FISCHER ELEKTRONIK
Found 197 products. Showing up to 30 products per page (7 pages).
Heat Sink, For Transistors, TO-220, Black Anodized, 17 °C/W, TO-220, 30.4 mm, 31.2 mm, 12.5 mm
Heat Sink, For Transistors, TO-220, Black Anodized, 26 °C/W, TO-220, 14.5 mm, 13.51 mm, 25.4 mm
Thermally Conductive Foil, 5 W/m.K, 400 mm x 200 mm x 1 mm
Thermally Conductive Foil, 5 W/m.K, 400 mm x 200 mm x 1.5 mm
Thermally Conductive Foil, 5 W/m.K, 400 mm x 200 mm x 2 mm
Thermally Conductive Foil, 5 W/m.K, 400 mm x 200 mm x 2.5 mm
Thermally Conductive Foil, 5 W/m.K, 400 mm x 200 mm x 6.5 mm
Thermally Conductive Foil, 8 W/m.K, 400 mm x 200 mm x 0.5 mm
Thermally Conductive Foil, 8 W/m.K, 400 mm x 200 mm x 1 mm
Thermally Conductive Foil, 8 W/m.K, 400 mm x 200 mm x 2 mm
Thermally Conductive Foil, 8 W/m.K, 400 mm x 200 mm x 2.5 mm
Thermally Conductive Foil, 8 W/m.K, 400 mm x 200 mm x 4 mm
Thermally Conductive Foil, 8 W/m.K, 400 mm x 200 mm x 4.5 mm
Thermally Conductive Foil, 8 W/m.K, 400 mm x 200 mm x 6 mm
Heat Sink, DIP, Glue-On, 50 °C/W, DIP, 19 mm, 4.8 mm, 6.3 mm
Heat Sink, DIP, Glue-On, 46 °C/W, DIP, 6.3 mm, 4.8 mm, 19 mm
Heat Sink, Square, PCB, For Ball Grid Arrays, 28.5 °C/W, BGA, 10 mm, 10 mm, 10 mm
Heat Sink, Square, PCB, For Ball Grid Arrays, 27.4 °C/W, BGA, 14 mm, 10 mm, 14 mm
Heat Sink, For Ball Grid Array, 23 °C/W, BGA, PLCC, 23 mm, 6 mm, 23 mm
Heat Sink, Square, PCB, For Ball Grid Arrays, 18.5 °C/W, BGA, 27 mm, 10 mm, 27 mm
Heat Sink, Square, PCB, For Ball Grid Arrays, 13.5 °C/W, BGA, 27 mm, 22 mm, 27 mm
Heat Sink, For Ball Grid Array, 20 °C/W, BGA, 27 mm, 6 mm, 27 mm
Heat Sink, Square, PCB, For Ball Grid Arrays, 17 °C/W, BGA, 31 mm, 10 mm, 31 mm
Heat Sink, For Ball Grid Array, 17 °C/W, BGA, 35 mm, 6 mm, 35 mm
