Cooling & Thermal Management

Heat Sink, 0.592 °C/W, 125 mm, 50 mm, 200 mm

Heat Sink, 0.503 °C/W, 125 mm, 50 mm, 250 mm

Heat Sink, Square, PCB, For Ball Grid Arrays, 40 °C/W, BGA, 23 mm, 10 mm, 23 mm

Heat Sink, Square, PCB, For Ball Grid Arrays, 40 °C/W, BGA, 23 mm, 10 mm, 23 mm

Heat Sink, Square, PCB, For Ball Grid Arrays, 23.4 °C/W, BGA, 23 mm, 18 mm, 23 mm

Heat Sink, Square, PCB, For Ball Grid Arrays, 23.4 °C/W, BGA, 23 mm, 18 mm, 23 mm

Heat Sink, Square, PCB, For Ball Grid Arrays, 30.6 °C/W, BGA, 27 mm, 10 mm, 27 mm

Heat Sink, Square, PCB, For Ball Grid Arrays, 30.6 °C/W, BGA, 27 mm, 10 mm, 27 mm

Heat Sink, Square, PCB, For Ball Grid Arrays, 20.3 °C/W, BGA, 27 mm, 18 mm, 27 mm

Heat Sink, Square, PCB, For Ball Grid Arrays, 20.3 °C/W, BGA, 27 mm, 18 mm, 27 mm

HEAT SINK

Heat Sink, For Ball Grid Array, 15.3 °C/W, BGA, 35 mm, 18 mm, 35 mm

HEAT SINK

HEAT SINK

HEAT SINK

HEAT SINK, BLACK ANODIZED

HEATSINK, NATURAL CONVECTION, 1.51°C/W

HEAT SINK

HEAT SINK

Thermally Conductive Material, Silicone, 1 W/m.K, 400 mm L x 200 mm W x 2 mm T

Thermally Conductive Material, Silicone, 1 W/m.K, 400 mm L x 200 mm W x 5 mm T

Thermally Conductive Material, 2 W/m.K, 400 mm L x 200 mm W x 2 mm T

Thermally Conductive Material, 2 W/m.K, 400 mm L x 200 mm W x 5 mm T

Thermally Conductive Material, 3 W/m.K, 400 mm L x 200 mm W x 2 mm T

Thermally Conductive Material, 3 W/m.K, 400 mm L x 200 mm W x 5 mm T

Thermally Conductive Material, 4 W/m.K, 400 mm L x 200 mm W x 2 mm T

Thermally Conductive Material, 4 W/m.K, 400 mm L x 200 mm W x 3 mm T

Thermally Conductive Material, 4 W/m.K, 400 mm L x 200 mm W x 4 mm T

Thermally Conductive Material, 5 W/m.K, 400 mm L x 200 mm W x 2 mm T

Thermally Conductive Material, 5 W/m.K, 400 mm L x 200 mm W x 3 mm T