Z0405MB

**Z0405MB** 

Datasheet 

4 A - Triac in DPAK package 

## **Features** 

**==> picture [65 x 81] intentionally omitted <==**

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A2<br>A1 A2<br>G<br>DPAK<br>**----- End of picture text -----**<br>


- 4 A Triac 

- VDRM / VRRM = 600 V and VDSM / VRSM = 750 V 

- 125 °C maximum junction temperature Tj 

- DPAK package 

- 4 quadrants triacs with IGT = 5 mA 

- Halogen-free molding, lead-free plating 

- ECOPACK2 compliant 

## **Applications** 

**Product status link** Z0405MB 

- Actuators 

- Heating elements 

- Inrush current limiting circuits 

|**Product summary**|**Product summary**|
|---|---|
|**IT(RMS)**|4 A|
|**VDSM/VRSM**|750 V|
|**IGT**|5 mA|
|**Tj max.**|125 °C|



## **Description** 

The Z0405MB series is 4 A Triac housed in compact SMD DPAK. This 4 quadrants device is suited to home appliances or power tools and industrial systems and drives loads up to 4 A. 

**DS14023** - **Rev 1** - **September 2022** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**Z0405MB Characteristics** 

**1 Characteristics** 

**Table 1. Absolute maximum ratings (limiting values)** 

|**Symbol**|**Parameter**||**Value**|**Unit**|
|---|---|---|---|---|
|IT(RMS)|RMS on-state current (full sine wave)|Tc= 107 °C|4|A|
|ITSM|Non repetitive surge peak on-state current (full cycle,<br>Tjinitial = 25 °C)|t = 16.7 ms|16|A|
|||t = 20 ms|15||
|I2t|I2t value for fusing|tp= 10 ms|1.5|A2s|
|dl/dt|Critical rate of rise of on-state current, IG= 2 x IGT, tr<br>≤ 100 ns, f = 120 Hz|Tj= 125 °C|50|A/µs|
|VDRM/VRRM|Repetitive peak off-state voltage|Tj= 125 °C|600|V|
|VDSM/VRSM|Non Repetitive peak off-state voltage, 10 ms||750|V|
|IGM|Maximum peak gate current|tp= 20 µs, Tj= 125 °C|1.2|A|
|PGM|Maximum gate power dissipation||0.5|W|
|Tstg|Storage temperature range||-40 to +125|°C|
|Tj|Operating junction temperature range||-40 to +125|°C|
|TL|Maximum lead temperature for soldering during 10 s||260|°C|



**Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified)** 

|**Symbol**|**Test conditions**|||**Value**|**Unit**|
|---|---|---|---|---|---|
|IGT(1)|VD= 12 V, RL= 33 Ω||Max.|5|mA|
|VGT|VD= 12 V, RL= 33 Ω||Max.|1.3|V|
|VGD|VD= VDRM, RL= 3.3 kΩ|Tj= 125 °C|Min.|0.2|V|
|IL|IG= 1.2 x IGT|I-III-IV|Max.|10|mA|
|||II|Max.|14|mA|
|IH (2)|IT= 500 mA, gate open||Max.|5|mA|
|dV/dt(2)|VD= 67 % VDRM; VR= 67 % VRRM, gate open|Tj= 110 °C|Min.|20|V/µs|
|(dV/dt)c(2)|(dI/dt)c = 1.8 A/ms|Tj= 110 °C|Min.|1|V/µs|



_1. For both polarities of OUT pin referenced to COM pin._ 

_2. For both polarities of A2 referenced to A1._ 

**Table 3. Static characteristics** 

|**Symbol**|**Test conditions**|**Tj**||**Value**|**Unit**|
|---|---|---|---|---|---|
|VTM (1)|ITM= 5.5 A, tp= 380 µs|25 °C|Max.|2|V|
|VTO (1)|Threshold voltage|125 °C|Max.|0.95|V|
|RD(1)|Dynamic resistance|125 °C|Max.|180|mΩ|
|IDRM/IRRM|VD= VR= VDRM= VRRM|25 °C|Max.|5|µA|
|||125°C||0.5|mA|



_1. For both polarities of A2 referenced to A1._ 

**DS14023** - **Rev 1** 

**page 2/11** 

**Z0405MB Characteristics** 

## **Table 4. Thermal resistance** 

|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|Rth(j-c)|Junction to case (AC)|Max.|3|°C/W|
|Rth(j-a)|Junction to ambient: SCU= 0.5 cm²|Typ.|70|°C/W|



**DS14023** - **Rev 1** 

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**Z0405MB Characteristics (curves)** 

## **1.1 Characteristics (curves)** 

**Figure 1. Maximum power dissipation versus on-state Figure 2. Average and DC on-state current versus case RMS current (full cycle) temperature** 

**Figure 3. On-state RMS current versus ambient Figure 4. Relative variation of thermal impedance versus temperature (full cycle) pulse duration** 

**Figure 5. Relative variation of gate triggering current and Figure 6. Surge peak on-state current versus number of voltage versus junction temperature (typical values) cycles** 

**DS14023** - **Rev 1** 

**page 4/11** 

**Z0405MB Characteristics (curves)** 

**Figure 7. Non repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms and corresponding Figure 8. On-state characteristics (maximum values) value of I²t** 

**Figure 9. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values)** 

**Figure 10. Relative variation of critical rate of decrease of main current versus junction temperature** 

**Figure 11. Relative variation of static dV/dt immunity versus junction temperature** 

**Figure 12. Thermal resistance junction to ambient versus copper surface under tab (typical values)** 

**==> picture [224 x 146] intentionally omitted <==**

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Rth(j-a) (°C/W)<br>100<br>DPAK<br>90 ATt  e<br>80<br>sce ree ee<br>70<br>a<br>60<br>50<br>ANSE SSS<br>40 WL}|THEI<br>30<br>a<br>20 poof fp op peee<br>10 S Cu (cm²)<br>0 a<br>0 5 10 15 20 25 30 35 40<br>**----- End of picture text -----**<br>


**DS14023** - **Rev 1** 

**page 5/11** 

**Z0405MB Package information** 

**2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **2.1 DPAK package information** 

- Molding compouned resin is halogen free and meets UL94 flammability standard, level V0 

- Lead-free package leads plating 

## **Figure 13. DPAK package outline** 

**DS14023** - **Rev 1** 

**page 6/11** 

**Z0405MB DPAK package information** 

**Table 5. DPAK package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
|**Ref.**|**Millimeters**|||**Inches(1)**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|2.20|2.30|2.38|0.0866|0.0906|0.0937|
|A1|0.90|1.01|1.10|0.0354|0.0398|0.0433|
|A2|0.00||0.10|0.0000||0.0039|
|b|0.72||0.85|0.0283||0.335|
|b4|5.13|5.33|5.46|0.2020|0.2098|0.2150|
|c|0.47||0.60|0.0185||0.0236|
|c2|0.47||0.60|0.0185||0.0236|
|D|6.00|6.10|6.20|0.2362|0.2402|0.2441|
|D1|5.15|5.40|5.65|0.2028|0.2126|0.2224|
|E|6.50|6.60|6.70|0.2550|0.2598|0.2638|
|E1|4.70|4.85|5.00|0.1850|0.1909|0.1969|
|e|2.186|2.286|2.386|0.0860|0.0900|0.0940|
|H|9.80|10.10|10.40|0.3858|0.3976|0.4094|
|L|1.40|1.50|1.70|0.0551|0.0591|0.0669|
|L1|2.90 REF|||0.1142 REF|||
|L2|0.90||1.25|0.0354||0.0492|
|L3|0.51 BSC|||0.201 BSC|||
|L4|0.60|0.80|1.00|0.0236|0.0315|0.0394|
|L6|1.80 BSC|||0.0709 BSC|||
|ϴ1|5°|7°|9°|5°|7°|9°|
|ϴ2|5°|7°|9°|5°|7°|9°|
|V2|0°||8°|0°||8°|



_1. Dimensions in inches are given for reference only_ 

_Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed._ 

**DS14023** - **Rev 1** 

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**Z0405MB DPAK package information** 

**Figure 14. DPAK recommended footprint (dimensions are in mm)** 

**DS14023** - **Rev 1** 

**page 8/11** 

**Z0405MB Ordering information** 

**3** 

## **Ordering information** 

**Figure 15. Ordering information scheme** 

**Table 6. Ordering information** 

|**Order code**<br>~~es~~|**Marking**<br>~~ee~~|**Package**<br>~~ee~~|**Weight**<br>~~ee~~|**Base qty.**<br>~~ee~~|**Delivery mode**|
|---|---|---|---|---|---|
|Z0405MB<br>~~es~~|Z0405MB<br>~~ee~~|DPAK<br>~~ee~~|0.3 g<br>~~ee~~|2500<br>~~ee~~|Tape and reel|



**DS14023** - **Rev 1** 

**page 9/11** 

**Z0405MB** 

## **Revision history** 

## **Table 7. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|05-Sep-2022|1|Initial release.|



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**Z0405MB** 

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