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FK 212 SA-CB
Heat Sink, TO-220/SOT-32, 18 °C/W, SOT-32, TO-220, 25.4 mm, 8 mm, 30 mm
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: FISCHER ELEKTRONIK
- Product type: Natural Convection Heat Sinks
- Thermal Resistance:18°C/W; Packages Cooled:SOT-32, TO-220; External Width - Metric:25.4mm; External Height - Metric:8mm; External Length - Metric:30; Available until stocks are exhausted
- SVHC: No SVHC (25-Jun-2025)
- Product Range: -
- Packages Cooled: SOT-32, TO-220
- Heat Sink Material: Aluminium
- Thermal Resistance: 18°C/W
- External Width - Metric: 25.4mm
- External Height - Metric: 8mm
- External Length - Metric: 30mm
- External Width - Imperial: 1"
- External Diameter - Metric: -
- External Height - Imperial: 0.31"
- External Length - Imperial: 1.18"
- External Diameter - Imperial: -
| Delivery and price | |
|---|---|
| Units per pack | 100 |
| Price | 0.812 € |
| Current stock | 100+ |
| Lead time | 30 days |
H **A** H **B** **C** **D** **E** **F** **G** **H** **I** **K** **L** **M** **H** **==> picture [4 x 1] intentionally omitted <==** **----- Start of picture text -----**<br> Hola1<br>**----- End of picture text -----**<br> ## **Heatsinks for transistors in plastic case** ## **art. no.** sd ## **art. no. FK 211 32 ... art. no.** Po **FK 212 CB ... art. no.** ts—~S **FK 215 32 ... art. no.** **FK 216 SA art. no.** **FK 222 ... art. no.** **FK 222 THF ... art. no. FK 247 220 ... please indicate: ... surface treatment SA=black anodised MI=solderable** The heatsinks FK 211 ... 216 are available without hole pattern as well, e.g. FK 211 SA **H** **H Retaining springs for transistors** ➔ **A 111 – 116 Mounting material for semiconduct.** ➔ **E 34 – 38 H Heatsinks for D PAK** ➔ **C 17 Mounting pads** ➔ **E 36 GEL thermal conductive foil** ➔ **E 7 Mounting pads for transistors** ➔ **E 37 Insulator caps** ➔ **E 40 Mounting parts for heatsinks** ➔ **E 39 – 40** **C 7** **N** **H**
Updated at April 29, 2026
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