WLA.04

## +-Qd AS A | (© +) (O C) 

|1.|Introduction|3|
|---|---|---|
|2.|Specifications|4|
|3.|Antenna Characteristics|5|
|4.|Radiation Patterns|7|
|5.|Mechanical Drawing|8|
|6.|Antenna Integration Guide|9|
|7.|Packaging|12|
||Changelog|13|



Taoglas makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Taoglas reserves all rights to this document and the information contained herein. Reproduction, use or disclosure to third parties without express permission is strictly prohibited. 

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## 1. Introduction 

The WLA.04  is a compact size LTCC Antenna designed for use in 2.4GHz systems such as Bluetooth, Wi-Fi, BLE, WLAN, THREAD and ZigBee. It is perfect for devices with small ground planes due to it’s miniature size of just 1.6*0.8mm. It is delivered on Tape and Reel for ease of integration through pick and place machines. 

Typical Applications Include: 

- Handheld Devices 

- Wearables 

- IoT development Kits 

- Security 

- Connected Health 

The WLA.04 is a ceramic chip antenna for 2.4GHz applications, it’s miniature size allows it to be used in areas where larger antennas do not fit. 

For further information regarding the integration of the WLA.04 into your device please contact your regional Taoglas customer support team. 

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## **2.** Specifications 

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|**Electrical**|**Electrical**|
|---|---|
|Centre Frequency|2400-2500MHz|
|VSWR|≤2.0|
|Radiation Pattern|Omnidirectional|
|Bandwidth|65MHz typ.|
|Peak Gain|2.7dBi typ.|
|Efficiency|69% typ.|
|Impedance|50|
|**Mechanical**||
|Dimensions|1.6*0.8*0.4mm|
|Material|Ceramic|
|**Environmental**||
|Temperature Range|25+5°C|
|Relative Humidity range|5575%RH|
|Operating Temperature|-40°C+85°C|
|Storage Temperature|-40°C+85°C|
|Moisture Sensitivity Level|1|



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## **3.** Antenna Characteristcs 

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3.1 Characteristic curve Smith Chart + Return Loss<br>**----- End of picture text -----**<br>


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3.2 Peak Gain<br>**----- End of picture text -----**<br>


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2.5<br>2<br>1.5<br>1<br>0.5<br>0<br>2400 2410 2420 2430 2440 2450 2460 2470 2480 2490 2500<br>Frequency [MHz]<br>Peak Gain [dBi]<br>**----- End of picture text -----**<br>


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## **3.3** Avergae Gain 4 

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0<br>-0.5<br>-1<br>-1.5<br>-2<br>-2.5<br>2400 2410 2420 2430 2440 2450 2460 2470 2480 2490 2500<br>Frequency [MHz]<br>Average Gain [dB]<br>**----- End of picture text -----**<br>


## **3.4** Efficiency |[f] 

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100<br>90<br>80<br>70<br>60<br>50<br>40<br>30<br>20<br>10<br>0<br>2400 2410 2420 2430 2440 2450 2460 2470 2480 2490 2500<br>Frequency [MHz}<br>Efficiency [%]<br>**----- End of picture text -----**<br>


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## **4.** Radiation Patterns 

**4.1** 2400MHz 3D and 2D Radiation Patterns 

## XY Plane XZ Plane YZ Plane 

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## **5.** Mechanical Drawing (Units: mm) 

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## **5.** Antenna Integration 

## **5.1** Evaluation Board Matching Circuit 

Layout 1 (mm) 

Layout 2 

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## **5.2** Vibration Resist 

The device should fulfill the electrical specification after applied to the vibration of 10 to 55Hz with amplitude of 1.5mm for 2 hours each in X , Y and Z directions. 

## **5.3** Drop Shock 

The device should have no mechanical damage after dropping onto the hard wooden board from the height of 100cm for 3 times each facet of the 3 dimensions of the device. 

## **5.4** Solder Heat Proof 

The device should be satisfied after preheating at 120 ℃ ~150 ℃ for 120 seconds and dipping in soldering Sn at 255 ℃ +10 ℃ for 5±0.5 seconds，or electric iron 300 ℃ -10 ℃ for 3±0.5 seconds，without damnify. 

## **5.5** Adhesive Strength of Termination 

The device have no remarkable damage or removal of the termination after horizontal force of 5N( ≦ 0603)；10N(>0603)with 10±1 seconds. 

## **5.6** Bending Resist Test 

Weld the product to the center part of the PCB with the thickness 1.6±0.2mm or 0.8±0.1mm as the illustration shows, and keep exerting force arrow-ward on it at speed of :1mm/S , and hold for 5±1S at the position of 1.5mm bending distance , so far , any peeling off of the product metal coating should not be detected. 

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**5.7** Moisture Proof 

The device should fulfill the electrical specification after exposed to the temperature 60±2 ℃ and the relative humidity 90~95% RH for 96 hours and 1~2 hours recovery time under normal condition. 

## **5.8** Hight Temperature Endurance 

The device should fulfill the electrical specification after exposed to temperature 85±5 ℃ for 96±2 hours and 1~2 hours recovery time under normal temperature. 

## **5.9** Low Temperature Endurance 

The device should fulfill the electrical specification after exposed to the temperature -40 ℃ ±5 ℃ for 96 ±2 hours and to 2 hours recovery time under normal temperature. 

## **5.10** Temperature Cycle Test 

The device should fulfill the electrical specification after exposed to the low temperature -40 ℃ and high temperature +85 ℃ for 30±2 min each by 5 cycles and 1 to 2 hours recovery time under normal temperature. 

## **5.11** Reflow Soldering Standard Condition 

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## **6.** Packaging 

1pc WLA.04 per Tape 

6000pcs WLA.04 per reel 

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Changelog for the datasheet **SPE-23-8-135 – WLA.04** 

**Revision: A (Original First Release)** Date: 2023-05-23 Notes: First Release Author: Cesar Sousa 

## **Previous Revisions** 

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