X0402MB

**X0402MB** 

Datasheet 

## 4 A Sensitive gate SCR in DPAK package 

## **Features** 

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- 4 A Triac 

- Sensitive SCR: IGT = 200 µA 

- VDRM / VRRM = 600 V and VDSM / VRSM = 750 V 

- 125 °C maximum junction temperature Tj 

- DPAK SMD package 

- Halogen-free molding, lead-free plating 

- ECOPACK2 compliant 

## **Application** 

**Product status link** X0402MB 

- Actuators 

- Ignitors 

- Inrush current limiting circuits 

|**Product summary**|**Product summary**|
|---|---|
|**IT(RMS)**|4 A|
|**VDSM/VRSM**|750 V|
|**IGT**|200 µA|
|**Tj max.**|125 °C|



## **Description** 

The X04 series is 4 A SCR housed in compact SMD DPAK package. This highly sensitive device is suited to home appliances or power tools and industrial systems and drives loads up to 4 A. 

**DS14030** - **Rev 1** - **September 2022** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**X0402MB Characteristics** 

**1 Characteristics** 

**Table 1. Absolute maximum ratings (limiting values)** 

|**Symbol**|**Parameter**||**Value**|**Unit**|
|---|---|---|---|---|
|IT(RMS)|RMS on-state current (full sine wave)|Tc= 114 °C|4|A|
|IT AV|RMS on-state average current (full sine wave)|Tc= 114 °C|2.5|A|
|ITSM|Non repetitive surge peak on-state current (full cycle,<br>Tjinitial = 25 °C)|t = 8.3 ms|33|A|
|||t = 10 ms|30||
|I2t|I2t value for fusing|tp= 10 ms|9|A2s|
|dl/dt|Critical rate of rise of on-state current, IG= 2 x IGT, tr<br>≤ 100 ns, f = 60 Hz|Tj= 125 °C|50|A/µs|
|VDRM/VRRM|Repetitive peak off-state voltage|Tj= 125 °C|600|V|
|VDSM/VRSM|Non Repetitive peak off-state voltage, 10 ms||750|V|
|IGM|Maximum peak gate current|tp= 20 µs, Tj= 125 °C|1.2|A|
|PGM|Maximum gate power dissipation||0.5|W|
|Tstg|Storage temperature range||-40 to +125|°C|
|Tj|Operating junction temperature range||-40 to +125|°C|
|TL|Maximum lead temperature for soldering during 10 s||260|°C|



**Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified)** 

|**Symbol**|**Test conditions**|**Test conditions**||**Value**|**Unit**|
|---|---|---|---|---|---|
|IGT(1)|VD= 12 V, RL= 140 Ω||Max.|200|µA|
|VGT|||Max.|0.8|V|
|VGD|VD= VDRM, RL= 3.3 kΩ|Tj= 125 °C|Min.|0.1|V|
|VRGM|IRG= 10 µA||Max.|8|V|
|IL|IG= 1.2 x IGT||Max.|6|mA|
|IH (2)|IT= 500 mA, gate open||Max.|5|mA|
|dV/dt(2)|VD= 67 % VDRM, RGK= 1 kΩ|Tj= 110 °C|Min.|10|V/µs|



_1. For both polarities of OUT pin referenced to COM pin._ 

_2. For both polarities of A2 referenced to A1._ 

**Table 3. Static characteristics** 

|**Symbol**|**Test conditions**|**Tj**||**Value**|**Unit**|
|---|---|---|---|---|---|
|VTM (1)|ITM= 8 A, tp= 380 µs|25 °C|Max.|1.8|V|
|VTO (1)|Threshold voltage|125 °C|Max.|0.85|V|
|RD(1)|Dynamic resistance|125 °C|Max.|100|mΩ|
|IDRM/IRRM|VD= VDRM; VR= VRRM; RGK= 1 kΩ|25 °C|Max.|5|µA|
|||125°C||1|mA|



_1. For both polarities of A2 referenced to A1._ 

**DS14030** - **Rev 1** 

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**X0402MB Characteristics** 

## **Table 4. Thermal resistance** 

|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|Rth(j-c)|Junction to case|Max.|3|°C/W|
|Rth(j-a)|Junction to ambient: SCU= 0.5 cm²|Typ.|70|°C/W|



**DS14030** - **Rev 1** 

**page 3/11** 

ky **X0402MB Characteristics (curves)** ~~a~~ 

## **1.1 Characteristics (curves)** 

**Figure 1. Maximum average power dissipation versus onFigure 2. Average and DC on-state current versus case state RMS current temperature** 

**Figure 3. On-state RMS current versus ambient temperature (full cycle)** 

**Figure 4. Relative variation of thermal impedance versus pulse duration** 

**Figure 5. Relative variation of gate triggering current and Figure 6. Surge peak on-state current versus number of voltage versus junction temperature (typical values) cycles** 

**DS14030** - **Rev 1** 

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**X0402MB Characteristics (curves)** 

**Figure 7. Non repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms and corresponding value of I²t** 

**Figure 9. Relative variation of static dV/dt immunity versus gate-to-cathode resistance (typical values)** 

**Figure 11. Relative variation of static dV/dt immunity versus junction temperature** 

**Figure 8. On-state characteristics (maximum values)** 

**Figure 10. Relative variation of static dV/dt immunity versus gate-to-cathode capacitance (typical values)** 

**Figure 12. Thermal resistance junction to ambient versus copper surface under tab (typical values)** 

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**DS14030** - **Rev 1** 

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**X0402MB Package information** 

**2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **2.1 DPAK package information** 

- Molding compouned resin is halogen free and meets UL94 flammability standard, level V0 

- Lead-free package leads plating 

## **Figure 13. DPAK package outline** 

**DS14030** - **Rev 1** 

**page 6/11** 

**X0402MB DPAK package information** 

**Table 5. DPAK package mechanical data** 

||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
|**Ref.**|**Millimeters**|||**Inches(1)**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|2.20|2.30|2.38|0.0866|0.0906|0.0937|
|A1|0.90|1.01|1.10|0.0354|0.0398|0.0433|
|A2|0.00||0.10|0.0000||0.0039|
|b|0.72||0.85|0.0283||0.335|
|b4|5.13|5.33|5.46|0.2020|0.2098|0.2150|
|c|0.47||0.60|0.0185||0.0236|
|c2|0.47||0.60|0.0185||0.0236|
|D|6.00|6.10|6.20|0.2362|0.2402|0.2441|
|D1|5.15|5.40|5.65|0.2028|0.2126|0.2224|
|E|6.50|6.60|6.70|0.2550|0.2598|0.2638|
|E1|4.70|4.85|5.00|0.1850|0.1909|0.1969|
|e|2.186|2.286|2.386|0.0860|0.0900|0.0940|
|H|9.80|10.10|10.40|0.3858|0.3976|0.4094|
|L|1.40|1.50|1.70|0.0551|0.0591|0.0669|
|L1|2.90 REF|||0.1142 REF|||
|L2|0.90||1.25|0.0354||0.0492|
|L3|0.51 BSC|||0.201 BSC|||
|L4|0.60|0.80|1.00|0.0236|0.0315|0.0394|
|L6|1.80 BSC|||0.0709 BSC|||
|ϴ1|5°|7°|9°|5°|7°|9°|
|ϴ2|5°|7°|9°|5°|7°|9°|
|V2|0°||8°|0°||8°|



_1. Dimensions in inches are given for reference only_ 

_Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed._ 

**DS14030** - **Rev 1** 

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**X0402MB DPAK package information** 

**Figure 14. DPAK recommended footprint (dimensions are in mm)** 

**DS14030** - **Rev 1** 

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**X0402MB Ordering information** 

**3** 

## **Ordering information** 

**Figure 15. Ordering information scheme** 

**Table 6. Ordering information** 

|**Order code**<br>~~a~~|**Marking**<br>~~ee~~|**Package**<br>~~ee~~|**Weight**<br>~~ee~~|**Base qty.**<br>~~ee~~|**Delivery mode**<br>~~ee~~|
|---|---|---|---|---|---|
|X0402MB<br>~~a~~|X0402MB<br>~~ee~~|DPAK<br>~~ee~~|0.3 g<br>~~ee~~|2500<br>~~ee~~|Tape and reel<br>~~ee~~|



**DS14030** - **Rev 1** 

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**X0402MB** 

## **Revision history** 

## **Table 7. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|06-Sep-2022|1|Initial release.|



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**X0402MB** 

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