsections define the operating conditions for the module. 

## **2.1.2.1  General Operating Conditions** 

## **Table 2.2.  General Operating Conditions** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Operating ambient tempera-<br>ture range|TA||-40|25|85|°C|
|VBATT operating supply<br>voltage|VVBATT||2.4|3.3|3.8|V|
|VBATT current|IVBATT||—|—|200|mA|



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Preliminary Rev. 0.5  |  6 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Electrical Specifications 

## **2.1.3  Power Consumption** 

Unless otherwise indicated, typical conditions are: VBATT = 3.3 V. T = 25 °C. Minimum and maximum values in this table represent the worst conditions across process variation at T = 25 °C. 

**Table 2.3.  Power Consumption** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Active supply current, Un-<br>connected, Idle|IACTIVE_IDLE|Baud rate ≤ 9600 bps|—|3|—|µA|
|||Baud rate > 9600 bps|—|3.25|—|mA|
|Active supply current, Adver-<br>tising|IACTIVE_ADV|Interval = 546.25 ms, Baud rate ≤<br>9600 bps|—|90|—|µA|
|||Interval = 20 ms, Baud rate ≤<br>9600 bps|—|2|—|mA|
|||Interval = 546.25 ms, Baud rate ><br>9600 bps|—|3.3|—|mA|
|||Interval = 20 ms, Baud rate ><br>9600 bps|—|4.7|—|mA|
|Active supply current, Con-<br>nected, 15 ms Interval|IACTIVE_CONN|Idle, Baud Rate ≤ 9600 bps|—|660|—|µA|
|||TX/RX (acknowledged) at highest<br>throughput, Baud Rate ≤ 9600<br>bps|—|3.5|—|mA|
|||TX/RX (unacknowledged) at high-<br>est throughput, Baud Rate ≤ 9600<br>bps|—|4|—|mA|
|||Idle, Baud Rate > 9600 bps|—|3.5|—|mA|
|||TX/RX (acknowledged) at highest<br>throughput, Baud Rate > 9600<br>bps|—|5.25|—|mA|
|||TX/RX (unacknowledged) at high-<br>est throughput, Baud Rate > 9600<br>bps|—|7|—|mA|
|Supply current in low power<br>mode|ILPM|Radio disabled|—|3|—|µA|
|||Radio enabled, Advertising, Inter-<br>val = 546.25 ms|—|90|—|µA|
|||Radio enabled, Advertising, Inter-<br>val = 20 ms|—|2|—|mA|



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Preliminary Rev. 0.5  |  7 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Electrical Specifications 

## **2.1.4  2.4 GHz RF Transceiver Characteristics** 

## **2.1.4.1  RF Transmitter General Characteristics for 2.4 GHz Band** 

Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency=38.4 MHz. RF center frequency 2.45 GHz. Conducted measurement from the antenna feedpoint. 

**Table 2.4.  RF Transmitter General Characteristics for 2.4 GHz Band** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Maximum TX power1, 2|POUTMAX|8 dBm-rated part numbers|—|7.8|—|dBm|
|Minimum active TX Power|POUTMIN|CW||-30|—|dBm|
|Output power step size|POUTSTEP|-5 dBm< Output power < 0 dBm|—|1|—|dB|
|||0 dBm < output power <<br>POUTMAX|—|0.5|—|dB|
|Output power variation vs<br>supply at POUTMAX|POUTVAR_V|1.8 V < VVREGVDD< 3.3 V using<br>DC-DC converter|—|2.1|—|dB|
|Output power variation vs<br>temperature at POUTMAX|POUTVAR_T|From -40 to +85 °C, PAVDD con-<br>nected to DC-DC output|—|1.7|—|dB|
|||From -40 to +85 °C, PAVDD con-<br>nected to external supply|—|1.7|—|dB|
|Output power variation vs RF<br>frequency at POUTMAX|POUTVAR_F|Over RF tuning frequency range,<br>PAVDD connected to external<br>supply|—|0.3|—|dB|
|RF tuning frequency range|FRANGE||2400|—|2483.5|MHz|
|**Note:**<br>1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-<br>ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table.<br>2. The FCC-rated TXP for the BGM13S module family is 19 dBM. For the CE, Japan, and Korea, the maximum TXP is nominally 8<br>dBM. The maximum TXP for each region is reported in the formal certification test reports. The end-product manufacturer must<br>make sure that the country limitations are taken into account when configuring the module.|||||||



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Preliminary Rev. 0.5  |  8 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Electrical Specifications 

## **2.1.4.2  RF Receiver General Characteristics for 2.4 GHz Band** 

Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency=38.4 MHz. RF center frequency 2.45 GHz. Conducted measurement from the antenna feedpoint. 

**Table 2.5.  RF Receiver General Characteristics for 2.4 GHz Band** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|RF tuning frequency range|FRANGE||2400|—|2483.5|MHz|
|Receive mode maximum<br>spurious emission|SPURRX|30 MHz to 1 GHz|—|-57|—|dBm|
|||1 GHz to 12 GHz|—|-47|—|dBm|
|Max spurious emissions dur-<br>ing active receive mode, per<br>FCC Part 15.109(a)|SPURRX_FCC|216 MHz to 960 MHz, Conducted<br>Measurement|—|-55.2|—|dBm|
|||Above 960 MHz, Conducted<br>Measurement|—|-47.2|—|dBm|
|Level above which<br>RFSENSE will trigger1|RFSENSETRIG|CW at 2.45 GHz|—|-24|—|dBm|
|Level below which<br>RFSENSE will not trigger1|RFSENSETHRES|CW at 2.45 GHz|—|-50|—|dBm|
|**Note:**<br>1. RFSENSE performance is only valid from 0||to 85 °C. RFSENSE should be disabled outside this temperature range.|||||



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Preliminary Rev. 0.5  |  9 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Electrical Specifications 

## **2.1.4.3  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate** 

Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency=38.4 MHz. RF center frequency 2.45 GHz. Conducted measurement from the antenna feedpoint. 

**Table 2.6.  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Max usable receiver input<br>level, 0.1% BER|SAT|Signal is reference signal1. Packet<br>length is 20 bytes.|—|10|—|dBm|
|Sensitivity, 0.1% BER|SENS|Signal is reference signal1. Using<br>DC-DC converter.|—|-94.1|—|dBm|
|||With non-ideal signals as speci-<br>fied in RF-PHY.TS.4.2.2, section<br>4.6.1.|—|-93.8|—|dBm|
|Signal to co-channel interfer-<br>er, 0.1% BER|C/ICC|Desired signal 3 dB above refer-<br>ence sensitivity.|—|9.0|—|dB|
|N+1 adjacent channel selec-<br>tivity, 0.1% BER, with allowa-<br>ble exceptions. Desired is<br>reference signal at -67 dBm|C/I1+|Interferer is reference signal at +1<br>MHz offset. Desired frequency<br>2402 MHz ≤ Fc ≤ 2480 MHz|—|-3.3|—|dB|
|N-1 adjacent channel selec-<br>tivity, 0.1% BER, with allowa-<br>ble exceptions. Desired is<br>reference signal at -67 dBm|C/I1-|Interferer is reference signal at -1<br>MHz offset. Desired frequency<br>2402 MHz ≤ Fc ≤ 2480 MHz|—|-1.6|—|dB|
|Alternate selectivity, 0.1%<br>BER, with allowable excep-<br>tions. Desired is reference<br>signal at -67 dBm|C/I2|Interferer is reference signal at ± 2<br>MHz offset. Desired frequency<br>2402 MHz ≤ Fc ≤ 2480 MHz|—|-42.0|—|dB|
|Alternate selectivity, 0.1%<br>BER, with allowable excep-<br>tions. Desired is reference<br>signal at -67 dBm|C/I3|Interferer is reference signal at ± 3<br>MHz offset. Desired frequency<br>2404 MHz ≤ Fc ≤ 2480 MHz|—|-46.4|—|dB|
|Selectivity to image frequen-<br>cy, 0.1% BER. Desired is ref-<br>erence signal at -67 dBm|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion|—|-42.0|—|dB|
|Selectivity to image frequen-<br>cy ± 1 MHz, 0.1% BER. De-<br>sired is reference signal at<br>-67 dBm|C/IIM+1|Interferer is reference signal at im-<br>age frequency ± 1 MHz with 1<br>MHz precision|—|-47.1|—|dB|
|Intermodulation performance|IM|Per Core_4.1, Vol 6, Part A, Sec-<br>tion 4.4 with n = 3|—|-18.4|—|dBm|
|**Note:**<br>1. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 1 Mbps, desired data = PRBS9;<br>interferer data = PRBS15; frequency accuracy better than 1 ppm.|||||||



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Preliminary Rev. 0.5  |  10 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Electrical Specifications 

## **2.1.4.4  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate** 

Unless otherwise indicated, typical conditions are: T = 25 °C, VBATT = 3.3 V. DC-DC on. Crystal frequency=38.4 MHz. RF center frequency 2.45 GHz. Conducted measurement from the antenna feedpoint. 

**Table 2.7.  RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Max usable receiver input<br>level, 0.1% BER|SAT|Signal is reference signal1. Packet<br>length is 20 bytes.|—|10|—|dBm|
|Sensitivity, 0.1% BER|SENS|Signal is reference signal1. Using<br>DC-DC converter.|—|-90.2|—|dBm|
|||With non-ideal signals as speci-<br>fied in RF-PHY.TS.4.2.2, section<br>4.6.1.|—|-89.9|—|dBm|
|Signal to co-channel interfer-<br>er, 0.1% BER|C/ICC|Desired signal 3 dB above refer-<br>ence sensitivity.|—|8.6|—|dB|
|N+1 adjacent channel selec-<br>tivity, 0.1% BER, with allowa-<br>ble exceptions. Desired is<br>reference signal at -67 dBm|C/I1+|Interferer is reference signal at +2<br>MHz offset. Desired frequency<br>2402 MHz ≤ Fc ≤ 2480 MHz|—|-7.6|—|dB|
|N-1 adjacent channel selec-<br>tivity, 0.1% BER, with allowa-<br>ble exceptions. Desired is<br>reference signal at -67 dBm|C/I1-|Interferer is reference signal at -2<br>MHz offset. Desired frequency<br>2402 MHz ≤ Fc ≤ 2480 MHz|—|-11.4|—|dB|
|Alternate selectivity, 0.1%<br>BER, with allowable excep-<br>tions. Desired is reference<br>signal at -67 dBm|C/I2|Interferer is reference signal at ± 4<br>MHz offset. Desired frequency<br>2402 MHz ≤ Fc ≤ 2480 MHz|—|-40.3|—|dB|
|Alternate selectivity, 0.1%<br>BER, with allowable excep-<br>tions. Desired is reference<br>signal at -67 dBm|C/I3|Interferer is reference signal at ± 6<br>MHz offset. Desired frequency<br>2404 MHz ≤ Fc ≤ 2480 MHz|—|-45.1|—|dB|
|Selectivity to image frequen-<br>cy, 0.1% BER. Desired is ref-<br>erence signal at -67 dBm|C/IIM|Interferer is reference signal at im-<br>age frequency with 1 MHz preci-<br>sion|—|-7.6|—|dB|
|Selectivity to image frequen-<br>cy ± 2 MHz, 0.1% BER. De-<br>sired is reference signal at<br>-67 dBm|C/IIM+1|Interferer is reference signal at im-<br>age frequency ± 2 MHz with 2<br>MHz precision|—|-40.30|—|dB|
|Intermodulation performance|IM|Per Core_4.1, Vol 6, Part A, Sec-<br>tion 4.4 with n = 3|—|-18.4|—|dBm|
|**Note:**<br>1. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 2 Mbps, desired data = PRBS9;<br>interferer data = PRBS15; frequency accuracy better than 1 ppm.|||||||



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Preliminary Rev. 0.5  |  11 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Electrical Specifications 

## **2.1.5  Non-Volatile Configuration Storage** 

**Table 2.8.  Non-Volatile Configuration Storage** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Update cycles before failure|UC||10000|—|—|cycles|
|Data retention|RET||10|—|—|years|
|Supply voltage during update|VDD||1.62|—|3.6|V|



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Preliminary Rev. 0.5  |  12 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Electrical Specifications 

## **2.1.6  General-Purpose I/O (GPIO)** 

**Table 2.9.  General-Purpose I/O (GPIO)** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Input low voltage|VIL|GPIO pins|—|—|IOVDD*0.3|V|
|Input high voltage|VIH|GPIO pins|IOVDD*0.7|—|—|V|
|Output high voltage relative<br>to IOVDD|VOH|Sourcing 3 mA, IOVDD ≥ 3 V,<br>Drive Strength = Weak|IOVDD*0.8|—|—|V|
|||Sourcing 1.2 mA, IOVDD ≥ 1.62<br>V,<br>Drive Strength = Weak|IOVDD*0.6|—|—|V|
|||Sourcing 20 mA, IOVDD ≥ 3 V,<br>Drive Strength = Strong|IOVDD*0.8|—|—|V|
|||Sourcing 8 mA, IOVDD ≥ 1.62 V,<br>Drive Strength = Strong|IOVDD*0.6|—|—|V|
|Output low voltage relative to<br>IOVDD|VOL|Sinking 3 mA, IOVDD ≥ 3 V,<br>Drive Strength = Weak|—|—|IOVDD*0.2|V|
|||Sinking 1.2 mA, IOVDD ≥ 1.62 V,<br>Drive Strength = Weak|—|—|IOVDD*0.4|V|
|||Sinking 20 mA, IOVDD ≥ 3 V,<br>Drive Strength = Strong|—|—|IOVDD*0.2|V|
|||Sinking 8 mA, IOVDD ≥ 1.62 V,<br>Drive Strength = Strong|—|—|IOVDD*0.4|V|
|Input leakage current|IIOLEAK|All GPIO except LFXO pins, GPIO<br>≤ IOVDD|—|0.1|30|nA|
|||LFXO Pins, GPIO ≤ IOVDD|—|0.1|50|nA|
|I/O pin pull-up/pull-down re-<br>sistor|RPUD||30|40|65|kΩ|
|Pulse width of pulses re-<br>moved by the glitch suppres-<br>sion filter|tIOGLITCH||15|25|45|ns|
|Output fall time, From 70%<br>to 30% of VIO|tIOOF|CL= 50 pF,<br>Drive Strength = Strong|—|1.8|—|ns|
|||CL= 50 pF,<br>Drive Strength = Weak|—|4.5|—|ns|
|Output rise time, From 30%<br>to 70% of VIO|tIOOR|CL= 50 pF,<br>Drive Strength = Strong|—|2.2|—|ns|
|||CL= 50 pF,<br>Drive Strength = Weak|—|7.4|—|ns|



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Preliminary Rev. 0.5  |  13 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Typical Connection Diagrams 

## **3.  Typical Connection Diagrams** 

## **3.1  Typical BGX13S Connections** 

Typical connections for the BGX13S module are shown in Figure 3.1 Typical Connections for BGX13S on page 14. This diagram shows connections for: 

- Power supplies 

- Reset line 

- external crystal connections 

- UART connection to an embedded host 

- 32.768 kHz crystal - Required in applications that must meet 500 ppm Bluetooth Sleep Clock accuracy requirement. Recommended crystal is KDS part number 1TJG125DP1A0012 or equivalent. 

**Note:** It is recommended to connect the RESETn line to the host CPU. 

**==> picture [457 x 283] intentionally omitted <==**

**----- Start of picture text -----**<br>
Battery / Supply Voltage<br>+3.3 V GND GND<br>GPIO0 RESETn RESETn<br>GPIO1 DNC<br>GPIO2<br>DNC<br>RX UART_TX BGX13S DNC<br>Host CPU     TX UART_RX LFXTAL_P<br>32.768 kHz XTAL<br>RTS UART_CTS<br>LFXTAL_N<br>CTS UART_RTS NC<br>GPIO3<br>NC<br>GPIO4<br>NC<br>GND GND<br>BOOT<br>VBATT 1V8 VDDIO<br>VSS<br>DNC GPIO5 GPIO6 GPIO7 DNC DNC BOOT<br>**----- End of picture text -----**<br>


**Figure 3.1.  Typical Connections for BGX13S** 

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Preliminary Rev. 0.5  |  14 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Layout Guidelines 

## **4.  Layout Guidelines** 

For optimal performance of the BGX13S, please follow the PCB layout guidelines and ground plane recommendations indicated in this section. 

## **4.1  Layout Guidelines** 

This section contains generic PCB layout and design guidelines for the BGX13S module. For optimal performance: 

- Place the module at the edge of the PCB, as shown in the figures in this chapter. 

- Do not place any metal (traces, components, etc.) in the antenna clearance area. 

- Connect all ground pads directly to a solid ground plane. 

- Place the ground vias as close to the ground pads as possible. 

## **Figure 4.1.  BGX13S PCB Top Layer Design** 

The following rules are recommended for the PCB design: 

- Trace to copper clearance 150um 

- PTH drill size 300um 

- PTH annular ring 150um 

## **Important** : 

The antenna area must align with the pads precisely. Please refer to the recommended PCB land pattern for exact dimensions. 

**Figure 4.2.  BGX13S PCB Middle and Bottom Layer Design** 

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Preliminary Rev. 0.5  |  15 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Layout Guidelines 

## **Figure 4.3.  Poor Layout Designs for the BGX13S** 

## Layout checklist for BGX13S: 

1. Antenna area is aligned relative to the module pads as shown in the recommended PCB land pattern. 

2. Clearance area within the inner layers and bottom layer is covering the whole antenna area as shown in the layout guidelines. 

3. The antenna loop is implemented on the top layer as shown in the layoyt guidelines. 

4. All dimensions within the antenna area are precisely as shown in the recommended PCB land pattern. 

5. The module is placed near the edge of the PCB with max 1mm indentation. 

6. The module is not placed in the corner of the PCB. 

## **4.2  Effect of PCB Width** 

The BGX13S module should be placed at the center of the PCB edge. The width of the board has an impact to the radiated efficiency and, more importantly, there should be enough ground plane on both sides of the module for optimal antenna performance. Figure 4.4 BGX13S PCB Top Layer Design on page 16 gives an indcation of ground plane size vs. maximum achievable range. 

## **Figure 4.4.  BGX13S PCB Top Layer Design** 

The impact of the board size to the radiated performance is a generic feature of all PCB and chip antennas and it is not a unique feature of the BGX13S. For the BGX13S the depth of the board is not important and does not impact the radiated performance. 

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Preliminary Rev. 0.5  |  16 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Layout Guidelines 

## **4.3  Effect of Plastic and Metal Materials** 

The antenna on the BGX13S is insensitive to the effects of nearby plastic and other materials with low dielectric constant. No separation between the BGX13S and plastic or other materials is needed. The board thickness does not have any impact the module. 

Any metal within the antenna area or in close proximity to the antenna area may detune the antenna. In this case it is possible to retune the antenna by adjusting the width of the antenna loop. To avoid detuning of the antenna, the minimum distance to any metal should be more than 3 mm. Encapsulating the module inside metal casing will prevent the radiation of the antenna. 

Figure 4.5 Antenna Tuning on page 17 shows how it is possible to adjust the frequency of the antenna by adjusting the width of the antenna loop. The antenna is extremely robust against any objects in close proximity or in direct contact with the antenna and it is recommended not to adjust the dimensions of the antenna area unless it is clear that a metal object, such as a coin cell battery, within the antenna area is detuning the antenna. 

**Figure 4.5.  Antenna Tuning** 

## **4.4  Effects of Human Body** 

Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range. 

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Preliminary Rev. 0.5  |  17 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Layout Guidelines 

## **4.5  2D Radiation Pattern Plots** 

**Figure 4.6.  Typical 2D Radiation Pattern – Front View** 

**Figure 4.7.  Typical 2D Radiation Pattern – Side View** 

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Preliminary Rev. 0.5  |  18 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Layout Guidelines 

**Figure 4.8.  Typical 2D Radiation Pattern – Top View** 

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Preliminary Rev. 0.5  |  19 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Pin Definitions 

## **5.  Pin Definitions** 

## **5.1  BGX13S Device Pinout** 

||||||||||||||||N/C|N/C||N/C|N/C|BOOT|N/C||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||||||||||||||||||||||||
||||||||||||||||||||||||||
|VSS||47|||||||||VSS||46||35|||34||33|32|31||VSS|
||||||||||||||||||||||||||
|VSS||49||||||||||||||||||||30||N/C|
||||||||||||||||||||||||||
|||||||||||||||||||||||29||N/C|
|VSS||1|||||||||VSS||48||||||||||||
|ANTENNA||2|45|44|43||||42||41||40||39|||38||37|36|28<br>27||GPIO7<br>GPIO6|
|RF<br>VSS||3<br>4|VSS|RESETn|N/C||||N/C||N/C||N/C||N/C|||N/C||N/C|N/C|26<br>25||GPIO5<br>N/C|
|VSS||5||||||||||||||||||||24||IOVDD|
|N/C||6||VSS|||50||||||VSS|||51||||||23||1V8|
|N/C||7|||||||||||||||||||||||
|N/C||8||||||||||||||||||||22<br>21||VBATT<br>LFXTAL_N|
|N/C||9|10|11|12||||13||14||15||16|||17||18|19|20||VSS|
||||||||||||||||||||||||||
||||GPIO0|GPIO1|GPIO2||||UART_TX||UART_RX||UART_CTS||UART_RTS|||GPIO3||GPIO4|LFXTAL_P||||



**Figure 5.1.  BGX13S Device Pinout** 

The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the supported features for each GPIO pin, see or . 

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Preliminary Rev. 0.5  |  20 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Pin Definitions 

## **Table 5.1.  BGX13S Device Pinout** 

|**Pin Name**|**Pin(s)**|**Description**|
|---|---|---|
|VSS|1<br>4<br>5<br>20<br>31<br>45<br>46<br>47<br>48<br>49<br>50<br>51|Ground|
|RF|3|50 Ohm I/O for external antenna connection.|
|GPIO0|10|Pin with input/output functionality configured by the command API.|
|GPIO1|11|Pin with input/output functionality configured by the command API.|
|GPIO2|12|Pin with input/output functionality configured by the command API.|
|GPIO3|17|Pin with input/output functionality configured by the command API.|
|GPIO4|18|Pin with input/output functionality configured by the command API.|
|GPIO5|26|Pin with input/output functionality configured by the command API.|
|GPIO6|27|Pin with input/output functionality configured by the command API.|
|UART_TX|13|Digital output|
|UART_RX|14|Digital input|
|UART_CTS|15|Digital input|
|UART_RTS|16|Digital output|
|GPI07|28|Pin with input/output functionality configured by the command API.|
|VBATT|22|Battery supply voltage input to the internal DC-DC and analog supply.|
|IOVDD|24|Digital IO power supply.|
|LFXTAL_P|19|Low frequency external oscillator pin.|
|LFXTAL_N|21|Low frequency external oscillator pin.|
|RESETn|44|Reset input, active low. To Apply an external reset source to this pin, it is required<br>to only drive this pin low during reset, and let the internal pull-up ensure that reset<br>is released.|
|ANTENNA|2|50 Ohm input, pin for internal 2.4 GHz antenna|
|1V8|23|1.8V output of the internal DC-DC converer. Internally decoupled - do not add ex-<br>ternal decoupling.|
|BOOT|33|Digital input to force module entrance into DFU bootlading state. See commandA-<br>PI documentation for functional details.|



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Preliminary Rev. 0.5  |  21 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Pin Definitions 

|**Pin Name**|**Pin(s)**|**Description**|
|---|---|---|
|N/C|6<br>7<br>8<br>9<br>10<br>11<br>25<br>29<br>30<br>32<br>34<br>35<br>36<br>37<br>38<br>39<br>40<br>41<br>42<br>43|No Connect.|



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Preliminary Rev. 0.5  |  22 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Functional Overview 

## **6.  Functional Overview** 

## **6.1  Introduction** 

The BGX13S creates a Bluetooth 5 compliant BLE cable replacement interface, facilitating a BLE link to a second embedded device or a mobile device. An embedded MCU controls the device and communicates across the BLE link through a serial interface and control signals. Parameters stored in non-volatile memory and configurable through the serial interface adjust performance characteristics of the device. Silicon Labs offers iOS and Android mobile libraries for Blue Gecko Xpress devices to speed mobile development and simplify communication with the device. This library also controls OTA management, facilitating secure and reliable updates to the device’s embedded stack. 

This functional overview does not cover each command supported by the command API. The complete command API specification is available at www.devtools.silabs.com/BGXCommandAPI(PLACEHOLDER) 

## **6.2  Communication Use Cases** 

The BGX13S family facilitates two types of BLE communication links: 

- BGX-to-mobile 

- BGX-to-BGX 

In the BGX-to-mobile communication use case, the BGX13S operates as a peripheral that is discoverable and connectable when configured to that state through either the command API or the pin states driven by the embedded MCU. Using the Xpress mobile library, mobile applications can scan for BGX13S devices, connect, and communicate with the device in both streaming and remote command modes, where the mobile app can execute command API functions remotely. 

In the BGX-to-BGX communication use case, one BGX13S must be configured as the central and one or more other BGX devices should be configured as a peripheral. Devices can be configured at runtime through the command API, or those settings can be saved to non-volatile memory so that each device wakes from power-on or low power states as either a peripheral or central. For more information on advertising and connection options, please see the command API documentation. 

## **6.3  Embedded Interface** 

The BGX13S family uses a 8-N-1 USART interface for data and flow control signalling. The interface is used both for a raw data streaming interface and a command interface, depending on additional hardware pin configuration. 

UART_TX and UART_RX are defined with flow directions relative to the BGX. Bytes sent from the embedded host to the BGX use the UART_RX pin. Bytes sent from the BGX to the embedded host appear on the UART_TX pin. 

UART_CTS is a digital input that controls the state of the UART_RTS digital output on the other end of the wireless link. Assertion of a CTS/RTS pair signals that the embedded MCU driving its respective UART_CTS is available to receive bytes. 

The baud rate of the BGX13S is a configurable parameter. For information on the process by which a baud rate change gets processed and executed by the device, please see the command API documentation. 

State control signals and visual indicators described below can be assigned to any of the GPIO pins through the command API. These settings can be stored in non-volatile memory and take effect during the next power cycle. For information on configuration of standard GPIO and available special function I/O available on the device, please see the command API documentation. 

## **6.4  Command Mode and Streaming Mode** 

The BGX13S is designed to wake and offer optimized serial interface with hardware follow control. When operating in a peripheral role and when flow control signals are monitored, the device may never need to leave streaming mode during operation. 

However, when use cases require more advanced runtime configuration, the device can switch to command interface through pin or escape sequence. Commands defined here can control scanning, advertising, connection state, and GPIO settings. 

The command interface is also used to configure and store customizable parameters. 

Streaming mode can be switched to command mode through an escape sequence of characters if the sequence has been previously saved in the device's configuration. A comand can be issued in command mode to switch to streaming mode. Stream mode and command mode entrance can be controlled through a device port pin state, if a pin has been previously defined for that purpose. 

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Preliminary Rev. 0.5  |  23 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Functional Overview 

## **6.5  Command API** 

Each command begins with a command name followed by arguments, and the syntax of each command is defined in the command API documentation. 

The command interface saves settings as key-value pairs. These values can be used at runtime to modify the operational state, and they can also be stored in non-volatile memory. Values stored in non-volatile memory function to configure the device's startup/default state. 

## **6.6  GPIO Control** 

The BGX13S offers 8 GPIO pins. These pins can be configured as state control pins or visual indicator pins. Alternatively, they can be used as general purpose I/O pins. Digital output settings can be set and digital input state can be read through the command interface locally or remotely through the remote command execution using the mobile libraries. 

## **6.7  Device Configuration** 

Device configuration is handled through the command API, where commands are executed when the serial interface is set to operate in command mode. These commands can also be executed remotely through the mobile library unless prohibited through previous configuration. 

Additionally, a device configuration can be generated and saved using Simplicity Studio's Xpress Configurator tool. A generated configuration can be submitted to Silicon Labs through the process defined in that application. Silicon Labs will then validate the configuration request, generate a custom orderable part number, and deliver first article samples for testing. Developers should contact sales representatives for more information about this process. Once first article samples have been validated by the customer, this custom orderable part number can be ordered directly from Silicon Labs. 

## **6.8  Security Features** 

BGX13S devices communicate with LE secure connections,establishing encrypted communication upon connection. 

Device OTA requires an encrypted image signed by Silicon Laboratories. Only firmware developed, signed, and encrypted by Silicon Labs can be bootloaded successfully on the device. 

## **6.9  OTA** 

The BGX13S supports secure OTA of the embedded stack and the command interface. Images are encrypted and signed by Silicon Laboratories. OTA can be performed through the mobile library APIs. Specific device firmware versions can be selected and programmed through these APIs. See command API documentation for more information. 

Orders of the default device OPN will ship with the latest release version of the device firmware. The firmware version is not guaranteed to be the same for all items shipped. No firmware update for an OPN will break backwards compatibility with existing functionality, within functional limits specified in this document and as noted in command API documentation. 

Contact Silicon Labs technical support for information on customer factory programming options for custom OPN ordering with a specified device firmware version and for customer factory programming options. 

## **6.10  Direct Test Mode Support** 

The BGX13S 's command API offers a command set that configure the device to support the Direct Test Mode (DTM) protocol as defined in the Bluetooth Core Specification Version 4.2, Volume 6, part F. 

See the command API for information about commands to support specific DTM test procedures. 

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Preliminary Rev. 0.5  |  24 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Package Specifications 

## **7.  Package Specifications** 

## **7.1   BGX13S Package Marking** 

The figure below shows the package markings printed on the module. 

**Figure 7.1.  BGX13S Package Marking** 

## **Explanations** : 

|**Marking**|**Explanation**|
|---|---|
|BGM13SENG|The part number designation<br>1. Family Code (B=Blue)<br>2. G (Gecko)<br>3. M (Module)<br>4. Series (1,2,...)<br>5. Device Configuration (1,2,...)<br>6. Module Type (S= SiP Module, P= PCB Module)<br>7. ENG = Engineering Status|
|FCCID13|FCC Certification ID|
|IC5123A-13|IC5123A-13|
|MSIP-CRM-BGM-13|KC (Korea) Certification ID|
|YWWTTTT|1. Y = Manufacturing Year<br>2. WW = Manufacturing Work Week<br>3. TTTT = Trace Code|



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Preliminary Rev. 0.5  |  25 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Package Specifications 

## **7.2  BGX13S Package Dimensions** 

**Figure 7.2.  BGX13S Package Dimensions** 

|**Dimension**|**MIN**|**NOM**|**MAX**|
|---|---|---|---|
|A|1.20|1.30|1.40|
|A1|0.26|0.30|0.34|
|A2|0.95|1.00|1.05|
|b|0.27|0.32|0.37|
|D|6.50 BSC|||
|D2|2.92 BSC|||



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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Package Specifications 

|**Dimension**|**MIN**|**NOM**|**MAX**|
|---|---|---|---|
|D3|4.50 BSC|||
|D4|0.68 BSC|||
|D5|0.60 BSC|||
|e|0.50 BSC|||
|E|6.50 BSC|||
|E2|1.00 BSC|||
|E3|5.50 BSC|||
|E4|4.00 BSC|||
|E5|0.60 BSC|||
|L|0.43|0.48|0.53|
|L1|0.11|0.16|0.21|
|L2|0.34|0.39|0.44|
|L3|0.24|0.29|0.34|
|L4|0.14|0.19|0.24|
|L5|0.62|0.67|0.72|
|eD1|1.20 BSC|||
|eD2|2.40 BSC|||
|eD3|0.07 BSC|||
|eD4|1.50 BSC|||
|eE1|0.30 BSC|||
|eE2|0.20 BSC|||
|eE3|1.60 BSC|||
|eE4|1.65 BSC|||
|eE5|0.80 BSC|||
|aaa|0.10|||
|bbb|0.10|||
|ccc|0.10|||
|ddd|0.10|||
|eee|0.10|||



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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Package Specifications 

|**Dimension**|**MIN**|**NOM**|**MAX**|
|---|---|---|---|
|**Note:**<br>1. All dimensions shown are in millimeters (mm) unless otherwise noted.<br>2. Tolerances are:<br>a. Decimal:<br>X.X = ±0.1<br>X.XX = ±0.05<br>X.XXX = ±0.03<br>b. Angular:<br>±0.1 Degrees<br>3. Dimensioning and Tolerancing per ANSI Y14.5M-1994.<br>4. This drawing conforms to the JEDEC Solid State Outline MO-220.<br>5. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.<br>6. Hatching lines means package shielding area.<br>7. Solid pattern (3.1x3.1mm) shows non-shielding area including its side walls. For side wall, borderline between shielding area and<br>not-shielding area could not be defined clearly like top side.||||



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Preliminary Rev. 0.5  |  28 

BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Package Specifications 

## **7.3   BGX13S Recommeded PCB Land Pattern** 

This section describes the recommended PCB land pattern for the BGX13S. The antenna copper clearance area is shown in Figure 7.3 BGX13S Recommended Antenna Clearance on page 29, while the X-Y cordinates of pads relative to the origin are shown in Table 7.1 BGX13S Pad Coordinates and Sizing on page 29. The origin is the center point of pin number 47. It is very important to align the antenna area relative to the module pads precisely. 

**Figure 7.3.  BGX13S Recommended Antenna Clearance** 

**Table 7.1.  BGX13S Pad Coordinates and Sizing** 

|**Pad No.**|**Pad coordinates (X,Y)**|**Pad size (mm)**|
|---|---|---|
|47|Pad Center, Origin (0,0)|0.32 x 0.48|
|1|(0,-1.60)||
|2|(0,-2.10)||
|9|(0,-5.60)||
|10|(0.60,-5.75)||
|19|(5.10, -5.75)||
|20|(5.70,-5.60)||
|31|(5.70,-0.10)||
|32|(5.10,-0.05)||
|36|(5.10,-1.65)||
|45|(0.60,-1.65)||
|49|(0,-1.00)||
|46|(2.92,0)||
|50|(1.65,-3.70)|0.67 x 0.67|
|51|(4.05,-3.70)||



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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Package Specifications 

**Figure 7.4.  BGX13S Recommended PCB Land Pattern** 

**Table 7.2.  BGX13S Recommended PCB Land Pattern** 

|**Symbol**|**NOM (mm)**|**NOM (mm)**|
|---|---|---|
|b|0.32 BSC|0.32 BSC|
|D1|5.50 BSC|5.50 BSC|
|D2|3.70 BSC|3.70 BSC|
|D3|4.00 BSC|4.00 BSC|
|eD1|1.00 BSC|1.00 BSC|
|eD2|0.60 BSC|0.60 BSC|
|eD3|0.15 BSC|0.15 BSC|
|e|0.50 BSC|0.50 BSC|
|E1|5.70 BSC|5.70 BSC|
|E2|5.10 BSC|5.10 BSC|
|E3|3.60 BSC|3.60 BSC|
|E4|2.92 BSC|2.92 BSC|
|E5|1.65 BSC|1.65 BSC|
|E6|4.50 BSC|4.50 BSC|
|E7|4.50 BSC|4.50 BSC|
|L|0.48 BSC|0.48 BSC|
|L1|0.67 BSC|0.67 BSC|
|eE1|0.60 BSC|0.60 BSC|
|eE2|0.60 BSC|0.60 BSC|
|eE3|2.40 BSC|2.40 BSC|



## **Notes** : 

1. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05mm is assumed. 

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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Package Specifications 

2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 

3. This Land Pattern Design is based on the IPC-7351 guidelines. 

4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 

5. The stencil thickness should be 0.100mm (4 mils). 

6. The stencil aperture to land pad size recommendation is 70% paste coverage. 

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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Tape and Reel Specifications 

## **8.  Tape and Reel Specifications** 

## **8.1  Tape and Reel Packaging** 

This section contains information regarding the tape and reel packaging for the BGX13S Blue Gecko Module. 

## **8.2  Reel and Tape Specifications** 

- Reel material: Polystyrene (PS) 

- Reel diameter: 13 inches (330 mm) 

- Number of modules per reel: 1000 pcs 

- Disk deformation, folding whitening and mold imperfections: Not allowed 

- Disk set: consists of two 13 inch (330 mm) rotary round disks and one central axis (100 mm) 

- Antistatic treatment: Required 

- Surface resistivity: 10[4] - 10[9] Ω/sq. 

**Figure 8.1.  Reel Dimensions - Side View** 

|**Symbol**|**Dimensions [mm]**|
|---|---|
|W0|32.5 ± 0.3|
|W1|37.1 ± 1.0|



**Figure 8.2.  Cover tape information** 

|**Symbol**|**Dimensions [mm]**|
|---|---|
|Thickness (T)|0.061|
|Width (W)|25.5 + 0.2|



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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Tape and Reel Specifications 

**Figure 8.3.  Tape information** 

## **8.3  Orientation and Tape Feed** 

The user direction of feed, start and end of tape on reel and orientation of the modules on the tape are shown in the figure below. 

**Figure 8.4.  Module Orientation and Feed Direction** 

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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Tape and Reel Specifications 

## **8.4  Tape and Reel Box Dimensions** 

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Figure 8.5.  Tape and Reel Box Dimensions<br>Symbol Dimensions [mm]<br>W2 368<br>W3 338<br>W4 72<br>——<br>8.5  Moisture Sensitivity Level<br>Reels are delivered in packing which conforms to MSL3 (Moisture Sensitivity Level 3) requirements.<br>**----- End of picture text -----**<br>


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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Soldering Recommendations 

## **9.  Soldering Recommendations** 

## **9.1  Soldering Recommendations** 

This section describes the soldering recommendations for the BGX13S module. 

BGX13S is compatible with industrial-standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven, and particular type of solder paste used. 

- Refer to technical documentations of particular solder paste for profile configurations. 

- Avoid using more than two reflow cycles. 

- A no-clean, type-3 solder paste is recommended. 

- A stainless steel, laser-cut, and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 

- Recommended stencil thickness is 0.100 mm (4 mils). 

- Refer to the recommended PCB land pattern for an example stencil aperture size. 

- For further recommendation, please refer to the JEDEC/IPC J-STD-020, IPC-SM-782 and IPC 7351 guidelines. 

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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Certifications 

## **10.  Certifications** 

## **10.1  Certifications Pending** 

Certifications for the BGX13S are not yet complete. Certification details will be provided in future versions of this document. 

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BGX13S Blue Gecko Xpress _Bluetooth_[®] SiP Module Data Sheet Revision History 

## **11.  Revision History** 

## **Revision 0.5** 

August 2018 

- Public Release 

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Preliminary Rev. 0.5  |  37 

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**----- Start of picture text -----**<br>
Simplicity Studio<br>One-click access to MCU and<br>wireless tools, documentation,<br>software, source code libraries &<br>more. Available for Windows,<br>Mac and Linux!<br>IoT Portfolio SW/HW Quality Support and Community<br>www.silabs.com/IoT www.silabs.com/simplicity www.silabs.com/quality community.silabs.com<br>**----- End of picture text -----**<br>


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