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Cooling & Thermal Management

Found 1495 products. Showing up to 30 products per page.

Subcategories

Manufacturer

6237BG: HEAT SINK
Boyd 6237BG

HEAT SINK

624-25ABT3: HEAT SINK
Wakefield 624-25ABT3

HEAT SINK

624-25ABT4E: HEAT SINK, ALUMINIUM, 21MM
Wakefield 624-25ABT4E

HEAT SINK, ALUMINIUM, 21MM

624-45ABT3: HEAT SINK
Wakefield 624-45ABT3

HEAT SINK

624-60AB: HEAT SINK
Wakefield 624-60AB

HEAT SINK

625-25ABT4E: HEAT SINK, ALUMINIUM, 25MM
Wakefield 625-25ABT4E

HEAT SINK, ALUMINIUM, 25MM

6273B: HEAT SINK
Boyd 6273B

HEAT SINK

6298BG: Heat Sink, TO-220/218, 3.9 °C/W, TO-218, TO-220, 41.91 mm, 38 mm, 25.4 mm
Boyd 6298BG

Heat Sink, TO-220/218, 3.9 °C/W, TO-218, TO-220, 41.91 mm, 38 mm, 25.4 mm

634-10ABPE: HEAT SINK
Wakefield 634-10ABPE

HEAT SINK

637-10ABEP: Heat Sink, For Board Level Power Semiconductor, 5.8 °C/W, TO-220, 34.9 mm, 25.4 mm, 12.7 mm
Wakefield 637-10ABEP

Heat Sink, For Board Level Power Semiconductor, 5.8 °C/W, TO-220, 34.9 mm, 25.4 mm, 12.7 mm

637-10ABPE: HEAT SINK
Wakefield 637-10ABPE

HEAT SINK

637-15ABEP: Heat Sink, For Board Level Power Semiconductor, 11 °C/W, TO-220, 34.9 mm, 38.1 mm, 12.7 mm
Wakefield 637-15ABEP

Heat Sink, For Board Level Power Semiconductor, 11 °C/W, TO-220, 34.9 mm, 38.1 mm, 12.7 mm

637-15ABPE: HEAT SINK
Wakefield 637-15ABPE

HEAT SINK

637303B03000: HEAT SINK EXTRUSION, 1.88°C/W
Boyd 637303B03000

HEAT SINK EXTRUSION, 1.88°C/W

6396BG: Heat Sink, Square, PCB, With Radial Fins, 5.6 °C/W, TO-218, TO-220, 41.91 mm, 25.4 mm, 25.4 mm
Boyd 6396BG

Heat Sink, Square, PCB, With Radial Fins, 5.6 °C/W, TO-218, TO-220, 41.91 mm, 25.4 mm, 25.4 mm

6399BG: Heat Sink, TO-220/218, 3.3 °C/W, TO-220, 41.91 mm, 50 mm, 25.4 mm
Boyd 6399BG

Heat Sink, TO-220/218, 3.3 °C/W, TO-220, 41.91 mm, 50 mm, 25.4 mm

6400BG: Heat Sink, TO-220/218, 2.7 °C/W, TO-218, TO-220, TO-247, 41.91 mm, 63.5 mm, 25.4 mm
Boyd 6400BG

Heat Sink, TO-220/218, 2.7 °C/W, TO-218, TO-220, TO-247, 41.91 mm, 63.5 mm, 25.4 mm

642-45AB: HEAT SINK, ALUMINIUM, 35MM, BGA
Wakefield 642-45AB

HEAT SINK, ALUMINIUM, 35MM, BGA

647-15ABPE: HEAT SINK
Wakefield 647-15ABPE

HEAT SINK

65-00-GEL30-0010: Thermally Conductive Material, Dispensable Gel, Silicone, 3.5W/m.K
Chomerics 65-00-GEL30-0010

Thermally Conductive Material, Dispensable Gel, Silicone, 3.5W/m.K

655-26AB: HEAT SINK
Wakefield 655-26AB

HEAT SINK

655-53AB: HEAT SINK
Wakefield 655-53AB

HEAT SINK

656053B07000G: HEAT SINK EXTRUSION, 0.47°C/W, LED
Boyd 656053B07000G

HEAT SINK EXTRUSION, 0.47°C/W, LED

657-15ABPE: HEAT SINK
Wakefield 657-15ABPE

HEAT SINK

657-25ABPE: HEAT SINK
Wakefield 657-25ABPE

HEAT SINK

658-25ABT4E: HEAT SINK, ALUMINIUM, 27.9MM
Wakefield 658-25ABT4E

HEAT SINK, ALUMINIUM, 27.9MM