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ZEPTOSMDC0015F
PPTC RESETTABLE FUSE, 0.2A, 13V, 0201
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: LITTELFUSE
- Product type: Surface Mount PPTCs
- PPTC Case Style:0201 (0603 Metric); Product Range:PolySwitch zeptoSMDC Series; Voltage Rating:13VDC; Holding Current:15mA; Trip Current:80mA; Time to Trip:0.02s; 82AH0215
- Time to Trip: 0.02s
- Trip Current: 80mA
- Product Range: PolySwitch zeptoSMDC Series
- Voltage Rating: 13VDC
- Holding Current: 15mA
- PPTC Case Style: 0201 (0603 Metric)
- Current Rating Max: 200mA
- Operating Temperature Max: 60°C
- Operating Temperature Min: -20°C
- Automotive Qualification Standard: -
| Delivery and price | |
|---|---|
| Units per pack | 5000 |
| Price | 0.204 € |
| Current stock | 100+ |
| Lead time | 30 days |
Datasheet
PTC **Datasheet** **zeptoSMDC Series** Surface Mount HFL_| **RoHS** ## **Description** Littelfuse zeptoSMDC Series PPTC is developed for overcurrent and overtemperature protection in mobile applications. It works to protect battery management ICs and fuel auges. ## **Features** - Maximum electrical rating: 13 VDC - Short circuit current: 82~200mA - Small footprint 0201 size - RoHS compliant - Resets to normal operation after fault is cleared - Help protect battery monitor IC from electrical over-stress - Save space due to small footprint - ISO/TS 16949 certified ## **Additional Information** ## **Applications** - Smartphones and Tablets - Notebook PC - e-Readers - Portable medical equipment - Wearables - Smartwatches - Wireless speakers - Portable game players - Mobile point of sale **Resources Accessories Samples** ## **Electrical Characteristics** |**Part Number**<br>zeptoSMDC0011F|**Initial Resistance**<br>**Ohms @ 25°C**|**Initial Resistance**<br>**Ohms @ 25°C**|**VMAX**<br>**2**<br>**(Vdc)**<br>13|**IMAX**<br>**3**<br>**(mA)**<br>82|**Trip**<br>**Temperature**<br>**°C TYP**<br>125|**Hold Current4**<br>**(mA) @ 25°C**<br>11|**Time to Trip5**|**Time to Trip5**|**Post Process**<br>**Resistance6**|**Post Process**<br>**Resistance6**| |---|---|---|---|---|---|---|---|---|---|---| ||**Min1**<br>10|**Max**<br>80|||||**Current**<br>**(mA)**<br>80|**Time (ms)**<br>**Max**<br>20|**Time (ms)**<br>**ohms**<br>**@ -20°C**<br>**Min**<br>68|**ohms**<br>**@ 60°C**<br>**Max**<br>290| |zeptoSMDC0015F|10|60|13|200|125|15|80|20|28|150| ## **Notes:** **1.** Rmin = Minimum resistance of device in initial (un-soldered) state **2.** Vmax = Maximum voltage device can withstand without damage at rated current (Imax) **3.** Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax) **4.** Ihold = Hold current: maximum current device will pass without tripping in 25°C still air. Values specified using PCB’s with 0.004” x 1.0 ounce copper traces **5.** Time to trip values specified using PCB’s with 0.004” x 1.0 ounce copper traces **6.** With LOCTITE ECCOBOND UF 3915, curing condition: 140°C/20mins, resistance is measured 12 hours post coating curing process © 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 03/16/21 **1** PTC **Datasheet** **zeptoSMDC Series** Surface Mount **==> picture [46 x 52] intentionally omitted <==** **==> picture [312 x 52] intentionally omitted <==** ## **Soldering Parameters** |**Profle Feature**|**Profle Feature**|Pb-Free Assembly| |---|---|---| |**Average Ramp-Up Rate (Liquidus Temp (TL) to peak**||1~3 °C/second max.| |**Preheat:**|**Temperature Min. (Tsmin)**|130 °C| ||**Temperature Max. (Tsmax)**|180 °C| ||**Time Min. to Max (ts)**|90 – 110 seconds| |**Tsmax to TL Ramp-up Rate**||≤2 °C/seconds max.| |**Refow**|**Temperature (TL) (Liquidus)**|217 °C| ||**Time (tL)**|60~70 seconds| |**Peak Temperature (TP)**||240 °C| |**Time within 3°C of actual Peak Temperature (tP)**||35 seconds| |**Ramp-down Rate**||2~4 °C/seconds| |**Time 25°C to peak Temperature (TP)**||300 seconds max.| ## **Physical Specifications** |**Terminal Material**|Solder-Plated Copper (Solder Material: NiAu)<br>| |---|---| |**Lead Solderability**|Meets EIA Specifcation RS186-9E, ANSI/J- STD-<br>002B,Test S| **==> picture [245 x 402] intentionally omitted <==** **----- Start of picture text -----**<br> t P<br>T P<br>Ramp-up<br>T S(max) T L t L<br>Ramp-down<br>Preheat<br>T S(min)<br>t S<br>25<br>time to peak temperatur e Time<br>■ All temperature refer to topside of the package, measured on the package body surface.<br>■ If reflow temperature exceeds the recommended profile, devices may not meet the<br>performance requirements.<br>■ Recommended reflow methods:IR, vapor phase oven, hot air oven.<br>■ Customer should validate that the solder paste amount and reflow recommendations to<br>meet its application<br>■ Recommended maximum paste thickness is 0.25 mm (0.010 inch).<br>■ Devices can be cleaned using standard industry methods and aqueous solvents.<br>■ Devices can be reworked using the standard industry practices (avoid contact to<br>■ the device).<br>Environmental Specifications<br>Operating Temperature -20°C to 60°C<br>+85°C, 1000 hours<br>Passive Aging -25% typical resistance change<br>+65°C, 90%,R.H.,100 hours<br>Humidity Aging -/+15% typical resistance change<br>MIL-STD-202, Method 107G<br>Thermal Shock -33% typical resistance change<br>-40°C to 85°C (20 times)<br>MIL–STD–202, Method 204 Condition A<br>Vibration<br>No change<br>Moisture Sensitivity Level Level 2a, J–STD–020<br>Temperature<br>**----- End of picture text -----**<br> © 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 03/16/21 **2** PTC **Datasheet** **zeptoSMDC Series** Surface Mount **==> picture [46 x 52] intentionally omitted <==** ## **Physical Dimensions** **==> picture [165 x 130] intentionally omitted <==** **----- Start of picture text -----**<br> A B<br>C<br>D<br>**----- End of picture text -----**<br> **==> picture [312 x 52] intentionally omitted <==** ## **Solder Pad Layout** **==> picture [157 x 108] intentionally omitted <==** **----- Start of picture text -----**<br> C A<br>B B<br>**----- End of picture text -----**<br> |**Part Number**|**A**<br>**Min**<br>**Max**|**A**<br>**Min**<br>**Max**|**B**|**B**|**C**|**C**|**D**|**D**| |---|---|---|---|---|---|---|---|---| |||**Max**|**Min**|**Max**|**Min**|**Max**|**Min**|**Max**| |zeptoSMDC0011F|0.55 (0.022)|0.65 (0.026)|-|0.40 (0.016)|0.40 (0.016)|0.50 (0.020)|0.10 (0.004)|0.25 (0.010)| |zeptoSMDC0015F|0.55 (0.022)|0.65 (0.026)|-|0.40 (0.016)|0.40 (0.016)|0.50 (0.020)|0.10 (0.004)|0.25 (0.010)| ## **Packaging** **==> picture [504 x 81] intentionally omitted <==** **----- Start of picture text -----**<br> Recommended Pad Layout Figures [mm(in)]<br>Part Number Ordering Tape & Reel Quantity Minimum Orgder Quantity<br>Dimension A Dimension B Dimension C<br>(Nom) (Nom) (Nom)<br>zeptoSMDC0011F RF5005-000 15,000 15,000 0.45 (0.0178) 0.325 (0.013) 0.250 (0.010)<br>zeptoSMDC0015F RF5006-000 15,000 15,000 0.45 (0.0178) 0.325 (0.013) 0.250 (0.010)<br>**----- End of picture text -----**<br> ## **Part Ordering Number System** **zepto SMDC 0011 F 0201 Size Series Surface Mount Device Hold Current 11mA Lead-Free** ## **Warning** - Electrical performance of the device can differ according to installation conditions. Users should independently evaluate the suitability of the device under the actual application conditions. - Operation beyond maximum ratings may result indevice damage. - Exposure to silicon-based oils, solvents, electrolytes, acids, or similar materials can adversely affect device performance. - The device undergoes thermal expansion during fault conditions. It should be provided with adequate space to allow expansion and should be protected against mechanical stress. - Consult with Littelfuse if the device will experience thermal process other than reflow onto PCB board, such as molding or hand soldering. © 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 03/16/21 **3** PTC **Datasheet** **zeptoSMDC Series** Surface Mount ## **Tape and Reel Specifications** **==> picture [495 x 326] intentionally omitted <==** **----- Start of picture text -----**<br> 40±0.1<br>4±0.1 (10xP0)<br>(P0)<br>0.42±0.03<br>2±0.05<br>∅ 1.55±0.05 1.75±0.05 (T)<br>(P2) (D0) (E)<br>3.5±0.05 0.70±0.03<br>8±0.1<br>(W) (F) (B0)<br>2±0.05 0.53±0.03<br>(P1) (A0)<br>W2 All dimensions in mm<br>W 8 ±0.1<br>P0 4 ± 0.1<br>W1 P1 2 ± 0.05<br>(Measure at Hub)<br>P2 2 ± 0.05<br>∅A ∅N A0 0.53 ± 0.03<br>B0 0.70 ± 0.03<br>D0 1.55 ± 0.05<br>F 3.5 ± 0.05<br>E 1.75 ± 0.05<br>ee ) i<br>ESD Logo T 0.42 ± 0.03<br>Front View<br>**----- End of picture text -----**<br> |**All dimensions in mm**<br>**W**<br>8 ±0.1|**All dimensions in mm**<br>**W**<br>8 ±0.1| |---|---| |**P00**|4 ± 0.1| |**P11**|2 ± 0.05| |**P22**|2 ± 0.05| |**A00**|0.53 ± 0.03| |**B00**|0.70 ± 0.03| |**D00**|1.55 ± 0.05| |**F**|3.5 ± 0.05| |**E**|1.75 ± 0.05| |**T**|0.42 ± 0.03| |**A**|178.0 ± 1.0| |**N**|54.0 ± 0.5| |**W1**|9.5 ± 0.5| |**W2 max**|15.0| **Disclaimer Notice** - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. www.littelfuse.com/disclaimer-electronics. © 2021 Littelfuse, Inc. **4** Specifications are subject to change without notice. ~~a~~ Revised: GD. 03/16/21
Updated at April 12, 2026
Founded in 1927 and headquartered in Chicago, Illinois, Littelfuse is a premier global manufacturer of circuit protection, power control, and sensing technologies. Widely recognized for pioneering the first small, fast-acting protective fuse, the company has grown into an industry leader whose highly reliable components are essential to modern industrial, transportation, and consumer electronics applications worldwide. At the core of the Littelfuse portfolio is an expansive and industry-leading range of circuit protection solutions. This encompasses a massive selection of traditional fuses, fuse holders, and resettable PTC thermistor fuses designed to safely interrupt overcurrent conditions. To defend against electrical overstress, Littelfuse also provides advanced transient voltage suppression (TVS) technologies, including thousands of specialized TVS diodes, TVS varistors, and gas discharge tubes (GDTs) that ensure robust defense against voltage spikes and environmental hazards. Beyond its foundational protection components, Littelfuse manufactures a diverse array of discrete semiconductors, sensors, and switching devices. Engineers rely on their high-performance thyristors, including TRIACs and SCRs, alongside power-efficient Schottky diodes and MOSFETs for demanding power control applications. Complemented by precision proximity sensors and highly reliable reed and solid-state relays, Littelfuse delivers the critical building blocks required for secure, efficient, and complete system design.
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