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WGM160PX22KGA3R
WGM160PX22KGA CERTIFIED WI-FI MODULE
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- Manufacturer: SILICON LABS
- Product type:
| Delivery and price | |
|---|---|
| Units per pack | 1000 |
| Price | 8.01 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
**WGM160P Wi-Fi[®] Module Data Sheet** The WGM160P is an ultra low power standalone Wi-Fi[®] module targeted for applications requiring superior RF performance in noisy environments, low power consumption, high **KEY POINTS** security, integrated customer applications and fast time to market. • Available with integrated chip antenna or The WGM160P module integrates all of the necessary elements required for a cloud an RF pin connected IoT Wi-Fi application, including 802.11b/g/n radio, integrated chip antenna, • Antenna diversity supported via secondary certifications, microcontroller, Wi-Fi and IP stacks, HTTP server, and multiple protocols, RF pin such as TCP and UDP. Co-existence with external 2.4GHz transceivers is supported. • IEEE 802.11 b/g/n compliant WGM160P can be configured to concurrently act as a Wi-Fi client and a Wi-Fi access • TX power: +16 dBm point, which is ideal for user friendly device provisioning. WGM160P can natively host C- • RX sensitivity: -95.5 dBm applications, removing the need for an external host controller. Alternatively, the Wi-Fi • CPU core: 32-bit ARM® Cortex-M4 Module can run in Network Co-Processor (NCP) mode, leaving the complexity of TCP/IP • Flash memory: 2 MB networking to the module so that the customer’s own host controller can be fully dedica• RAM: 512 kB ted to processing the customer application tasks. The WGM160P module has highly • Concurrent mode: Wi-Fi AP and STA flexible host and peripheral hardware interfaces for wide application use. • Ultra low power consumption • Modular certification • CE, UKCA, FCC, ISED • MIC, KC • End-to-end security • Built-in 10/100 Ethernet Support • Size: 23.8 mm x 14.2 mm x 2.3 mm **Certified Module Core / Memory Clock Management Energy Management Other Antenna ARM CortexM4 processor M4 processor[[TM]] ETM Crystal OscillatorHigh Frequency High Frequency High FrequencyRC OscillatorRC Oscillator RegulatorVoltage Voltage Voltage/Temp MonitorMonitor CRYPTO with FPU and MPUMPU PLL Universal HF RC OscillatorOscillator DC-DC CRC Matching Flash Program MemoryMemory Debug Interface Auxiliary High Freq. RC Osc.Freq. RC Osc. Ultra Low Freq. RC OscillatorRC Oscillator Converter Power-On Reset Number GeneratorTrue Random True Random Radio XTAL RAM Memory ControllerLDMA LDMA XTAL + OscillatorLow Frequency Low Frequency Low FrequencyRC OscillatorRC Oscillator Brown-Out DetectorDetector Backup Domain SMU Wi-Fi Radio 32-bit bus Peripheral Reflex System 2.4 GHz Transceiver Serial Interfaces I/O Ports Timers and Triggers Analog Interfaces 802.11 b/g/n USART UART InterruptsExternal External Purpose I/OGeneral General Timer/Counter Low Energy Sensor IFSensor IF Low Energy LCD ControllerController ADC MODEM 10/100 Ethernet Quad-SPI Low Energy Timer Real Time Counter VDAC Operational AmplifierAmplifier Pin Reset Pin Wakeup Diversity Input CAN Low Energy UARTUART[[TM]] Pulse Counter Watchdog Timer ComparatorAnalog Analog IDAC PTA support (crystal free)LEUSB I[[2]] C Real Time Counter and Calendarand Calendar CRYOTIMER Capacitive SensingSensing Lowest power mode with peripheral operational:** **==> picture [467 x 206] intentionally omitted <==** **----- Start of picture text -----**<br> Certified Module Core / Memory Clock Management Energy Management Other<br>Antenna ARM CortexM4 processor M4 processor [[TM]] ETM Crystal OscillatorHigh Frequency High Frequency High FrequencyRC OscillatorRC Oscillator RegulatorVoltage Voltage Voltage/Temp MonitorMonitor CRYPTO<br>with FPU and MPUMPU PLL Universal HF RC OscillatorOscillator DC-DC CRC<br>Matching Flash Program MemoryMemory Debug Interface Auxiliary High Freq. RC Osc.Freq. RC Osc. Ultra Low Freq. RC OscillatorRC Oscillator Converter Power-On Reset Number GeneratorTrue Random True Random<br>Radio XTAL RAM Memory ControllerLDMA LDMA XTAL + OscillatorLow Frequency Low Frequency Low FrequencyRC OscillatorRC Oscillator Brown-Out DetectorDetector Backup Domain SMU<br>Wi-Fi Radio 32-bit bus<br>Peripheral Reflex System<br>2.4 GHz<br>Transceiver Serial Interfaces I/O Ports Timers and Triggers Analog Interfaces<br>802.11 b/g/n USART UART InterruptsExternal External Purpose I/OGeneral General Timer/Counter Low Energy Sensor IFSensor IF Low Energy LCD ControllerController ADC<br>MODEM 10/100 Ethernet Quad-SPI Low Energy Timer Real Time Counter VDAC Operational AmplifierAmplifier<br>Pin Reset Pin Wakeup<br>Diversity Input CAN Low Energy UARTUART [[TM]] Pulse Counter Watchdog Timer ComparatorAnalog Analog IDAC<br>LEUSB<br>PTA support (crystal free)LEUSB I [[2]] C Real Time Counter and Calendarand Calendar CRYOTIMER Capacitive SensingSensing<br>Lowest power mode with peripheral operational:<br>EM0 - Active EM1 - Sleep EM2 – Deep Sleep EM3 - Stop EM4H - Hibernate EM4S - Shutoff<br>**----- End of picture text -----**<br> **Copyright © 2025 by Silicon Laboratories** **silabs.com** | Building a more connected world. Rev. 1.4 WGM160P Wi-Fi[®] Module Data Sheet Key Features ## **1. Key Features** The key features of the WGM160P module are listed below. ## **MCU Features** ## **Radio Features** - Built-in Antenna (optional) - ARM[®] Cortex-M4, 72MHz • TX Power: +16 dBm - 512 kB RAM • RX Sensitivity: -95.5 dBm • 2 MB Flash • Superior blocking performance **Hardware Interfaces Wi-Fi Features** • 802.11: b/g/n • Host interface: UART/SPI/USB • Bit rate: up to 72.2 Mbps • Peripheral interfaces • 802.11 Security: WPA2/WPA Personal • 2 x USART (UART/SPI/I2S) • STA (Station Mode) • QSPI with Execute In Place (XIP) support • SoftAP (Soft Access Point Mode) • SD Card support (SPI) • Capacitive Touch Sensing in all GPIOs **Electrical Characteristics** • LESENSE • Supply voltage: 3.0V to 3.6V • 10/100 Ethernet MAC with RMII interface **Environmental Specifications** • USB device (2.0 Full speed) • Temperature range: -40°C to +85°C • I[2] C peripheral interfaces **Modular Certification** • CAN • CE and UKCA - EU and UK • Up to 31 x GPIO with interrupts • FCC - USA • 2 x 12-bit ADC • ISED - Canada • 2 x 12-bit DAC • MIC - Japan • Rich selection of timers, inc. Real-time counters • KC - South Korea • Co-existence interface (PTA: 2, 3, 4 wire) • RoHS/REACH compliant **Dimensions** • L x W x H: 23.8 mm x 14.2 mm x 2.3 mm **silabs.com** | Building a more connected world. Rev. 1.4 | 2 WGM160P Wi-Fi[®] Module Data Sheet Ordering Information ## **2. Ordering Information** ## **Part Revisions** _**Revision 3**_ of the WGM160P modules comes with Gecko OS kernel preloaded in the flash. **Those part are not recommended for new design (NRND) as Gecko OS has been set in maintenance mode and will turn End Of Life.** These parts can be used with the Full MAC software, but this requires changing the bootloader to erase the Gecko OS Kernel. Devices ship with the debug interface locked. Devices may be reprogrammed via serial or OTA DFU and preserve the device credentials. Unlocking the debug interface will result in loss of pre-programmed firmware, including Gecko OS Kernel and device credentials. ||Not Recommended for New Designs<br>Full MAC software, but this requires changing the bootloader to erase the Gecko OS Kernel. Devices ship with the debug interface<br>locked. Devices may be reprogrammed via serial or OTA DFU and preserve the device credentials. Unlocking the debug interface will<br>result in loss of pre-programmed firmware, including Gecko OS Kernel and device credentials.<br>**_Revision 4_**of the WGM160P modules is recommended for new designs based on Full MAC software. Unlike revision 3, revision 4<br>parts do not have the Gecko OS kernel loaded, so there is no need to remove it before loading a FMAC based application. Devices ship<br>with the debug interface unlocked.<br>All parts share the same characteristics regarding parameters below:<br>• Protocol: Wi-Fi (802.11 b/g/n)<br>• Max Tx Power: 16 dBm<br>• GPIO: up to 31<br>• 2048 Flash/512 Ram (kB)<br>**Part Number**<br>**Status**<br>**LFXTAL**<br>**Antenna**<br>**Pre-loaded Firmware**<br>**Carrier**<br>WGM160PX22KGA4<br>**NRND**<br>Included<br>Built-in<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160PX22KGA4R<br>**NRND**<br>Included<br>Built-in<br>Standard Gecko bootloader<br>Reel<br>WGM160P022KGA4<br>**NRND**<br>None<br>Built-in<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160P022KGA4R<br>**NRND**<br>None<br>Built-in<br>Standard Gecko bootloader<br>Reel<br>WGM160PX22KGN4<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160PX22KGN4R<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Reel<br>WGM160P022KGN4<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160P022KGN4R<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Reel<br>WGM160PX22KGA3<br>**NRND**<br>Included<br>Built-in<br>Gecko OS kernel<br>Cut Tape<br>WGM160PX22KGA3R<br>**NRND**<br>Included<br>Built-in<br>Gecko OS kernel<br>Reel<br>WGM160P022KGA3<br>**NRND**<br>None<br>Built-in<br>Gecko OS kernel<br>Cut Tape<br>WGM160P022KGA3R<br>**NRND**<br>None<br>Built-in<br>Gecko OS kernel<br>Reel<br>WGM160PX22KGN3<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Cut Tape<br>WGM160PX22KGN3R<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Reel<br>WGM160P022KGN3<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Cut Tape<br>WGM160P022KGN3R<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Reel<br>**Note:**<br>1. SLWSTK6121A Wireless Starter Kit and SLWRB4321A Radio Board are available to start developing with WGM160P Wi-Fi mod-<br>ules.<br>2. Devices listed may be referred to by the product family name (WGM160P), model name (WGM160P22A / WGM160P22N) or the<br>full orderable part number throughout this document.|Not Recommended for New Designs<br>Full MAC software, but this requires changing the bootloader to erase the Gecko OS Kernel. Devices ship with the debug interface<br>locked. Devices may be reprogrammed via serial or OTA DFU and preserve the device credentials. Unlocking the debug interface will<br>result in loss of pre-programmed firmware, including Gecko OS Kernel and device credentials.<br>**_Revision 4_**of the WGM160P modules is recommended for new designs based on Full MAC software. Unlike revision 3, revision 4<br>parts do not have the Gecko OS kernel loaded, so there is no need to remove it before loading a FMAC based application. Devices ship<br>with the debug interface unlocked.<br>All parts share the same characteristics regarding parameters below:<br>• Protocol: Wi-Fi (802.11 b/g/n)<br>• Max Tx Power: 16 dBm<br>• GPIO: up to 31<br>• 2048 Flash/512 Ram (kB)<br>**Part Number**<br>**Status**<br>**LFXTAL**<br>**Antenna**<br>**Pre-loaded Firmware**<br>**Carrier**<br>WGM160PX22KGA4<br>**NRND**<br>Included<br>Built-in<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160PX22KGA4R<br>**NRND**<br>Included<br>Built-in<br>Standard Gecko bootloader<br>Reel<br>WGM160P022KGA4<br>**NRND**<br>None<br>Built-in<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160P022KGA4R<br>**NRND**<br>None<br>Built-in<br>Standard Gecko bootloader<br>Reel<br>WGM160PX22KGN4<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160PX22KGN4R<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Reel<br>WGM160P022KGN4<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160P022KGN4R<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Reel<br>WGM160PX22KGA3<br>**NRND**<br>Included<br>Built-in<br>Gecko OS kernel<br>Cut Tape<br>WGM160PX22KGA3R<br>**NRND**<br>Included<br>Built-in<br>Gecko OS kernel<br>Reel<br>WGM160P022KGA3<br>**NRND**<br>None<br>Built-in<br>Gecko OS kernel<br>Cut Tape<br>WGM160P022KGA3R<br>**NRND**<br>None<br>Built-in<br>Gecko OS kernel<br>Reel<br>WGM160PX22KGN3<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Cut Tape<br>WGM160PX22KGN3R<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Reel<br>WGM160P022KGN3<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Cut Tape<br>WGM160P022KGN3R<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Reel<br>**Note:**<br>1. SLWSTK6121A Wireless Starter Kit and SLWRB4321A Radio Board are available to start developing with WGM160P Wi-Fi mod-<br>ules.<br>2. Devices listed may be referred to by the product family name (WGM160P), model name (WGM160P22A / WGM160P22N) or the<br>full orderable part number throughout this document.|Not Recommended for New Designs<br>Full MAC software, but this requires changing the bootloader to erase the Gecko OS Kernel. Devices ship with the debug interface<br>locked. Devices may be reprogrammed via serial or OTA DFU and preserve the device credentials. Unlocking the debug interface will<br>result in loss of pre-programmed firmware, including Gecko OS Kernel and device credentials.<br>**_Revision 4_**of the WGM160P modules is recommended for new designs based on Full MAC software. Unlike revision 3, revision 4<br>parts do not have the Gecko OS kernel loaded, so there is no need to remove it before loading a FMAC based application. Devices ship<br>with the debug interface unlocked.<br>All parts share the same characteristics regarding parameters below:<br>• Protocol: Wi-Fi (802.11 b/g/n)<br>• Max Tx Power: 16 dBm<br>• GPIO: up to 31<br>• 2048 Flash/512 Ram (kB)<br>**Part Number**<br>**Status**<br>**LFXTAL**<br>**Antenna**<br>**Pre-loaded Firmware**<br>**Carrier**<br>WGM160PX22KGA4<br>**NRND**<br>Included<br>Built-in<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160PX22KGA4R<br>**NRND**<br>Included<br>Built-in<br>Standard Gecko bootloader<br>Reel<br>WGM160P022KGA4<br>**NRND**<br>None<br>Built-in<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160P022KGA4R<br>**NRND**<br>None<br>Built-in<br>Standard Gecko bootloader<br>Reel<br>WGM160PX22KGN4<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160PX22KGN4R<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Reel<br>WGM160P022KGN4<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160P022KGN4R<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Reel<br>WGM160PX22KGA3<br>**NRND**<br>Included<br>Built-in<br>Gecko OS kernel<br>Cut Tape<br>WGM160PX22KGA3R<br>**NRND**<br>Included<br>Built-in<br>Gecko OS kernel<br>Reel<br>WGM160P022KGA3<br>**NRND**<br>None<br>Built-in<br>Gecko OS kernel<br>Cut Tape<br>WGM160P022KGA3R<br>**NRND**<br>None<br>Built-in<br>Gecko OS kernel<br>Reel<br>WGM160PX22KGN3<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Cut Tape<br>WGM160PX22KGN3R<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Reel<br>WGM160P022KGN3<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Cut Tape<br>WGM160P022KGN3R<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Reel<br>**Note:**<br>1. SLWSTK6121A Wireless Starter Kit and SLWRB4321A Radio Board are available to start developing with WGM160P Wi-Fi mod-<br>ules.<br>2. Devices listed may be referred to by the product family name (WGM160P), model name (WGM160P22A / WGM160P22N) or the<br>full orderable part number throughout this document.|Not Recommended for New Designs<br>Full MAC software, but this requires changing the bootloader to erase the Gecko OS Kernel. Devices ship with the debug interface<br>locked. Devices may be reprogrammed via serial or OTA DFU and preserve the device credentials. Unlocking the debug interface will<br>result in loss of pre-programmed firmware, including Gecko OS Kernel and device credentials.<br>**_Revision 4_**of the WGM160P modules is recommended for new designs based on Full MAC software. Unlike revision 3, revision 4<br>parts do not have the Gecko OS kernel loaded, so there is no need to remove it before loading a FMAC based application. Devices ship<br>with the debug interface unlocked.<br>All parts share the same characteristics regarding parameters below:<br>• Protocol: Wi-Fi (802.11 b/g/n)<br>• Max Tx Power: 16 dBm<br>• GPIO: up to 31<br>• 2048 Flash/512 Ram (kB)<br>**Part Number**<br>**Status**<br>**LFXTAL**<br>**Antenna**<br>**Pre-loaded Firmware**<br>**Carrier**<br>WGM160PX22KGA4<br>**NRND**<br>Included<br>Built-in<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160PX22KGA4R<br>**NRND**<br>Included<br>Built-in<br>Standard Gecko bootloader<br>Reel<br>WGM160P022KGA4<br>**NRND**<br>None<br>Built-in<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160P022KGA4R<br>**NRND**<br>None<br>Built-in<br>Standard Gecko bootloader<br>Reel<br>WGM160PX22KGN4<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160PX22KGN4R<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Reel<br>WGM160P022KGN4<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160P022KGN4R<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Reel<br>WGM160PX22KGA3<br>**NRND**<br>Included<br>Built-in<br>Gecko OS kernel<br>Cut Tape<br>WGM160PX22KGA3R<br>**NRND**<br>Included<br>Built-in<br>Gecko OS kernel<br>Reel<br>WGM160P022KGA3<br>**NRND**<br>None<br>Built-in<br>Gecko OS kernel<br>Cut Tape<br>WGM160P022KGA3R<br>**NRND**<br>None<br>Built-in<br>Gecko OS kernel<br>Reel<br>WGM160PX22KGN3<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Cut Tape<br>WGM160PX22KGN3R<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Reel<br>WGM160P022KGN3<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Cut Tape<br>WGM160P022KGN3R<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Reel<br>**Note:**<br>1. SLWSTK6121A Wireless Starter Kit and SLWRB4321A Radio Board are available to start developing with WGM160P Wi-Fi mod-<br>ules.<br>2. Devices listed may be referred to by the product family name (WGM160P), model name (WGM160P22A / WGM160P22N) or the<br>full orderable part number throughout this document.|Not Recommended for New Designs<br>Full MAC software, but this requires changing the bootloader to erase the Gecko OS Kernel. Devices ship with the debug interface<br>locked. Devices may be reprogrammed via serial or OTA DFU and preserve the device credentials. Unlocking the debug interface will<br>result in loss of pre-programmed firmware, including Gecko OS Kernel and device credentials.<br>**_Revision 4_**of the WGM160P modules is recommended for new designs based on Full MAC software. Unlike revision 3, revision 4<br>parts do not have the Gecko OS kernel loaded, so there is no need to remove it before loading a FMAC based application. Devices ship<br>with the debug interface unlocked.<br>All parts share the same characteristics regarding parameters below:<br>• Protocol: Wi-Fi (802.11 b/g/n)<br>• Max Tx Power: 16 dBm<br>• GPIO: up to 31<br>• 2048 Flash/512 Ram (kB)<br>**Part Number**<br>**Status**<br>**LFXTAL**<br>**Antenna**<br>**Pre-loaded Firmware**<br>**Carrier**<br>WGM160PX22KGA4<br>**NRND**<br>Included<br>Built-in<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160PX22KGA4R<br>**NRND**<br>Included<br>Built-in<br>Standard Gecko bootloader<br>Reel<br>WGM160P022KGA4<br>**NRND**<br>None<br>Built-in<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160P022KGA4R<br>**NRND**<br>None<br>Built-in<br>Standard Gecko bootloader<br>Reel<br>WGM160PX22KGN4<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160PX22KGN4R<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Reel<br>WGM160P022KGN4<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160P022KGN4R<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Reel<br>WGM160PX22KGA3<br>**NRND**<br>Included<br>Built-in<br>Gecko OS kernel<br>Cut Tape<br>WGM160PX22KGA3R<br>**NRND**<br>Included<br>Built-in<br>Gecko OS kernel<br>Reel<br>WGM160P022KGA3<br>**NRND**<br>None<br>Built-in<br>Gecko OS kernel<br>Cut Tape<br>WGM160P022KGA3R<br>**NRND**<br>None<br>Built-in<br>Gecko OS kernel<br>Reel<br>WGM160PX22KGN3<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Cut Tape<br>WGM160PX22KGN3R<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Reel<br>WGM160P022KGN3<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Cut Tape<br>WGM160P022KGN3R<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Reel<br>**Note:**<br>1. SLWSTK6121A Wireless Starter Kit and SLWRB4321A Radio Board are available to start developing with WGM160P Wi-Fi mod-<br>ules.<br>2. Devices listed may be referred to by the product family name (WGM160P), model name (WGM160P22A / WGM160P22N) or the<br>full orderable part number throughout this document.|Not Recommended for New Designs<br>Full MAC software, but this requires changing the bootloader to erase the Gecko OS Kernel. Devices ship with the debug interface<br>locked. Devices may be reprogrammed via serial or OTA DFU and preserve the device credentials. Unlocking the debug interface will<br>result in loss of pre-programmed firmware, including Gecko OS Kernel and device credentials.<br>**_Revision 4_**of the WGM160P modules is recommended for new designs based on Full MAC software. Unlike revision 3, revision 4<br>parts do not have the Gecko OS kernel loaded, so there is no need to remove it before loading a FMAC based application. Devices ship<br>with the debug interface unlocked.<br>All parts share the same characteristics regarding parameters below:<br>• Protocol: Wi-Fi (802.11 b/g/n)<br>• Max Tx Power: 16 dBm<br>• GPIO: up to 31<br>• 2048 Flash/512 Ram (kB)<br>**Part Number**<br>**Status**<br>**LFXTAL**<br>**Antenna**<br>**Pre-loaded Firmware**<br>**Carrier**<br>WGM160PX22KGA4<br>**NRND**<br>Included<br>Built-in<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160PX22KGA4R<br>**NRND**<br>Included<br>Built-in<br>Standard Gecko bootloader<br>Reel<br>WGM160P022KGA4<br>**NRND**<br>None<br>Built-in<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160P022KGA4R<br>**NRND**<br>None<br>Built-in<br>Standard Gecko bootloader<br>Reel<br>WGM160PX22KGN4<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160PX22KGN4R<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Reel<br>WGM160P022KGN4<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Cut Tape<br>WGM160P022KGN4R<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Standard Gecko bootloader<br>Reel<br>WGM160PX22KGA3<br>**NRND**<br>Included<br>Built-in<br>Gecko OS kernel<br>Cut Tape<br>WGM160PX22KGA3R<br>**NRND**<br>Included<br>Built-in<br>Gecko OS kernel<br>Reel<br>WGM160P022KGA3<br>**NRND**<br>None<br>Built-in<br>Gecko OS kernel<br>Cut Tape<br>WGM160P022KGA3R<br>**NRND**<br>None<br>Built-in<br>Gecko OS kernel<br>Reel<br>WGM160PX22KGN3<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Cut Tape<br>WGM160PX22KGN3R<br>**NRND**<br>Included<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Reel<br>WGM160P022KGN3<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Cut Tape<br>WGM160P022KGN3R<br>**NRND**<br>None<br>External<br>(RF Pin)<br>Gecko OS kernel<br>Reel<br>**Note:**<br>1. SLWSTK6121A Wireless Starter Kit and SLWRB4321A Radio Board are available to start developing with WGM160P Wi-Fi mod-<br>ules.<br>2. Devices listed may be referred to by the product family name (WGM160P), model name (WGM160P22A / WGM160P22N) or the<br>full orderable part number throughout this document.| |---|---|---|---|---|---|---| ||<br>**Part Number**|<br>**Status**|<br>**LFXTAL**|<br>**Antenna**|<br>**Pre-loaded Firmware**|<br>**Carrier**| ||<br>WGM160PX22KGA4|<br>**NRND**|<br>Included|<br>Built-in|<br>Standard Gecko bootloader|<br>Cut Tape| ||<br>WGM160PX22KGA4R|<br>**NRND**|<br>Included|<br>Built-in|<br>Standard Gecko bootloader|<br>Reel| ||<br>WGM160P022KGA4|<br>**NRND**|<br>None|<br>Built-in|<br>Standard Gecko bootloader|<br>Cut Tape| ||<br>WGM160P022KGA4R|<br>**NRND**|<br>None|<br>Built-in|<br>Standard Gecko bootloader|<br>Reel| ||<br>WGM160PX22KGN4|<br>**NRND**|<br>Included|o<br>External<br>(RF Pin)|r<br>Standard Gecko bootloader|<br>Cut Tape| ||<br>WGM160PX22KGN4R|<br>**NRND**|<br>Included|f<br>External<br>(RF Pin)|<br>Standard Gecko bootloader|<br>Reel| ||<br>WGM160P022KGN4|<br>**NRND**|<br>None|<br>External<br>(RF Pin)|<br>Standard Gecko bootloader|<br>Cut Tape| ||<br>WGM160P022KGN4R|<br>**NRND**|nd<br>None|<br>External<br>(RF Pin)|<br>Standard Gecko bootloader|<br>Reel| ||<br>WGM160PX22KGA3|<br>**NRND**|<br>Included|<br>Built-in|<br>Gecko OS kernel|<br>Cut Tape| ||<br>WGM160PX22KGA3R|<br>**NRND**|<br>Included|<br>Built-in|<br>Gecko OS kernel|<br>Reel| ||<br>WGM160P022KGA3|<br>**NRND**|<br>None|<br>Built-in|<br>Gecko OS kernel|<br>Cut Tape| ||<br>WGM160P022KGA3R|<br>**NRND**|<br>None|<br>Built-in|<br>Gecko OS kernel|<br>Reel| ||<br>WGM160PX22KGN3|o<br>**NRND**|<br>Included|<br>External<br>(RF Pin)|<br>Gecko OS kernel|<br>Cut Tape| ||e<br>WGM160PX22KGN3R|<br>**NRND**|<br>Included|<br>External<br>(RF Pin)|<br>Gecko OS kernel|<br>Reel| ||R<br>WGM160P022KGN3|<br>**NRND**|<br>None|<br>External<br>(RF Pin)|<br>Gecko OS kernel|<br>Cut Tape| ||ot<br>WGM160P022KGN3R|<br>**NRND**|<br>None|<br>External<br>(RF Pin)|<br>Gecko OS kernel|<br>Reel| ||N<br>**Note:**<br>1. SLWSTK6121A Wireless Starter Kit and SLWRB4321A Radio Board are available to start developing with WGM160P Wi-Fi mod-<br>ules.<br>2. Devices listed may be referred to by the product family name (WGM160P), model name (WGM160P22A / WGM160P22N) or the<br>full orderable part number throughout this document.|||||| **silabs.com** | Building a more connected world. Rev. 1.4 | 3 |**Table of Contents**|||||||||||||| |---|---|---|---|---|---|---|---|---|---|---|---|---|---| |**1. Key Features**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**<br>**.**<br>**.**|**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**<br>**. 2**| |**2. Ordering Information**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**<br>**.**<br>**.**|**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**<br>**. 3**| |Not Recommended for New Designs<br>**3. System Overview .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**. 6**<br>3.1 Introduction .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>. 6<br>3.2 Wi-Fi Supported 2.4 GHz ISM Modulations, BW, and Channels<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>. 6<br>**4. Electrical Specifications .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**. 7**<br>4.1 Absolute Maximum Ratings.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>. 7<br>4.2 Operating Conditions .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>. 8<br>4.3 Power Consumption .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>. 8<br>4.4 Digital I/O Specifications.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>. 9<br>4.5 RF Transmitter General Characteristics<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.10<br>4.6 RF Receiver General Characteristics<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.11<br>4.7 Radiated Characteristics.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.11<br>4.8 Microcontroller Peripherals .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.12<br>**5. Typical Applications and Connections .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**13**<br>5.1 RF Connections<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.13<br>5.1.1 Antenna Ports .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.13<br>5.1.2 Antenna Diversity<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.13<br>5.2 Multi-Protocol Coexistence .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.13<br>5.3 Example Schematic<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.14<br>**6. Software**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**. 15**<br>6.1 FMAC (Full MAC) Driver Architecture .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.15<br>6.2 Examples.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.15<br>**7. Pin Descriptions**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**. 16**<br>7.1 WGM160P Device Pinout<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.16<br>7.2 GPIO Functionality<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.18<br>7.3 Alternate Pin Functionality .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.22<br>**8. Package Specifications**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.32**<br>8.1 Package Outline<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.32<br>8.2 Recommended PCB Land Patterns .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.33<br>8.3 Package Marking .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.35<br>**9. Soldering Recommendations**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**. 36**|||||||||||||| |**10. Tape and Reel Dimensions .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**<br>**.**<br>**.**|**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**<br>**37**| |**11. Certifications .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**<br>**.**<br>**.**|**.**<br>**.**|**.**|**.**<br>**.**||**.**|**.**<br>**.**||**.**|**.**|**.**|**.**<br>**38**| **silabs.com** | Building a more connected world. Rev. 1.4 | 4 11.1 Qualified External Antenna Types . . . . . . . . . . . . . . . . . . . . . . .38 11.2 CE and UKCA - EU and UK . . . . . . . . . . . . . . . . . . . . . . . . .38 11.3 FCC - USA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39 11.4 ISED - Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40 11.5 Locating the Module Close to Human Body . . . . . . . . . . . . . . . . . . . .42 11.6 MIC - Japan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43 11.7 KC - South Korea . . . . . . . . . . . . . . . . . . . . . . . . . . . .43 **12. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44** **silabs.com** | Building a more connected world. Rev. 1.4 | 5 WGM160P Wi-Fi[®] Module Data Sheet System Overview ## **3. System Overview** ## **3.1 Introduction** The WGM160P module combines the WF200 Wi-Fi transceiver with an EFM32GG11 microcontroller to deliver a complete and certified standalone Wi-Fi solution, with the ability to run customer application on an Cortex M4 processor. **==> picture [577 x 569] intentionally omitted <==** **----- Start of picture text -----**<br> For more details on the software platform, please consult our online documentation.<br>VBAT<br>3.0 – 3.6V<br>1.8V<br>4.7 µH<br>VDDPA VDDIO VDDVDDDIGRF DVDD VREGSW VREGVDD AVDD IOVDD<br>Chip<br>Antenna RESETb USB 2.0<br>RESETN GPIO<br>ADC<br>RF1 WUP WUP GPIO DAC<br>External WF200<br>Antenna WiFi NCP HIF SDIO SDIO EFM32GG11 GPIO<br>MCU Host<br>802.11 B/G/N<br>32.768 kHz USART<br>LP_CLK GPIO<br>RF2<br>WIRQ QSPI<br>WIRQ GPIO<br>ETH<br>HFXO PTA LFXO HFRCO HFXO RMII<br>RF XTAL LF XTAL<br>38.4M 32.768K<br>Figure 3.1. WGM160P Block Diagram<br>3.2 Wi-Fi Supported 2.4 GHz ISM Modulations, BW, and Channels<br>Table 3.1. Supported Wi-Fi Modulations, BW, and Channels<br>Parameter Symbol Test Condition Min Typ Max Unit<br>Channel Center Frequency CHAN Subject to Regulatory Agency 2412 2437 2484 [1] MHz<br>Channel Bandwidth BW — 20 — MHz<br>Note:<br>1. Channel 14 only supports 1 and 2 Mbps modulations.<br>Not Recommended for New Designs<br>**----- End of picture text -----**<br> **silabs.com** | Building a more connected world. Rev. 1.4 | 6 WGM160P Wi-Fi[®] Module Data Sheet Electrical Specifications ## **4. Electrical Specifications** All electrical parameters in all tables are specified under the following conditions, unless stated otherwise: - Typical values are based on TAMB = 25 °C; VVBAT = 3.3V; Center Frequency = 2,437 MHz. - Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output power-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna port. Conducted RF measurements include additional output power reductions to guarantee WiFi and regulatory emissions compliance while connected to the specified antennas which have non-ideal impedance loading. - Refer to Section 4.2 Operating Conditions for more details about operational supply and temperature limits.4.2 Operating Conditions for more details about operational supply and temperature limits. for more details about operational supply and temperature limits. nas which have non-ideal impedance loading. Refer to Section 4.2 Operating Conditions for more details about operational supply and temperature limits.4.2 Operating Conditions for more details about operational supply and temperature limits. for more details about operational supply and temperature limits. **4.1 Absolute Maximum Ratings** Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx. **Table 4.1. Absolute Maximum Ratings Parameter Symbol Test Condition Min Typ Max Unit** Storage temperature TSTG -40 — 105 °C RF power level at RF1 and PRFMAX Max power that can be applied to — — 10 dBm RF2 ports input of recommended matching network connected to RF1 and RF2 pins. Maximum supply voltage to VBATMAX -0.3 — 3.6 V VBAT DC voltage on I/O pins VGMAX 5 V tolerant GPIO (PF0, PF1, -0.3 — Min of 5.25 V PF10, PF11)[1][2] and VBAT +2 All other GPIO and PTA pins -0.3 — VBAT + 0.3 V Current into any GPIO pin IOMAX — — 20 mA Sum of current into all GPIO IO — — 150 mA ALL_MAX pins Range of load impedance at LOADTX — — 10:1 VSWR RF1 and RF2 pins during TX **Note:** 1. When a GPIO is used for analog functions via the APORT, the maximum voltage is VBAT. 2. To operate above the VBAT supply rail, over-voltage tolerance must be enabled according to the GPIO_Px_OVTDIS register. Pins with over-voltage tolerance disabled have the same limits as all other GPIO (max = VBAT + 0.3 V). **silabs.com** | Building a more connected world. Rev. 1.4 | 7 WGM160P Wi-Fi[®] Module Data Sheet Electrical Specifications ## **4.2 Operating Conditions** **Table 4.2. Recommended Operating Conditions** ||**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---|---| ||<br>Ambient operating tempera-<br>ture|<br>TA||<br>-40|<br>—|<br>85|<br>°C| ||<br>Nominal supply voltage to<br>VBAT1|<br>VVBAT||<br>3.0|<br>3.3|<br>3.6|n<br>V| ||esi<br>**Note:**<br>1. Operating outside of the recommended voltage supply range is not supported. The module may disable WiFi transmit functions<br>when operating outside of this range in order to guarantee regulatory emissions compliance.||||||| ||<br>**Parameter**|<br>**Symbol**|<br>**Test Condition**|<br>**Min**|<br>**Typ**|<br>**Max**|<br>**Unit**| ||<br>Continuous TX current, 1<br>Mbps, max power setting|<br>ITXMAX|or|<br>—|<br>141.3|<br>—|<br>mA| ||<br>Continuous TX current,<br>MCS7, max power setting|<br>ITXMAX_N|d f|<br>—|<br>131.4|<br>—|<br>mA| ||<br>Continuous RX listen current|<br>IRXMAX||<br>—|<br>36.6|<br>—|<br>mA| ||<br>Continuous RX receive cur-<br>rent, 1 Mbps|<br>IRXMAXR|de|<br>—|<br>34.5|<br>—|<br>mA| ||<br>Continuous RX receive cur-<br>rent, MCS7|<br>IRXMAXR_N|n|<br>—|<br>38.5|<br>—|<br>mA| ||<br>Average Current DTIM=1|mm<br>ILP_DTIM1|<br>Connected as STATION.<br>EFM32GG11 in EM2 mode. DC-<br>DC in Low Noise mode CCM 3<br>MHz.|<br>—|<br>641|<br>—|<br>µA| ||c<br>Average Current DTIM=3|o<br>ILP_DTIM3|<br>Connected as STATION.<br>EFM32GG11 in EM2 mode. DC-<br>DC in Low Noise mode CCM 3<br>MHz.|<br>—|<br>270|<br>—|<br>µA| ||Re<br>Average Current DTIM=10|<br>ILP_DTIM10|<br>Connected as STATION.<br>EFM32GG11 in EM2 mode. DC-<br>DC in Low Noise mode CCM 3<br>MHz.|<br>—|<br>147|<br>—|<br>µA| ||ot<br>Sleep current|<br>ISLEEP|<br>EFM32GG11 in EM2 mode, DC-<br>DC in Low-Noise mode CCM 3<br>MHz.|<br>—|<br>90|<br>—|<br>µA| ||<br>Standby mode current|<br>ISTANDBY|<br>No memory retained. WF200 in<br>Shutdown mode, EFM32GG11 in<br>EM4 mode.|<br>—|<br>217|<br>—|<br>nA| **silabs.com** | Building a more connected world. Rev. 1.4 | 8 WGM160P Wi-Fi[®] Module Data Sheet Electrical Specifications ## **4.4 Digital I/O Specifications** ## **Table 4.4. Digital I/O Specifications** |Not Recomm<br>**Parameter**<br>**Symbol**<br>Voltage input high (relative to<br>VBAT)<br>VIH<br>Voltage input low (relative to<br>VBAT)<br>VIL<br>Logic low output voltage (rel-<br>ative to VBAT)<br>VOL<br>Logic high output voltage<br>(relative to VBAT)<br>VOH<br>Input leakage current<br>ILeak<br>Pullup resistance<br>RPU<br>Pulldown resistance<br>RPD<br>Output fall time from VOHto<br>VOL<br>TOF<br>Output rise time from VOLto<br>VOH<br>TOR<br>Required external series re-<br>sistor on USB D+ and D-<br>RUSB|<br>**Parameter**|<br>**Symbol**|<br>**Test Condition**|<br>**Min**|<br>**Typ**|<br>**Max**|<br>**Unit**| |---|---|---|---|---|---|---|---| ||<br>Voltage input high (relative to<br>VBAT)|<br>VIH||<br>70|<br>—|<br>—|n<br>%| ||<br>Voltage input low (relative to<br>VBAT)|<br>VIL||<br>—|<br>—|i<br>30|<br>%| ||<br>Logic low output voltage (rel-<br>ative to VBAT)|<br>VOL|<br>PTA Pins, Sinking 5 mA|<br>—|<br>—|s<br>25|<br>%| ||||<br>GPIO Pins, Sinking 20 mA, DRIV-<br>ESTRENGTH = STRONG|<br>—|<br>—|e<br>25|<br>%| ||<br>Logic high output voltage<br>(relative to VBAT)|<br>VOH|<br>PTA Pins, Sourcing 5 mA|<br>75|<br>—|<br>—|<br>%| ||||<br>GPIO Pins, Sourcing 20 mA,<br>DRIVESTRENGTH = STRONG|<br>75|w<br>—|<br>—|<br>%| ||<br>Input leakage current|<br>ILeak|<br>All I/O when GPIO voltage ≤<br>VBAT|e<br>—|<br>1|<br>—|<br>nA| ||||r<br>5 V Tolerant I/O (PF0, PF1, PF10,<br>PF11) when VBAT < GPIO volt-<br>age ≤ VBAT + 2 V|<br>—|<br>3.3|<br>15|<br>µA| ||<br>Pullup resistance|<br>RPU|fo|<br>30|<br>40|<br>65|<br>kΩ| ||<br>Pulldown resistance|<br>RPD||<br>30|<br>40|<br>65|<br>kΩ| ||<br>Output fall time from VOHto<br>VOL|<br>TOF|ed<br>50 pF load, DRIVESTRENGTH =<br>STRONG, SLEWRATE = 0x6|<br>—|<br>1.8|<br>—|<br>ns| ||||d<br>50 pF load, DRIVESTRENGTH =<br>WEAK, SLEWRATE = 0x6|<br>—|<br>4.5|<br>—|<br>ns| ||<br>Output rise time from VOLto<br>VOH|m<br>TOR|en<br>50 pF load, DRIVESTRENGTH =<br>STRONG, SLEWRATE = 0x6|<br>—|<br>2.2|<br>—|<br>ns| ||||<br>50 pF load, DRIVESTRENGTH =<br>WEAK, SLEWRATE = 0x6|<br>—|<br>7.4|<br>—|<br>ns| ||<br>Required external series re-<br>sistor on USB D+ and D-|m<br>RUSB||<br>—|<br>33 +/-10%|<br>—|<br>Ω| **silabs.com** | Building a more connected world. Rev. 1.4 | 9 WGM160P Wi-Fi[®] Module Data Sheet Electrical Specifications ## **4.5 RF Transmitter General Characteristics** Unless otherwise indicated, typical conditions are: Operating Ambient Temp = 25 °C, VBAT = 3.3 V, center frequency = 2,437 MHz, and measured in 50 Ω test equipment attached at antenna port. Measurements for this specification are made at the 50 Ω Antenna Port. See Section 5.1.1 Antenna Ports. Conducted RF measurements include additional output power reductions to guarantee WiFi and regulatory emissions compliance while connected to the specified antennas which have non-ideal impedance loading. |Not Recommended for New Designs<br> <br>**Table 4.5. RF Transmitter Characteristics**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Maximum RMS Output Pow-<br>er at Antenna (High Power<br>PA)1<br>POUTMAX_RMS_<br>HPPA<br>802.11b: 1 Mbps<br>—<br>16.1<br>—<br>dBm<br>802.11b: 11 Mbps<br>—<br>15.1<br>—<br>dBm<br>802.11g: 6 Mbps<br>—<br>14.7<br>—<br>dBm<br>802.11g: 54 Mbps<br>—<br>9.1<br>—<br>dBm<br>802.11n: MCS=0<br>—<br>14.4<br>—<br>dBm<br>802.11n: MCS=7<br>—<br>5.8<br>—<br>dBm<br>Carrier frequency error<br>CARRFREQ_ER-<br>ROR<br>Across temperature<br>-25<br>—<br>25<br>ppm<br>POUT variation over supply<br>voltage range, relative to<br>nominal 3.3 V<br>POUTVAR_V<br>VBAT = 3.0-3.6 V<br>—<br>+0.3 / -1.1<br>—<br>dB<br>POUT variation over fre-<br>quency range, relative to<br>average1<br>POUTVAR_F<br>CH1 to CH14<br>—<br>+/-0.15<br>—<br>dB<br>POUT variation over temper-<br>ature range, relative to 25C<br>POUTVAR_T<br>-40 to +85C<br>—<br>+0.1 / -1.2<br>—<br>dB<br>**Note:**<br>1. Rated power levels may not apply to the edge channels, which may need additional backoff for FCC compliance.| |---| **silabs.com** | Building a more connected world. Rev. 1.4 | 10 WGM160P Wi-Fi[®] Module Data Sheet Electrical Specifications ## **4.6 RF Receiver General Characteristics** Unless otherwise indicated, typical conditions are: Operating Ambient Temp = 25 °C, VBAT = 3.3 V, center frequency = 2,437 MHz, and measured in 50 Ω test equipment attached at antenna port. Measurements for this specification are made at the 50 Ω Antenna Port. See Section 5.1.1 Antenna Ports. ||Not Recommended for New Designs<br>**Table 4.6. RF Receiver Characteristics**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>RX Sensitivity for 8% FER<br>(1024 Octet)1<br>SENSB<br>802.11b: 1 Mbps<br>—<br>-95.5<br>—<br>dBm<br>802.11b: 11 Mbps<br>—<br>-88.3<br>—<br>dBm<br>RX Sensitivity for 10% PER<br>(1024 Octet)1<br>SENSG<br>802.11g: 6 Mbps<br>—<br>-89<br>—<br>dBm<br>802.11g: 54 Mbps<br>—<br>-75.2<br>—<br>dBm<br>RX Sensitivity for 10% PER<br>(4096 Octet)1<br>SENSEN<br>802.11n: MCS=0<br>—<br>-89.3<br>—<br>dBm<br>802.11n: MCS=7<br>—<br>-72.8<br>—<br>dBm<br>RX Max Strong Signal for<br>8% FER (1024 Octet)<br>RXSAT_B<br>802.11b: 1 Mbps<br>—<br>-4.0<br>—<br>dBm<br>802.11b: 11 Mbps<br>—<br>-10.0<br>—<br>dBm<br>RX Max Strong Signal for<br>10% PER (1024 Octet)<br>RXSAT_G<br>802.11g: 6 Mbps<br>—<br>-9.0<br>—<br>dBm<br>802.11g: 54 Mbps<br>—<br>-9.0<br>—<br>dBm<br>RX Max Strong Signal for<br>10% PER (4096 Octet)<br>RXSAT_N<br>802.11n: MCS=0<br>—<br>-9.0<br>—<br>dBm<br>802.11n: MCS=7<br>—<br>-9.0<br>—<br>dBm<br>Sensitivity variation across<br>frequency range, CH1 to<br>CH14<br>SENSVAR_V<br>802.11b 1 Mbps<br>—<br>+/-0.5<br>—<br>dB<br>Sensitivity variation over<br>temperature range, -40 to<br>85C<br>SENSVAR_TEMP<br>802.11b 1 Mbps<br>—<br>+/-1.3<br>—<br>dB<br>RX Channel power Indicator<br>Step Size<br>RCPISTEP<br>802.11b: 1 Mbps<br>—<br>0.5<br>—<br>dB<br>**Note:**<br>1. Measurement taken at U.FL connector. Includes 0.5 dB loss introduced by connnector.<br>**4.7 Radiated Characteristics**<br>Unless otherwise indicated, typical conditions are: Operating Ambient Temp = 25 °C, VBAT = 3.3 V, center frequency = 2437 MHz,<br>using the integrated antenna, and measured with the ideal application board size for 2.4 GHz radiation.<br>**Table 4.7. Radiated Characteristics**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Application board size, radi-<br>ated edge "X" dimension1<br>PCBX_MM<br>40<br>50<br>—<br>mm<br>Antenna Efficiency<br>ANTEFF<br>Optimal application board design<br>—<br>-1.4<br>—<br>dB<br>**Note:**<br>1. Refer to "UG384: WGM160P Hardware Design Users Guide" for more PCB layout details.|Not Recommended for New Designs<br>**Table 4.6. RF Receiver Characteristics**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>RX Sensitivity for 8% FER<br>(1024 Octet)1<br>SENSB<br>802.11b: 1 Mbps<br>—<br>-95.5<br>—<br>dBm<br>802.11b: 11 Mbps<br>—<br>-88.3<br>—<br>dBm<br>RX Sensitivity for 10% PER<br>(1024 Octet)1<br>SENSG<br>802.11g: 6 Mbps<br>—<br>-89<br>—<br>dBm<br>802.11g: 54 Mbps<br>—<br>-75.2<br>—<br>dBm<br>RX Sensitivity for 10% PER<br>(4096 Octet)1<br>SENSEN<br>802.11n: MCS=0<br>—<br>-89.3<br>—<br>dBm<br>802.11n: MCS=7<br>—<br>-72.8<br>—<br>dBm<br>RX Max Strong Signal for<br>8% FER (1024 Octet)<br>RXSAT_B<br>802.11b: 1 Mbps<br>—<br>-4.0<br>—<br>dBm<br>802.11b: 11 Mbps<br>—<br>-10.0<br>—<br>dBm<br>RX Max Strong Signal for<br>10% PER (1024 Octet)<br>RXSAT_G<br>802.11g: 6 Mbps<br>—<br>-9.0<br>—<br>dBm<br>802.11g: 54 Mbps<br>—<br>-9.0<br>—<br>dBm<br>RX Max Strong Signal for<br>10% PER (4096 Octet)<br>RXSAT_N<br>802.11n: MCS=0<br>—<br>-9.0<br>—<br>dBm<br>802.11n: MCS=7<br>—<br>-9.0<br>—<br>dBm<br>Sensitivity variation across<br>frequency range, CH1 to<br>CH14<br>SENSVAR_V<br>802.11b 1 Mbps<br>—<br>+/-0.5<br>—<br>dB<br>Sensitivity variation over<br>temperature range, -40 to<br>85C<br>SENSVAR_TEMP<br>802.11b 1 Mbps<br>—<br>+/-1.3<br>—<br>dB<br>RX Channel power Indicator<br>Step Size<br>RCPISTEP<br>802.11b: 1 Mbps<br>—<br>0.5<br>—<br>dB<br>**Note:**<br>1. Measurement taken at U.FL connector. Includes 0.5 dB loss introduced by connnector.<br>**4.7 Radiated Characteristics**<br>Unless otherwise indicated, typical conditions are: Operating Ambient Temp = 25 °C, VBAT = 3.3 V, center frequency = 2437 MHz,<br>using the integrated antenna, and measured with the ideal application board size for 2.4 GHz radiation.<br>**Table 4.7. Radiated Characteristics**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Application board size, radi-<br>ated edge "X" dimension1<br>PCBX_MM<br>40<br>50<br>—<br>mm<br>Antenna Efficiency<br>ANTEFF<br>Optimal application board design<br>—<br>-1.4<br>—<br>dB<br>**Note:**<br>1. Refer to "UG384: WGM160P Hardware Design Users Guide" for more PCB layout details.|Not Recommended for New Designs<br>**Table 4.6. RF Receiver Characteristics**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>RX Sensitivity for 8% FER<br>(1024 Octet)1<br>SENSB<br>802.11b: 1 Mbps<br>—<br>-95.5<br>—<br>dBm<br>802.11b: 11 Mbps<br>—<br>-88.3<br>—<br>dBm<br>RX Sensitivity for 10% PER<br>(1024 Octet)1<br>SENSG<br>802.11g: 6 Mbps<br>—<br>-89<br>—<br>dBm<br>802.11g: 54 Mbps<br>—<br>-75.2<br>—<br>dBm<br>RX Sensitivity for 10% PER<br>(4096 Octet)1<br>SENSEN<br>802.11n: MCS=0<br>—<br>-89.3<br>—<br>dBm<br>802.11n: MCS=7<br>—<br>-72.8<br>—<br>dBm<br>RX Max Strong Signal for<br>8% FER (1024 Octet)<br>RXSAT_B<br>802.11b: 1 Mbps<br>—<br>-4.0<br>—<br>dBm<br>802.11b: 11 Mbps<br>—<br>-10.0<br>—<br>dBm<br>RX Max Strong Signal for<br>10% PER (1024 Octet)<br>RXSAT_G<br>802.11g: 6 Mbps<br>—<br>-9.0<br>—<br>dBm<br>802.11g: 54 Mbps<br>—<br>-9.0<br>—<br>dBm<br>RX Max Strong Signal for<br>10% PER (4096 Octet)<br>RXSAT_N<br>802.11n: MCS=0<br>—<br>-9.0<br>—<br>dBm<br>802.11n: MCS=7<br>—<br>-9.0<br>—<br>dBm<br>Sensitivity variation across<br>frequency range, CH1 to<br>CH14<br>SENSVAR_V<br>802.11b 1 Mbps<br>—<br>+/-0.5<br>—<br>dB<br>Sensitivity variation over<br>temperature range, -40 to<br>85C<br>SENSVAR_TEMP<br>802.11b 1 Mbps<br>—<br>+/-1.3<br>—<br>dB<br>RX Channel power Indicator<br>Step Size<br>RCPISTEP<br>802.11b: 1 Mbps<br>—<br>0.5<br>—<br>dB<br>**Note:**<br>1. Measurement taken at U.FL connector. Includes 0.5 dB loss introduced by connnector.<br>**4.7 Radiated Characteristics**<br>Unless otherwise indicated, typical conditions are: Operating Ambient Temp = 25 °C, VBAT = 3.3 V, center frequency = 2437 MHz,<br>using the integrated antenna, and measured with the ideal application board size for 2.4 GHz radiation.<br>**Table 4.7. Radiated Characteristics**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Application board size, radi-<br>ated edge "X" dimension1<br>PCBX_MM<br>40<br>50<br>—<br>mm<br>Antenna Efficiency<br>ANTEFF<br>Optimal application board design<br>—<br>-1.4<br>—<br>dB<br>**Note:**<br>1. Refer to "UG384: WGM160P Hardware Design Users Guide" for more PCB layout details.|Not Recommended for New Designs<br>**Table 4.6. RF Receiver Characteristics**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>RX Sensitivity for 8% FER<br>(1024 Octet)1<br>SENSB<br>802.11b: 1 Mbps<br>—<br>-95.5<br>—<br>dBm<br>802.11b: 11 Mbps<br>—<br>-88.3<br>—<br>dBm<br>RX Sensitivity for 10% PER<br>(1024 Octet)1<br>SENSG<br>802.11g: 6 Mbps<br>—<br>-89<br>—<br>dBm<br>802.11g: 54 Mbps<br>—<br>-75.2<br>—<br>dBm<br>RX Sensitivity for 10% PER<br>(4096 Octet)1<br>SENSEN<br>802.11n: MCS=0<br>—<br>-89.3<br>—<br>dBm<br>802.11n: MCS=7<br>—<br>-72.8<br>—<br>dBm<br>RX Max Strong Signal for<br>8% FER (1024 Octet)<br>RXSAT_B<br>802.11b: 1 Mbps<br>—<br>-4.0<br>—<br>dBm<br>802.11b: 11 Mbps<br>—<br>-10.0<br>—<br>dBm<br>RX Max Strong Signal for<br>10% PER (1024 Octet)<br>RXSAT_G<br>802.11g: 6 Mbps<br>—<br>-9.0<br>—<br>dBm<br>802.11g: 54 Mbps<br>—<br>-9.0<br>—<br>dBm<br>RX Max Strong Signal for<br>10% PER (4096 Octet)<br>RXSAT_N<br>802.11n: MCS=0<br>—<br>-9.0<br>—<br>dBm<br>802.11n: MCS=7<br>—<br>-9.0<br>—<br>dBm<br>Sensitivity variation across<br>frequency range, CH1 to<br>CH14<br>SENSVAR_V<br>802.11b 1 Mbps<br>—<br>+/-0.5<br>—<br>dB<br>Sensitivity variation over<br>temperature range, -40 to<br>85C<br>SENSVAR_TEMP<br>802.11b 1 Mbps<br>—<br>+/-1.3<br>—<br>dB<br>RX Channel power Indicator<br>Step Size<br>RCPISTEP<br>802.11b: 1 Mbps<br>—<br>0.5<br>—<br>dB<br>**Note:**<br>1. Measurement taken at U.FL connector. Includes 0.5 dB loss introduced by connnector.<br>**4.7 Radiated Characteristics**<br>Unless otherwise indicated, typical conditions are: Operating Ambient Temp = 25 °C, VBAT = 3.3 V, center frequency = 2437 MHz,<br>using the integrated antenna, and measured with the ideal application board size for 2.4 GHz radiation.<br>**Table 4.7. Radiated Characteristics**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Application board size, radi-<br>ated edge "X" dimension1<br>PCBX_MM<br>40<br>50<br>—<br>mm<br>Antenna Efficiency<br>ANTEFF<br>Optimal application board design<br>—<br>-1.4<br>—<br>dB<br>**Note:**<br>1. Refer to "UG384: WGM160P Hardware Design Users Guide" for more PCB layout details.|Not Recommended for New Designs<br>**Table 4.6. RF Receiver Characteristics**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>RX Sensitivity for 8% FER<br>(1024 Octet)1<br>SENSB<br>802.11b: 1 Mbps<br>—<br>-95.5<br>—<br>dBm<br>802.11b: 11 Mbps<br>—<br>-88.3<br>—<br>dBm<br>RX Sensitivity for 10% PER<br>(1024 Octet)1<br>SENSG<br>802.11g: 6 Mbps<br>—<br>-89<br>—<br>dBm<br>802.11g: 54 Mbps<br>—<br>-75.2<br>—<br>dBm<br>RX Sensitivity for 10% PER<br>(4096 Octet)1<br>SENSEN<br>802.11n: MCS=0<br>—<br>-89.3<br>—<br>dBm<br>802.11n: MCS=7<br>—<br>-72.8<br>—<br>dBm<br>RX Max Strong Signal for<br>8% FER (1024 Octet)<br>RXSAT_B<br>802.11b: 1 Mbps<br>—<br>-4.0<br>—<br>dBm<br>802.11b: 11 Mbps<br>—<br>-10.0<br>—<br>dBm<br>RX Max Strong Signal for<br>10% PER (1024 Octet)<br>RXSAT_G<br>802.11g: 6 Mbps<br>—<br>-9.0<br>—<br>dBm<br>802.11g: 54 Mbps<br>—<br>-9.0<br>—<br>dBm<br>RX Max Strong Signal for<br>10% PER (4096 Octet)<br>RXSAT_N<br>802.11n: MCS=0<br>—<br>-9.0<br>—<br>dBm<br>802.11n: MCS=7<br>—<br>-9.0<br>—<br>dBm<br>Sensitivity variation across<br>frequency range, CH1 to<br>CH14<br>SENSVAR_V<br>802.11b 1 Mbps<br>—<br>+/-0.5<br>—<br>dB<br>Sensitivity variation over<br>temperature range, -40 to<br>85C<br>SENSVAR_TEMP<br>802.11b 1 Mbps<br>—<br>+/-1.3<br>—<br>dB<br>RX Channel power Indicator<br>Step Size<br>RCPISTEP<br>802.11b: 1 Mbps<br>—<br>0.5<br>—<br>dB<br>**Note:**<br>1. Measurement taken at U.FL connector. Includes 0.5 dB loss introduced by connnector.<br>**4.7 Radiated Characteristics**<br>Unless otherwise indicated, typical conditions are: Operating Ambient Temp = 25 °C, VBAT = 3.3 V, center frequency = 2437 MHz,<br>using the integrated antenna, and measured with the ideal application board size for 2.4 GHz radiation.<br>**Table 4.7. Radiated Characteristics**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Application board size, radi-<br>ated edge "X" dimension1<br>PCBX_MM<br>40<br>50<br>—<br>mm<br>Antenna Efficiency<br>ANTEFF<br>Optimal application board design<br>—<br>-1.4<br>—<br>dB<br>**Note:**<br>1. Refer to "UG384: WGM160P Hardware Design Users Guide" for more PCB layout details.|Not Recommended for New Designs<br>**Table 4.6. RF Receiver Characteristics**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>RX Sensitivity for 8% FER<br>(1024 Octet)1<br>SENSB<br>802.11b: 1 Mbps<br>—<br>-95.5<br>—<br>dBm<br>802.11b: 11 Mbps<br>—<br>-88.3<br>—<br>dBm<br>RX Sensitivity for 10% PER<br>(1024 Octet)1<br>SENSG<br>802.11g: 6 Mbps<br>—<br>-89<br>—<br>dBm<br>802.11g: 54 Mbps<br>—<br>-75.2<br>—<br>dBm<br>RX Sensitivity for 10% PER<br>(4096 Octet)1<br>SENSEN<br>802.11n: MCS=0<br>—<br>-89.3<br>—<br>dBm<br>802.11n: MCS=7<br>—<br>-72.8<br>—<br>dBm<br>RX Max Strong Signal for<br>8% FER (1024 Octet)<br>RXSAT_B<br>802.11b: 1 Mbps<br>—<br>-4.0<br>—<br>dBm<br>802.11b: 11 Mbps<br>—<br>-10.0<br>—<br>dBm<br>RX Max Strong Signal for<br>10% PER (1024 Octet)<br>RXSAT_G<br>802.11g: 6 Mbps<br>—<br>-9.0<br>—<br>dBm<br>802.11g: 54 Mbps<br>—<br>-9.0<br>—<br>dBm<br>RX Max Strong Signal for<br>10% PER (4096 Octet)<br>RXSAT_N<br>802.11n: MCS=0<br>—<br>-9.0<br>—<br>dBm<br>802.11n: MCS=7<br>—<br>-9.0<br>—<br>dBm<br>Sensitivity variation across<br>frequency range, CH1 to<br>CH14<br>SENSVAR_V<br>802.11b 1 Mbps<br>—<br>+/-0.5<br>—<br>dB<br>Sensitivity variation over<br>temperature range, -40 to<br>85C<br>SENSVAR_TEMP<br>802.11b 1 Mbps<br>—<br>+/-1.3<br>—<br>dB<br>RX Channel power Indicator<br>Step Size<br>RCPISTEP<br>802.11b: 1 Mbps<br>—<br>0.5<br>—<br>dB<br>**Note:**<br>1. Measurement taken at U.FL connector. Includes 0.5 dB loss introduced by connnector.<br>**4.7 Radiated Characteristics**<br>Unless otherwise indicated, typical conditions are: Operating Ambient Temp = 25 °C, VBAT = 3.3 V, center frequency = 2437 MHz,<br>using the integrated antenna, and measured with the ideal application board size for 2.4 GHz radiation.<br>**Table 4.7. Radiated Characteristics**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Application board size, radi-<br>ated edge "X" dimension1<br>PCBX_MM<br>40<br>50<br>—<br>mm<br>Antenna Efficiency<br>ANTEFF<br>Optimal application board design<br>—<br>-1.4<br>—<br>dB<br>**Note:**<br>1. Refer to "UG384: WGM160P Hardware Design Users Guide" for more PCB layout details.|Not Recommended for New Designs<br>**Table 4.6. RF Receiver Characteristics**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>RX Sensitivity for 8% FER<br>(1024 Octet)1<br>SENSB<br>802.11b: 1 Mbps<br>—<br>-95.5<br>—<br>dBm<br>802.11b: 11 Mbps<br>—<br>-88.3<br>—<br>dBm<br>RX Sensitivity for 10% PER<br>(1024 Octet)1<br>SENSG<br>802.11g: 6 Mbps<br>—<br>-89<br>—<br>dBm<br>802.11g: 54 Mbps<br>—<br>-75.2<br>—<br>dBm<br>RX Sensitivity for 10% PER<br>(4096 Octet)1<br>SENSEN<br>802.11n: MCS=0<br>—<br>-89.3<br>—<br>dBm<br>802.11n: MCS=7<br>—<br>-72.8<br>—<br>dBm<br>RX Max Strong Signal for<br>8% FER (1024 Octet)<br>RXSAT_B<br>802.11b: 1 Mbps<br>—<br>-4.0<br>—<br>dBm<br>802.11b: 11 Mbps<br>—<br>-10.0<br>—<br>dBm<br>RX Max Strong Signal for<br>10% PER (1024 Octet)<br>RXSAT_G<br>802.11g: 6 Mbps<br>—<br>-9.0<br>—<br>dBm<br>802.11g: 54 Mbps<br>—<br>-9.0<br>—<br>dBm<br>RX Max Strong Signal for<br>10% PER (4096 Octet)<br>RXSAT_N<br>802.11n: MCS=0<br>—<br>-9.0<br>—<br>dBm<br>802.11n: MCS=7<br>—<br>-9.0<br>—<br>dBm<br>Sensitivity variation across<br>frequency range, CH1 to<br>CH14<br>SENSVAR_V<br>802.11b 1 Mbps<br>—<br>+/-0.5<br>—<br>dB<br>Sensitivity variation over<br>temperature range, -40 to<br>85C<br>SENSVAR_TEMP<br>802.11b 1 Mbps<br>—<br>+/-1.3<br>—<br>dB<br>RX Channel power Indicator<br>Step Size<br>RCPISTEP<br>802.11b: 1 Mbps<br>—<br>0.5<br>—<br>dB<br>**Note:**<br>1. Measurement taken at U.FL connector. Includes 0.5 dB loss introduced by connnector.<br>**4.7 Radiated Characteristics**<br>Unless otherwise indicated, typical conditions are: Operating Ambient Temp = 25 °C, VBAT = 3.3 V, center frequency = 2437 MHz,<br>using the integrated antenna, and measured with the ideal application board size for 2.4 GHz radiation.<br>**Table 4.7. Radiated Characteristics**<br>**Parameter**<br>**Symbol**<br>**Test Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>Application board size, radi-<br>ated edge "X" dimension1<br>PCBX_MM<br>40<br>50<br>—<br>mm<br>Antenna Efficiency<br>ANTEFF<br>Optimal application board design<br>—<br>-1.4<br>—<br>dB<br>**Note:**<br>1. Refer to "UG384: WGM160P Hardware Design Users Guide" for more PCB layout details.| |---|---|---|---|---|---|---|---| ||||||||| ||o<br>**Parameter**|<br>**Symbol**|<br>**Test Condition**|<br>**Min**|<br>**Typ**|<br>**Max**|<br>**Unit**| ||<br>Application board size, radi-<br>ated edge "X" dimension1|<br>PCBX_MM||<br>40|<br>50|<br>—|<br>mm| ||<br>Antenna Efficiency|<br>ANTEFF|<br>Optimal application board design|<br>—|<br>-1.4|<br>—|<br>dB| ||**Note:**<br>1. Refer to "UG384: WGM160P Hardware Design Users Guide" for more PCB layout details.||||||| |Not<br>**Parameter**<br>**Symbol**<br>Application board size, radi-<br>ated edge "X" dimension1<br>PCBX_MM|<br>**Test Condition**|<br>**Min**<br>40|<br>**Typ**<br>50|<br>**Max**<br>—|<br>**Unit**<br>mm| |---|---|---|---|---|---| ||||||| |Antenna Efficiency<br>ANTEFF|Optimal application board design|—|-1.4|—|dB| |**Note:**|||||| |1. Refer to "UG384: WGM160P Hardware Design Users Guide" for more PCB layout details.|||||| **silabs.com** | Building a more connected world. Rev. 1.4 | 11 WGM160P Wi-Fi[®] Module Data Sheet Electrical Specifications ## **4.8 Microcontroller Peripherals** WGM160P offers an extensive list of peripherals, some of which are listed below: - 12-bit ADC - 12-bit DAC - GPIO - USART (UART/SPI/I2S) • QSPI with Execute In Place (XIP) support • Capacitive Touch Sensing in all GPIOs • LESENSE • 10/100 Ethernet MAC with RMII interface (50 MHz external crystal required) • USB device (2.0 Full speed) • I[2] C peripheral interfaces • CAN • Timers • LCD Driver For more information on the pins these peripherals are availabile on, please consult: 7.2 GPIO Functionality and 7.3 Alternate Pin Functionality. For details on the electrical performance of these peripherals, please consult the relevant portions of Section 4 in the EFM32GG11 Family Datasheet (See EFM32GG11B820F2048GM64) . **silabs.com** | Building a more connected world. Rev. 1.4 | 12 WGM160P Wi-Fi[®] Module Data Sheet Typical Applications and Connections ## **5. Typical Applications and Connections** For more information, see UG384: WGM160P Hardware Design Users Guide. ## **5.1 RF Connections** **5.1.1 Antenna Ports** The WGM160P offers two RF ports that support antenna diversity using an internal switch. In applications with only one antenna, the unused port should be terminated to ground with a 47-51 Ω resistor. Leaving the unused port floating or tying directly to ground will result in degraded performance. An external antenna connected to either RF port needs to be properly matched with at least -10dB return loss (VSWR < 2). **5.1.2 Antenna Diversity** In applications where multipath fading is a potential issue, such as indoors, a second antenna can be connected. A firmware feature can be enabled to automatically determine which of the two antennas gives a better signal, allowing significant improvement in link reliability. **5.2 Multi-Protocol Coexistence** Packet Transmit Arbitration (PTA) pins are provide to share antenna and optimize coexistence performance with other networks including other protocols. See Application Notes AN1128: Bluetooth Coexistence with Wi-Fi, AN1017: Zigbee and Thread Coexistence with Wi-Fi and Wi-Fi Coexistence with Other 2.4GHz Radio Protocols section in www.docs.silabs.com/wifi. **silabs.com** | Building a more connected world. Rev. 1.4 | 13 WGM160P Wi-Fi[®] Module Data Sheet Typical Applications and Connections ## **5.3 Example Schematic** **Note:** RF1 pin connected internally to module antenna in WGM160PX22KGAx. VDD3V3 4 55 fT 7] SND WGM160PX22KGAX GND Ea at i esayoan ool es I" SiR =] SNO GND FES | VBAT PAISTEH 7—| PTA_TX_CONF PAB -Z5 A] PTALRF_ACT posta 9] THERMALGND PESIa> I P70] TERMALGND Peerage taro | THERMALGND PET bas UART_TX Ta—| THERMALGND PF1/US2RX/SWDIO rag SwDIO 737] PTAFREQ PFO/US2TX/SWCLK ¢ | SWCLK Ta] PTA_STATUS GNDF-A> | I 75] PEV4/RMIL_TXD1 PF11/USB_DP [35 TBO] PETSIRMII_TXDO PF10/USB_OM 75 17] PAOIRMIL_TXEN VBUS I-35 TA] PAVRMILRXD vo Pcs To] PAZ/RMII_RXDO 30 PFSIUS2CS F-5> FO] PASIRMILREFCLK se Z az PF2IUS2CLK Pa 57] PASIRMILCRSDY = g 3 5 _ am PDS/US2RTS [ae 57] PASIRMII_RXER srr EE PDB/IUS2CTS F-54 | 55-| PSS/ETH_MDIOGND ZZEHwHe Segcaff RESETGND 33 | (| RESET anaZzag2aa OQGoaoaodanaaGaa fan] UART_RTS __f UART_CTS [7S **Figure 5.1. Example Schematic for NCP Application** **silabs.com** | Building a more connected world. Rev. 1.4 | 14 WGM160P Wi-Fi[®] Module Data Sheet Software ## **6. Software** WGM160P software is based on the FMAC (Full MAC) driver. Architecture and examples are described below. ## **6.1 FMAC (Full MAC) Driver Architecture** WPA/WPA2 personal supplicant, allowing it to handle full MAC responsibilities without utilizing the host MCU. The host receives an IP packet and implements all stack layers necessary above it. The figure below shows the typical software architecture in Full MAC implementations. WGM160P Application IP Stack EFM32GG11 WF200 Full MAC Driver SDIO Driver | Application SDIO [| API FMAC API i FW& SW WPA Personal Supplicant CFG LMAC Wi-Fi Radio **Figure 6.1. Full MAC Implementation Note:** The WPA supplicant on WF200 does not support WPA enterprise. If WPA-enterprise is required, then it should be implemented above the IP stack in the EFM32GG11 software. **6.2 Examples** Numerous software examples are available from Simplicity Studio or the GitHub repository. These examples utilize the MicriumOS Kernel, FreeRTOS or Bare Metal (no RTOS). Unless otherwise specified in the repository, all examples are considered to be EXPERIMENTAL QUALITY which implies that the code provided in the repos has not been formally tested and is provided as-is. They are not suitable for production environment. For more information see the following: • https://docs.silabs.com/wifi/ • https://github.com/SiliconLabs/wfx-fullMAC-tools Utilizing the Full MAC driver, both the lower MAC and upper MAC are running in WF200 of the WGM160P. The WF200 contains a WPA/WPA2 personal supplicant, allowing it to handle full MAC responsibilities without utilizing the host MCU. The host receives an IP packet and implements all stack layers necessary above it. The figure below shows the typical software architecture in Full MAC implementations. **silabs.com** | Building a more connected world. Rev. 1.4 | 15 WGM160P Wi-Fi[®] Module Data Sheet Pin Descriptions ## **7. Pin Descriptions** ## **7.1 WGM160P Device Pinout** **==> picture [576 x 596] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 7.1. WGM160P Device Pinout<br>The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the sup-<br>ported features for each GPIO pin, see 7.2 GPIO Functionality or 7.3 Alternate Pin Functionality.<br>Table 7.1. WGM160P Device Pinout<br>Pin Name Pin(s) Description Pin Name Pin(s) Description<br>1 External antenna connection for diversi-<br>2 ty antenna. Terminate to ground with<br>ANT_GND Antenna ground. RF2 3<br>54 47-51 Ohms if not connected to an an-<br>55 tenna.<br>Not Recommended for New Designs<br>**----- End of picture text -----**<br> ||Recommended for New D<br>**Figure 7.1. WGM160P Device Pinout**<br>The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the sup-<br>ported features for each GPIO pin, see7.2 GPIO Functionalityor7.3 Alternate Pin Functionality.<br>**Table 7.1. WGM160P Device Pinout**|Recommended for New D<br>**Figure 7.1. WGM160P Device Pinout**<br>The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the sup-<br>ported features for each GPIO pin, see7.2 GPIO Functionalityor7.3 Alternate Pin Functionality.<br>**Table 7.1. WGM160P Device Pinout**|Recommended for New D<br>**Figure 7.1. WGM160P Device Pinout**<br>The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the sup-<br>ported features for each GPIO pin, see7.2 GPIO Functionalityor7.3 Alternate Pin Functionality.<br>**Table 7.1. WGM160P Device Pinout**|Recommended for New D<br>**Figure 7.1. WGM160P Device Pinout**<br>The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the sup-<br>ported features for each GPIO pin, see7.2 GPIO Functionalityor7.3 Alternate Pin Functionality.<br>**Table 7.1. WGM160P Device Pinout**|Recommended for New D<br>**Figure 7.1. WGM160P Device Pinout**<br>The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the sup-<br>ported features for each GPIO pin, see7.2 GPIO Functionalityor7.3 Alternate Pin Functionality.<br>**Table 7.1. WGM160P Device Pinout**|Recommended for New D<br>**Figure 7.1. WGM160P Device Pinout**<br>The following table provides package pin connections and general descriptions of pin functionality. For detailed information on the sup-<br>ported features for each GPIO pin, see7.2 GPIO Functionalityor7.3 Alternate Pin Functionality.<br>**Table 7.1. WGM160P Device Pinout**| |---|---|---|---|---|---|---| |||||||| ||t<br>**Pin Name**|<br>**Pin(s)**|<br>**Description**|<br>**Pin Name**|<br>**Pin(s)**|<br>**Description**| ||No<br>ANT_GND|<br>1<br>2<br>54<br>55|<br>Antenna ground.|<br>RF2|<br>3|<br>External antenna connection for diversi-<br>ty antenna. Terminate to ground with<br>47-51 Ohms if not connected to an an-<br>tenna.| **silabs.com** | Building a more connected world. Rev. 1.4 | 16 WGM160P Wi-Fi[®] Module Data Sheet Pin Descriptions ||**Pin Name**|**Pin(s)**|**Description**||**Pin Name**|**Pin(s)**|**Description**|| |---|---|---|---|---|---|---|---|---| ||<br>GND|<br>4<br>8<br>9<br>10<br>11<br>23<br>27<br>30<br>33<br>43<br>52|<br>Ground. Connect all ground pins to<br>ground plane.||<br>VBAT|<br>5|igns<br>Module power supply|| ||<br>PTA_TX_CO<br>NF|<br>6|<br>PTA TX_CONF pin. These pins can be<br>used to manage co-existence with an-<br>other 2.4 GHz radio.||<br>PTA_RF_AC<br>T|<br>7|es<br>PTA RF_ACT pin. These pins can be<br>used to manage co-existence with an-<br>other 2.4 GHz radio.|| ||<br>PTA_FREQ|<br>12|<br>PTA FREQ pin. These pins can be<br>used to manage co-existence with an-<br>other 2.4 GHz radio.||<br>PTA_STA-<br>TUS|<br>13|D<br>PTA STATUS pin. These pins can be<br>used to manage co-existence with an-<br>other 2.4 GHz radio.|| ||<br>PE14|<br>14|<br>GPIO||<br>PE15|<br>15|<br>GPIO|| ||<br>PA0|<br>16|<br>GPIO||<br>PA1|<br>17|<br>GPIO|| ||<br>PA2|<br>18|<br>GPIO||<br>PA3|<br>19|<br>GPIO|| ||<br>PA4|<br>20|<br>GPIO||<br>PA5|<br>21|<br>GPIO|| ||<br>PB3|<br>22|<br>GPIO||<br>PB4|<br>24|<br>GPIO|| ||<br>PB5|<br>25|<br>GPIO||f<br>PB6|<br>26|<br>GPIO|| ||<br>PB13|<br>28|<br>GPIO||<br>PB14|<br>29|<br>GPIO|| ||<br>PB11|<br>31|<br>GPIO||<br>PB12|<br>32|<br>GPIO|| ||<br>RESETn|<br>34|end<br>Reset input, active low. This pin is inter-<br>nally pulled up to VBAT. To apply an<br>external reset source to this pin, it is re-<br>quired to only drive this pin low during<br>reset, and let the internal pull-up ensure<br>that reset is released.||<br>PD6|<br>35|<br>GPIO|| ||<br>PD8|<br>36|<br>GPIO||<br>PF2|<br>37|<br>GPIO|| ||<br>PF5|<br>38|<br>GPIO||<br>PC5|<br>39|<br>GPIO|| ||<br>VBUS|<br>40|o<br>USB VBUS signal and auxiliary input to<br>5 V regulator. May be left disconnected<br>if USB is unused.||<br>PF10|<br>41|<br>GPIO (5V)|| ||<br>PF11|<br>42|<br>GPIO (5V)||<br>PF0|<br>44|<br>GPIO (5V)|| ||<br>PF1|<br>45|<br>GPIO (5V)||<br>PE7|<br>46|<br>GPIO|| ||<br>PE6|<br>47|<br>GPIO||<br>PE5|<br>48|<br>GPIO|| ||t<br>PC4|<br>49|<br>GPIO||<br>PA6|<br>50|<br>GPIO|| ||No<br>PA15|<br>51|<br>GPIO||<br>RF1|<br>53|<br>External antenna connection on<br>WGM160P22N. Not connected on<br>WGM160P22A.|| ||<br>**Note:**<br>1. GPIO with 5V tolerance are indicated by (5V).|||||||| **silabs.com** | Building a more connected world. Rev. 1.4 | 17 WGM160P Wi-Fi[®] Module Data Sheet Pin Descriptions ## **7.2 GPIO Functionality** A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows the name of each GPIO pin, followed by the functionality available on that pin. Refer to 7.3 Alternate Pin Functionality for a list of GPIO locations available for each function. Full peripheral features and flexibility are not supported with all software architectures. Refer to “UG384 WGM160P Hardware Design Users Guide” for more details. |||ecommended for New Designs<br>**Table 7.2. GPIO Functionality Table**<br>**Pin Alternate Functionality / Description**<br>**Analog**<br>**Timers**<br>**Communication**<br>**Other**<br>BUSBY<br>BUSAX<br>LCD_SEG13<br>TIM0_CC0 #0<br>TIM0_CC1 #7<br>TIM3_CC0 #4<br>PCNT0_S0IN #4<br>ETH_RMIITXEN<br>US1_RX #5<br>US3_TX #0<br>QSPI0_CS0<br>LEU0_RX #4<br>I2C0_SDA #0<br>CMU_CLK2 #0<br>PRS_CH0 #0<br>PRS_CH3<br>GPIO_EM4WU0<br>BUSAY<br>BUSBX<br>LCD_SEG14<br>TIM0_CC0 #7<br>TIM0_CC1 #0<br>TIM3_CC1 #4<br>PCNT0_S1IN #4<br>ETH_RMIIRXD1<br>US3_RX #0<br>QSPI0_CS1<br>I2C0_SCL #0<br>CMU_CLK1 #0<br>PRS_CH1<br>BUSBY<br>BUSAX<br>LCD_SEG15<br>TIM0_CC2 #0<br>TIM3_CC2 #4<br>ETH_RMIIRXD0<br>US1_RX #6<br>US3_CLK<br>QSPI0_DQ0<br>CMU_CLK0 #0<br>PRS_CH8<br>ETM_TD0 #3<br>BUSAY<br>BUSBX<br>LCD_SEG16<br>TIM0_CDTI0<br>TIM3_CC0 #5<br>ETH_RMIIREFCLK<br>US3_CS<br>U0_TX #2<br>QSPI0_DQ1<br>CMU_CLK2 #1<br>CMU_CLKI0 #1<br>CMU_CLK2 #4<br>LES_ALTEX2<br>PRS_CH9<br>ETM_TD1<br>BUSBY<br>BUSAX<br>LCD_SEG17<br>TIM0_CDTI1<br>TIM3_CC1 #5<br>ETH_RMIICRSDV<br>US3_CTS #0<br>U0_RX #2<br>QSPI0_DQ2<br>LES_ALTEX3<br>PRS_CH16 #0<br>ETM_TD2 #3<br>BUSAY<br>BUSBX<br>LCD_SEG18<br>TIM0_CDTI2 #0<br>TIM3_CC2 #5<br>PCNT1_S0IN #0<br>ETH_RMIIRXER<br>US3_RTS<br>U0_CTS<br>QSPI0_DQ3<br>LEU1_TX #1<br>LES_ALTEX4<br>PRS_CH17 #0<br>ACMP1_O #7<br>ETM_TD3 #3|ecommended for New Designs<br>**Table 7.2. GPIO Functionality Table**<br>**Pin Alternate Functionality / Description**<br>**Analog**<br>**Timers**<br>**Communication**<br>**Other**<br>BUSBY<br>BUSAX<br>LCD_SEG13<br>TIM0_CC0 #0<br>TIM0_CC1 #7<br>TIM3_CC0 #4<br>PCNT0_S0IN #4<br>ETH_RMIITXEN<br>US1_RX #5<br>US3_TX #0<br>QSPI0_CS0<br>LEU0_RX #4<br>I2C0_SDA #0<br>CMU_CLK2 #0<br>PRS_CH0 #0<br>PRS_CH3<br>GPIO_EM4WU0<br>BUSAY<br>BUSBX<br>LCD_SEG14<br>TIM0_CC0 #7<br>TIM0_CC1 #0<br>TIM3_CC1 #4<br>PCNT0_S1IN #4<br>ETH_RMIIRXD1<br>US3_RX #0<br>QSPI0_CS1<br>I2C0_SCL #0<br>CMU_CLK1 #0<br>PRS_CH1<br>BUSBY<br>BUSAX<br>LCD_SEG15<br>TIM0_CC2 #0<br>TIM3_CC2 #4<br>ETH_RMIIRXD0<br>US1_RX #6<br>US3_CLK<br>QSPI0_DQ0<br>CMU_CLK0 #0<br>PRS_CH8<br>ETM_TD0 #3<br>BUSAY<br>BUSBX<br>LCD_SEG16<br>TIM0_CDTI0<br>TIM3_CC0 #5<br>ETH_RMIIREFCLK<br>US3_CS<br>U0_TX #2<br>QSPI0_DQ1<br>CMU_CLK2 #1<br>CMU_CLKI0 #1<br>CMU_CLK2 #4<br>LES_ALTEX2<br>PRS_CH9<br>ETM_TD1<br>BUSBY<br>BUSAX<br>LCD_SEG17<br>TIM0_CDTI1<br>TIM3_CC1 #5<br>ETH_RMIICRSDV<br>US3_CTS #0<br>U0_RX #2<br>QSPI0_DQ2<br>LES_ALTEX3<br>PRS_CH16 #0<br>ETM_TD2 #3<br>BUSAY<br>BUSBX<br>LCD_SEG18<br>TIM0_CDTI2 #0<br>TIM3_CC2 #5<br>PCNT1_S0IN #0<br>ETH_RMIIRXER<br>US3_RTS<br>U0_CTS<br>QSPI0_DQ3<br>LEU1_TX #1<br>LES_ALTEX4<br>PRS_CH17 #0<br>ACMP1_O #7<br>ETM_TD3 #3|ecommended for New Designs<br>**Table 7.2. GPIO Functionality Table**<br>**Pin Alternate Functionality / Description**<br>**Analog**<br>**Timers**<br>**Communication**<br>**Other**<br>BUSBY<br>BUSAX<br>LCD_SEG13<br>TIM0_CC0 #0<br>TIM0_CC1 #7<br>TIM3_CC0 #4<br>PCNT0_S0IN #4<br>ETH_RMIITXEN<br>US1_RX #5<br>US3_TX #0<br>QSPI0_CS0<br>LEU0_RX #4<br>I2C0_SDA #0<br>CMU_CLK2 #0<br>PRS_CH0 #0<br>PRS_CH3<br>GPIO_EM4WU0<br>BUSAY<br>BUSBX<br>LCD_SEG14<br>TIM0_CC0 #7<br>TIM0_CC1 #0<br>TIM3_CC1 #4<br>PCNT0_S1IN #4<br>ETH_RMIIRXD1<br>US3_RX #0<br>QSPI0_CS1<br>I2C0_SCL #0<br>CMU_CLK1 #0<br>PRS_CH1<br>BUSBY<br>BUSAX<br>LCD_SEG15<br>TIM0_CC2 #0<br>TIM3_CC2 #4<br>ETH_RMIIRXD0<br>US1_RX #6<br>US3_CLK<br>QSPI0_DQ0<br>CMU_CLK0 #0<br>PRS_CH8<br>ETM_TD0 #3<br>BUSAY<br>BUSBX<br>LCD_SEG16<br>TIM0_CDTI0<br>TIM3_CC0 #5<br>ETH_RMIIREFCLK<br>US3_CS<br>U0_TX #2<br>QSPI0_DQ1<br>CMU_CLK2 #1<br>CMU_CLKI0 #1<br>CMU_CLK2 #4<br>LES_ALTEX2<br>PRS_CH9<br>ETM_TD1<br>BUSBY<br>BUSAX<br>LCD_SEG17<br>TIM0_CDTI1<br>TIM3_CC1 #5<br>ETH_RMIICRSDV<br>US3_CTS #0<br>U0_RX #2<br>QSPI0_DQ2<br>LES_ALTEX3<br>PRS_CH16 #0<br>ETM_TD2 #3<br>BUSAY<br>BUSBX<br>LCD_SEG18<br>TIM0_CDTI2 #0<br>TIM3_CC2 #5<br>PCNT1_S0IN #0<br>ETH_RMIIRXER<br>US3_RTS<br>U0_CTS<br>QSPI0_DQ3<br>LEU1_TX #1<br>LES_ALTEX4<br>PRS_CH17 #0<br>ACMP1_O #7<br>ETM_TD3 #3|ecommended for New Designs<br>**Table 7.2. GPIO Functionality Table**<br>**Pin Alternate Functionality / Description**<br>**Analog**<br>**Timers**<br>**Communication**<br>**Other**<br>BUSBY<br>BUSAX<br>LCD_SEG13<br>TIM0_CC0 #0<br>TIM0_CC1 #7<br>TIM3_CC0 #4<br>PCNT0_S0IN #4<br>ETH_RMIITXEN<br>US1_RX #5<br>US3_TX #0<br>QSPI0_CS0<br>LEU0_RX #4<br>I2C0_SDA #0<br>CMU_CLK2 #0<br>PRS_CH0 #0<br>PRS_CH3<br>GPIO_EM4WU0<br>BUSAY<br>BUSBX<br>LCD_SEG14<br>TIM0_CC0 #7<br>TIM0_CC1 #0<br>TIM3_CC1 #4<br>PCNT0_S1IN #4<br>ETH_RMIIRXD1<br>US3_RX #0<br>QSPI0_CS1<br>I2C0_SCL #0<br>CMU_CLK1 #0<br>PRS_CH1<br>BUSBY<br>BUSAX<br>LCD_SEG15<br>TIM0_CC2 #0<br>TIM3_CC2 #4<br>ETH_RMIIRXD0<br>US1_RX #6<br>US3_CLK<br>QSPI0_DQ0<br>CMU_CLK0 #0<br>PRS_CH8<br>ETM_TD0 #3<br>BUSAY<br>BUSBX<br>LCD_SEG16<br>TIM0_CDTI0<br>TIM3_CC0 #5<br>ETH_RMIIREFCLK<br>US3_CS<br>U0_TX #2<br>QSPI0_DQ1<br>CMU_CLK2 #1<br>CMU_CLKI0 #1<br>CMU_CLK2 #4<br>LES_ALTEX2<br>PRS_CH9<br>ETM_TD1<br>BUSBY<br>BUSAX<br>LCD_SEG17<br>TIM0_CDTI1<br>TIM3_CC1 #5<br>ETH_RMIICRSDV<br>US3_CTS #0<br>U0_RX #2<br>QSPI0_DQ2<br>LES_ALTEX3<br>PRS_CH16 #0<br>ETM_TD2 #3<br>BUSAY<br>BUSBX<br>LCD_SEG18<br>TIM0_CDTI2 #0<br>TIM3_CC2 #5<br>PCNT1_S0IN #0<br>ETH_RMIIRXER<br>US3_RTS<br>U0_CTS<br>QSPI0_DQ3<br>LEU1_TX #1<br>LES_ALTEX4<br>PRS_CH17 #0<br>ACMP1_O #7<br>ETM_TD3 #3| |---|---|---|---|---|---| ||<br>**GPIO Name**|<br>**Pin Alternate Functionality / Description**|||| |||<br>**Analog**|<br>**Timers**|<br>**Communication**|i<br>**Other**| ||<br>PA0|<br>BUSBY<br>BUSAX<br>LCD_SEG13|<br>TIM0_CC0 #0<br>TIM0_CC1 #7<br>TIM3_CC0 #4<br>PCNT0_S0IN #4|ew<br>ETH_RMIITXEN<br>US1_RX #5<br>US3_TX #0<br>QSPI0_CS0<br>LEU0_RX #4<br>I2C0_SDA #0|Des<br>CMU_CLK2 #0<br>PRS_CH0 #0<br>PRS_CH3<br>GPIO_EM4WU0| ||<br>PA1|<br>BUSAY<br>BUSBX<br>LCD_SEG14|f<br>TIM0_CC0 #7<br>TIM0_CC1 #0<br>TIM3_CC1 #4<br>PCNT0_S1IN #4|or N<br>ETH_RMIIRXD1<br>US3_RX #0<br>QSPI0_CS1<br>I2C0_SCL #0|<br>CMU_CLK1 #0<br>PRS_CH1| ||<br>PA2|<br>BUSBY<br>BUSAX<br>LCD_SEG15|nded<br>TIM0_CC2 #0<br>TIM3_CC2 #4|<br>ETH_RMIIRXD0<br>US1_RX #6<br>US3_CLK<br>QSPI0_DQ0|<br>CMU_CLK0 #0<br>PRS_CH8<br>ETM_TD0 #3| ||<br>PA3|comm<br>BUSAY<br>BUSBX<br>LCD_SEG16|<br>TIM0_CDTI0<br>TIM3_CC0 #5|<br>ETH_RMIIREFCLK<br>US3_CS<br>U0_TX #2<br>QSPI0_DQ1|<br>CMU_CLK2 #1<br>CMU_CLKI0 #1<br>CMU_CLK2 #4<br>LES_ALTEX2<br>PRS_CH9<br>ETM_TD1| ||ot R<br>PA4|<br>BUSBY<br>BUSAX<br>LCD_SEG17|<br>TIM0_CDTI1<br>TIM3_CC1 #5|<br>ETH_RMIICRSDV<br>US3_CTS #0<br>U0_RX #2<br>QSPI0_DQ2|<br>LES_ALTEX3<br>PRS_CH16 #0<br>ETM_TD2 #3| ||N<br>PA5|<br>BUSAY<br>BUSBX<br>LCD_SEG18|<br>TIM0_CDTI2 #0<br>TIM3_CC2 #5<br>PCNT1_S0IN #0|<br>ETH_RMIIRXER<br>US3_RTS<br>U0_CTS<br>QSPI0_DQ3<br>LEU1_TX #1|<br>LES_ALTEX4<br>PRS_CH17 #0<br>ACMP1_O #7<br>ETM_TD3 #3| **silabs.com** | Building a more connected world. Rev. 1.4 | 18 WGM160P Wi-Fi[®] Module Data Sheet Pin Descriptions ||**GPIO Name**|**Pin Alternate Functionality / Description**|**Pin Alternate Functionality / Description**|**Pin Alternate Functionality / Description**|**Pin Alternate Functionality / Description**|| |---|---|---|---|---|---|---| |||**Analog**|**Timers**|**Communication**|**Other**|| ||<br>PA6|<br>BUSBY<br>BUSAX<br>LCD_SEG19|<br>TIM3_CC0 #6<br>WTIM0_CC0 #1<br>LETIM1_OUT1 #0<br>PCNT1_S1IN #0|<br>ETH_MDC #3<br>U0_RTS #2<br>LEU1_RX #1|<br>PRS_CH6 #0<br>ACMP0_O #4<br>ETM_TCLK<br>GPIO_EM4WU1|| ||<br>PA15|<br>BUSAY<br>BUSBX<br>LCD_SEG12|<br>TIM3_CC2 #0|<br>ETH_MDIO #3<br>US2_CLK #3|sign<br>PRS_CH15 #0|| ||<br>PB3|<br>BUSAY<br>BUSBX<br>LCD_SEG20 /<br>LCD_COM4|<br>TIM1_CC3 #2<br>WTIM0_CC0 #6<br>PCNT1_S0IN #1|w<br>ETH_MDIO #0<br>US2_TX #1<br>US3_TX #2<br>QSPI0_DQ4|De<br>PRS_CH19 #0<br>ACMP0_O #7|| ||<br>PB4|<br>BUSBY<br>BUSAX<br>LCD_SEG21 /<br>LCD_COM5|<br>WTIM0_CC1 #6<br>PCNT1_S1IN #1|r Ne<br>ETH_MDC #0<br>US2_RX #1<br>QSPI0_DQ5<br>LEU1_TX #4|<br>PRS_CH20|| ||<br>PB5|<br>BUSAY<br>BUSBX<br>LCD_SEG22 /<br>LCD_COM6|nded f<br>WTIM0_CC2 #6<br>LETIM1_OUT0<br>PCNT0_S0IN #6|<br>ETH_TSUEXTCLK<br>US0_RTS #4<br>US2_CLK #1<br>QSPI0_DQ6<br>LEU1_RX #4|<br>PRS_CH21 #0|| ||<br>PB6|mm<br>BUSBY<br>BUSAX<br>LCD_SEG23 /<br>LCD_COM7|e<br>TIM0_CC0 #3<br>TIM2_CC0 #4<br>WTIM3_CC0<br>LETIM1_OUT1 #4<br>PCNT0_S1IN #6|<br>ETH_TSUTMRTOG<br>US0_CTS #4<br>US2_CS #1<br>QSPI0_DQ7|<br>PRS_CH12 #1|| ||ot R<br>PB11|eco<br>BUSAY<br>BUSBX<br>VDAC0_OUT0 /<br>OPA0_OUT<br>IDAC0_OUT|<br>TIM0_CDTI2 #4<br>TIM1_CC2<br>WTIM2_CC2<br>LETIM0_OUT0 #1<br>PCNT0_S1IN #7<br>PCNT1_S0IN #6|<br>US0_CTS #5<br>US1_CLK #5<br>US2_CS #3<br>U1_CTS #2<br>I2C1_SDA #1|<br>CMU_CLK1 #5<br>CMU_CLKI0 #7<br>PRS_CH21 #2<br>ACMP0_O #3<br>GPIO_EM4WU7|| ||<br>PB12|<br>BUSBY<br>BUSAX<br>VDAC0_OUT1 /<br>OPA1_OUT|<br>TIM1_CC3 #3<br>WTIM2_CC0<br>LETIM0_OUT1 #1<br>PCNT0_S0IN #7<br>PCNT1_S1IN #6|<br>US2_CTS #1<br>U1_RTS #2<br>I2C1_SCL #1|<br>PRS_CH16 #1|| **silabs.com** | Building a more connected world. Rev. 1.4 | 19 WGM160P Wi-Fi[®] Module Data Sheet Pin Descriptions ||**GPIO Name**|**Pin Alternate Functionality / Description**|**Pin Alternate Functionality / Description**|**Pin Alternate Functionality / Description**|**Pin Alternate Functionality / Description**|| |---|---|---|---|---|---|---| |||**Analog**|**Timers**|**Communication**|**Other**|| ||<br>PB13|<br>BUSAY<br>BUSBX<br>HFXTAL_P|<br>TIM6_CC0<br>WTIM1_CC0 #0<br>PCNT2_S0IN #2|<br>US0_CLK #4<br>US1_CTS<br>LEU0_TX #1|<br>CMU_CLKI0 #3<br>PRS_CH7 #0|| ||<br>PB14|<br>BUSBY<br>BUSAX<br>HFXTAL_N|<br>TIM6_CC1<br>WTIM1_CC1<br>PCNT2_S1IN #2|<br>US0_CS<br>US1_RTS<br>LEU0_RX #1|ign<br>PRS_CH6 #1|| ||<br>PC4|<br>BUSACMP0Y<br>BUSACMP0X<br>OPA0_P|<br>TIM0_CC0 #5<br>TIM0_CDTI2 #3<br>TIM2_CC2<br>LETIM0_OUT0 #3<br>PCNT1_S0IN #3|w<br>US2_CLK #0<br>U0_TX #4<br>U1_CTS #4<br>I2C1_SDA #0|Des<br>LES_CH4<br>PRS_CH18<br>GPIO_EM4WU6|| ||<br>PC5|<br>BUSACMP0Y<br>BUSACMP0X<br>OPA0_N|<br>TIM0_CC1 #5<br>LETIM0_OUT1 #3<br>PCNT1_S1IN #3|r Ne<br>US2_CS #0<br>U0_RX #4<br>U1_RTS #4<br>I2C1_SCL #0|<br>LES_CH5<br>PRS_CH19 #2|| ||<br>PD6|<br>BUSADC0Y<br>BUSADC0X<br>ADC0_EXTP<br>VDAC0_EXT<br>ADC1_EXTP<br>OPA1_P|nded f<br>TIM1_CC0 #4<br>TIM6_CC2<br>WTIM0_CDTI2<br>WTIM1_CC0 #2<br>LETIM0_OUT0 #0<br>PCNT0_S0IN #3|<br>US0_RTS #5<br>US1_RX #2<br>US2_CTS #5<br>US3_CTS #2<br>U0_RTS #5<br>I2C0_SDA #1|<br>CMU_CLK2 #2<br>LES_ALTEX0<br>PRS_CH5<br>ACMP0_O #2<br>ETM_TD0 #0|| ||<br>PD8|mm<br>BU_VIN|<br>WTIM1_CC2 #2|<br>US2_RTS|<br>CMU_CLK1 #1<br>PRS_CH12 #2<br>ACMP2_O|| ||t R<br>PE5|eco<br>BUSCY<br>BUSDX<br>LCD_COM1|<br>TIM3_CC0 #3<br>TIM3_CC2 #2<br>TIM5_CC1 #0<br>TIM6_CDTI1<br>WTIM0_CC1 #0<br>WTIM1_CC2 #4|<br>US0_CLK #1<br>US1_CLK #6<br>US3_CTS #1<br>U1_RTS #3<br>I2C0_SCL #7|<br>PRS_CH17 #2|| ||No<br>PE6|<br>BUSDY<br>BUSCX<br>LCD_COM2|<br>TIM3_CC1 #3<br>TIM5_CC2 #0<br>TIM6_CDTI2<br>WTIM0_CC2 #0<br>WTIM1_CC3|<br>US0_RX<br>US3_TX #1|<br>PRS_CH6 #2|| **silabs.com** | Building a more connected world. Rev. 1.4 | 20 WGM160P Wi-Fi[®] Module Data Sheet Pin Descriptions ||**GPIO Name**|**Pin Alternate Functionality / Description**|**Pin Alternate Functionality / Description**|**Pin Alternate Functionality / Description**|**Pin Alternate Functionality / Description**|| |---|---|---|---|---|---|---| |||**Analog**|**Timers**|**Communication**|**Other**|| ||<br>PE7|<br>BUSCY<br>BUSDX<br>LCD_COM3|<br>TIM3_CC2 #3<br>TIM5_CC0<br>WTIM1_CC0 #5|<br>US0_TX<br>US3_RX #1|<br>PRS_CH7 #2|| ||<br>PE14|<br>BUSDY<br>BUSCX<br>LCD_SEG10|<br>TIM2_CDTI1<br>TIM3_CC0 #0|<br>ETH_RMIITXD1<br>US0_CTS #0<br>QSPI0_SCLK<br>LEU0_TX #2|sign<br>PRS_CH13<br>ETM_TD2 #4|| ||<br>PE15|<br>BUSCY<br>BUSDX<br>LCD_SEG11|<br>TIM2_CDTI2<br>TIM3_CC1 #0|w<br>ETH_RMIITXD0<br>US0_RTS #0<br>QSPI0_DQS<br>LEU0_RX #2|De<br>PRS_CH14<br>ETM_TD3 #4|| ||<br>PF0|<br>BUSDY<br>BUSCX|f<br>TIM0_CC0 #4<br>WTIM0_CC1 #4<br>LETIM0_OUT0 #2|or Ne<br>US2_TX #5<br>CAN0_RX<br>US1_CLK #2<br>LEU0_TX #3<br>I2C0_SDA #5|<br>PRS_CH15 #2<br>ACMP3_O<br>DBG_SWCLKTCK<br>BOOT_TX|| ||<br>PF1|<br>BUSCY<br>BUSDX|nded<br>TIM0_CC1 #4<br>WTIM0_CC2 #4<br>LETIM0_OUT1 #2|<br>US2_RX #5<br>US1_CS<br>U0_TX #5<br>LEU0_RX #3<br>I2C0_SCL #5|<br>PRS_CH4<br>DBG_SWDIOTMS<br>GPIO_EM4WU3<br>BOOT_RX|| ||<br>PF2|comm<br>BUSDY<br>BUSCX<br>LCD_SEG0|<br>TIM0_CC2 #4<br>TIM1_CC0 #5<br>TIM2_CC0 #3|<br>US2_CLK #5<br>CAN0_TX<br>US1_TX<br>U0_RX #5<br>LEU0_TX #4<br>I2C1_SCL #4|<br>CMU_CLK0 #4<br>PRS_CH0 #3<br>ACMP1_O #0<br>DBG_TDO<br>DBG_SWO<br>GPIO_EM4WU4|| ||t R<br>PF5|<br>BUSCY<br>BUSDX<br>LCD_SEG3|<br>TIM0_CDTI2 #2<br>TIM1_CC3 #6<br>TIM4_CC0|<br>US2_CS #5<br>I2C2_SCL #0<br>USB_VBUSEN|<br>PRS_CH2<br>DBG_TDI|| ||No<br>PF10|<br>BUSDY<br>BUSCX|<br>TIM5_CC1 #6<br>WTIM3_CC1<br>PCNT2_S0IN #3|<br>U1_TX<br>I2C2_SDA<br>USB_DM||| ||PF11|BUSCY<br>BUSDX|TIM5_CC2 #6<br>WTIM3_CC2<br>PCNT2_S1IN #3|U1_RX<br>I2C2_SCL #2<br>USB_DP||| **silabs.com** | Building a more connected world. Rev. 1.4 | 21 WGM160P Wi-Fi[®] Module Data Sheet Pin Descriptions ## **7.3 Alternate Pin Functionality** A wide selection of alternate functionality is available for multiplexing to various pins. The following table shows the name of the alternate functionality in the first column, followed by columns showing the possible LOCATION bitfield settings and the associated GPIO pin. Refer to 7.2 GPIO Functionality for a list of functions available on each GPIO pin. **Note:** Some functionality, such as analog interfaces, do not have alternate settings or a LOCATION bitfield. In these cases, the pinout is shown in the column corresponding to LOCATION 0. ||Not Recommended for New Designs<br>**Table 7.3. Alternate Functionality Overview**<br>**Alternate**<br>**LOCATION**<br>**Functionality**<br>**0 - 3**<br>**4 - 7**<br>**Description**<br>ACMP0_O<br>2: PD6<br>3: PB11<br>4: PA6<br>7: PB3<br>Analog comparator ACMP0, digital output.<br>ACMP1_O<br>0: PF2<br>7: PA5<br>Analog comparator ACMP1, digital output.<br>ACMP2_O<br>0: PD8<br>Analog comparator ACMP2, digital output.<br>ACMP3_O<br>0: PF0<br>Analog comparator ACMP3, digital output.<br>ADC0_EXTP<br>0: PD6<br>Analog to digital converter ADC0 external reference input positive pin.<br>ADC1_EXTP<br>0: PD6<br>Analog to digital converter ADC1 external reference input positive pin.<br>BOOT_RX<br>0: PF1<br>Bootloader RX.<br>BOOT_TX<br>0: PF0<br>Bootloader TX.<br>BU_VIN<br>0: PD8<br>Battery input for Backup Power Domain.<br>CAN0_RX<br>1: PF0<br>CAN0 RX.<br>CAN0_TX<br>1: PF2<br>CAN0 TX.<br>CMU_CLK0<br>0: PA2<br>4: PF2<br>Clock Management Unit, clock output number 0.<br>CMU_CLK1<br>0: PA1<br>1: PD8<br>5: PB11<br>Clock Management Unit, clock output number 1.<br>CMU_CLK2<br>0: PA0<br>1: PA3<br>2: PD6<br>4: PA3<br>Clock Management Unit, clock output number 2.<br>CMU_CLKI0<br>1: PA3<br>3: PB13<br>7: PB11<br>Clock Management Unit, clock input number 0.<br>DBG_SWCLKTCK<br>0: PF0<br>Debug-interface Serial Wire clock input and JTAG Test Clock.<br>Note that this function is enabled to the pin out of reset, and has a built-in pull down.<br>DBG_SWDIOTMS<br>0: PF1<br>Debug-interface Serial Wire data input / output and JTAG Test Mode Select.<br>Note that this function is enabled to the pin out of reset, and has a built-in pull up.<br>DBG_SWO<br>0: PF2<br>Debug-interface Serial Wire viewer Output.<br>Note that this function is not enabled after reset, and must be enabled by software to be<br>used.|Not Recommended for New Designs<br>**Table 7.3. Alternate Functionality Overview**<br>**Alternate**<br>**LOCATION**<br>**Functionality**<br>**0 - 3**<br>**4 - 7**<br>**Description**<br>ACMP0_O<br>2: PD6<br>3: PB11<br>4: PA6<br>7: PB3<br>Analog comparator ACMP0, digital output.<br>ACMP1_O<br>0: PF2<br>7: PA5<br>Analog comparator ACMP1, digital output.<br>ACMP2_O<br>0: PD8<br>Analog comparator ACMP2, digital output.<br>ACMP3_O<br>0: PF0<br>Analog comparator ACMP3, digital output.<br>ADC0_EXTP<br>0: PD6<br>Analog to digital converter ADC0 external reference input positive pin.<br>ADC1_EXTP<br>0: PD6<br>Analog to digital converter ADC1 external reference input positive pin.<br>BOOT_RX<br>0: PF1<br>Bootloader RX.<br>BOOT_TX<br>0: PF0<br>Bootloader TX.<br>BU_VIN<br>0: PD8<br>Battery input for Backup Power Domain.<br>CAN0_RX<br>1: PF0<br>CAN0 RX.<br>CAN0_TX<br>1: PF2<br>CAN0 TX.<br>CMU_CLK0<br>0: PA2<br>4: PF2<br>Clock Management Unit, clock output number 0.<br>CMU_CLK1<br>0: PA1<br>1: PD8<br>5: PB11<br>Clock Management Unit, clock output number 1.<br>CMU_CLK2<br>0: PA0<br>1: PA3<br>2: PD6<br>4: PA3<br>Clock Management Unit, clock output number 2.<br>CMU_CLKI0<br>1: PA3<br>3: PB13<br>7: PB11<br>Clock Management Unit, clock input number 0.<br>DBG_SWCLKTCK<br>0: PF0<br>Debug-interface Serial Wire clock input and JTAG Test Clock.<br>Note that this function is enabled to the pin out of reset, and has a built-in pull down.<br>DBG_SWDIOTMS<br>0: PF1<br>Debug-interface Serial Wire data input / output and JTAG Test Mode Select.<br>Note that this function is enabled to the pin out of reset, and has a built-in pull up.<br>DBG_SWO<br>0: PF2<br>Debug-interface Serial Wire viewer Output.<br>Note that this function is not enabled after reset, and must be enabled by software to be<br>used.|Not Recommended for New Designs<br>**Table 7.3. Alternate Functionality Overview**<br>**Alternate**<br>**LOCATION**<br>**Functionality**<br>**0 - 3**<br>**4 - 7**<br>**Description**<br>ACMP0_O<br>2: PD6<br>3: PB11<br>4: PA6<br>7: PB3<br>Analog comparator ACMP0, digital output.<br>ACMP1_O<br>0: PF2<br>7: PA5<br>Analog comparator ACMP1, digital output.<br>ACMP2_O<br>0: PD8<br>Analog comparator ACMP2, digital output.<br>ACMP3_O<br>0: PF0<br>Analog comparator ACMP3, digital output.<br>ADC0_EXTP<br>0: PD6<br>Analog to digital converter ADC0 external reference input positive pin.<br>ADC1_EXTP<br>0: PD6<br>Analog to digital converter ADC1 external reference input positive pin.<br>BOOT_RX<br>0: PF1<br>Bootloader RX.<br>BOOT_TX<br>0: PF0<br>Bootloader TX.<br>BU_VIN<br>0: PD8<br>Battery input for Backup Power Domain.<br>CAN0_RX<br>1: PF0<br>CAN0 RX.<br>CAN0_TX<br>1: PF2<br>CAN0 TX.<br>CMU_CLK0<br>0: PA2<br>4: PF2<br>Clock Management Unit, clock output number 0.<br>CMU_CLK1<br>0: PA1<br>1: PD8<br>5: PB11<br>Clock Management Unit, clock output number 1.<br>CMU_CLK2<br>0: PA0<br>1: PA3<br>2: PD6<br>4: PA3<br>Clock Management Unit, clock output number 2.<br>CMU_CLKI0<br>1: PA3<br>3: PB13<br>7: PB11<br>Clock Management Unit, clock input number 0.<br>DBG_SWCLKTCK<br>0: PF0<br>Debug-interface Serial Wire clock input and JTAG Test Clock.<br>Note that this function is enabled to the pin out of reset, and has a built-in pull down.<br>DBG_SWDIOTMS<br>0: PF1<br>Debug-interface Serial Wire data input / output and JTAG Test Mode Select.<br>Note that this function is enabled to the pin out of reset, and has a built-in pull up.<br>DBG_SWO<br>0: PF2<br>Debug-interface Serial Wire viewer Output.<br>Note that this function is not enabled after reset, and must be enabled by software to be<br>used.|Not Recommended for New Designs<br>**Table 7.3. Alternate Functionality Overview**<br>**Alternate**<br>**LOCATION**<br>**Functionality**<br>**0 - 3**<br>**4 - 7**<br>**Description**<br>ACMP0_O<br>2: PD6<br>3: PB11<br>4: PA6<br>7: PB3<br>Analog comparator ACMP0, digital output.<br>ACMP1_O<br>0: PF2<br>7: PA5<br>Analog comparator ACMP1, digital output.<br>ACMP2_O<br>0: PD8<br>Analog comparator ACMP2, digital output.<br>ACMP3_O<br>0: PF0<br>Analog comparator ACMP3, digital output.<br>ADC0_EXTP<br>0: PD6<br>Analog to digital converter ADC0 external reference input positive pin.<br>ADC1_EXTP<br>0: PD6<br>Analog to digital converter ADC1 external reference input positive pin.<br>BOOT_RX<br>0: PF1<br>Bootloader RX.<br>BOOT_TX<br>0: PF0<br>Bootloader TX.<br>BU_VIN<br>0: PD8<br>Battery input for Backup Power Domain.<br>CAN0_RX<br>1: PF0<br>CAN0 RX.<br>CAN0_TX<br>1: PF2<br>CAN0 TX.<br>CMU_CLK0<br>0: PA2<br>4: PF2<br>Clock Management Unit, clock output number 0.<br>CMU_CLK1<br>0: PA1<br>1: PD8<br>5: PB11<br>Clock Management Unit, clock output number 1.<br>CMU_CLK2<br>0: PA0<br>1: PA3<br>2: PD6<br>4: PA3<br>Clock Management Unit, clock output number 2.<br>CMU_CLKI0<br>1: PA3<br>3: PB13<br>7: PB11<br>Clock Management Unit, clock input number 0.<br>DBG_SWCLKTCK<br>0: PF0<br>Debug-interface Serial Wire clock input and JTAG Test Clock.<br>Note that this function is enabled to the pin out of reset, and has a built-in pull down.<br>DBG_SWDIOTMS<br>0: PF1<br>Debug-interface Serial Wire data input / output and JTAG Test Mode Select.<br>Note that this function is enabled to the pin out of reset, and has a built-in pull up.<br>DBG_SWO<br>0: PF2<br>Debug-interface Serial Wire viewer Output.<br>Note that this function is not enabled after reset, and must be enabled by software to be<br>used.| |---|---|---|---|---| ||<br>**Alternate**|<br>**LOCATION**||i| ||<br>**Functionality**|<br>**0 - 3**|<br>**4 - 7**|s<br>**Description**| ||<br>ACMP0_O|<br>2: PD6<br>3: PB11|<br>4: PA6<br>7: PB3|De<br>Analog comparator ACMP0, digital output.| ||<br>ACMP1_O|<br>0: PF2|<br>7: PA5|<br>Analog comparator ACMP1, digital output.| ||<br>ACMP2_O|<br>0: PD8||<br>Analog comparator ACMP2, digital output.| ||<br>ACMP3_O|<br>0: PF0||<br>Analog comparator ACMP3, digital output.| ||<br>ADC0_EXTP|<br>0: PD6||<br>Analog to digital converter ADC0 external reference input positive pin.| ||<br>ADC1_EXTP|<br>0: PD6||r<br>Analog to digital converter ADC1 external reference input positive pin.| ||<br>BOOT_RX|<br>0: PF1||<br>Bootloader RX.| ||<br>BOOT_TX|<br>0: PF0||f<br>Bootloader TX.| ||<br>BU_VIN|<br>0: PD8||<br>Battery input for Backup Power Domain.| ||<br>CAN0_RX|<br>1: PF0||<br>CAN0 RX.| ||<br>CAN0_TX|<br>1: PF2||<br>CAN0 TX.| ||<br>CMU_CLK0|<br>0: PA2|<br>4: PF2|n<br>Clock Management Unit, clock output number 0.| ||<br>CMU_CLK1|<br>0: PA1<br>1: PD8|<br>5: PB11|e<br>Clock Management Unit, clock output number 1.| ||<br>CMU_CLK2|<br>0: PA0<br>1: PA3<br>2: PD6|m<br>4: PA3|<br>Clock Management Unit, clock output number 2.| ||<br>CMU_CLKI0|c<br>1: PA3<br>3: PB13|<br>7: PB11|<br>Clock Management Unit, clock input number 0.| ||R<br>DBG_SWCLKTCK|<br>0: PF0||<br>Debug-interface Serial Wire clock input and JTAG Test Clock.<br>Note that this function is enabled to the pin out of reset, and has a built-in pull down.| ||ot<br>DBG_SWDIOTMS|<br>0: PF1||<br>Debug-interface Serial Wire data input / output and JTAG Test Mode Select.<br>Note that this function is enabled to the pin out of reset, and has a built-in pull up.| ||<br>DBG_SWO|<br>0: PF2||<br>Debug-interface Serial Wire viewer Output.<br>Note that this function is not enabled after reset, and must be enabled by software to be<br>used.| **silabs.com** | Building a more connected world. Rev. 1.4 | 22 WGM160P Wi-Fi[®] Module Data Sheet Pin Descriptions ||**Alternate**|**LOCATION**|**LOCATION**||| |---|---|---|---|---|---| ||**Functionality**|**0 - 3**|**4 - 7**|**Description**|| ||<br>DBG_TDI|<br>0: PF5||<br>Debug-interface JTAG Test Data In.<br>Note that this function becomes available after the first valid JTAG command is re-<br>ceived, and has a built-in pull up when JTAG is active.|| ||<br>DBG_TDO|<br>0: PF2||n<br>Debug-interface JTAG Test Data Out.<br>Note that this function becomes available after the first valid JTAG command is re-<br>ceived.|| ||<br>ETH_MDC|<br>0: PB4<br>3: PA6||sig<br>Ethernet Management Data Clock.|| ||<br>ETH_MDIO|<br>0: PB3<br>3: PA15||De<br>Ethernet Management Data I/O.|| ||<br>ETH_RMIICRSDV|<br>0: PA4||<br>Ethernet RMII Carrier Sense / Data Valid.|| ||<br>ETH_RMIIREFCLK|<br>0: PA3||<br>Ethernet RMII Reference Clock.|| ||<br>ETH_RMIIRXD0|<br>0: PA2||<br>Ethernet RMII Receive Data Bit 0.|| ||<br>ETH_RMIIRXD1|<br>0: PA1||<br>Ethernet RMII Receive Data Bit 1.|| ||<br>ETH_RMIIRXER|<br>0: PA5||<br>Ethernet RMII Receive Error.|| ||<br>ETH_RMIITXD0|<br>0: PE15||r<br>Ethernet RMII Transmit Data Bit 0.|| ||<br>ETH_RMIITXD1|<br>0: PE14||f<br>Ethernet RMII Transmit Data Bit 1.|| ||<br>ETH_RMIITXEN|<br>0: PA0||<br>Ethernet RMII Transmit Enable.|| ||<br>ETH_TSUEXTCLK|<br>0: PB5||<br>Ethernet IEEE1588 External Reference Clock.|| ||<br>ETH_TSUTMR-<br>TOG|<br>0: PB6||d<br>Ethernet IEEE1588 Timer Toggle.|| ||<br>ETM_TCLK|<br>3: PA6||n<br>Embedded Trace Module ETM clock .|| ||<br>ETM_TD0|<br>0: PD6<br>3: PA2||e<br>Embedded Trace Module ETM data 0.|| ||<br>ETM_TD1|<br>3: PA3||<br>Embedded Trace Module ETM data 1.|| ||<br>ETM_TD2|<br>3: PA4|<br>4: PE14|<br>Embedded Trace Module ETM data 2.|| ||<br>ETM_TD3|<br>3: PA5|<br>4: PE15|<br>Embedded Trace Module ETM data 3.|| ||<br>GPIO_EM4WU0|c<br>0: PA0||<br>Pin can be used to wake the system up from EM4|| ||<br>GPIO_EM4WU1|<br>0: PA6||<br>Pin can be used to wake the system up from EM4|| ||<br>GPIO_EM4WU3|<br>0: PF1||<br>Pin can be used to wake the system up from EM4|| ||t<br>GPIO_EM4WU4|<br>0: PF2||<br>Pin can be used to wake the system up from EM4|| ||<br>GPIO_EM4WU6|<br>0: PC4||<br>Pin can be used to wake the system up from EM4|| ||<br>GPIO_EM4WU7|<br>0: PB11||<br>Pin can be used to wake the system up from EM4|| ||<br>HFXTAL_N|<br>0: PB14||<br>High Frequency Crystal negative pin. Also used as external optional clock input pin.|| ||<br>HFXTAL_P|<br>0: PB13||<br>High Frequency Crystal positive pin.|| ||I2C0_SCL|0: PA1|5: PF1<br>7: PE5|I2C0 Serial Clock Line input / output.|| **silabs.com** | Building a more connected world. Rev. 1.4 | 23 WGM160P Wi-Fi[®] Module Data Sheet Pin Descriptions ||**Alternate**|**LOCATION**|**LOCATION**||| |---|---|---|---|---|---| ||**Functionality**|**0 - 3**|**4 - 7**|**Description**|| ||I2C0_SDA|0: PA0<br>1: PD6|5: PF0|I2C0 Serial Data input / output.|| ||<br>I2C1_SCL|<br>0: PC5<br>1: PB12|<br>4: PF2|<br>I2C1 Serial Clock Line input / output.|| ||<br>I2C1_SDA|<br>0: PC4<br>1: PB11||ign<br>I2C1 Serial Data input / output.|| ||<br>I2C2_SCL|<br>0: PF5<br>2: PF11||es<br>I2C2 Serial Clock Line input / output.|| ||<br>I2C2_SDA|<br>2: PF10||<br>I2C2 Serial Data input / output.|| ||<br>IDAC0_OUT|<br>0: PB11||<br>IDAC0 output.|| ||<br>LCD_COM1|<br>0: PE5||<br>LCD driver common line number 1.|| ||<br>LCD_COM2|<br>0: PE6||<br>LCD driver common line number 2.|| ||<br>LCD_COM3|<br>0: PE7||<br>LCD driver common line number 3.|| ||<br>LCD_SEG0|<br>0: PF2||<br>LCD segment line 0.|| ||<br>LCD_SEG3|<br>0: PF5||r<br>LCD segment line 3.|| ||<br>LCD_SEG10|<br>0: PE14||f<br>LCD segment line 10.|| ||<br>LCD_SEG11|<br>0: PE15||<br>LCD segment line 11.|| ||<br>LCD_SEG12|<br>0: PA15||<br>LCD segment line 12.|| ||<br>LCD_SEG13|<br>0: PA0||<br>LCD segment line 13.|| ||<br>LCD_SEG14|<br>0: PA1||<br>LCD segment line 14.|| ||<br>LCD_SEG15|<br>0: PA2||n<br>LCD segment line 15.|| ||<br>LCD_SEG16|<br>0: PA3||<br>LCD segment line 16.|| ||<br>LCD_SEG17|<br>0: PA4||<br>LCD segment line 17.|| ||<br>LCD_SEG18|<br>0: PA5||<br>LCD segment line 18.|| ||<br>LCD_SEG19|<br>0: PA6||<br>LCD segment line 19.|| ||<br>LCD_SEG20 /<br>LCD_COM4|c<br>0: PB3||<br>LCD segment line 20. This pin may also be used as LCD COM line 4|| ||<br>LCD_SEG21 /<br>LCD_COM5|e<br>0: PB4||<br>LCD segment line 21. This pin may also be used as LCD COM line 5|| ||t<br>LCD_SEG22 /<br>LCD_COM6|<br>0: PB5||<br>LCD segment line 22. This pin may also be used as LCD COM line 6|| ||o<br>LCD_SEG23 /<br>LCD_COM7|<br>0: PB6||<br>LCD segment line 23. This pin may also be used as LCD COM line 7|| ||<br>LES_ALTEX0|<br>0: PD6||<br>LESENSE alternate excite output 0.|| ||<br>LES_ALTEX2|<br>0: PA3||<br>LESENSE alternate excite output 2.|| ||LES_ALTEX3|0: PA4||LESENSE alternate excite output 3.|| ||LES_ALTEX4|0: PA5||LESENSE alternate excite output 4.|| ||LES_CH4|0: PC4||LESENSE channel 4.|| **silabs.com** | Building a more connected world. Rev. 1.4 | 24 WGM160P Wi-Fi[®] Module Data Sheet Pin Descriptions ||**Alternate**|**LOCATION**|**LOCATION**||| |---|---|---|---|---|---| ||**Functionality**|**0 - 3**|**4 - 7**|**Description**|| ||LES_CH5|0: PC5||LESENSE channel 5.|| ||<br>LETIM0_OUT0|<br>0: PD6<br>1: PB11<br>2: PF0<br>3: PC4||ns<br>Low Energy Timer LETIM0, output channel 0.|| ||<br>LETIM0_OUT1|<br>1: PB12<br>2: PF1<br>3: PC5||esig<br>Low Energy Timer LETIM0, output channel 1.|| ||<br>LETIM1_OUT0||<br>4: PB5|<br>Low Energy Timer LETIM1, output channel 0.|| ||<br>LETIM1_OUT1|<br>0: PA6|<br>4: PB6|<br>Low Energy Timer LETIM1, output channel 1.|| ||<br>LEU0_RX|<br>1: PB14<br>2: PE15<br>3: PF1|<br>4: PA0|New<br>LEUART0 Receive input.|| ||<br>LEU0_TX|<br>1: PB13<br>2: PE14<br>3: PF0|<br>4: PF2|for<br>LEUART0 Transmit output. Also used as receive input in half duplex communication.|| ||<br>LEU1_RX|<br>1: PA6|<br>4: PB5|<br>LEUART1 Receive input.|| ||<br>LEU1_TX|<br>1: PA5|<br>4: PB4|<br>LEUART1 Transmit output. Also used as receive input in half duplex communication.|| ||<br>OPA0_N|<br>0: PC5||<br>Operational Amplifier 0 external negative input.|| ||<br>OPA0_P|<br>0: PC4||<br>Operational Amplifier 0 external positive input.|| ||<br>OPA1_P|<br>0: PD6||n<br>Operational Amplifier 1 external positive input.|| ||<br>PCNT0_S0IN|<br>3: PD6|m<br>4: PA0<br>6: PB5<br>7: PB12|e<br>Pulse Counter PCNT0 input number 0.|| ||<br>PCNT0_S1IN|co|<br>4: PA1<br>6: PB6<br>7: PB11|<br>Pulse Counter PCNT0 input number 1.|| ||t R<br>PCNT1_S0IN|<br>0: PA5<br>1: PB3<br>3: PC4|<br>6: PB11|<br>Pulse Counter PCNT1 input number 0.|| ||No<br>PCNT1_S1IN|<br>0: PA6<br>1: PB4<br>3: PC5|<br>6: PB12|<br>Pulse Counter PCNT1 input number 1.|| ||PCNT2_S0IN|2: PB13<br>3: PF10||Pulse Counter PCNT2 input number 0.|| **silabs.com** | Building a more connected world. Rev. 1.4 | 25 WGM160P Wi-Fi[®] Module Data Sheet Pin Descriptions ||**Alternate**|**LOCATION**|**LOCATION**||| |---|---|---|---|---|---| ||**Functionality**|**0 - 3**|**4 - 7**|**Description**|| ||PCNT2_S1IN|2: PB14<br>3: PF11||Pulse Counter PCNT2 input number 1.|| ||<br>PRS_CH0|<br>0: PA0<br>3: PF2||<br>Peripheral Reflex System PRS, channel 0.|| ||<br>PRS_CH1|<br>0: PA1||n<br>Peripheral Reflex System PRS, channel 1.|| ||<br>PRS_CH2|<br>1: PF5||i<br>Peripheral Reflex System PRS, channel 2.|| ||<br>PRS_CH3|<br>3: PA0||s<br>Peripheral Reflex System PRS, channel 3.|| ||<br>PRS_CH4|<br>2: PF1||<br>Peripheral Reflex System PRS, channel 4.|| ||<br>PRS_CH5|<br>2: PD6||<br>Peripheral Reflex System PRS, channel 5.|| ||<br>PRS_CH6|<br>0: PA6<br>1: PB14<br>2: PE6||ew<br>Peripheral Reflex System PRS, channel 6.|| ||<br>PRS_CH7|<br>0: PB13<br>2: PE7||N<br>Peripheral Reflex System PRS, channel 7.|| ||<br>PRS_CH8|<br>1: PA2||r<br>Peripheral Reflex System PRS, channel 8.|| ||<br>PRS_CH9|<br>1: PA3||f<br>Peripheral Reflex System PRS, channel 9.|| ||<br>PRS_CH12|<br>1: PB6<br>2: PD8||d<br>Peripheral Reflex System PRS, channel 12.|| ||<br>PRS_CH13|<br>2: PE14||<br>Peripheral Reflex System PRS, channel 13.|| ||<br>PRS_CH14|<br>2: PE15||<br>Peripheral Reflex System PRS, channel 14.|| ||<br>PRS_CH15|<br>0: PA15<br>2: PF0||en<br>Peripheral Reflex System PRS, channel 15.|| ||<br>PRS_CH16|<br>0: PA4<br>1: PB12||<br>Peripheral Reflex System PRS, channel 16.|| ||<br>PRS_CH17|o<br>0: PA5<br>2: PE5||<br>Peripheral Reflex System PRS, channel 17.|| ||<br>PRS_CH18|c<br>2: PC4||<br>Peripheral Reflex System PRS, channel 18.|| ||R<br>PRS_CH19|<br>0: PB3<br>2: PC5||<br>Peripheral Reflex System PRS, channel 19.|| ||t<br>PRS_CH20|<br>0: PB4||<br>Peripheral Reflex System PRS, channel 20.|| ||o<br>PRS_CH21|<br>0: PB5<br>2: PB11||<br>Peripheral Reflex System PRS, channel 21.|| ||<br>QSPI0_CS0|<br>1: PA0||<br>Quad SPI 0 Chip Select 0.|| ||QSPI0_CS1|1: PA1||Quad SPI 0 Chip Select 1.|| ||QSPI0_DQ0|1: PA2||Quad SPI 0 Data 0.|| ||QSPI0_DQ1|1: PA3||Quad SPI 0 Data 1.|| **silabs.com** | Building a more connected world. Rev. 1.4 | 26 WGM160P Wi-Fi[®] Module Data Sheet Pin Descriptions ||**Alternate**|**LOCATION**|**LOCATION**||| |---|---|---|---|---|---| ||**Functionality**|**0 - 3**|**4 - 7**|**Description**|| ||QSPI0_DQ2|1: PA4||Quad SPI 0 Data 2.|| ||QSPI0_DQ3|1: PA5||Quad SPI 0 Data 3.|| ||<br>QSPI0_DQ4|<br>1: PB3||<br>Quad SPI 0 Data 4.|| ||<br>QSPI0_DQ5|<br>1: PB4||<br>Quad SPI 0 Data 5.|| ||<br>QSPI0_DQ6|<br>1: PB5||n<br>Quad SPI 0 Data 6.|| ||<br>QSPI0_DQ7|<br>1: PB6||i<br>Quad SPI 0 Data 7.|| ||<br>QSPI0_DQS|<br>1: PE15||s<br>Quad SPI 0 Data S.|| ||<br>QSPI0_SCLK|<br>1: PE14||<br>Quad SPI 0 Serial Clock.|| ||<br>TIM0_CC0|<br>0: PA0<br>3: PB6|<br>4: PF0<br>5: PC4<br>7: PA1|w D<br>Timer 0 Capture Compare input / output channel 0.|| ||<br>TIM0_CC1|<br>0: PA1|<br>4: PF1<br>5: PC5<br>7: PA0|Ne<br>Timer 0 Capture Compare input / output channel 1.|| ||<br>TIM0_CC2|<br>0: PA2|<br>4: PF2|r<br>Timer 0 Capture Compare input / output channel 2.|| ||<br>TIM0_CDTI0|<br>0: PA3||f<br>Timer 0 Complimentary Dead Time Insertion channel 0.|| ||<br>TIM0_CDTI1|<br>0: PA4||<br>Timer 0 Complimentary Dead Time Insertion channel 1.|| ||<br>TIM0_CDTI2|<br>0: PA5<br>2: PF5<br>3: PC4|<br>4: PB11|de<br>Timer 0 Complimentary Dead Time Insertion channel 2.|| ||<br>TIM1_CC0||<br>4: PD6<br>5: PF2|en<br>Timer 1 Capture Compare input / output channel 0.|| ||<br>TIM1_CC2|<br>3: PB11||<br>Timer 1 Capture Compare input / output channel 2.|| ||<br>TIM1_CC3|<br>2: PB3<br>3: PB12|m<br>6: PF5|<br>Timer 1 Capture Compare input / output channel 3.|| ||<br>TIM2_CC0|<br>3: PF2|<br>4: PB6|<br>Timer 2 Capture Compare input / output channel 0.|| ||<br>TIM2_CC2|c|<br>5: PC4|<br>Timer 2 Capture Compare input / output channel 2.|| ||<br>TIM2_CDTI1|<br>2: PE14||<br>Timer 2 Complimentary Dead Time Insertion channel 1.|| ||<br>TIM2_CDTI2|<br>2: PE15||<br>Timer 2 Complimentary Dead Time Insertion channel 2.|| ||ot<br>TIM3_CC0|<br>0: PE14<br>3: PE5|<br>4: PA0<br>5: PA3<br>6: PA6|<br>Timer 3 Capture Compare input / output channel 0.|| ||<br>TIM3_CC1|<br>0: PE15<br>3: PE6|<br>4: PA1<br>5: PA4|<br>Timer 3 Capture Compare input / output channel 1.|| **silabs.com** | Building a more connected world. Rev. 1.4 | 27 WGM160P Wi-Fi[®] Module Data Sheet Pin Descriptions ||**Alternate**|**LOCATION**|**LOCATION**||| |---|---|---|---|---|---| ||**Functionality**|**0 - 3**|**4 - 7**|**Description**|| ||<br>TIM3_CC2|<br>0: PA15<br>2: PE5<br>3: PE7|<br>4: PA2<br>5: PA5|<br>Timer 3 Capture Compare input / output channel 2.|| ||<br>TIM4_CC0|<br>2: PF5||<br>Timer 4 Capture Compare input / output channel 0.|| ||<br>TIM5_CC0|<br>1: PE7||n<br>Timer 5 Capture Compare input / output channel 0.|| ||<br>TIM5_CC1|<br>0: PE5|<br>6: PF10|i<br>Timer 5 Capture Compare input / output channel 1.|| ||<br>TIM5_CC2|<br>0: PE6|<br>6: PF11|s<br>Timer 5 Capture Compare input / output channel 2.|| ||<br>TIM6_CC0||<br>5: PB13|<br>Timer 6 Capture Compare input / output channel 0.|| ||<br>TIM6_CC1||<br>5: PB14|<br>Timer 6 Capture Compare input / output channel 1.|| ||<br>TIM6_CC2||<br>7: PD6|<br>Timer 6 Capture Compare input / output channel 2.|| ||<br>TIM6_CDTI1|<br>2: PE5||<br>Timer 6 Complimentary Dead Time Insertion channel 1.|| ||<br>TIM6_CDTI2|<br>2: PE6||<br>Timer 6 Complimentary Dead Time Insertion channel 2.|| ||<br>U0_CTS|<br>2: PA5||<br>UART0 Clear To Send hardware flow control input.|| ||<br>U0_RTS|<br>2: PA6|<br>5: PD6|<br>UART0 Request To Send hardware flow control output.|| ||<br>U0_RX|<br>2: PA4|<br>4: PC5<br>5: PF2|for<br>UART0 Receive input.|| ||<br>U0_TX|<br>2: PA3|<br>4: PC4<br>5: PF1|d<br>UART0 Transmit output. Also used as receive input in half duplex communication.|| ||<br>U1_CTS|<br>2: PB11|<br>4: PC4|<br>UART1 Clear To Send hardware flow control input.|| ||<br>U1_RTS|<br>2: PB12<br>3: PE5|<br>4: PC5|n<br>UART1 Request To Send hardware flow control output.|| ||<br>U1_RX|<br>1: PF11||<br>UART1 Receive input.|| ||<br>U1_TX|<br>1: PF10||<br>UART1 Transmit output. Also used as receive input in half duplex communication.|| ||<br>US0_CLK|<br>1: PE5|<br>4: PB13|<br>USART0 clock input / output.|| ||<br>US0_CS||<br>4: PB14|<br>USART0 chip select input / output.|| ||<br>US0_CTS|c<br>0: PE14|<br>4: PB6<br>5: PB11|<br>USART0 Clear To Send hardware flow control input.|| ||R<br>US0_RTS|<br>0: PE15|<br>4: PB5<br>5: PD6|<br>USART0 Request To Send hardware flow control output.|| ||ot<br>US0_RX|<br>1: PE6||<br>USART0 Asynchronous Receive.<br>USART0 Synchronous mode Master Input / Slave Output (MISO).|| ||<br>US0_TX|<br>1: PE7||<br>USART0 Asynchronous Transmit. Also used as receive input in half duplex communica-<br>tion.<br>USART0 Synchronous mode Master Output / Slave Input (MOSI).|| ||US1_CLK|2: PF0|5: PB11<br>6: PE5|USART1 clock input / output.|| **silabs.com** | Building a more connected world. Rev. 1.4 | 28 WGM160P Wi-Fi[®] Module Data Sheet Pin Descriptions ||**Alternate**|**LOCATION**|**LOCATION**||| |---|---|---|---|---|---| ||**Functionality**|**0 - 3**|**4 - 7**|**Description**|| ||US1_CS|2: PF1||USART1 chip select input / output.|| ||US1_CTS||5: PB13|USART1 Clear To Send hardware flow control input.|| ||<br>US1_RTS||<br>5: PB14|<br>USART1 Request To Send hardware flow control output.|| ||<br>US1_RX|<br>2: PD6|<br>5: PA0<br>6: PA2|n<br>USART1 Asynchronous Receive.<br>USART1 Synchronous mode Master Input / Slave Output (MISO).|| ||<br>US1_TX||<br>5: PF2|esig<br>USART1 Asynchronous Transmit. Also used as receive input in half duplex communica-<br>tion.<br>USART1 Synchronous mode Master Output / Slave Input (MOSI).|| ||<br>US2_CLK|<br>0: PC4<br>1: PB5<br>3: PA15|<br>5: PF2|w D<br>USART2 clock input / output.|| ||<br>US2_CS|<br>0: PC5<br>1: PB6<br>3: PB11|<br>5: PF5|Ne<br>USART2 chip select input / output.|| ||<br>US2_CTS|<br>1: PB12|<br>5: PD6|r<br>USART2 Clear To Send hardware flow control input.|| ||<br>US2_RTS||<br>5: PD8|<br>USART2 Request To Send hardware flow control output.|| ||<br>US2_RX|<br>1: PB4|<br>5: PF1|d f<br>USART2 Asynchronous Receive.<br>USART2 Synchronous mode Master Input / Slave Output (MISO).|| ||<br>US2_TX|<br>1: PB3|<br>5: PF0|nde<br>USART2 Asynchronous Transmit. Also used as receive input in half duplex communica-<br>tion.<br>USART2 Synchronous mode Master Output / Slave Input (MOSI).|| ||<br>US3_CLK|<br>0: PA2||<br>USART3 clock input / output.|| ||<br>US3_CS|<br>0: PA3||<br>USART3 chip select input / output.|| ||<br>US3_CTS|<br>0: PA4<br>1: PE5<br>2: PD6|m|<br>USART3 Clear To Send hardware flow control input.|| ||<br>US3_RTS|c<br>0: PA5||<br>USART3 Request To Send hardware flow control output.|| ||<br>US3_RX|e<br>0: PA1<br>1: PE7||<br>USART3 Asynchronous Receive.<br>USART3 Synchronous mode Master Input / Slave Output (MISO).|| ||ot<br>US3_TX|<br>0: PA0<br>1: PE6<br>2: PB3||<br>USART3 Asynchronous Transmit. Also used as receive input in half duplex communica-<br>tion.<br>USART3 Synchronous mode Master Output / Slave Input (MOSI).|| ||<br>USB_DM|<br>0: PF10||<br>USB D- pin.|| ||<br>USB_DP|<br>0: PF11||<br>USB D+ pin.|| ||USB_VBUSEN|0: PF5||USB 5 V VBUS enable.|| ||VDAC0_EXT|0: PD6||Digital to analog converter VDAC0 external reference input pin.|| **silabs.com** | Building a more connected world. Rev. 1.4 | 29 WGM160P Wi-Fi[®] Module Data Sheet Pin Descriptions ||**Alternate**|**LOCATION**|**LOCATION**||| |---|---|---|---|---|---| ||**Functionality**|**0 - 3**|**4 - 7**|**Description**|| ||VDAC0_OUT0 /<br>OPA0_OUT|0: PB11||Digital to Analog Converter DAC0 output channel number 0.|| ||<br>VDAC0_OUT1 /<br>OPA1_OUT|<br>0: PB12||<br>Digital to Analog Converter DAC0 output channel number 1.|| ||<br>WTIM0_CC0|<br>1: PA6|<br>6: PB3|n<br>Wide timer 0 Capture Compare input / output channel 0.|| ||<br>WTIM0_CC1|<br>0: PE5|<br>4: PF0<br>6: PB4|ig<br>Wide timer 0 Capture Compare input / output channel 1.|| ||<br>WTIM0_CC2|<br>0: PE6|<br>4: PF1<br>6: PB5|es<br>Wide timer 0 Capture Compare input / output channel 2.|| ||<br>WTIM0_CDTI2||<br>4: PD6|<br>Wide timer 0 Complimentary Dead Time Insertion channel 2.|| ||<br>WTIM1_CC0|<br>0: PB13<br>2: PD6|<br>5: PE7|w<br>Wide timer 1 Capture Compare input / output channel 0.|| ||<br>WTIM1_CC1|<br>0: PB14||<br>Wide timer 1 Capture Compare input / output channel 1.|| ||<br>WTIM1_CC2|<br>2: PD8|<br>4: PE5|<br>Wide timer 1 Capture Compare input / output channel 2.|| ||<br>WTIM1_CC3||<br>4: PE6|<br>Wide timer 1 Capture Compare input / output channel 3.|| ||<br>WTIM2_CC0|<br>3: PB12||r<br>Wide timer 2 Capture Compare input / output channel 0.|| ||<br>WTIM2_CC2|<br>2: PB11||f<br>Wide timer 2 Capture Compare input / output channel 2.|| ||<br>WTIM3_CC0||<br>6: PB6|<br>Wide timer 3 Capture Compare input / output channel 0.|| ||<br>WTIM3_CC1|<br>3: PF10||<br>Wide timer 3 Capture Compare input / output channel 1.|| ||<br>WTIM3_CC2|<br>3: PF11||<br>Wide timer 3 Capture Compare input / output channel 2.|| ||c<br>**Alternate Functionality**||<br>**Location**||<br>**Priority**| ||<br>CMU_CLK2||<br>1: PA3||<br>High Speed| ||<br>CMU_CLKI0||<br>1: PA3||<br>High Speed| ||t<br>ETH_RMIICRSDV||<br>0: PA4||<br>High Speed| ||<br>ETH_RMIIREFCLK||<br>0: PA3||<br>High Speed| ||<br>ETH_RMIIRXD0||<br>0: PA2||<br>High Speed| ||<br>ETH_RMIIRXD1||<br>0: PA1||<br>High Speed| ||ETH_RMIIRXER||0: PA5||High Speed| ||ETH_RMIITXD0||0: PE15||High Speed| ||ETH_RMIITXD1||0: PE14||High Speed| **silabs.com** | Building a more connected world. Rev. 1.4 | 30 WGM160P Wi-Fi[®] Module Data Sheet Pin Descriptions ||**Alternate Functionality**|**Location**|**Priority**|| |---|---|---|---|---| ||ETH_RMIITXEN|0: PA0|High Speed|| ||TIM0_CC0|3: PB6|Non-interference|| ||US2_CLK|5: PF2|High Speed|| |Not Recommended for New Designs<br>US2_CS<br>5: PF5<br>High Speed<br>US2_RX<br>5: PF1<br>High Speed<br>US2_TX<br>5: PF0<br>High Speed||||| **silabs.com** | Building a more connected world. Rev. 1.4 | 31 WGM160P Wi-Fi[®] Module Data Sheet Package Specifications ## **8. Package Specifications** ## **8.1 Package Outline** — —_— Pad row to row: 116mm =—| .= Antenna clearance: 7.5mm = —= Antenna fron module edge: 4.85mm PCB thickness: 0.8mm —E= = Antenna sidth: 3.0mm Antenna height: 1.2mm a . eae Antenna from module edge: 635mm 7 A | Lm | eo : -- amt =2i zci I = j E == 72 | Gi 32 Ss Ez2 E> == E |) @mmi a=]=:as “7 OL ° 2= =|aa Gi ts= a= as E a= |i: “s;. ==. Shield height: 1.5mm = \ i ih — Pad center ta module edge: 3.lmm Module thickness: 2.3mm —= — Pad length:hla1.7mm **—** C== _ Tolerances +/- 0.1mm Module width*. and length +/- 0.2mm **Figure 8.1. WGM160P Package Outline** **silabs.com** | Building a more connected world. Rev. 1.4 | 32 WGM160P Wi-Fi[®] Module Data Sheet Package Specifications **8.2 Recommended PCB Land Patterns** Module width: 14.20mm E _4 Antenna clearance: 10.00mm — 7 = ~ : — = Pad extension outside module edge: 100mm ® tf / Pad length: 3.00mm ne 5 i = Z 7—eeeeeeee—= = = = = = 7 = SCOCCCOCO 5 bard aE =s Vl # z ih B aE z 2ma E s _— i ia S = a i a8 2 **E** eV m = S FSE FS© a© zZ 3 \ 1 il Ih as eeih | i Row end pad center to module edge: 0.95mm End row end pod center to module edge: 310mm j=] — **Figure 8.2. WGM160P22A Land Pattern** **silabs.com** | Building a more connected world. Rev. 1.4 | 33 WGM160P Wi-Fi[®] Module Data Sheet Package Specifications —— Module width: 14.20mm — = Pad center to center: 13.20mm = —- = Pod extension outside module edge: 100mm y | Pod length: 3.00mm nig I E = 2 Q 3 5 SsE 3g =x 2 2 il . x Co = & z E 2 a En ra = ;V 2 & & 3 \ s 5s = & \/ 2 = 3 a 2 3g S **E** FA . sa 3 a=] Lo a \/ V V es I\ es eeIh | i Row end pad center ta module edge: 0.95mm End row end pad center to module edge: 3.0mm b= — **Figure 8.3. WGM160P22N Land Pattern** **silabs.com** | Building a more connected world. Rev. 1.4 | 34 WGM160P Wi-Fi[®] Module Data Sheet Package Specifications ## **8.3 Package Marking** **==> picture [577 x 598] intentionally omitted <==** **----- Start of picture text -----**<br> WGM160Pxxxxxxx<br>Model: WGM160P22A<br>«es?<br>Certification OF<br>Marks<br>YYWWTTTTTT<br>www.silabs.com<br>|<br>Pin#1 Location<br>WGM160Pxxxxxxx<br>Model: WGM160P22N<br>«es?<br>Certification OF<br>Marks<br>YYWWTTTTTT<br>www.silabs.com<br>|<br>Pin#1 Location<br>Figure 8.4. Package Marking<br>The package marking consists of:<br>• WGM160Pxxxxxxx - Part number designation<br>• Model: WGM160Pxxx - Model number designation<br>• Certification Marks - All certification marks will be printed in this area according to regulatory body requirements.<br>• QR Code: YYWWMMABCDE<br>• YY – Last two digits of the assembly year.<br>• WW – Two-digit workweek when the device was assembled.<br>• MMABCDE – Silicon Labs unit code<br>Not Recommended for New Designs• YYWWTTTTTT<br>ANT<br>**----- End of picture text -----**<br> - YY – Last two digits of the assembly year. - WW – Two-digit workweek when the device was assembled. - TTTTTT – Manufacturing trace code. The first letter is the device revision. **silabs.com** | Building a more connected world. Rev. 1.4 | 35 WGM160P Wi-Fi[®] Module Data Sheet Soldering Recommendations ## **9. Soldering Recommendations** It is recommended that final PCB assembly of this product follows the industry standard as identified by the Institute for Printed Circuits (IPC). This product is assembled in compliance with the J-STD-001 requirements and the guidelines of IPC-AJ-820. Surface mounting of this product by the end user is recommended to follow IPC-A-610 to meet or exceed class 2 requirements. ## **CLASS 1 General Electronic Products** - Includes products suitable for applications where the major requirement is function of the completed assembly. **CLASS 2 Dedicated Service Electronic Products** Includes products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically the end-use environment would not cause failures. **CLASS 3 High Performance/Harsh Environment Electronic Products** Includes products where continued high performance or performance-on-demand is critical, equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems. **silabs.com** | Building a more connected world. Rev. 1.4 | 36 WGM160P Wi-Fi[®] Module Data Sheet Tape and Reel Dimensions ## **10. Tape and Reel Dimensions** **==> picture [577 x 569] intentionally omitted <==** **----- Start of picture text -----**<br> i in 7 a a a a a a a i<br>——— FPGosee¢eegeggggegsoeegegsosee¢eegeggggegsoeegegs<br>0.05 ——ee<br>a<br>g| a7 1. 70-0.1[ es|—14, «0—|—14, «0— «0—<br>1, 5000.1<br>4<br>All dimensions in mm unless otherwise indicated.<br>Figure 10.1. Carrier Tape Dimensions<br>:<br>8 ©<br>ee<br>\<br>Not Recommended for New Designs<br>**----- End of picture text -----**<br> **Figure 10.2. Reel Dimensions** 7 a a a a a a a i FPGosee¢eegeggggegsoeegegsosee¢eegeggggegsoeegegs ee es|—14, «0—|—14, «0— «0— All dimensions in mm unless otherwise indicated. **Figure 10.1. Carrier Tape Dimensions** 8 © ee \ All dimensions in mm unless otherwise indicated. **silabs.com** | Building a more connected world. Rev. 1.4 | 37 WGM160P Wi-Fi[®] Module Data Sheet Certifications ## **11. Certifications** This section details certification status of the module in various regions. The address for the module manufacturer and certification applicant is: SILICON LABORATORIES FINLAND OY Alberga Business Park, Bertel Jungin aukio 3, 02600 Espoo, Finland Alberga Business Park, Bertel Jungin aukio 3, 02600 Espoo, Finland **11.1 Qualified External Antenna Types** This device has been certified with an integrated chip antenna as well as external antennas connected to either RF port or both. The required antenna impedance is 50 Ω. **Table 11.1. Qualified Antennas for WGM160P Antenna Type Maximum Gain** Connectorized Coaxial Dipole 2.14 dBi Any antenna of the same general type and of equal or less directional gain as listed in the above table can be used in the regulatory areas that have a full modular radio approval (USA, Canada, Korea, Japan) as long as spot-check testing is performed to verify that no performance changes compromising compliance have been introduced. In countries applying the ETSI standards, like the EU countries, the radiated emissions are always tested with the end-product and the antenna type is not critical, but antennas with higher gain may violate some of the regulatory limits. If an antenna of a different type (such as a chip antenna, a PCB trace antenna or a patch) with a gain less than or equal to 2.14 dBi is needed, it can be added as a permissive change, requiring some radiated emission testing. Antenna types with more gain than 2.14 dBi may require a fully new certification. Since the exact permissive change procedure is chosen on a case by case basis, please consult your test house, for example while performing with them the EMC testing of the end-product. **11.2 CE and UKCA - EU and UK** The WGM160P22A and WGM160P22N modules have been tested against the relevant harmonized/designated standards and are in conformity with the essential requirements and other relevant requirements of the Radio Equipment Directive (RED) (2014/53/EU) and of the Radio Equipment Regulations (RER) (S.I. 2017/1206). Please notice that every end-product integrating a WGM160P22A or WGM160P22N module will need to perform the radio EMC tests on the whole assembly, according to the ETSI 301 489-x relevant standards. Furthermore, it is ultimately the responsibility of the manufacturer to ensure the compliance of the end-product as a whole. The specific product assembly is likely to have an impact to RF radiated characteristics, when compared to the bare module. Hence, manufacturers should carefully consider RF radiated testing with the final product assembly, especially taking into account the gain of the external antenna if any, and the possible deviations in the PSD, EIRP and spurious emissions measurements, as defined in the ETSI 300 328 standard. The modules are entitled to carry the CE and UKCA Marks, and a formal Declaration of Conformity (DoC) is available at the product web page which is reachable starting from https://www.silabs.com/. **silabs.com** | Building a more connected world. Rev. 1.4 | 38 WGM160P Wi-Fi[®] Module Data Sheet Certifications ## **11.3 FCC - USA** This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesirable operation. Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment. **FCC RF Radiation Exposure Statement:** This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter meets both portable and mobile requirements in accordance to the limits exposed in the RF Exposure Analysis. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. **OEM Responsibilities to comply with FCC Regulations:** OEM integrator is responsible for testing their end-product for any additional compliance requirements needed with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Additionally, investigative measurements and spot checking are strongly recommended to verify that the full system compliance is maintained when the module is integrated, in accordance to the "Host Product Testing Guidance" in FCC's KDB 996369 D04 Module Integration Guide V01. • In the typical case when the integral antenna of the WGM160P22A is used, a minimum separation distance of 40 mm must be maintained at all times between the human body and the radiator (antenna) to meet the SAR exemption for portable conditions. When the WGM160P22N is used instead, the minimum separation distance is also 40 mm, unless only the RF port 2 is used with a dipole antenna, in which case the minimum distance is 37 mm. • The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. **Important Note:** In the event that these conditions cannot be met, then for the FCC authorization to remain valid the final product will have to undergo additional testing to evaluate the RF exposure, and a permissive change will have to be applied with the help of the customer's own Telecommunication Certification Body. **End Product Labeling** The variants of WGM160P Modules are labeled with their own FCC ID. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: **"Contains Transmitter Module FCC ID: QOQWGM160P"** Or **"Contains FCC ID: QOQWGM160P"** The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. **Class B Device Notice Note:** This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna • Increase the separation between the equipment and receiver • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected • Consult the dealer or an experienced radio/TV technician for help **silabs.com** | Building a more connected world. Rev. 1.4 | 39 WGM160P Wi-Fi[®] Module Data Sheet Certifications ## **11.4 ISED - Canada** ## **ISED** This radio transmitter (IC: 5123A-WGM160P) has been approved by _Innovation, Science and Economic Development Canada (ISED Canada, formerly Industry Canada_ ) to operate with the antenna types listed above, with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain listed, are strictly prohibited for use with this device. This device complies with ISED’s license-exempt RSS standards. Operation is subject to the following two conditions: 1. This device may not cause interference; and 2. This device must accept any interference, including interference that may cause undesired operation of the device **RF Exposure Statement** Exemption from routine SAR evaluation limits are given in RSS-102 Issue 5. The models WGM160P22A and WGM160P22N meet the given exemption requirements when the minimum separation distance between the antenna(s) and the human body is respectively 30 mm and 40 mm. In the case of the N variant, the minimum separation distance could also be 30 mm but only in the case of using exclusively the dipole antenna at RF port 2, without configuring any transmission out of RF port 1. In other words, RF exposure or SAR evaluation is not required when the separation distance is same or more than stated above. If the separation distance is less than stated above the OEM integrator is responsible for evaluating the SAR when using the module at its highest transmission power. **OEM Responsibilities to comply with IC Regulations** The WGM160P modules have been certified for integration into products only by OEM integrators under the following conditions: • The antenna(s) must be installed such that a minimum separation distance as stated above is maintained between the radiator (antenna) and all persons at all times. • The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). **IMPORTANT NOTE** In the event that these conditions cannot be met, then for the ISED authorization to remain valid the final product will have to undergo additional testing to evaluate the RF exposure, and a permissive change will have to be applied with the help of the customer's own Telecommunication Certification Body. **End Product Labeling** The WGM160P module is labeled with its own ISED ID. If the ISED ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: “ **Contains Transmitter Module IC: 5123A-WGM160P** ” or “ **Contains IC: 5123A-WGM160P”** The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. **CAN ICES-003 (B)** This Class B digital apparatus complies with Canadian ICES-003. **silabs.com** | Building a more connected world. Rev. 1.4 | 40 WGM160P Wi-Fi[®] Module Data Sheet Certifications ## **ISED (Français)** ISED a approuvé l’utilisation de cet émetteur radio (IC: 5123A-WGM160P) en conjonction avec des antennes de type dipolaire à 2.14dBi ou de son antenne intégrée. L’utilisation de tout autre type d’antenne avec ce composant est proscrite. Ce composant est conforme aux normes RSS, exonérées de licence d'ISED. Son mode de fonctionnement est soumis aux deux conditions suivantes: 1. Ce composant ne doit pas générer d’interférences. 2. Ce composant doit pouvoir être soumis à tout type de perturbation y compris celle pouvant nuire à son bon fonctionnement. **Déclaration d'exposition RF** L'exemption tirée des limites courantes d'évaluation DAS est donnée dans le document RSS-102 Issue 5. Les modèles WGM160P22A et WGM160P22N respectent les exigences d’exemption prévues lorsque la distance de séparation minimale entre le(s) antenne(s) et le corps humain est respectivement de 30 mm et 40 mm. Dans le cas de la variante N, la distance minimale de séparation pourrait également être de 30 mm, mais uniquement dans le cas d’une utilisation exclusive de l’antenne dipôle sur le port RF 2, sans configurer de transmission sur le port RF 1. La déclaration d’exposition RF ou l'évaluation DAS n'est pas nécessaire lorsque la distance de séparation est identique ou supérieure à celle indiquée ci-dessus. Si la distance de séparation est inférieure à celle mentionnées plus haut, il incombe à l'intégrateur OEM de procédé à une évaluation DAS. **Responsabilités des OEM pour une mise en conformité avec le Règlement du Circuit Intégré** Le module WGM160P a été approuvé pour l'intégration dans des produits finaux exclusivement réalisés par des OEM sous les conditions suivantes: • L'antenne (s) doit être installée de sorte qu'une distance de séparation minimale indiquée ci-dessus soit maintenue entre le radiateur (antenne) et toutes les personnes avoisinante, ce à tout moment. • Le module émetteur ne doit pas être localisé ou fonctionner avec une autre antenne ou un autre transmetteur que celle indiquée plus haut. Tant que les deux conditions ci-dessus sont respectées, il n’est pas nécessaire de tester ce transmetteur de façon plus poussée. Cependant, il incombe à l’intégrateur OEM de s’assurer de la bonne conformité du produit fini avec les autres normes auxquelles il pourrait être soumis de fait de l’utilisation de ce module (par exemple, les émissions des périphériques numériques, les exigences de périphériques PC, etc.). **REMARQUE IMPORTANTE** Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou co-implantation avec un autre émetteur), l'autorisation ISED n'est plus considérée comme valide et le numéro d’identification ID IC ne peut pas être apposé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera responsable de la réévaluation du produit final (y compris le transmetteur) et de l'obtention d'une autorisation ISED distincte. **Étiquetage des produits finis** Les modules WGM160P sont étiquetés avec leur propre ID ISED. Si l'ID ISED n'est pas visible lorsque le module est intégré au sein d'un autre produit, cet autre produit dans lequel le module est installé devra porter une étiquette faisant apparaitre la référence du module intégré. Dans un tel cas, sur le produit final doit se trouver une étiquette aisément lisible sur laquelle figurent les informations suivantes: “ **Contient le module transmetteur IC: 5123A-WGM160P** ” ou “ **Contient le circuit IC: 5123A-WGM160P”** L'intégrateur OEM doit être conscient qu’il ne doit pas fournir, dans le manuel d’utilisation, d'informations relatives à la façon d'installer ou de d’enlever ce module RF ainsi que sur la procédure à suivre pour modifier les paramètres liés à la radio. **silabs.com** | Building a more connected world. Rev. 1.4 | 41 WGM160P Wi-Fi[®] Module Data Sheet Certifications ## **11.5 Locating the Module Close to Human Body** When using the module in an application where the radio is located close to human body, the human RF exposure must be evaluated. FCC, ISED, and CE all have different standards for evaluating the RF exposure, and because of this, each standard will require a different minimum separation distance between the module and human body. Certification of WGM160P allows for the minimum separation distances detailed in Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 42 in portable use cases (less than 20 cm from human body). The module is approved for the mobile use case (more than 20 cm) without any need for RF exposure evaluation. **Table 11.2. Minimum Separation Distances for SAR Evaluation Exemption Certification WGM160P with integrated antenna WGM160P with external reference dipole antenna** FCC 40 mm 40 mm (or 37 mm when transmitting only over RF port 2) ISED 30 mm 40 mm (or 30 mm mm when transmitting only over RF port 2) CE The RF exposure must always be evaluated using the end-product when transmitting with power levels higher than 20 mW = 13 dBm. For FCC and ISED, using the module in end products where the separation distance is smaller than those listed above is allowed but requires evaluation of the RF exposure in the final assembly and applying for a _Class 2 Permissive Change_ or _Change of ID_ to be applied to the existing FCC/ISED approvals of the module. For CE, RF exposure must be evaluated using the end-product in all cases. **Note:** Placing the module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thus reducing range. **silabs.com** | Building a more connected world. Rev. 1.4 | 42 WGM160P Wi-Fi[®] Module Data Sheet Certifications ## **11.6 MIC - Japan** The WGM160P22A and WGM160P22N are certified in Japan with number 005-102265 and 005-102264 respectively. Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio module in their host equipment can place the certification mark and certification number (the same marking/number as depicted on the label of the radio module) on the outside of the host equipment. The certification mark and certification number must be placed close to the text in the Japanese language which is provided below. This change in the Radio Law has been made in order to enable users of the combination of host and radio module to verify if they are actually using a radio device which is approved for use in Japan. Certification Text to be Placed on the Outside Surface of the Host Equipment: Seas (CIRC <<) PeiS EAA SS & eT Re A a ie & oe LOLS, **Translation of the text:** “This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law.” The "Giteki" marking shown in the figure below must be affixed to an easily noticeable section of the specified radio equipment. Note that additional information may be required if the device is also subject to a telecom approval. tT | | tet | ft a am, ee A deals lin ada <4 a ee O54 || | rr 4A A ‘Cae PAST OR) _aeen PELLETtI Oda 906A = Oda **Figure 11.1. GITEKI Mark 11.7 KC - South Korea** The WGM160P22A and WGM160P22N are certified in South Korea with number R-C-BGT-WGM160P. **silabs.com** | Building a more connected world. Rev. 1.4 | 43 WGM160P Wi-Fi[®] Module Data Sheet Revision History ## **12. Revision History** ## **Revision 1.4** March 2025 • Changed the status of parts from Full Production to NRND in Section 2. Ordering Information. - Added 11.6 MIC - Japan and 11.7 KC - South Korea certifications11.6 MIC - Japan and 11.7 KC - South Korea certifications and 11.7 KC - South Korea certifications11.7 KC - South Korea certifications certifications - **Revision 0.5** April 2019 • Updated naming for Sections 7.2 GPIO Functionality and 7.3 Alternate Pin Functionality7.2 GPIO Functionality and 7.3 Alternate Pin Functionality and 7.3 Alternate Pin Functionality7.3 Alternate Pin Functionality • Removed TBD Idle currents from Table 4.3 Power Consumption on page 8 and changed term "Sleep" to "Standby"Table 4.3 Power Consumption on page 8 and changed term "Sleep" to "Standby" and changed term "Sleep" to "Standby" • Updated Table 4.4 Digital I/O Specifications on page 9Table 4.4 Digital I/O Specifications on page 9 • Updated Table 4.6 RF Receiver Characteristics on page 11Table 4.6 RF Receiver Characteristics on page 11 • Updated min PCBx_mm to 40 mm in Table 4.7 Radiated Characteristics on page 11Table 4.7 Radiated Characteristics on page 11 • Updated Section 9. Soldering Recommendations • Updated module manufacturer address in Section 11. Certifications - Updated text in Sections 11.1 Qualified External Antenna Types, 11.3 FCC - USA, 11.4 ISED - Canada, and 11.5 Locating the Module Close to Human Body - • Updated Table 11.2 Minimum Separation Distances for SAR Evaluation Exemption on page 42 Rev. 1.4 | 44 **Revision 1.3** August 2022 • Removed references to Gecko OS from the following: • Front page • Ordering Information table notes • Section 3.1 Introduction • Section 7.2 GPIO Functionality • Updated Section 2. Ordering Information by adding table for revision 4 parts. **Revision 1.2** December 2021 • Updated Certifications to take into account UK specifics (Section 1. Key Features and Section 11.2 CE and UKCA - EU and UK) • Removed Gecko OS as a software option (Section 4.8 Microcontroller Peripherals and Section 6. Software) **Revision 1.1** September 2020 • Updated Table 2.1 Ordering Information for Revision 3 Parts • Updated Figure 5.1 Example Schematic for NCP Application on page 14 • Updated Chapter 6. Software **Revision 1.0** March 2020 • Removed WiFi Alliance from certifications listed in Front Page and Key Features • Added note to Table 3.1 Supported Wi-Fi Modulations, BW, and Channels on page 6 • Added DTIM and sleep current values to Table 4.3 Power Consumption on page 8 and updated Typical standby current from 638 nA to 217 nA • Updated Max VOL from 20 to 25 % and Min VOH from 80 to 75% in 4.4 Digital I/O Specifications • Added note about peripherals supported by Gecko OS in 4.8 Microcontroller Peripherals • Added reference to AN1224 in 5.2 Multi-Protocol Coexistence • Corrected pin 40 naming from VUSB to VSUB in Figure 5.1 Added 11.6 MIC - Japan and 11.7 KC - South Korea certifications11.6 MIC - Japan and 11.7 KC - South Korea certifications and 11.7 KC - South Korea certifications11.7 KC - South Korea certifications certifications **Revision 0.5** April 2019 • Updated naming for Sections 7.2 GPIO Functionality and 7.3 Alternate Pin Functionality7.2 GPIO Functionality and 7.3 Alternate Pin Functionality and 7.3 Alternate Pin Functionality7.3 Alternate Pin Functionality • Removed TBD Idle currents from Table 4.3 Power Consumption on page 8 and changed term "Sleep" to "Standby"Table 4.3 Power Consumption on page 8 and changed term "Sleep" to "Standby" and changed term "Sleep" to "Standby" • Updated Table 4.4 Digital I/O Specifications on page 9Table 4.4 Digital I/O Specifications on page 9 • Updated Table 4.6 RF Receiver Characteristics on page 11Table 4.6 RF Receiver Characteristics on page 11 • Updated min PCBx_mm to 40 mm in Table 4.7 Radiated Characteristics on page 11Table 4.7 Radiated Characteristics on page 11 **silabs.com** | Building a more connected world. WGM160P Wi-Fi[®] Module Data Sheet Revision History ## **Revision 0.3** Feb 2019 - Updated top-level device details throughout document. - Removed software details from Section 1. Key Features (moved to Section ). - Updated Section 2. Ordering Information to expand all OPN details. - Corrected details in Section Figure 3.1 WGM160P Block Diagram on page 6. . • Updated all tables in Section 4. Electrical Specifications with latest nomenclature and characterization data. • Added Section 5.3 Example Schematic. • Added Section . • Updated pinout details in Section 7. Pin Descriptions. • Removed functions not pinned out from Section 7.2 GPIO Functionality and 7.3 Alternate Pin Functionality. • Updated Section 8. Package Specifications with additional landing diagram and package marking details. • Added Section 9. Soldering Recommendations. • Added Section 10. Tape and Reel Dimensions. • Added Section 11. Certifications. **Revision 0.2** November 2018 • Initial release. **silabs.com** | Building a more connected world. Rev. 1.4 | 45 **Simplicity Studio** One-click access to MCU and wireless tools, documentation, software, source code libraries & more. Available for Windows, Mac and Linux! . /, 4 **IoT Portfolio SW/HW Quality Support & Community** www.silabs.com/IoT www.silabs.com/simplicity www.silabs.com/quality www.silabs.com/community **Disclaimer** Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and “Typical” parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A “Life Support System” is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications. **Trademark Information** Silicon Laboratories Inc.[[®]] , Silicon Laboratories[[®]] , Silicon Labs[[®]] , SiLabs[[®]] and the Silicon Labs logo[[®]] , Bluegiga[[®]] , Bluegiga Logo[[®]] , EFM[[®]] , EFM32[[®]] , EFR, Ember[[®]] , Energy Micro, Energy Micro logo and combinations thereof, “the world’s most energy friendly microcontrollers”, Redpine Signals[[®]] , WiSeConnect , n-Link, EZLink[[®]] , EZRadio[[®]] , EZRadioPRO[[®]] , Gecko[[®]] Gecko OS, Gecko OS Studio, Precision32[[®]] , Simplicity Studio[[®]] , Telegesis, the Telegesis Logo[[®]] , USBXpress[[®]] , Zentri, the Zentri logo and Zentri DMS, Z-Wave[[®]] , and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered **==> picture [578 x 360] intentionally omitted <==** **----- Start of picture text -----**<br> . /, 4<br>IoT Portfolio SW/HW Quality Support & Community<br>www.silabs.com/IoT www.silabs.com/simplicity www.silabs.com/quality www.silabs.com/community<br>Disclaimer<br>Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software imple-<br>menters using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each<br>specific device, and “Typical” parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon<br>Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the<br>accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or<br>reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the infor-<br>mation supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or<br>authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent<br>of Silicon Labs. A “Life Support System” is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in<br>significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used<br>in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims<br>all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications.<br>**----- End of picture text -----**<br> **Trademark Information** Silicon Laboratories Inc.[[®]] , Silicon Laboratories[[®]] , Silicon Labs[[®]] , SiLabs[[®]] and the Silicon Labs logo[[®]] , Bluegiga[[®]] , Bluegiga Logo[[®]] , EFM[[®]] , EFM32[[®]] , EFR, Ember[[®]] , Energy Micro, Energy Micro logo and combinations thereof, “the world’s most energy friendly microcontrollers”, Redpine Signals[[®]] , WiSeConnect , n-Link, EZLink[[®]] , EZRadio[[®]] , EZRadioPRO[[®]] , Gecko[[®]] , Gecko OS, Gecko OS Studio, Precision32[[®]] , Simplicity Studio[[®]] , Telegesis, the Telegesis Logo[[®]] , USBXpress[[®]] , Zentri, the Zentri logo and Zentri DMS, Z-Wave[[®]] , and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective holders. **Silicon Laboratories Inc. 400 West Cesar Chavez Austin, TX 78701 USA** **www.silabs.com**
Updated at March 31, 2026
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