X1B000351000212

## Low power, wide temp range and automotive compliant 32.768kHz D-TCXO 

## **TG-3541CE / TG-3541CEA** 

## **Features** 

- •Built-in frequency adjusted 32.768 kHz crystal unit and D-TCXO. 

- Operation temperature -40 °C to +105 °C 

- •Use of CMOS IC enables reduction of current consumption. 

- •VIO controls swing amplitude. 

- AEC-Q100 compliant (TG-3541CEA) 

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TG-3541CE  TG-3541CEA<br>(3.2  ×  2.5  ×  1.0 mm Max.)  (3.2  ×  2.5  ×  1.0 mm Max.)<br>**----- End of picture text -----**<br>


## **Applications** 

## `·` TG-3541CE 

Industrial, Security, Smart Meter, Clock for Time counting and Sleep function 

- TG-3541CEA 

Infotainment and communication devices, Body (ECU*) Clock for Time counting and Sleep function. *ECU: Electronic control unit 

## **Description** 

low power, wide temp range and automotive compliant 

32.768 kHz Crystal Oscillator with D-TCXO, offered in 3.2 x 2.5 mm, 10 pins package. 

## **Outline Drawing** 

## **Typical Performance** 

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3.2  0.2<br>◼ 32.768 kHz-DTCXO Frequency temperature characteristics (Example)<br>Frequency temperature characteristics<br>10<br>5<br>32.768 kHz DTCXO<br>0<br>a -5 H ET} | |—-E HH<br>-10<br>CC<br>-15<br>Tuning fork X'tal<br>-20<br>0.7  0.3  -25 + | t +<br>PTET -30 i ar cents<br>LaeSie -45  H -35  -25 -15 -5  5 Temperature (ºC)  E 15  25  35 45 55  E 65 75  85 95  105<br>)<br>-6<br>Frequency tolerance ( ×10<br>0.2<br>±<br>2.5<br>1.0Max.<br>0.62<br>**----- End of picture text -----**<br>


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0.35<br>**----- End of picture text -----**<br>


## **Terminal** 

|1.|1.<br>OE||10.|10.<br>TEST|
|---|---|---|---|---|
|2.|2.<br>VCC||9.|9.<br>GND|
|3.|3.<br>TEST||8.|8.<br>TEST|
|4.|4.<br>OUT||7.|7.<br>TEST|
|5.|5.<br>TEST||6.|6.<br>TEST|



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Pin  Connection<br>1  OE<br>2  VCC<br>3  TEST (*1)<br>4  OUT<br>5  TEST (*2)<br>6  TEST (*3)<br>7  TEST (*2)<br>8  TEST (*2)<br>9  GND<br>10  TEST (*3)<br>OE is active HIGH input,<br>Do not leave floating.<br>**----- End of picture text -----**<br>


- (1) #3 connect to VCC 

- (2) #5, 7, 8 connect to GND 

- (*3) #6,10: N.C. must be left open 

No: TG-3541CE_CEA_EN_rev2.0 

## 1. Number / Product Name 

- 1.1 Product Number 

   - TG-3541CE XA `：` X 1B00035 1 0001 00 TG-3541CE XB `：` X 1B00035 1 0002 00 TG-3541CEA XA `：` X 1B00036 1 A001 00 TG-3541CEA XB `：` X 1B00036 1 A002 00 

(1)   (2)    (3)  (4)  (5) 

- (1) Crystal devices 

- (2) Model 

- (3) Pb free code (1 : EU RoHS compliant / Pb free) 

- (4) Detail specifications 

- (5) Packing (00 : 2 000 pcs/reel) 

- 1.2 Product Name (Standard Form) TG-3541 CE XA 32.768000 kHz TG-3541 CE A XB 32.768000 kHz 

   - (a)    (b)  (d) (e)     (c) 

- (a) Model 

- (b) Package type (CE `：` 3.2 x 2.5 x 1.0 mm size) 

- (c) Output Frequency 

- (d) For Automotive 

- (e) Frequency / Temperature characteristics 

## 2. Block Diagram 

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I Latch<br>I [I]<br>I [I]<br>I Temp.  A / D<br>I Sensor  > Conv.  Cc] Ic ROM  I<br>I<br>I [I]<br>I<br>I [I]<br>I<br>I U I<br>VCC d I1 Control Logic  Latch  | U 11 [I]<br>I<br>I Cap. Array  [I]<br>I<br>I [I]<br>OUT OSC II<br>I<br>I [I]<br>I<br>GND II<br>c al 32.768 kHz  !<br>**----- End of picture text -----**<br>


## 3. Terminal Description 

3.1. Terminal Arrangement 

|1.<br>2.|1.<br>OE<br>2.<br>VCC|Sats||LTR|10.<br>9.|10.<br>TEST<br>9.<br>GND|
|---|---|---|---|---|---|---|
|3.|3.<br>TEST||||8.|8.<br>TEST|
|4.|4.<br>OUT||||7.|7.<br>TEST|
|5.|5.<br>TEST|=|en|Ne —<4|6.|6.<br>TEST|



No: TG-3541CE_CEA_EN_rev2.0 

p. 1 

## 3.2. Terminal Function 

|Signal<br>name|I/O|Function|
|---|---|---|
|OUT|Output|This is the C-MOS output pin with output control provided via the OE pin.<br>OE = ”H” (high level), this pin outputs a 32.768 kHz signal.<br>When OE= “L”(low level), output is stopped, the OUT pin=Hi-Z (high impedance).|
|OE|Input|This is an input pin used to control the output mode of the OUT pin.<br>When this pin's level is high, the OUT pin is in output mode.<br>When it is low, output via the OUT pin is stopped.|
|VCC|−|Thispin is connected to apositivepower supply.|
|GND|−|Thispin is connected to aground.|
|TEST|−|Test terminal. TEST should be connected as below.<br>#3: Vcc,#5,7,8: GND,#6,10: N.C.|



Note: Be sure to connect a bypass capacitor rated at least 0.1 μF between VCC and GND. 

## 4. External Connection Example 

## 1) Output Waveform 

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Switch<br>OE<br>VCC<br>4, [77]<br>by-pass<br>capacitor<br>Load circuit<br>Supply<br>Test<br>Point<br>GND  OUT<br>L_CMOS<br>**----- End of picture text -----**<br>


## 2) Current Consumption 

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Switch<br>oe<br>OE<br>VCC<br>A  by-pass<br>capacitor<br>Supply<br>Test<br>GND  OUT  Point<br>*Current consumption under the<br> disable function should be<br> OE= GND.<br>**----- End of picture text -----**<br>


## 3) Condition 

- (1) Oscilloscope 

   - Band width should be minimum 5 times higher (wider) than measurement frequency. 

   - Probe earth should be placed closely from test point and lead length should be as short as possible. 

   - Recommendable to use miniature socket. (Don’t use earth lead.) 

- (2) L_CMOS also includes probe capacitance. 

- (3) By-pass capacitor (at least 0.1 μF) is placed closely between VCC and GND. 

- (4) Use the current meter whose internal impedance value is small. 

No: TG-3541CE_CEA_EN_rev2.0 

p. 2 

## 5. Outline Drawing / Marking Layout 5.1. Outline Drawing 

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TG-3541CE / TG-3541CEA<br>3.2  0.2<br>•Recommended footprint<br>EEE = =F<br>0.7  0.4  0.3<br>0.7  0.3<br>a Unit : mm<br>>><br>0.42  0.4  0.35<br>The small metal pads on the short side of the ceramic package are used to test the crystal.<br>When assembling the part, please be careful not to connect or short circuit those pads.<br>In addition, please avoid short circuit between these metal parts by dew condensation or particle adhesion.<br>0.9<br>0.2<br>± 1.1<br>2.5<br>1.0 Max.  0.2 Min.<br>0.62<br>**----- End of picture text -----**<br>


## 5.2. Marking Layout 

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TG-3541CE / TG-3541CEA<br>(1) TG-3541CE<br>Logo  Type<br>Frequency<br>T3541 X Stability XA : X<br>XB : Y<br>123A<br>#1 Pin Mark  Production lot<br>(2) TG-3541CEA<br>Logo  Type<br>Frequency<br>A3541 X Stability XA : X<br>XB : Y<br>123A<br>#1 Pin Mark  Production lot<br>**----- End of picture text -----**<br>


 The display contents indicate the outline of the seal and display, and do not specify the details of the shape, size and position. 

No: TG-3541CE_CEA_EN_rev2.0 

p. 3 

## 6. Absolute Maximum Ratings 

|Parameter|Symbol|Value|Value|Value|Unit|Note|
|---|---|---|---|---|---|---|
|||Min.|Typ.|Max.|||
|Supply voltage|VCC-GND|-0.3|-|+6.5|V||
|Input voltage|VIN|GND−0.3|-|+6.5|V|OE pin|
|Output voltage|VOUT1|GND−0.3|0.3<br>-|VCC+ 0.3|+ 0.3<br>V|OUT pin|
|Storage temperature range|T_stg|-55|-|+125|C|When stored separately,<br>withoutpackaging|



## 7. Recommended Operating Conditions 

|Parameter|Symbol|Value|Value|Value|Unit|Note|
|---|---|---|---|---|---|---|
|||Min.|Typ.|Max.|||
|Supply voltage|VCC|1.5|3.0|5.5|V||
||GND|0.0|-|0.0|V||
|Operating temperature range|T_use|-40|+25|+105|C|No condensation|
|Output load|L_CMOS|-|-|30|pF||



## 8. Frequency Characteristics 

|Parameter<br>~~a~~|Symbol<br>~~ce~~|Value<br>~~—r———~~<br>~~ce~~<br>~~eeee~~|Value<br>~~—r———~~<br>~~ce~~<br>~~eeee~~|Value<br>~~—r———~~<br>~~ce~~<br>~~eeee~~|Unit<br>~~—r———~~<br>~~ee~~|Note<br>~~—r———~~|
|---|---|---|---|---|---|---|
|||Min.<br>~~—r———~~<br>~~ce~~|Typ.<br>~~—r———~~<br>~~ee~~|Max.<br>~~—r———~~<br>~~ee~~|||
|Output frequency<br>~~a~~|fo<br>~~ce~~|32.768<br>~~—r———~~<br>~~ce~~<br>~~ee ee~~|||kHz<br>~~—r———~~<br>~~ee~~|~~—r———~~|
|Frequency / Temperature<br>characteristics<br>(XA)|fo-Tc|-1.9||+1.9|10-6|T_use = 0C to +50C<br>VCC= 3.0 V, Include initial<br>frequency tolerance  *1|
|||-3.4|-|+3.4||T_use = -40C to +85C<br>VCC= 3.0 V, Include initial<br>frequency tolerance *2|
|||-8.0|-|+8.0||T_use = +85C to +105C<br>VCC= 3.0 V, Include initial<br>frequency tolerance *3|
|Frequency / Temperature<br>characteristics<br>(XB)|fo-Tc|-3.8||+3.8|10-6|T_use = 0C to +50C<br>VCC= 3.0 V, Include initial<br>frequency tolerance  *1|
|||-5.0|-|+5.0||T_use = -40C to +85C<br>VCC= 3.0 V, Include initial<br>frequency tolerance *2|
|||-8.0|-|+8.0||T_use = +85C to +105C<br>VCC= 3.0 V, Include initial<br>frequency tolerance *3|
|Frequency /<br>Voltage coefficient|fo- VCC|-1.0|-|+1.0|10-6|VCC= 1.6 V to 5.5 V|
|Start up time|t_str|-|-|1.0|s|T_use = +25 *C<br>VCC =1.6 V to 5.5 V|
|||-|-|3.0||T_use =−40 to +105C,<br>VCC = 1.6Vto 5.5V|
|Frequency aging|f_age|-3.0|-|+3.0|10-6|T_use = +25C, VCC= 3.0 V<br>First year|
|Reflowshift<br>~~eS~~|-<br>~~eS~~|-3.0<br>~~eS~~|-<br>~~eS~~|+3.0<br>~~eS~~|10-6<br>~~eS~~|+260C(Max.),2 times   *4<br>~~eS~~|



- *1 (XA) Equivalent to 5 seconds of month deviation ( ±1.9  10[-6 ] ) 

- *2 (XA) Equivalent to 9 seconds of month deviation ( ±3.4  10[-6 ] ) *3 (XA) Equivalent to 21 seconds of month deviation ( ±8.0  10[-6 ] ) 

- *3 (XA) Equivalent to 21 seconds of month deviation 

   - ( ±3.8  10[-6 ] ) 

- *1 (XB) Equivalent to 10 seconds of month deviation 

   - ( ±5.0  10[-6 ] ) 

- *2 (XB) Equivalent to 13.2 seconds of month deviation 

      - ( ±8.0  10[-6 ] ) 

- *3 (XB) Equivalent to 21 seconds of month deviation 

   - *4 Measurement of frequency deviation is made 24 h after reflow soldering 

No: TG-3541CE_CEA_EN_rev2.0 

p. 4 

## 9. Electrical Characteristics 

*Unless otherwise specified, GND = 0 V, VCC = 1.5 V to 5.5 V, T_use = −40 C to +105 C 

|Item<br>~~ee~~|Symbol<br>~~ee~~<br>~~ee~~|Min.<br>~~eee~~|Typ.<br>~~eee~~|Max.<br>~~eee~~|Unit<br>~~ee~~|Condition<br>~~eee~~|
|---|---|---|---|---|---|---|
|Current<br>consumption|ICC1<br>~~ee~~|~~eee ~~|1.1<br> ~~eee~~|3.1<br>~~eee ~~|A<br> ~~ee~~|OE = VCC, VCC= 5.0 V,<br>L_CMOS= No load<br>Temp compensation interval 2.0 s<br>~~eee~~|
||ICC2||1.0|3.0|A|OE = VCC,VCC= 3.0 V<br>L_CMOS= No load<br>Temp compensation interval 2.0 s|
||ICC3||6.1|8.1|A|OE = VCC,VCC= 5.0 V<br>L_CMOS= 30 pF<br>Temp compensation interval 2.0 s|
||ICC4||4.0|6.0|A|OE = VCC,VCC= 3.0 V<br>L_CMOS= 30 pF<br>Temp compensation interval 2.0 s|
|Output disable<br>current<br>OUT : stopped<br>( Hi-z )|I_dis1||0.40|1.6|A|OE = GND, VCC= 5.0 V<br>Tempcompensation interval 2.0 s|
||I_dis2||0.35|1.5|A|OE = GND, VCC= 3.0 V<br>Tempcompensation interval 2.0 s|
||I_dis3||0.38|1.55|A|OE = GND, VCC= 5.0 V<br>Tempcompensation is stopped.|
||I_dis4||0.33|1.45|A|OE = GND, VCC= 3.0 V<br>Tempcompensation is stopped.|
||I_dis5||55|100|A|OE = GND, VCC= 5.0 V<br>Tempcompensation ON(peak)|
||I_dis6||50|95|A|OE = GND, VCC= 3.0 V<br>Tempcompensation ON(peak)|
|Symmetry<br>~~po~~|SYM<br>~~po~~|40<br>~~po~~|50<br>~~po~~|60<br>~~po~~|%<br>~~po~~|50 % VCC Level, L_CMOS = 30 pF<br>~~po~~|
|Input voltage<br>~~ee~~|VIH<br>~~ee~~<br>~~ee~~|0.8VCC<br>~~ee~~|~~ee~~|5.5<br>~~ee~~|V|OE pin<br>~~pO~~|
||VIL<br>~~ee~~<br>~~es~~<br>~~ee~~<br>~~ee~~|GND−0.3<br>~~es~~<br>~~ee~~<br>~~es~~<br>|~~es~~<br>~~ee~~<br>~~es~~|0.2VCC<br>~~es~~<br>~~ee~~|||
|Output voltage|VOH1<br>~~ee~~<br>~~ee~~<br>~~ee~~|4.5<br>~~ee~~<br>~~es~~<br>~~es~~|~~ee~~<br>~~es~~|5.0<br>~~ee~~|V|OUTpin,VCC =5.0V,IOH=−1 mA<br>~~pO~~<br>~~pO~~|
||VOH2<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~es~~|2.2<br>~~ee ~~<br>~~es~~<br>~~es~~<br>~~es~~|~~ee ~~<br>~~es~~|3.0<br> ~~ee~~||OUTpin,VCC =3.0V,IOH=−1 mA<br>~~pO~~<br>~~pO~~<br>~~pO~~|
||VOH3<br>~~ee ~~<br>~~ee~~<br>~~es~~<br>~~ee~~|2.9<br>~~es~~<br> ~~es~~<br>~~es~~<br>~~**ee**~~|~~es~~|3.0||OUTpin,VCC =3.0V,IOH=−100 A<br>~~pO~~<br>~~pO~~<br>~~pO~~<br>~~**p**t~~|
||VOL1<br> <br>~~ee~~<br>~~es~~<br>~~ee~~|GND<br> ~~es~~<br>~~es~~<br>~~**ee**~~|~~ee~~|GND+ 0.5|V|OUTpin,VCC =5.0V,IOL= 1 mA<br>~~pO~~<br>~~pO~~<br>~~**p**t~~<br>~~O~~|
||VOL2<br>~~es~~<br>~~ee~~|GND<br>~~es~~<br>~~**ee**~~|~~ee~~|GND+ 0.8||OUTpin,VCC =3.0V,IOL= 1 mA<br>~~pO~~<br>~~**p**t~~<br>~~O~~|
||VOL3<br>~~ee~~|GND<br>~~**ee**~~|~~ee~~|GND + 0.1||OUTpin,VCC =3.0V,IOL= 100 A<br>~~**p**t~~<br>~~O~~|
|Input leakage<br>current<br>~~a ee~~|ILK<br>~~ee~~|−0.5<br>~~ee~~|~~ee~~|0.5<br>~~ee~~|A<br>~~ee~~|OE pin = VCCor GND<br>~~ee~~|
|Output leakage<br>current|IOZ|−0.5||0.5|A|OUT pin = VCCor GND|



## • Temperature compensation and consumption current 

No: TG-3541CE_CEA_EN_rev2.0 

p. 5 

## 10. How To Use 

## 10.1. Start Up 

- `※` This circuit is sensitive to power supply noise and supply voltage should be stabilized to avoid negative impact on the accuracy. 

- `※` tR1 is needed for a proper power-on reset. 

- `※` In case of repeated ON/OFF of the power supply within short term, it is possible that the power-on reset becomes unstable. 

After power-OFF, keep VCC = GND for more than 10 seconds for a proper power-on reset. 

**==> picture [342 x 88] intentionally omitted <==**

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VCC<br>VCC ( >1.6V)<br>GND<br>tR1  tR1<br>**----- End of picture text -----**<br>


*Unless otherwise specified, 

|Item|Symbol|Condition|Min.|Typ.|Max.|Unit|
|---|---|---|---|---|---|---|
|Power supplyrise time1|tR1|VCC= GND to 1.6 V|1|-|10|ms/V|



No: TG-3541CE_CEA_EN_rev2.0 

p. 6 

## 11. Characteristic Data 

## 11.1. Frequency Temperature Coefficient 

**==> picture [167 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
Frequency / temperature characteristics: fo-Tc<br>**----- End of picture text -----**<br>


Test Conditions: No Load, n = 22 pcs. 

## 11.2. Current Consumption (Output disable) 

Test Conditions: No Load, T_use = -40 °C, n = 22 pcs. 

Test Conditions: No Load, T_use = +25 °C, n = 22 pcs. 

Test Conditions: No Load, T_use = +105 °C, n = 22 pcs. 

No: TG-3541CE_CEA_EN_rev2.0 

p. 7 

## 11.3. Current Consumption (Output enable) 

Test Conditions: No Load, T_use = -40 °C, n = 22 pcs. 

Test Conditions: No Load, T_use = +25 °C, n = 10 pcs. 

Test Conditions: No Load, T_use = +105 °C, n = 22 pcs. 

No: TG-3541CE_CEA_EN_rev2.0 

p. 8 

## 12. Moisture Sensitivity 

|Item|Class||Test Condition|
|---|---|---|---|
|MSL|LEVEL 1|JEDEC J-STD-020D.1|JEDEC J-STD-020D.1|



## 13. Reflow Profiles (follow to IPC / JEDEC J-STD-020D.1) 

No: TG-3541CE_CEA_EN_rev2.0 

p. 9 

## 14. Taping Specification 

- Subject to EIA-481 , IEC 60286 , JIS C0806. (1) Tape dimensions TE0804L 

   - Material of the Carrier Tape: PS Material of the Top Tape : PET+PE 

## (2) Reel dimensions 

- Material of the Reel: PS 

Form and Size of reel window shows are one of the example 

- (3) Storage Form 

## (4) Storage Quantity 

The product number is X1B000351000100 (TG-3541CE XA), X1B000351000200 (TG-3541CE XB) X1B000361A00100 (TG-3541CEA XA), X1B000361A00200 (TG-3541CEA XB) Packing quantity is defined by 14th and 15th digit of product number. The standard is "00", 2 000 pcs/Reel. 

No: TG-3541CE_CEA_EN_rev2.0 

p. 10 

## 15. Handling Precautions 

## 1) Notes on handling 

This device contains a crystal resonator, so please don’t expose excessive shock or vibration. 

This device uses a C-MOS IC to realize low power consumption. Carefully note the following cautions when handling. 

- (1) Static electricity 

While this module has built-in circuitry designed to protect it against electrostatic discharge, the chip could still be damaged by a large discharge of static electricity. Containers used for packing and transport should be constructed of conductive materials. In addition, only soldering irons, measurement circuits, and other such devices which do not leak high voltage should be used with this module, which should also be grounded when such devices are being used. 

- (2) Noise 

If a signal with excessive external noise is applied to the power supply or input pins, the device may malfunction or "latch up." In order to ensure stable operation, connect a filter capacitor (preferably ceramic) of greater that 0.1 F as close as possible to the power supply pins (between Vcc and GNDs). Also, avoid placing any device that generates high level of electronic noise near this module. 

   - Do not connect signal lines to the shaded area in the figure shown in Fig. 1 and, if possible, embed this area in a GND land. 

- (3) Voltage levels of input pins 

When the input pins are at the mid-level, this will cause increased current consumption and a reduced noise margin, and can impair the functioning of the device. Therefore, try as much as possible to apply the voltage level close to Vcc or GND. 

- (4) Handling of unused pins 

Since the input impedance of the input pins is extremely high, operating the device with these pins in the open circuit state can lead to unstable voltage level and malfunctions due to noise. Therefore, please apply the voltage level close to Vcc or GND. 

- (5) Storage 

This device is equivalent to JEDEC J-STD-020D.1 Moisture Sensitivity Level 1. After opening the packing, store it in an environment with a temperature of + 30 ° C or less and humidity of 85 ° C or less, and mount it within 6 months. 

## 2) Notes on packaging 

- (1) Soldering heat resistance. 

If the temperature within the package exceeds +260 C, the characteristics of the crystal oscillator will be degraded and it may be damaged. The reflow conditions within our reflow profile is recommended. Therefore, always check the mounting temperature and time before mounting this device. Also, check again if the mounting conditions are later changed. 

   - See Fig. 1 profile for our evaluation of Soldering heat resistance for reference. 

- (2) Mounting equipment 

While this module can be used with general-purpose mounting equipment, the internal crystal oscillator may be damaged in some circumstances, depending on the equipment and conditions. Therefore, be sure to check this. In addition, if the mounting conditions are later changed, the same check should be performed again. 

The high-speed mounter (stationary type of parts cassette) can not be used because storage vibrations in parts cassettes cause scraping of carrier tape due to friction between the embossed carrier tape and the product. 

- (3) Ultrasonic cleaning 

Depending on the usage conditions, there is a possibility that the crystal oscillator will be damaged by resonance during ultrasonic cleaning. Since the conditions under which ultrasonic cleaning is carried out (the type of cleaner, power level, time, state of the inside of the cleaning vessel, etc.) vary widely, this device is not warranted against damage during ultrasonic cleaning. 

## (4) Mounting orientation 

This device can be damaged if it is mounted in the wrong orientation. Always confirm the orientation of the device before mounting. 

## (5) Leakage between pins 

Leakage between pins may occur if the power is turned on while the device has condensation or dirt on it. Make sure the device is dry and clean before supplying power to it. 

No: TG-3541CE_CEA_EN_rev2.0 

p. 11 

**►Explanation of the mark that are using it for the catalog** Pb ►Pb free. ►Complies with EU RoHS directive. RoHS *About the products without the Pb-free mark. Contains Pb in products exempted by EU RoHS directive. (Contains Pb in sealing glass, high melting temperature type solder or other.) ►Designed for automotive general equipment. ~~Bee~~ ►Designed for automotive applications related to driving and safety. ~~Be~~ 

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1. Epson products are designed for use in general electronic equipment applications that do not require extremely high reliability or safety. 

2. Epson does not represent or warrant that its products will not cause a failure for any particular application, except for cases where the failure is a direct result caused by defects in materials and workmanship of this product. If a product fails due to defects in materials and workmanship, to the maximum extent permitted by law, we will, at our sole discretion, refund or replace the affected product. 

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4. For the products designed for automotive applications, the products comply with AEC-Q100 or AEC-Q200. Products do not comply with ISO 26262 (Products are not categorized to ASIL A, B, C and D). 

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No: TG-3541CE_CEA_EN_rev2.0 

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