X1G004461000312

## Clock OSC 

## SG5032CBN 

## Product name SG5032CBN     133.333000MHz TJGA Product Number / Ordering code X1G0044610003xx 

## X1G0044610003xx 

Please refer to the 8.Packing information about xx (last 2 digits) 

## Output waveform CMOS 

Pb free / Complies with EU RoHS directive Reference weight Typ. 52 mg 

|**2.Specifications(characteristics)**<br>~~a~~<br>~~**p**o~~|**2.Specifications(characteristics)**<br>~~a~~<br>~~**p**o~~|**2.Specifications(characteristics)**<br>~~a~~<br>~~**p**o~~|**2.Specifications(characteristics)**<br>~~a~~<br>~~**p**o~~|**2.Specifications(characteristics)**<br>~~a~~<br>~~**p**o~~|**2.Specifications(characteristics)**<br>~~a~~<br>~~**p**o~~|**2.Specifications(characteristics)**<br>~~a~~<br>~~**p**o~~|
|---|---|---|---|---|---|---|
|Parameter<br>~~**p**o~~|Symbol|Min.|Typ.|Max.|Unit|Conditions /Remarks|
|Output frequency<br>~~**p**o~~<br>~~**p**o~~|f0||133.3330<br>~~o~~|~~o~~|MHz<br>~~o~~|~~o~~|
|Supplyvoltage<br>~~**p**o~~|Vcc|1.6|-|3.6|V|-|
|Operatingtemperature<br>~~**p**o~~<br>~~**p**o~~|T_use|-40|-<br>~~o~~|+85<br>~~o~~|ºC<br>~~o~~|-<br>~~o~~|
|Frequencytolerance<br>~~**p**o~~|f_tol|-50|-|50|x10-6|T_use|
|Current consumption<br>~~**p**o~~<br>~~**p**o~~|Icc|-|-<br>~~o~~|11<br>~~o~~|mA<br>~~o~~|No load condition<br>~~o~~|
|Stand-bycurrent<br>~~**p**o~~|I_std|-|-|10.0|µA|ST = GND|
|Disable current<br>~~**p**o~~<br>~~po~~|I_dis|-|-<br>~~o~~|-<br>~~o~~|mA<br>~~o~~|-<br>~~o~~|
|Symmetry<br>~~po~~|SYM|45|-|55|%|50% Vcc Level  L_CMOS=<15pF|
|Output voltage<br>~~po~~<br>~~EE~~|VOH<br>~~EE~~|Vcc-0.4<br>~~EE~~|-|-<br>~~ee~~|~~ee~~|-|
||VOL<br>~~EE~~<br>~~a~~|-<br>~~EE~~|-|0.4<br>~~ee~~|~~ee~~|-|
|Output load condition<br>~~po~~|L_CMOS<br>~~po~~|-<br>~~po~~|-<br>~~po~~|15<br>~~po~~|pF<br>~~po~~|CMOS Load<br>~~po~~|
|Input voltage<br>~~pyre~~|VIH<br>~~pyre~~<br>~~a~~|0.8Vcc<br>~~pyre~~<br>~~ee~~|-<br>~~pyre~~<br>~~ee~~|-<br>~~pyre~~<br>~~ee~~|~~pyre~~<br>~~ee~~|ST terminal<br>ST terminal<br>~~pyre~~|
||VIL<br>~~pyre~~<br>~~a~~|-<br>~~pyre~~<br>~~ee~~|-<br>~~pyre~~<br>~~ee~~|0.2Vcc<br>~~pyre~~<br>~~ee~~|~~pyre~~<br>~~ee~~||
|Rise time|tr<br>~~a~~|-<br>~~ee~~|-<br>~~ee~~|3<br>~~ee~~|ns<br>~~ee~~|Vcc1.6V : 0.2Vcc to 0.8Vcc Level,<br>L_CMOS=15pF|
|Fall time<br>~~po~~|tf<br>~~a~~|-|-|3|ns|Vcc1.6V : 0.2Vcc to 0.8Vcc Level,<br>L_CMOS=15pF|
|Start-uptime<br>~~po~~|t_str<br>~~a~~|-|-|5|ms|t = 0 at 0.9Vcc|
|Jitter<br>~~po~~|tDJ<br>~~a~~|-|0|-|ps|Deterministic Jitter Vcc=3.3V|
||tRJ<br>~~a~~|-|2.1|-|ps|Random Jitter Vcc=3.3V|
||tRMS<br>~~a~~|-|2.1|-|ps|δ(RMS of total distribution) Vcc=3.3V|
||tp-p<br>~~a~~|-|17.8|-|ps|Peak to Peak Vcc=3.3V|
||tacc|-|-|-|ps|-|
|Phasejitter<br>~~po~~|tPJ<br>~~po~~|-<br>~~po~~<br>~~a~~|0.3<br>~~po~~<br>~~ee~~|-<br>~~po~~<br>~~ee~~|ps<br>~~po~~|Off set Frequency: 12kHz to 20MHz Vcc=3.3V<br>~~po~~|
|Phase noise|L(f)|-<br>~~a~~|-<br>~~ee~~|-<br>~~ee~~|dBc/Hz|-|
|||-<br>~~a~~<br>~~a~~|-57<br>~~ee~~|-<br>~~ee~~|dBc/Hz|Off set 10Hz Vcc=3.3V|
|||-<br>~~a~~|-86<br>~~se~~|-<br>~~se~~|dBc/Hz|Off set 100Hz Vcc=3.3V|
|||-<br>~~a~~|-115|-|dBc/Hz|Off set 1kHz Vcc=3.3V|
|||-<br>~~a~~|-128<br>~~se~~|-<br>~~se~~|dBc/Hz|Off set 10kHz Vcc=3.3V|
|||-<br>~~a~~|-137<br>~~es~~|-<br>~~es~~|dBc/Hz|Off set 100kHz Vcc=3.3V|
|||-<br>~~a~~|-146<br>~~es~~|-<br>~~es~~|dBc/Hz|Off set 1MHz Vcc=3.3V|
|Frequency aging|f_age|-5<br>-|-<br>-<br>~~es~~|5<br>-<br>~~es~~|x10-6|@+25ºC first year<br>-|



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## **3.Timing chart** 

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tr  tf<br>VCC<br>80 %VCC<br>50 %VCC<br>20 %VCC<br>GND<br>tw<br>t<br>**----- End of picture text -----**<br>


## **4.Test circuit** 

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swich<br>1) Waveform observation<br>&<br>VCC ST<br>or<br>OE<br>by-pass<br>capacitor<br>supply  Test Point<br>GND  OUT<br>L_CMOS<br>e @ a<br>2) Current consumption<br>swich<br>VCC ST<br>or<br>A  OE<br>by-pass<br>capacitor<br>supply<br>GND  OUT  Test<br>hoy Point  |<br>3) Condition<br>(1) Oscilloscope<br>· Band width should be minimum 5 times higher (wider) than measurement frequency.<br>**----- End of picture text -----**<br>


*Current consumption under the disable function should be = GND. 

- Probe earth should be placed closely from test point and lead length should be as short as possible 

- Recommendable to use miniature socket. (Don’t use earth lead.) 

- (2) L_CMOS also includes probe capacitance. 

- (3) By-pass capacitor (0.01 µF to 0.1 µF) is placed closely between VCC and GND. 

- (4) Use the current meter whose internal impedance value is small. 

- (5) Power supply 

- Start up time (0 %VCC to 90 %VCC) of power source should be more than 150 µs. 

- Impedance of power supply should be as lowest as possible. 

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5.External dimensions                     (Unit: mm)<br>5.0±0.2<br>#4  #3<br>E 156.25<br>CBN395K<br>[ l. | } E<br>#1  #2<br>— ——=><br>7<br>a 1.2  Pin map<br>[rh [conection<br>C0.4<br>| 2 [| Geo |<br>| [| «+ [| we |<br><>! 80unclonEF oniy auciinble<br>2.54<br>Note.<br>OE pin = "H" or "open" : Specified frequency output.<br>OE pin = "L" : Output is high impedance.<br>ST pin = "H" or "open" : Specified frequency output.<br>ST pin = "L" : Output is high impedance、oscillation stops.<br>0.2<br>±<br>3.2<br>0.<br>±<br>1.1<br>1.0<br>**----- End of picture text -----**<br>


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6.Footprint(Recommended) (Unit: mm)<br>1.6<br>#4  #3<br>C ( ex. 0.01 µF)<br>C<br>ml] L —it<br>Resist  EE<br>#1  #2<br>2.54<br>1.5<br>2.2<br>**----- End of picture text -----**<br>


## **7.Reflow profile** 

## Reflow condition (Follow of JEDEC STD-020D.01) 

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Temperature [C ]<br>300<br>TP  ; +260C<br>+255C<br>tp ; 20 s to 40 s<br>250  Avg. Ramp-up<br>TL  ; +217C 3 C / s Max.  tL<br>200  Ts max ; +200C  (60+217s toC 150over s) 6Ramp-down C / s Max.<br>Ts min ; +150 C  ts<br>150  60 s to 180 s<br>( +150C to +200C )<br>100<br>50<br>Time +25 C to Peak<br>0  60  120 180 240 300 360 420 480 540 600 660 720 780<br>Time [ s ]<br>**----- End of picture text -----**<br>


## **8.Packing information** 

|[ 1 ]Product number last 2 digits code(xx) description|[ 1 ]Product number last 2 digits code(xx) description|[ 1 ]Product number last 2 digits code(xx) description|
|---|---|---|
|||X1G0044610003xx|



|Code|Condition|Code|Condition|
|---|---|---|---|
|01|AnyQ'tyvinyl bag(Tape cut)|13|500pcs / Reel|
|11|AnyQ'ty/ Reel|00|1000pcs / Reel|
|12|250pcs / Reel|||



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[ 2 ] Taping specification<br>Subject to EIA-481 & IEC-60286<br>(1)  Tape dimensions<br>Material of the Carrier Tape : PS<br>Material of the Top Tape    : PET+PE Unit: mm<br>Ａ Ｂ<br>Carrier tape<br>ip 8 ,‘ O na O Oo Oo Oo oO oO<br>Top tape<br>C rettettet t=: I<br>Ｃ Ｇ Ｆ<br>—~| Ee ~<br>Symbol A B C D E F Ｇ Ｈ<br>Value φ1.5 4.0±0.1 8.0±0.1 7.25±0.2 12.0±0.2 1.40±0.1 3.5±0.1 5.4±0.1<br>+0.1/-0<br>(2)  Reel dimensions<br>      Center material      : PS<br>      Material of the Reel  : PS<br>—-<br>13.0 ± 1. 0<br><_| ||<br>O Ps<br>© L S | 621 20.8 . O<br>/ w u c t No 1 5 20.2 a<br>Ｄ<br>Ｅ<br>Ｈ<br>0±2<br>60±1  1 8<br>φ φ<br>**----- End of picture text -----**<br>


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## **9.Notice** 

- This material is subject to change without notice. 

- Any part of this material may not be reproduced or duplicated in any form or any means without the written permission of Seiko Epson. ·  The information about applied data,circuitry, software, usage, etc. written in this material is intended for reference   only. Seiko Epson does not assume any liability for the occurrence of customer damage or infringing on any patent or copyright of a third  party. This material does not  authorize the licensing for any patent or intellectual copyrights. 

- When exporting the products or technology described in this material, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. 

- You are requested not to use the products (and any technical information furnished, if any) for the development and/or manufacture of weapon of mass destruction or for other military purposes. You are also requested that you would not make the products available  to any third party who may use the products for such prohibited purposes. ·  These products are intended for general use in electronic equipment. When using them in specific applications that require extremely high reliability, such as the applications stated below, you must obtain permission from Seiko Epson in advance. 

- / Space equipment (artificial satellites, rockets, etc.) 

- / Transportation vehicles and related (automobiles, aircraft, trains, vessels, etc.) / Medical instruments to sustain life 

- / Submarine transmitters 

- / Power stations and related 

- / Fire work equipment and security equipment / Traffic control equipment 

- / And others requiring equivalent reliability. 

## **10.Contact us** 

http://www5.epsondevice.com/en/contact/ 

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