WFM200S022XNN3

Wireless LAN Module, 2.4 GHz, SDIO/SPI/GPIO, Consumer Medical, Home & Building Automation

⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
Manufacturer: SILICON LABS
Product type:
SVHC: To Be Advised
Frequency RF: 2.4GHz
Product Range: WFM200S Series
Module Interface: SDIO, SPI, GPIO
Module Applications: Consumer Medical, Home & Building Automation, Home Appliances, Industrial, Security, Sports/Fitness
Delivery and price
Units per pack	250
Price	6.22 €
Current stock	500+
Lead time	30 days
Datasheet
## **WFM200S Data Sheet** 

The Silicon Labs WFM200S is an Ultra Low Power Wi-Fi[®] transceiver or network co-processor (NCP) SiP module targeted for applications where optimal RF performance, lowpower consumption, and secure end-to-end solution, together with fast time to market, are key requirements. 

The very compact 6.5mm x 6.5mm WFM200S SiP module contains an embedded antenna, high frequency crystal, and shield. This all-inclusive module offer the fastest time to market. 

## **KEY POINTS** 

- IEEE 802.11 b/g/n compliant 

- Embedded high efficiency antenna 

- Integrated crystal and shield 

- 105°C ambient temp support 

- TX power: up to +15.1 dBm 

The WFM200S integrates a balun, T/R switch, LNA and PA for the best possible RF performance. Co-existence with external 2.4GHz transceivers is supported via a PTA interface. 

WFM200S has been optimized for resource and power constrained devices at the RF, protocol and firmware levels. Power conscious devices can take advantage of these features in both active and idle/sleep modes. 

For security sensitive applications, the WFM200S provides secure boot and a secure, encrypted host interface. Robust security is made possible with the native integrated True Random Number Generator and OTP memory for confidential encryption key storage. 

The WFM200S fits well witl Linux-based and RTOS-based host processors. WFM200S supports both the 802.11 split MAC architecture and the 802.11 full MAC software architecture. WFM200S communicates with the external host controller over the SPI or SDIO interface. 

- RX sensitivity: -96.3 dBm 

- Integrated switched antenna diversity support 

- Ultra low power consumption 

- Secure and signed software 

- Encrypted host interface communication 

- Linux and RTOS host support 

- Certifications 

- CE (EU), UKCA (UK), FCC (USA), ISED (Canada), MIC (Japan), KC (South Korea) 

- 6.5 x 6.5 mm SiP Module 

**==> picture [128 x 21] intentionally omitted <==**

**----- Start of picture text -----**<br>
VDDPA VDDD VDDIO<br>3.3V 1.8-3.3V 1.8-3.3V<br>**----- End of picture text -----**<br>


**==> picture [399 x 196] intentionally omitted <==**

**----- Start of picture text -----**<br>
WF200 IC<br>SPI/SDIO Integral Antenna<br>802.11 b/g/n Transceiver<br>Integrated RF, Baseband,<br>RESETn & WUP Balun<br>PTA/GPIO RF1<br>FEM/GPIO RF2<br>CLK_32K<br>WIRQ XTAL 38.4 MHz<br>optional<br>or<br>**----- End of picture text -----**<br>


**Copyright © 2022 by Silicon Laboratories** 

**silabs.com** | Building a more connected world. 

Rev. 1.2 

WFM200S Data Sheet Features List 

## **1.  Features List** 

The WFM200S Wi-Fi SiP module key features are listed below. 

## **Applications** 

- Industrial, Home and Buidling automation 

- Home appliances 

- Security solutions 

- Retail and Commercial 

- Commercial transportation 

- Consumer medical 

- Sports and Fitness 

## **Features** 

- 802.11 b/g/n Wi-Fi NCP including the radio, baseband, MAC, security and host interface 

- Integrated LNA, PA and Balun 

- Integrated 38.4 MHz Crystal and embedded antenna 

- OTP included removing the need for an external EEPROM 

- Ultra low power optimized solution 

- End-to-end security with hardware protected secure boot and encrypted host interface (optional) 

- 802.11 split and full MAC architecture support 

- Complete Network Co-Processor (NCP) support for Linux and RTOS external hosts 

## **Standards/IEEE 802.11 and WFA** 

- b - symbol rates: up to 11 Mbps 

- g - symbol rates: up to 54 Mbps 

- n - symbol rates: up to 72.2Mbps 

- d - regulatory domains 

- e - QoS as per definition in WMM specification 

- i - as per definition in WPA2 specification 

- w - protected management frames 

- WMM Power save 

## **RF Features** 

- Tx Power: +15.1 dBm 

- Rx Sensitivity: -96.3 dBm 

- 2 x 2.4GHz antenna pads for switched antenna diversity support 

- 2.4GHz co-existence; 2-, 3- and 4-wire PTA support 

- Integrated Balun, T/R switch, LNA and PA for 2.4GHz 

## **Power Consumption** 

- Rx (@DSSS-1Mbps): 42.3 mA 

- Tx (15.1 dBm @DSSS-1Mbps): 145 mA 

- Associated DTIM3 average current : 298 μA 

- Associated Sleep Current : 22 μA 

- Shutdown mode: 0.5 μA 

## **Security and Encryption Features** 

- Secure boot with roll-back prevention 

- Encrypted host interface, dedicated hardware acceleration block (optional) 

- Integrated True Random Number Generator 

- Secure key storage using protected OTP technology 

- AES/WEP hardware acceleration 

## **Host Interfaces** 

- SDIO (1-bit and 4-bit SD mode @ 26MHz) 

- SPI (1-bit @ 52MHz) 

## **Peripheral Interfaces** 

- External 32kHz crystal for low power 

- GPIOs (including wake-up and Tx/Rx activity monitoring) 

## **ROHS/REACH Compliant** 

- WPA/WPA2 Personal/WPA3 Personal 

- Supported with Linux UMAC: 

   - WPA2 Enterprise 

   - WPS - Wi-Fi Protected Setup 

## **Certifications** 

- CE (EU), UKCA (UK), FCC (USA), ISED (Canada), MIC (Japan), KC (South Korea) 

## **Electrical Characteristics** 

## **Key MAC and Baseband Features** 

- 1x1 802.11n (20 MHz) with full 802.11 b/g compatibility, 72.2Mbps 

- Greenfield Tx/Rx for 802.11n optimal performance 

- Short Guard Interval (SGI) for 802.11n optimal throughput 

- A-MPDU Rx and Tx for high MAC throughput 

- 1.62V - 3.6V (VDDD, VDDIO) 

- 3.0 - 3.6V (VDDPA) 

## **Packaging** 

   - 6.5x6.5 LGA58 SiP Module 

   - Temperature range: -40°C to +105°C 

- Block acknowledgement for several frames 

- Rx Defragmentation 

- Roaming supported 

- Client, SoftAP modes supported 

- Concurrent AP + STA supported on different channels 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  2 

WFM200S Data Sheet Ordering Information 

## **2.  Ordering Information** 

This section contains ordering information for WFM200S. 

**Note: The parts may be referred to by the product family friendly name (WFM200S), or by the model names (WFM200SA, WFM200SN), or by the full orderable part numbers throughout this document** 

**Table 2.1.  WFM200S Ordering Information (R indicates Full Reel)** 

|**Part Number**|**Description**|**Antenna**<br>**Type**|**Package**|
|---|---|---|---|
|WFM200S022XNA3(R)|WFM200S 802.11bgn NCP|Embedded|6.5x6.5 LGA52 SiP module|
|WFM200SS22XNA3(R)|WFM200S 802.11bgn NCP<br>Secure host interface|Embedded|6.5x6.5 LGA52 SiP module|
|WFM200S022XNN3(R)|WFM200S 802.11bgn NCP|External only|6.5x6.5 LGA52 SiP module|
|WFM200SS22XNN3(R)|WFM200S 802.11bgn NCP<br>Secure host interface|External only|6.5x6.5 LGA52 SiP module|



**silabs.com** | Building a more connected world. 

Rev. 1.2  |  3 

## **Table of Contents** 

|**1.**|**Features List**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**|**. 2**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**2.**|**Ordering Information**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**|**. 3**|
|**3.**|**System Overview .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**|**. 6**|
||3.1  Introduction .<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|. 6|
||3.2  Wi-Fi Supported 2.4 GHz Bandwidth and Channels|||||||.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|. 7|
|**4.**|**Electrical Specifications .**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**|**. 8**|
||4.1  Absolute Maximum Ratings.<br>.<br>.|.|.|.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|. 8|
||4.2  Operating Conditions .<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|. 9|
||4.3  Power Consumption .<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.10|
||4.4  RF Transmitter General Characteristics|||.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.11|
||4.4.1  RF Transmitter Characteristics|.|.|.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.12|
||4.5  RF Receiver General Characteristics||.|.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.12|
||4.5.1  RF Receiver Characteristics .|.|.|.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.13|
||4.6  Reference Oscillator and Low Power Clock Characteristics|||||||||.||.||.||.||.||.||.||.||.||.||.||.||.||.|.14|
||4.6.1  Low Power 32.768 kHz Clock Input Requirements||||||||.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.14|
||4.7  Interface Terminal Characteristics|.|.|.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.14|
||4.7.1  Supply Terminal Specifications|.|.|.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.14|
||4.7.2  Digital I/O Terminal Specifications||.|.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.15|
||4.8  Host Interface<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.15|
||4.8.1  SPI Specification .<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.17|
||4.8.2  SDIO Specification .<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.18|
|**5.**|**Typical Applications and Connections **||**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**|**19**|
||5.1  Typical Application Circuit for SDIO|Host Interface|||||.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.19|
||5.2  Typical Application Circuit for SPI Host||Interface||||.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.20|
||5.3**Power States and Low-Power Modes**|||.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.21|
||5.4  RF Connections<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.21|
||5.4.1  RF Ports<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.21|
||5.4.2  Antenna Diversity<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.21|
||5.4.3  Embedded Antenna Pins .<br>.|.|.|.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.21|
||5.5  Clocks .<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.21|
||5.5.1  High Frequency Crystal Oscillator||.|.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.21|
||5.5.2  LP_CLK Port .<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.22|
||5.6  Multi-Protocol Coexistence .<br>.<br>.|.|.|.|.|.|.|.|.|.||.||.||.||.||.||.||.||.||.||.||.||.||.|.22|
|**6.**|**Pin Descriptions**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**. 23**|
|**7.**|**Package Outline**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**. 25**|
|**8.**|**Land Pattern**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**|**.29**|
|**9.**|**Top Marking.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**||**.**|**31**|



**silabs.com** | Building a more connected world. 

Rev. 1.2 |  4 

|**10.  Tape and Reel Specifications **|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**32**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|10.1  Tape and Reel Packaging.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.32|
|10.2  Reel and Tape Specifications||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.32|
|10.3  Orientation and Tape Feed|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.34|
|10.4  Tape and Reel Box Dimensions.|||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.34|
|10.5  Moisture Sensitivity Level .|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.34|
|**11.  Software Reference**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**. 35**|
|11.1  Host and Device Software.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.35|
|11.1.1  Split MAC .<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.35|
|11.1.2  Full MAC .<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.36|
|11.1.3  Software Documentation.||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.36|
|11.2  Security .<br>.<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.36|
|11.2.1  Secure Device .<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.36|
|11.2.2  Secure Boot .<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.37|
|11.2.3  Secure Link (WFM200SS only)||||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.37|
|11.3  Startup, Sleep and Shutdown||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.37|
|11.3.1  Power On, Reset, and Boot||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.37|
|11.3.2  Sleep and Snooze Modes||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.37|
|11.3.3  Shutdown Mode.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.38|
|**12.  Certifications .**<br>**.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**39**|
|12.1  Qualified External Antenna Types|||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.39|
|12.2  CE and UKCA - EU and UK|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.39|
|12.3  FCC - USA .<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.40|
|12.4  ISED - Canada<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.41|
|12.5  MIC - Japan<br>.<br>.<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.43|
|12.6  KC - South Korea<br>.<br>.<br>.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.44|
|12.7  Locating the Module Close to Human||||Body||.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.|.44|
|**13.  Revision History.**<br>**.**<br>**.**<br>**.**<br>**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**.**|**45**|



**silabs.com** | Building a more connected world. 

Rev. 1.2 |  5 

WFM200S Data Sheet System Overview 

## **3.  System Overview** 

## **3.1  Introduction** 

WFM200S is a WiFi network co-processor module optimized for RF performance, low energy, and low cost, with two antenna ports, Crystal Oscillator, One Time Programmable Memory, and several GPIOs for interfacing with multi-protocol and RF Front End Module controls. 

**Figure 3.1.  WFM200SA Block Diagram** 

**Figure 3.2.  WFM200SN Block Diagram** 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  6 

WFM200S Data Sheet System Overview 

## **3.2  Wi-Fi Supported 2.4 GHz Bandwidth and Channels** 

Supported operating frequencies and bandwidth 

**Table 3.1.  Supported Wi-Fi Modulations, BW, and Channels** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Channel Center Frequency|CHAN|Subject to Regulatory Agency|2412||2484|MHz|
|Channel Bandwidth|BW||—|20|—|MHz|
|**Note:**<br>1. Channel 14 (2484 MHz) is meant for operation in the Japan market, and it only supports 1 and 2 Mbps modulations.|||||||



**silabs.com** | Building a more connected world. 

Rev. 1.2  |  7 

WFM200S Data Sheet Electrical Specifications 

## **4.  Electrical Specifications** 

All electrical parameters in all tables are specified under the following conditions, unless stated otherwise: 

- Typical values are based on TA = 25 °C; VVDD_IO, VVDD, VVDD_PA= 3.3V 

- Radio performance numbers are measured in conducted mode, based on Silicon Labs reference designs 

- WFM200S features and benefits depend on system configuration and may require specific driver, firmware or service activation. Learn more at https://www.silabs.com/products/wireless/wi-fi 

Refer to Section 4.2 Operating Conditions for more details about operational supply and temperature limits. 

## **4.1  Absolute Maximum Ratings** 

Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx. 

**Table 4.1.  Absolute Maximum Ratings** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Storage temperature|TSTG||-40|—|150|°C|
|Junction temperature|TJMAX||-40|—|125|°C|
|RF power level at RF1 and<br>RF2 ports|PRFMAX||—|—|10|dBm|
|Supply voltage to VDD_PA,<br>VDD_IO, VDD|VDDMAX||-0.3|—|3.6|V|
|Voltage on all other pins<br>(GPIO, Host interface, PTA,<br>etc.)|VGMAX||-0.3|—|VDDIO+<br>0.3 V|V|
|Current into any GPIO pin|IOMAX||—|—|20|mA|
|Sum of current into all GPIO<br>pins|IOALL_MAX||—|—|150|mA|
|Range of load impedance at<br>RF1 and RF2 pins during TX|LOADTX||—|—|10:1|VSWR|



**silabs.com** | Building a more connected world. 

Rev. 1.2  |  8 

WFM200S Data Sheet Electrical Specifications 

## **4.2  Operating Conditions** 

**Table 4.2.  Recommended Operating Conditions** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Ambient operating tempera-<br>ture|TA||-40|—|105|°C|
|Junction operating tempera-<br>ture|TJ||-40|—|125|°C|
|DC supply voltage to<br>VDD_PA1|VVDD_PA||3.0|3.3|3.6|V|
|Nominal supply voltage to<br>VDD|VVDD||1.62|1.8|3.6|V|
|Nominal supply voltage to<br>VDD_IO|VVDD_IO||1.62|1.8|3.6|V|
|**Note:**<br>1. VVDD_PAmust always be greater than or equal to VVDD.|||||||



**silabs.com** | Building a more connected world. 

Rev. 1.2  |  9 

WFM200S Data Sheet Electrical Specifications 

## **4.3  Power Consumption** 

Unless otherwise indicated, VVDD_PA = 3.3 V, VVDD = VVDD_IO = 1.8 V. 

**Table 4.3.  Power Consumption** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|TX mode current|ITX|802.11.b: 1 Mbps, from VDD_PA<br>at 3.3 V|—|99.4|—|mA|
|||802.11.b: 11 Mbps, from VDD_PA<br>at 3.3 V|—|95.6|—|mA|
|||802.11.g: 6 Mbps, from VDD_PA<br>at 3.3 V|—|95.2|—|mA|
|||802.11.g: 54 Mbps, from VDD_PA<br>at 3.3 V|—|92.6|—|mA|
|||802.11.n: MCS = 0, from VDD_PA<br>at 3.3 V|—|94.9|—|mA|
|||802.11.n: MCS = 7, from VDD_PA<br>at 3.3 V|—|92.3|—|mA|
|||802.11.b: 1 Mbps, from 1.8 V sup-<br>plies (VDD, VDD_IO)|—|45.5|—|mA|
|||802.11.b: 11 Mbps, from 1.8 V<br>supplies (VDD, VDD_IO)|—|45.4|—|mA|
|||802.11.g: 6 Mbps, from 1.8 V sup-<br>plies (VDD, VDD_IO)|—|46.7|—|mA|
|||802.11.g: 54 Mbps, from 1.8 V<br>supplies (VDD, VDD_IO)|—|47.4|—|mA|
|||802.11.n: MCS = 0, from 1.8 V<br>supplies (VDD, VDD_IO)|—|46.7|—|mA|
|||802.11.n: MCS = 7, from 1.8 V<br>supplies (VDD, VDD_IO)|—|47.4|—|mA|
|RX mode current|IRX|802.11.b: 1 Mbps, from 1.8 V sup-<br>plies (VDD, VDD_IO)|—|42.3|—|mA|
|||802.11.b: 11 Mbps, from 1.8 V<br>supplies (VDD, VDD_IO)|—|43.0|—|mA|
|||802.11.g: 6 Mbps, from 1.8 V sup-<br>plies (VDD, VDD_IO)|—|45.4|—|mA|
|||802.11.g: 54 Mbps, from 1.8 V<br>supplies (VDD, VDD_IO)|—|47.8|—|mA|
|||802.11.n: MCS = 0, from 1.8 V<br>supplies (VDD, VDD_IO)|—|45.2|—|mA|
|||802.11.n: MCS = 7, from 1.8 V<br>supplies (VDD, VDD_IO)|—|48.3|—|mA|
|Sleep current on power sup-<br>ply pins1|ISLEEP|VDD_PA pin, VVDD_PA= 3.3 V|—|66|—|nA|
|||VDD pin, VVDD= 1.8 V|—|18.7|—|µA|
|||VDD_IO pin, VVDD_IO= 3.3 V|—|3.5|—|µA|



**silabs.com** | Building a more connected world. 

Rev. 1.2  |  10 

WFM200S Data Sheet Electrical Specifications 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Snooze current on power<br>supply pins2|ISNOOZE|VDD_PA pin, VVDD_PA= 3.3 V|—|66|—|nA|
|||VDD pin, VVDD= 1.8 V|—|1146|—|µA|
|||VDD_IO pin, VVDD_IO= 3.3 V|—|51|—|µA|
|Shutdown current on power<br>supply pins3|ISHUTDOWN|VDD_PA pin, VVDD_PA= 3.3 V|—|67|—|nA|
|||VDD pin, VVDD= 1.8 V|—|83.8|—|nA|
|||VDD_IO pin, VVDD_IO= 3.3 V|—|49|—|nA|
|Average current for DTIM=1<br>Interval Profile4|ILP_DTIM1|VDD_PA pin, VVDD_PA= 3.3 V|—|154|—|nA|
|||VDD pin, VVDD= 1.8 V|—|891|—|µA|
|||VDD_IO pin, VVDD_IO= 3.3 V|—|3.7|—|µA|
|Average current for DTIM=3<br>Interval Profile4|ILP_DTIM3|VDD_PA pin, VVDD_PA= 3.3 V|—|128|—|nA|
|||VDD pin, VVDD= 1.8 V|—|294|—|µA|
|||VDD_IO pin, VVDD_IO= 3.3 V|—|3.6|—|µA|
|Average current for DTIM=10<br>Interval Profile4|ILP_DTIM10|VDD_PA pin, VVDD_PA= 3.3 V|—|118|—|nA|
|||VDD pin, VVDD= 1.8 V|—|103|—|µA|
|||VDD_IO pin, VVDD_IO= 3.3 V|—|3.7|—|µA|
|**Note:**<br>1. All memory is retained in sleep mode. WUP on timer and/or interrupt.<br>2. All memory is retained and Xtal oscillator is kept on if no 32 kHz clock is provided.<br>3. Requires complete start-up sequence to resume operation.<br>4. All DTIM currents assume a 1 ms beacon time duration with a beacon interval of 102.4ms from the AP.|||||||



## **4.4  RF Transmitter General Characteristics** 

Unless otherwise indicated, typical conditions are: Operating Ambient Temp = 25 °C, VVDD_IO = VVDD = 1.8 V; VVDD_PA= 3.3V, center frequency = 2,442 MHz, and measured in 50 Ω test equipment attached at antenna port. The output power levels are backed off to ensure compliance into a 2:1 VSWR antenna at the worst phase angles. More details are in UG395: WFM200 Hardware Design User's Guide. 

Measurements for this specification are made using the RF_1 port. See Section 5.4.1 RF Ports. 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  11 

WFM200S Data Sheet Electrical Specifications 

## **4.4.1  RF Transmitter Characteristics** 

## **Table 4.4.  RF Transmitter Characteristics** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|RMS output power into 50-Ω<br>load with compliance for an-<br>tenna up to 2:1 VSWR|POUTMAX_RMS_<br>HPPA|802.11b: 1 Mbps|—|15.1|—|dBm|
|||802.11b: 11 Mbps|—|13.0|—|dBm|
|||802.11g: 6 Mbps|—|12.5|—|dBm|
|||802.11g: 54 Mbps|—|7.1|—|dBm|
|||802.11n: MCS=0|—|12.1|—|dBm|
|||802.11n: MCS=7|—|5.0|—|dBm|
|Second Harmonic Level for<br>POUT_MAX_PA Setting|HD2MAX|802.11b: 1 Mbps|—|-47.9|—|dBm|
|||802.11b: 11 Mbps|—|-49.1|—|dBm|
|||802.11g: 6 Mbps|—|-50.2|—|dBm|
|||802.11g: 54 Mbps|—|-54.2|—|dBm|
|||802.11n: MCS=0|—|-50.4|—|dBm|
|||802.11n: MCS=7|—|-55.6|—|dBm|
|Carrier Suppression per<br>802.11-2012 for POUT_MAX<br>PA setting|CSUP|802.11b: 1 Mbps|—|-45.8|—|dBr|
|||802.11b: 11 Mbps|—|-44.3|—|dBr|
|||802.11g: 6 Mbps|—|-36.9|—|dBr|
|||802.11g: 54 Mbps|—|-35.9|—|dBr|
|||802.11n: MCS=0|—|-39.6|—|dBr|
|||802.11n: MCS=7|—|-31.4|—|dBr|
|POUT variation from<br>VDD_PA=3.0 V to 3.6 V|POUTMAX_VAR_<br>V|VDD_PA = 3.0 V to 3.6 V, Meas-<br>ured on single channel|—|1.6|—|dB|
|POUT variation across tem-<br>perature|POUTMAX_VAR_<br>T|25C to 85C|—|0.9|—|dB|



## **4.5  RF Receiver General Characteristics** 

Unless otherwise indicated, typical conditions are: Operating Ambient Temp = 25 °C, VVDD_IO = VVDD = 1.8 V; VVDD_PA= 3.3V, center frequency = 2,442 MHz, and measured in 50 Ω test equipment attached at antenna port. 

Measurements for this specification are made using the RF_1 port. See Section 5.4.1 RF Ports. 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  12 

WFM200S Data Sheet Electrical Specifications 

## **4.5.1  RF Receiver Characteristics** 

**Table 4.5.  RF Receiver Characteristics** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|RX Sensitivity for 8% FER<br>(1024 Octet)|SENSB|802.11b: 1 Mbps|—|-96.3|—|dBm|
|||802.11b: 11 Mbps|—|-88.0|—|dBm|
|RX Sensitivity for 10% PER<br>(1024 Octet)|SENSG|802.11g: 6 Mbps|—|-91.5|—|dBm|
|||802.11g: 54 Mbps|—|-74.6|—|dBm|
|RX Sensitivity for 10% PER<br>(4096 Octet)|SENSEN|802.11n: MCS=0|—|-91.0|—|dBm|
|||802.11n: MCS=7|—|-71.7|—|dBm|
|Adjacent Channel ( ± 30<br>MHz) Selectivity with desired<br>signal at 6 dB above refer-<br>ence sensitivity for 8% FER<br>(1024 Octet)|ACSWB|802.11b: 1 Mbps|—|56.0|—|dBc|
|||802.11b: 11 Mbps|—|45.2|—|dBc|
|Adjacent Channel ( ± 25<br>MHz) Selectivity with desired<br>signal at 3 dB above refer-<br>ence sensitivity for 10% PER<br>(1024 Octet)|ACSWG|802.11g: 6 Mbps|—|47.9|—|dBc|
|||802.11g: 54 Mbps|—|32.2|—|dBc|
|Adjacent Channel ( ± 25<br>MHz) Selectivity with desired<br>signal at 3 dB above refer-<br>ence sensitivity for 10% FER<br>(4096 Octet)|ACSWN|802.11n: MCS=0|—|47.5|—|dBc|
|||802.11n: MCS=7|—|29.9|—|dBc|
|2nd Adjacent Channel Sele-<br>citivity ( ± 50 MHz) with de-<br>sired at 6 dB above refer-<br>ence sensitivity 8% FER<br>(1024 Octet)|A2CSWB|802.11b: 1 Mbps|—|57.5|—|dBc|
|||802.11b: 11 Mbps|—|52.0|—|dBc|
|2nd Adjacent Channel Sele-<br>citivity ( ± 50 MHz) with de-<br>sired at 3 dB above refer-<br>ence sensitivity 10% PER<br>(1024 Octet)|A2CSWG|802.11g: 6 Mbps|—|52.4|—|dBc|
|||802.11g: 54 Mbps|—|36.4|—|dBc|
|2nd Adjacent Channel Sele-<br>citivity ( ± 50 MHz) with de-<br>sired at 3 dB above refer-<br>ence sensitivity 10% PER<br>(4096Octet)|A2CSWN|802.11n: MCS=0|—|51.7|—|dBc|
|||802.11n: MCS=7|—|33.4|—|dBc|
|RX Max Strong Signal for<br>8% FER (1024 Octet)|RXSAT_B|802.11b: 1 Mbps|—|-4.0|—|dBm|
|||802.11b: 11 Mbps|—|-10.0|—|dBm|
|RX Max Strong Signal for<br>10% PER (1024 Octet)|RXSAT_G|802.11g: 6 Mbps|—|-9.0|—|dBm|
|||802.11g: 54 Mbps|—|-9.0|—|dBm|
|RX Max Strong Signal for<br>10% PER (4096 Octet)|RXSAT_N|802.11n: MCS=0|—|-9.0|—|dBm|
|||802.11n: MCS=7|—|-9.0|—|dBm|



**silabs.com** | Building a more connected world. 

Rev. 1.2  |  13 

WFM200S Data Sheet Electrical Specifications 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|RX Channel Power Indicator<br>Accuracy worst case with in-<br>put swetp from -60 dBm to<br>RX_SAT|RCPITOLS|802.11b: 1 Mbps|—|-4.5|—|dB|
|||802.11g: 6 Mbps|—|-2.8|—|dB|
|||802.11n: MCS=7|—|-3.3|—|dB|
|RX Channel Power Indicator<br>Accuracy Worst Case with<br>input signal swept from refer-<br>ence sensitivity to -69 dbm|RCPITOLW|802.11b: 1 Mbps|—|-1.3|—|dB|
|||802.11g: 6 Mbps|—|-1.4|—|dB|
|||802.11n: MCS=7|—|-1.0|—|dB|
|RX Channel power Indicator<br>Step Size|RCPISTEP|802.11b: 1 Mbps|—|0.5|—|dB|
|||802.11g: 6 Mbps|—|0.5|—|dB|
|||802.11n: MCS=7|—|0.5|—|dB|



## **4.6  Reference Oscillator and Low Power Clock Characteristics** 

The WFM200S contains a built-in 38.4 MHz XTAL to generate the reference clock. 

To achieve low power operation during power save modes, an external 32.768 KHz clock is required. 

## **4.6.1  Low Power 32.768 kHz Clock Input Requirements** 

## **Table 4.6.  Low Power 32.768 kHz Clock Input Requirements** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Nominal Frequency of<br>LP_CLK|FNOMLPCLK||—|32.768|—|KHz|
|Frequency Tolerance of<br>LP_CLK over all conditions1|FTOLLPCLK||-1000|—|1000|ppm|
|Load of LP_CLK pin|RLPCLK||—|30|—|KOhm|
|Input Level at LP_CLK|SIGLLPCLK||0.7 *<br>VDD_IO|—|VDD_IO|V p-p|
|Symmetry of LP_CLK|DUTYLPCLK||—|50|—|%|
|**Note:**<br>1. To optimize power consumption in DTIM modes, it is recommended that the frequency drift of LP_CLK within 1 second be lower<br>than +- 100ppm.|||||||



## **4.7  Interface Terminal Characteristics** 

Unless otherwise indicated, typical conditions are: Operating Ambient Temp = 25 °C, VVDD_IO = VVDD = 1.8 V; VVDD_PA= 3.3V, center frequency = 2,442 MHz, and measured by 50 Ω test equipment attached at pin. 

## **4.7.1  Supply Terminal Specifications** 

There are three supply pins to attach to DC power sources: VDD_PA, VDD and VDD_IO. 

Please refer to the section on 4.2 Operating Conditions for details on allowed voltages on these pins. 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  14 

WFM200S Data Sheet Electrical Specifications 

## **4.7.2  Digital I/O Terminal Specifications** 

**Table 4.7.  Digital I/O Terminal Specifications** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Voltage input low (relative to<br>VVDD_IO)|VIL||—|—|30|%|
|Voltage input high (relative to<br>VVDD_IO)|VIH||70|—|—|%|
|Logic low output voltage (rel-<br>ative to VVDD_IO)|VOL|Sinking 5 mA, VVDD_IO≥ 1.62 V|—|—|25|%|
|Logic high output voltage<br>(relative to VVDD_IO)|VOH|Sourcing 5 mA, VVDD_IO≥ 1.62 V|80|—|—|%|
|Input leakage current|ILeak||—|1|—|nA|
|Pullup resistance|RPU||30|43|65|kΩ|
|Pulldown resistance1|RPD||30|43|65|kΩ|
|Output fall time from VOHto<br>VOL|TOF|50 pF load, VVDD_IO= 1.62 V|—|15|—|ns|
|Output rise time from VOLto<br>VOH|TOR|50 pF load, VVDD_IO= 1.62 V|—|15|—|ns|
|**Note:**<br>1. RESETn pin has only pull-up resistance.|||||||



## **4.8  Host Interface** 

The host interface allows control of WFM200S by an MCU or SoC using either SPI or SDIO. Selection between SPI and SDIO is done upon the logic state on SDIO_DAT2/HIF_SEL pin during the rising edge of RESETn signal. If this signal is HIGH, the host interface is configured as SDIO, otherwise it is configured as SPI. The tables below summarizes the pin configurations for the two modes and the achievable speeds on both interfaces 

**Table 4.8.  WFM200S SPI and SDIO interface pin configuration** 

|**WFM200S Pin Name**|**SPI Mode**|**SPI Mode**|**SDIO Mode**|**SDIO Mode**|
|---|---|---|---|---|
|RESETn|0 -> 1|1|0 -> 1|1|
|SDIO_DAT2/HIF_SEL|0|x|1|SDIO_DAT2|
|SDIO_CLK/SPI_CLK|x|SPI_CLK|x|SDIO_CLK|
|SDIO_CMD/SPI_MOSI|x|SPI_MOSI|x|SDIO_CMD|
|SDIO_DAT0/SPI_MISO|x|SPI_MISO|x|SDIO_DAT0|
|SDIO_DAT1/SPI_WIRQ|x|WIRQ<br>(interrupt request to<br>the SPI host)|x|SDIO_DAT1|
|SDIO_DAT3/SPI_CSn|x|SPI_CSn|x|SDIO_DAT3|



**silabs.com** | Building a more connected world. 

Rev. 1.2  |  15 

WFM200S Data Sheet Electrical Specifications 

## **Table 4.9.  Host Interface Speeds** 

|**Parameter**|**Symbol**|**Test Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|SDIO V2.0 clock rate|SDRate|Host Interface SDIO DS Mode|—|—|26|MHz|
|||Host Interface SDIO HS Mode|—|—|52|MHz|
|SPI clock rate|SPIRate|Host Interface SPI|—|—|52|MHz|



Besides the main host interface signals, a couple of other pins also complement the host interface. See AN1219 for more details: 

- The GPIO/WUP pin should be used by the host to wake up the WFM200S when in power-save mode. This pin is programmable and if power save is not enabled on the device, this pin can be configured as a GPIO. Note that this pin should be LOW to enable the WFM200S to reach sleep or shutdown modes. 

- GPIO/WIRQ can also optionally be used as a duplication of the IRQ signal from SPI or SDIO. If this is not required, the pin can be configured as a GPIO. 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  16 

WFM200S Data Sheet Electrical Specifications 

## **4.8.1  SPI Specification** 

**Figure 4.1.  SPI Interface Timing Parameters** 

**Table 4.10.  SPI Interface Timing Specifications** 

|**Symbol**<br>~~a~~|**Description**<br>ee|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|tCLK<br>~~a~~<br>PR|Clock period<br>ee|19.231|||ns|
|tCLK_HI<br>~~a~~<br>PR|Clock high<br>ee|9|||ns|
|tCLK_LO<br>PR<br>a~~ee~~|Clock low<br>~~ee~~|9<br>~~ee~~|~~ee~~|~~ee~~|ns<br>~~ee~~|
|tCS_DIS_MI<br>a~~ee~~|CS disable to MISO. VDDIO= 3.3V<br>~~ee~~|~~ee~~|~~ee~~|8<br>~~ee~~|ns<br>~~ee~~|
||CS disable to MISO. VDDIO= 1.8V<br>~~ee~~|~~ee~~|~~ee~~|10<br>~~ee~~|ns<br>~~ee~~|
|tSU_CS<br>~~ee~~<br>a<br>Pe|CS setup time<br>~~ee~~|3<br>~~ee~~|~~ee~~|~~ee~~|ns<br>~~ee~~|
|tSU_MO<br>a<br>Pe<br>a|MOSI setup time|3|||ns|
|tHD_MO<br>Pe<br>a2|MOSI hold time<br>eee|3<br>ee|||ns|
|tCLKr_MI, tCLKf_MI<br>a2|CLK to MISO out; VDDIO= 3.3V<br>eee|ee||10|ns|
||CLK to MISO out; VDDIO= 1.8V<br>eee<br>~~ee~~|ee<br>~~ee~~|~~ee~~|21<br>~~ee~~|ns<br>~~ee~~|
|**Note:**<br>1. 19.23 ns = 1/52 MHz<br>2. MISO can optionally be latched either on rising edge or falling edge of CLK<br>3. All timing parameters valid for output load up to 2 mA<br>2<br>eee ee||||||



1. 19.23 ns = 1/52 MHz 

2. MISO can optionally be latched either on rising edge or falling edge of CLK 

3. All timing parameters valid for output load up to 2 mA 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  17 

WFM200S Data Sheet Electrical Specifications 

## **4.8.2  SDIO Specification** 

**Figure 4.2.  SDIO Interface Timing Parameters** 

**Table 4.11.  SDIO Interface Timing Specifications** 

|**Symbol**|**Description**|**Min**|**Typ**|**Max**|**Unit**|**Conditions**|
|---|---|---|---|---|---|---|
|tCLK_HS|Clock period in high speed<br>mode|19.23|||ns|CL ≤ 20pF|
|tCLK_DS|Clock period in default speed<br>mode|38.46|||ns|CL ≤ 20pF|
|tCLK_LO<br>a|Clock low time<br>es|9<br>es|||ns|CL≤ 20pF|
|tCLK_HI<br>a|Clock high time<br>es|9<br>es|||ns|CL≤ 20pF|
|CMD, DAT0~3 Inputs (with reference to SDIO_CLK)<br>a<br>es<br>es<br>~~a~~|||||||
|tSU<br>~~a~~<br>~~es~~|Input Set time<br>~~a~~<br>~~es~~|3<br>~~a~~<br>~~es~~|~~a~~<br>~~es~~|~~a~~<br>~~es~~|ns<br>~~a~~<br>~~es~~|CL≤ 20pF<br>~~a~~<br>~~es~~|
|tHD<br>~~es~~<br>~~a~~|Input Hold time<br>~~es~~<br>~~a~~|3<br>~~es~~<br>~~a~~|~~es~~<br>~~a~~|~~es~~<br>~~a~~|ns<br>~~es~~<br>~~a~~|CL≤ 20pF<br>~~es~~<br>~~a~~|
|CMD, DAT0~3 Outputs (with reference to SDIO_CLK)<br>~~a~~|||||||
|tODLY_CLKr,<br>tODLY_CLKf<br>~~a~~<br>~~OO~~|Output delay time (relative to<br>rising and falling edge) for VDD<br>= 3.3V<br>~~a~~|~~a~~|~~a~~|11<br>~~a~~|ns<br>~~a~~|VDDIO= 3.3V;<br>CL≤ 20pF<br>~~a~~|
||Output delay time (relative to<br>rising and falling edge) for VDD<br>= 1.8V<br>~~OO~~|~~OO~~|~~OO~~|22<br>~~OO~~|ns<br>~~OO~~|VDDIO= 1.8V;<br>CL≤ 20pF|
|tOH<br>~~OO~~|Output Hold time<br>~~OO~~|3<br>~~OO~~|~~OO~~|~~OO~~|ns<br>~~OO~~|CL≤ 20pF|
|1. Output data can be latched either on rising edge (HS mode) or falling edge (DS mode) of CLK<br>2. All timing parameters valid for output load of up to 2 mA<br>~~OO~~|||||||



**silabs.com** | Building a more connected world. 

Rev. 1.2  |  18 

WFM200S Data Sheet Typical Applications and Connections 

## **5.  Typical Applications and Connections** 

## **5.1  Typical Application Circuit for SDIO Host Interface** 

**==> picture [532 x 435] intentionally omitted <==**

**----- Start of picture text -----**<br>
VDD_PA VDD VDD_IO<br>L\ L\ /\<br>U1<br>To Co-existing RF<br>transceiver<br>47<br>ANT_LOOP C_ANT<br>17 2<br>RHO/PTA_FREQ GPIO/PTA_FREQ 2G4ANT_IN<br>16 3<br>PRIORITY/PTA_STATUS GPIO/PTA_STATUS RF1<br>15<br>REQUEST/PTA_RF_ACT GPIO/PTA_RF_ACT 9<br>14 RF2<br>GRANT/PTA_TX_CONF GPIO/PTA_TX_CONF<br>50<br>19<br>GPIO/WIRQ GPIO/WIRQ<br>13<br>WUP GPIO/WUP<br>VDD_IO<br>To Host A | SILICON LABS<br>WFM200<br>82K 82K 82K 82K 82K<br>33<br>22 34<br>SDIO_CLK SDIO_CLK/SPI_CLK GPIO/FEM_PDET<br>33<br>23 29<br>SDIO_CMD e ee SDIO_CMD/SPI_MOSI GPIO/FEM_1<br>33<br>24 30<br>SDIO_DAT0 ys} | ft pO SDIO_DAT0/SPI_MISO GPIO/FEM_2<br>33<br>25 31<br>SDIO_DAT1 SDIO_DAT1/SPI_WIRQ GPIO/FEM_3<br>33<br>26 32<br>SDIO_DAT2 SDIO_DAT2/HIF_SEL GPIO/FEM_4<br>33<br>27 38<br>SDIO_DAT3 SDIO_DAT3/SPI_CSn GPIO/FEM_5<br>37<br>1 GPIO/FEM_6<br>1<br>0<br>Host or dedicated<br>circuits Delay<br>RESETn a 12 RESETn RESERVE_2 40<br>18 39<br>LP_CLK (32KHz) LP_CLK RESERVE_1<br>LUD<br>10 20 82<br>VDD_PA VDD VDD_IO<br>GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND<br>1 4 5 6 7 8 1 1 3 6 1 2 3 4 5 6 9 0 2 4 5 7 8<br>1 2 3 35 3 4 4 4 4 4 4 48 4 5 51 5 53 5 5 56 5 5<br>**----- End of picture text -----**<br>


## **Figure 5.1.  Typical Application Circuit SDIO Host Interface** 

## **Note:** 

- The SDIO pin pullup resistors are only required if the Host does not integrate internal pull-ups on SDIO signals as required by the SDIO standard. 

- Refer to UG395: WFM200S Hardware Design User's Guide for more details on the application circuit. 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  19 

WFM200S Data Sheet Typical Applications and Connections 

## **5.2  Typical Application Circuit for SPI Host Interface** 

|||||**VDD_PA**||||||**VDD**|**VDD**|**VDD**||||||**VDD_IO**|**VDD_IO**|**VDD_IO**|**VDD_IO**|**VDD_IO**|**VDD_IO**||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||~~TAN~~|||||||~~TAN~~|||||||||~~TAN~~|||||||||||||||||||||||
|||||**U1**<br>10||||||20|||||||||28||||||||||||||||||||||||
|**To Co-existing RF**<br>**transceiver**<br>**RHO/PTA_FREQ**|||17|GPIO/PTA_FREQ<br>VDD_PA|||||||VDD|||||||||VDD_IO|||||||||||||||ANT_LOOP<br>2G4ANT_IN||47<br>2|||||C_ANT|
|**PRIORITY/PTA_STATUS**|||16|GPIO/PTA_STATUS|||||||||||||||||||||||||||||||RF1||3||||||
|**GRANT/PTA_TX_CONF**<br>**REQUEST/PTA_RF_ACT**|||15<br>14|GPIO/PTA_RF_ACT<br>GPIO/PTA_TX_CONF|||||||||||||||||||||||||||||||RF2||9||||||
|||||||||||||||||||||||||||||||||||||||||||**50**|
|**GPIO/WIRQ**|||19|GPIO/WIRQ|||||||||||||||||||||||||||||||||||||||
|**WUP**|||13|GPIO/WUP<br>SILICON|||||||||||LABS||||||||||||||||||||||||||||
|**To Host**<br>**SPI_CLK**|||22|SDIO_CLK/SPI_CLK|||**WFM200**||||||||||||||||||||||||GPIO/FEM_PDET||||||34||||||
|**SPI_MOSI**|||23|SDIO_CMD/SPI_MOSI|||||||||||||||||||||||||||||||GPIO/FEM_1||29||||||
|**SPI_MISO**|||24|SDIO_DAT0/SPI_MISO|||||||||||||||||||||||||||||||GPIO/FEM_2||30||||||
|**SPI_IRQ**|||25|SDIO_DAT1/SPI_WIRQ|||||||||||||||||||||||||||||||GPIO/FEM_3||31||||||
|||**HIF_SEL**|26|SDIO_DAT2/HIF_SEL|||||||||||||||||||||||||||||||GPIO/FEM_4||32||||||
|**SPI_CSn**|||27|SDIO_DAT3/SPI_CSn|||||||||||||||||||||||||||||||GPIO/FEM_5||38||||||
||||||||||||||||||||||||||||||||||||GPIO/FEM_6||37||||||
|**Host or dedicated**<br>**circuits**<br>**RESETn**|||12|RESETn|||||||||||||||||||||||||||||||RESERVE_2||40||||||
|**LP_CLK (32KHz)**|||18|GND<br>GND<br>GND<br>GND<br>GND<br>GND<br>GND<br>GND<br>LP_CLK|GND||GND||GND||GND|GND||GND||GND||GND||GND||GND||GND||GND||GND||GND||GND||RESERVE_1<br>GND<br>GND<br>GND<br>GND<br>GND|||39||||||
|||||1<br>4<br>5<br>6<br>7<br>8<br>11<br>21<br>33<br>35<br>36<br>41<br>42<br>43<br>44<br>45<br>46<br>48<br>49<br>50<br>51<br>52<br>53<br>54<br>55<br>56<br>57<br>58<br>PULL|||||||||||||||||||||||||||||||||||||||



## **Figure 5.2.  Typical Application Circuit SPI Host Interface** 

## **Note:** 

- Refer to UG395: WFM200S Hardware Design User's Guide for more details on the application circuit. 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  20 

WFM200S Data Sheet Typical Applications and Connections 

## **5.3  Power States and Low-Power Modes** 

The current consumption on WFM200S is highly dynamic. It varies significantly depending on its activity, the activation of power-save modes, and when it is in shutdown. 

There are four main modes, each of them having several power states as detailed below. 

**Traffic mode** : The Traffic mode is defined as the mode when WFM200S is transmitting data, receiving data, or listening to the channel. If power save is not activated, the device stays in listen mode when there is no traffic. Current consumption is similar between receive and listen modes, while it is higher during transmission. 

**Power save modes** : When power save mode is activated, the device goes to a low-consumption mode and wakes-up periodically to listen to network beacons, so the device stays associated to the network. The current consumption, while receiving beacons, is as mentioned above for reception. 

There are three power-save/low-power consumption cases: 

1. Sleep: If a 32 KHz clock is available at LP_CLK input, then the device goes in sleep mode between reception of beacons. In this mode, most of the chip is turned off (including Xtal oscillator and host interface) to reduce the power consumption as much as possible. Given that the host interface is shut down in this mode, the host should assert the WUP pin to wake up the device before any communication with the host can be achieved. 

2. Sleep with XO on: If low-power clock is not available on LP_CLK or if the Xtal oscillator cannot be shut down, then the device goes in "Sleep with XO on" mode between reception of beacons. In this mode, the Xtal oscillator is active, so the typical consumption is higher. 

3. Snooze: If low-power clock is not available on LP_CLK then the device goes in snooze mode between reception of beacons. In this mode, a smaller part of the device is shut down and the XO is always enabled, so the typical consumption is higher. 

The sleep or snooze state/mode can also be achieved when not associated if the firmware decides there are no tasks to perform when the wake-up signal (pin GPIO/WUP) from host is low. 

**Shutdown mode:** Shutdown mode is the case where the transceiver is shut down and reaches the lowest power consumption while still being connected to the power supplies. Getting out of stand-by requires a complete start-up sequence triggered by RESETn pin being set from low to high. 

**Reset mode:** When RESETn is low, the consumption is typically 76 µA, mainly due to the RESETn pull-up resistor within the device. 

## **5.4  RF Connections** 

## **5.4.1  RF Ports** 

This device has two RF ports to allow antenna diversity using an internal switch. In applications with only one antenna, the un-used port should be terminated to ground through a resistor between 47 to 51 Ω. 

## **5.4.2  Antenna Diversity** 

In Applications where the main antenna is subject to obstruction or de-tuning, a second antenna can be attached to the alternate RF port by using the diversity antenna switch. The location of this second antenna should be such that both cannot be prevented from operating satisfactorily by the same event. A firmware feature can be invoked to determine which antenna has a better path to the remote Wi-Fi Device. 

## **5.4.3  Embedded Antenna Pins** 

For OPNs with embedded antenna, pin 2 (2G4ANT_IN) is the antenna input port. This has a reference impedance of 50 Ohms on nominal size host boards. The pin 3 (RF_1 port) is coupled to pin 2 when using the embedded antenna. Pin 47 is an intermediate connection to a loop trace on the host board. Follow UG395 for required dimensions of this trace when using the embedded antenna. When not using the embedded antenna, pin 2 and pin 47 are left floating. For OPNs without embedded antenna, pin 2 and pin 47 are disconnected internally. 

## **5.5  Clocks** 

## **5.5.1  High Frequency Crystal Oscillator** 

WFM200S has an internal 38.4MHz crystal used with the integrated oscillator circuitry to provide High Frequency Crystal Oscillator as the internal reference clock. A proprietary technique is used to calibrate and compensate for frequency errors. This achieves a frequency stability of +/-20ppm over the operating temperature range. 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  21 

WFM200S Data Sheet Typical Applications and Connections 

## **5.5.2  LP_CLK Port** 

A 32.768KHz clock source should be supplied to LP_CLK pin to enable the lowest power operation in power save modes. The frequency tolerance of this source affects wake up scheduling. 

## **5.6  Multi-Protocol Coexistence** 

In case an RF transceiver using the same 2.4 GHz band (e.g. Bluetooth, Zigbee, or Thread) is co-located with the WFM200S Wi-Fi transceiver, the Packet Traffic Arbitration (PTA) interface can be used to minimize mutual interference. In this case, PTA pins are connected to the other transceiver. The PTA interface is highly programmable and can use 1, 2, 3, or 4 pins upon configuration. WFM200S embeds a Packet Traffic Arbitration block in order to share the access to the RF medium between WLAN and another standard. 

Depending on manufacturer, PTA signal names can vary and the table below shows some alternative naming: 

**Table 5.1.  PTA Alternative Naming** 

|**WFM200S Pin Name**|**Alternative Names**|
|---|---|
|PTA_TX_CONF|GRANT, WL_ACTIVE, WL_DENY|
|PTA_RF_ACT|REQUEST, BT_ACTIVE|
|PTA_STATUS|PRIORITY, BT_STATUS|
|PTA_FREQ|FREQ, BT_FREQ|



PTA interface configuration is also achieved via the configuration file. 

See https://docs.silabs.com/wifi/wf200/additional-resources#documentation for more information regarding PTA and coexistence management on WFM200S, as well as AN1128 for EFR32BGx and EFR32MGx devices supporting BLE, Zigbee, and Thread. 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  22 

WFM200S Data Sheet Pin Descriptions 

## **6.  Pin Descriptions** 

**Figure 6.1.  WFM200S Pinout** 

**Table 6.1.  Pin Definitions** 

|**Pin #**|**Pin Name**|**Pin Type**|**Description / Default**|
|---|---|---|---|
|1|GND|GND||
|2|2G4ANT_IN|Analog|Embedded 2.4 Ghz antenna Port. To use the embedded antenna,<br>this pin should be connected to RF_1. For OPNs without an em-<br>bedded antenna, the pin is a No Connect|
|3|RF_1|Analog|RF_1 port + matching. Can be connected to 2G4ANT_IN pin.<br>If this pin is not used, it should be connected to GND through a 50<br>Ω resistor.|
|4-8|GND|GND||
|9|RF_2|Analog|RF_2 port + matching. Can be connected to a second antenna for<br>switched antenna diversity.<br>If this pin is not used, it should be connected to GND through a 50<br>Ω resistor.|
|10|VDD_PA|VDD|Power supply for the power amplifier|
|11|GND|GND||



**silabs.com** | Building a more connected world. 

Rev. 1.2  |  23 

WFM200S Data Sheet Pin Descriptions 

|**Pin #**|**Pin Name**|**Pin Type**|**Description / Default**|
|---|---|---|---|
|12|RESETn|Input|Reset pin, active low|
|13|GPIO/WUP|I/O|This pin should be used to wake-up the chip while in power-save<br>mode using LP_CLK. If not used, the pin can be used as a GPIO|
|14|GPIO/PTA_TX_CONF|I/O|As part of PTA interface, these pins can be used to manage co-<br>existence with another 2.4 GHz radio, or can be used as GPIO|
|15|GPIO/PTA_RF_ACT|I/O||
|16|GPIO/PTA_STATUS|I/O||
|17|GPIO/PTA_FREQ|I/O||
|18|LP_CLK|Input|Low Power clock input. This pin is typically connected to the 32<br>KHz clock. If not used, the pin should be connected to GND|
|19|GPIO/WIRQ|I/O|This pin can be used as an IRQ to host for SDIO, or can be used<br>as a GPIO.|
|20|VDD|VDD|Power supply for the digital and RF parts|
|21|GND|GND||
|22|SDIO_CLK/SPI_CLK|Input|Host interface: SDIO_CLK or SPI_CLK|
|23|SDIO_CMD/SPI_MOSI|I/O|Host interface: SDIO_CMD or SPI_MOSI|
|24|SDIO_DAT0/SPI_MISO|I/O|Host interface: SDIO_DAT0 or SPI_MISO|
|25|SDIO_DAT1/SPI_WIRQ|I/O|Host interface: SDIO_DAT1 or WIRQ|
|26|SDIO_DAT2/HIF_SEL|I/O|Host interface selection: Used to select the host interface during<br>RESETn rising edge. If Low, selects SPI interface. When High,<br>selects SDIO interface and this pin becomes SDIO_DAT2|
|27|SDIO_DAT3/SPI_CSn|I/O|Host interface: SDIO_DAT3 or SPI_CSn|
|28|VDD_IO|VDD|Power supply for I/Os|
|29|GPIO|I/O|These pins can be used for GPIO.|
|30|GPIO|I/O||
|31|GPIO|I/O||
|32|GPIO|I/O|This pin can be used for dynamic control of an external Power<br>Amplifier, otherwise this can be used as GPIO.|
|33|GND|GND||
|34|GPIO|I/O or Analog|This pin can be used as a GPIO|
|35,36|GND|GND||
|37|GPIO|I/O|These pins can be used for GPIO.|
|38|GPIO|I/O||
|39|RESERVE_1|N/A|Reserved. For normal operation, this pin must be grounded.|
|40|RESERVE_2|N/A|Reserved. This pin should be left unconnected.|
|41-46|GND|GND||
|47|ANT_LOOP|Analog|To use the embedded antenna, this pin should be connected to<br>ground through the embedded antenna loop capacitor. For OPNs<br>without the embedded antenna, this pin should be a No Connect.|
|48-58|GND|GND||



**silabs.com** | Building a more connected world. 

Rev. 1.2  |  24 

WFM200S Data Sheet Package Outline 

## **7.  Package Outline** 

**Figure 7.1.  WFM200S Package Outline** 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  25 

WFM200S Data Sheet Package Outline 

## **Table 7.1.  Package Outline Dimensions (in mm)** 

|**Dimension**|**MIN**|**NORM**|**MAX**|
|---|---|---|---|
|A|1.20|1.30|1.40|
|A1|0.26|0.30|0.34|
|A2|0.95|1.00|1.05|
|b|0.27|0.32|0.37|
|D|6.50 BSC|||
|e|0.50 BSC|||
|E|6.50 BSC|||
|L|0.43|0.48|0.53|
|L1|0.11|0.16|0.21|
|L2|0.34|0.39|0.44|
|L3|0.24|0.29|0.34|
|L4|0.14|0.19|0.24|
|L5|0.62|0.67|0.72|
|||||
|**Dimensions**|**MIN**|**MAX**|**NORM**|
|aaa|0.10|||
|bbb|0.10|||
|ccc|0.10|||
|ddd|0.10|||
|eee|0.10|||



**silabs.com** | Building a more connected world. 

Rev. 1.2  |  26 

WFM200S Data Sheet Package Outline 

**Pad Number Pad Coord (X,Y) Pad Size (X,Y) Pad Number Pad Coord (X,Y) Pad Size (X,Y)** 

Note: These coordinates correspond to the BOTTOM view. Please refer to UG395: WFM200S Hardware Design User's Guide for the stencil design. 

|**Pad Number**|**Pad Coord (X,Y)**|**Pad Coord (X,Y)**|**Pad Size (X,Y)**|**Pad Size (X,Y)**|**Pad Number**|**Pad Coord (X,Y)**|**Pad Coord (X,Y)**|**Pad Size (X,Y)**|**Pad Size (X,Y)**|
|---|---|---|---|---|---|---|---|---|---|
|Note: These coordinates correspond to the BOTTOM view. Please refer to UG395: WFM200S Hardware Design User's Guide for the<br>stencil design.||||||||||
|_1_|2.850|1.300|0.480|0.320|_30_|-2.850|2.300|0.480|0.320|
|_2_|2.850|0.800|0.480|0.320|_31_|-2.850|2.800|0.480|0.320|
|_3_|2.850|0.300|0.480|0.320|_32_|-2.250|2.850|0.320|0.480|
|_4_|2.850|-0.200|0.480|0.320|_33_|-1.750|2.850|0.320|0.480|
|_5_|2.850|-0.700|0.480|0.320|_34_|-1.250|2.850|0.320|0.480|
|_6_|2.850|-1.200|0.480|0.320|_35_|-0.750|2.850|0.320|0.480|
|_7_|2.850|-1.700|0.480|0.320|_36_|-2.250|1.250|0.320|0.480|
|_8_|2.850|-2.200|0.480|0.320|_37_|-1.750|1.250|0.320|0.480|
|_9_|2.850|-2.700|0.480|0.320|_38_|-1.250|1.250|0.320|0.480|
|_10_|2.250|-2.850|0.320|0.480|_39_|-0.750|1.250|0.320|0.480|
|_11_|1.750|-2.850|0.320|0.480|_40_|-0.250|1.250|0.320|0.480|
|_12_|1.250|-2.850|0.320|0.480|_41_|0.250|1.250|0.320|0.480|
|_13_|0.750|-2.850|0.320|0.480|_42_|0.750|1.250|0.320|0.480|
|_14_|0.250|-2.850|0.320|0.480|_43_|1.250|1.250|0.320|0.480|
|_15_|-0.250|-2.850|0.320|0.480|_44_|1.750|1.250|0.320|0.480|
|_16_|-0.750|-2.850|0.320|0.480|_45_|2.250|1.250|0.320|0.480|
|_17_|-1.250|-2.850|0.320|0.480|_46_|-0.070|2.900|0.480|0.320|
|_18_|-1.750|-2.850|0.320|0.480|_47_|2.850|2.900|0.480|0.320|
|_19_|-2.250|-2.850|0.320|0.480|_48_|-0.070|1.900|0.480|0.320|
|_20_|-2.850|-2.700|0.480|0.320|_49_|2.850|1.900|0.480|0.320|
|_21_|-2.850|-2.200|0.480|0.320|_50_|-1.200|0.270|0.670|0.670|
|_22_|-2.850|-1.700|0.480|0.320|_51_|0.000|0.270|0.670|0.670|
|_23_|-2.850|-1.200|0.480|0.320|_52_|1.200|0.270|0.670|0.670|
|_24_|-2.850|-0.700|0.480|0.320|_53_|-1.200|-0.800|0.670|0.670|
|_25_|-2.850|-0.200|0.480|0.320|_54_|0.000|-0.800|0.670|0.670|
|_26_|-2.850|0.300|0.480|0.320|_55_|1.200|-0.800|0.670|0.670|
|_27_|-2.850|0.800|0.480|0.320|_56_|-1.200|-1.870|0.670|0.670|
|_28_|-2.850|1.300|0.480|0.320|_57_|0.000|-1.870|0.670|0.670|
|_29_|-2.850|1.800|0.480|0.320|_58_|1.200|-1.870|0.670|0.670|



**silabs.com** | Building a more connected world. 

Rev. 1.2  |  27 

WFM200S Data Sheet Package Outline 

## **Note:** 

- The dimensions in parenthesis are reference 

- All dimensions in millimeters (mms) 

- Unless otherwise specified tolerances are: 

   - Decimal: 

      - X.X = ±0.1 

      - X.XX = ±0.05 

      - X.XXX=±0.03 

   - Angular: ±0.1 (In Deg) 

- Hatching lines means package shielding area 

- Pad coordinates located from package center (0,0) 

   - Dimensioning and Tolerance per ANSI Y14.5M-1994 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  28 

WFM200S Data Sheet Land Pattern 

## **8.  Land Pattern** 

**Figure 8.1.  WFM200S Land Pattern** 

**Table 8.1.  PCB Land Pattern** 

|**Dimension**|**mm**|
|---|---|
|b|0.32|
|D1|5.50|
|D2|4.77|
|D3|3.70|
|D4|2.63|
|D5|1.65|
|D6|4.00|
|D7|0.05|
|eD1|1.00|
|eD2|0.60|
|eD3|0.15|
|e|0.50|



**silabs.com** | Building a more connected world. 

Rev. 1.2  |  29 

WFM200S Data Sheet Land Pattern 

|**Dimension**|**mm**|
|---|---|
|E1|5.70|
|E2|5.10|
|E3|2.92|
|E4|2.85|
|E5|1.65|
|E6|4.50|
|E7|2.40|
|E8|1.20|
|E9|4.50|
|L|0.48|
|L1|0.67|
|eE1|0.60|
|eE2|0.60|



## **Notes:** 

1. General 

   - a. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05mm is assumed. b. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification. 

2. Stencil Design 

   - a. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release. 

   - b. The stencil thickness should be 0.100mm (4 mils). 

   - c. The stencil aperture to land pad size recommendation is 80% paste coverage. 

The above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different parameters and fine tune their SMT process as required for their application and tooling. 

**Note:** Recommendations regarding WFM200 handling and manufacturing are provided in AN1223: LGA Manufacturing Guidance. 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  30 

WFM200S Data Sheet Top Marking 

## **9.  Top Marking** 

**Figure 9.1.  WFM200S Top Marking** 

**Table 9.1.  Top Marking Definition** 

|**OPN**|**Line 1 Marking**|**Line 2 Marking**|**Line 3 Marking**|
|---|---|---|---|
|WFM200S022XNA3|WFM200SA|200022XNA3|See note below|
|WFM200SS22XNA3|WFM200SA|200S22XNA3|See note below|
|WFM200S022XNN3|WFM200SN|200022XNN3|See note below|
|WFM200SS22XNN3|WFM200SN|200S22XNN3|See note below|
|**Note:**YY = Year. WW = Work Week||||



**silabs.com** | Building a more connected world. 

Rev. 1.2  |  31 

WFM200S Data Sheet Tape and Reel Specifications 

## **10.  Tape and Reel Specifications** 

## **10.1  Tape and Reel Packaging** 

This section contains information regarding the tape and reel packaging for the WFM200S Module. 

## **10.2  Reel and Tape Specifications** 

- Reel material: Polystyrene (PS) 

- Reel diameter: 13 inches (330 mm) 

- Number of modules per reel: 1000 pcs 

- Disk deformation, folding whitening and mold imperfections: Not allowed 

- Disk set: consists of two 13 inch (330 mm) rotary round disks and one central axis (100 mm) 

- Antistatic treatment: Required 

• Surface resistivity: 10[4] - 10[9] Ω/sq. 

**Figure 10.1.  Reel Dimensions - Side View** 

**Table 10.1.  Reel Dimensions** 

|**Symbol**|**Dimensions [mm]**|
|---|---|
|W0|32.5 ± 0.3|
|W1|37.1 ± 1.0|



**silabs.com** | Building a more connected world. 

Rev. 1.2  |  32 

WFM200S Data Sheet Tape and Reel Specifications 

**Figure 10.2.  Cover tape information** 

**Table 10.2.  Cover Tape Dimensions** 

|**Symbol**|**Dimensions [mm]**|
|---|---|
|Thickness (T)|0.061|
|Width (W)|25.5 + 0.2|



**==> picture [130 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 10.3.  Tape information<br>**----- End of picture text -----**<br>


**silabs.com** | Building a more connected world. 

Rev. 1.2  |  33 

WFM200S Data Sheet Tape and Reel Specifications 

## **10.3  Orientation and Tape Feed** 

The user direction of feed, start and end of tape on reel and orientation of the Modules on the tape are shown in the figures below. 

**Figure 10.4.  Module Orientation and Feed Direction** 

## **10.4  Tape and Reel Box Dimensions** 

**Figure 10.5.  Tape and Reel Box Dimensions** 

**Table 10.3.  Tape and Reel Box Dimensions** 

|**Symbol**|**Dimensions [mm]**|
|---|---|
|W2|368|
|W3|338|
|W4|72|



## **10.5  Moisture Sensitivity Level** 

Reels are delivered in packing which conforms to MSL3 (Moisture Sensitivity Level 3) requirements. 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  34 

WFM200S Data Sheet Software Reference 

## **11.  Software Reference** 

This section gives a short overview of the software involved to run applications based on this device. The firmware running in the WFM200S allows it to be used at Lower MAC level (in split MAC) or at the Upper Mac level (in Full MAC). 

## **11.1  Host and Device Software** 

This device is intended to be used as a Network Co-Processor (NCP) which means that it requires a host processor to run the application. Depending on architecture choices based on required throughput, host memory size and power, the MAC layer can be split between WFM200S and its host or fully ran in WFM200S. 

## **11.1.1  Split MAC** 

The so-called split MAC is the case where WFM200S runs the Lower MAC section while the host processor runs the Upper MAC. This is a use case that typically fits the Linux application as MAC802.11 is provided with Linux 

For such an application, Silicon Labs provides the embedded firmware implementing the Lower MAC as well as needed configuration tasks. Sample core Linux drivers are available for a variety of platforms. 

The figure below shows the typical software architecture in Split MAC implementations. 

**Figure 11.1.  Split MAC Implementation** 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  35 

WFM200S Data Sheet Software Reference 

## **11.1.2  Full MAC** 

In this scenario, both the lower MAC and upper MAC are running in WFM200S. The WFM200S contains a WPA/WPA2 personal supplicant, allowing it to handle full MAC responsibilities without utilizing the host MCU. The host receives an IP packet and implements all stack layers necessary above it. 

The figure below shows the typical software architecture in Full MAC implementations. 

**Figure 11.2.  Full MAC Implementation** 

**Note:** The WPA supplicant on WFM200S does not support WPA enterprise. If WPA-enterprise is required, then it should be implemented above the IP stack in the host MCU software. 

## **11.1.3  Software Documentation** 

Documentation required for software implementation is available at https://docs.silabs.com/. 

## **11.2  Security** 

The WFM200S implements several security features as listed below. 

## **11.2.1  Secure Device** 

WFM200S disables access to all debug ports. 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  36 

WFM200S Data Sheet Software Reference 

## **11.2.2  Secure Boot** 

Secure Boot includes several features related to boot and firmware security. Firmware authentication and encryption do not have any impact on host software, whereas firmware roll back prevention requires more flexibility and is managed by each customer through software. 

- Firmware authentication: The downloaded firmware is authenticated such that only Firmware provided by Silicon Labs can run in WFM200S. 

- Firmware encryption: The downloaded firmware is encrypted when generated by Silicon Labs and is decrypted inside WFM200S during firmware download. 

- Firmware roll back prevention: If a security threat is discovered, Silicon Labs has the ability to increment in its firmware an anti-rollback tag. This can be used by the customer to prevent the part from starting with a firmware having a tag lower than a specified one. This mechanism is managed by each customer on a case-by-case need. 

## **11.2.3  Secure Link (WFM200SS only)** 

Secure Link refers to the capability to have encrypted SPI/SDIO communication between the host and WFM200S. This feature requires the host and WFM200S to exchange a key based on a shared secret stored on both sides nonvolatile secured memories and programmed at the end product manufacturing stage. The encrypted interface uses a Diffie-Hellman algorithm key exchanges on a per session/per device basis. As a result, a given link is secured uniquely on a given device, and keys are regenerated on a power cycle. 

There are 3 possible cases for secure link: 

- Secure link is not used: In this scenario, the part does not encrypt any communication with the host. 

- Secure link is temporary enabled: Secure Link can be activated through software, with a software key which is not stored in WFM200S. Doing this allows to assess the performance and consumption impacts of secure link. In this mode, Secure Link is achieved as long as the part is not reset. The next restart of WFM200S will make it start in Non-Secure Link mode. 

- Permanent Secure Link: This mode is activated by software and the key exchanged is permanently stored in WFM200S non-volatile memory. Once configured in this mode, WFM200S only understands host interface messages which have been encrypted with the stored key. 

Once a secure link has been established, the host can choose to only encrypt certain API messages between the host and the WFM200S to reduce the power and latency overhead of encryption. 

## **11.3  Startup, Sleep and Shutdown** 

## **11.3.1  Power On, Reset, and Boot** 

When RESETn pin is set HIGH, WFM200S is getting out of its reset mode. All supply voltages should be settled within the operational range before the rising edge of RESETn pin. Then the boot sequence can be initiated by the host software with the following sequence: 

- Some registers describing the required configuration before firmware download are written by the driver. 

- The driver initiates the boot. 

- The driver downloads the embedded firmware into WFM200S. 

- The driver configures WFM200S upon the hardware platform and requested features with a dedicated configuration file. 

## **11.3.2  Sleep and Snooze Modes** 

The sleep or snooze modes are reached when power-save mode has been enabled on the WFM200S. These modes highly reduce power consumption while maintaining all configuration and context, so that the device can be quickly back to normal operation. A WFM200S driver command is used to indicate that the driver wants the part to go to power-save. However it is the firmware on WFM200S that decides when it switches into sleep mode based on Wi-Fi activity. 

The part wake-up is achieved by asserting the GPIO/WUP pin. 

The sleep mode requires a 32 KHz clock to be provided on LP_CLK pin. 

In case a 32 KHz clock is not available, the part can be set in a snooze mode which is functionally equivalent but draws more current. 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  37 

WFM200S Data Sheet Software Reference 

## **11.3.3  Shutdown Mode** 

The shutdown mode can be used if the Wi-Fi feature is not needed for a long period of time. This mode achieves the lowest current consumption on the device but requires a full power-up reset and boot sequence to come back to the operational mode. This mode should be initiated by the host. 

**Note:** A similar behavior could be achieved by asserting RESETn pin low, but would draw more current. 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  38 

WFM200S Data Sheet Certifications 

## **12.  Certifications** 

This section details certification status of the module in various regions. 

The address for the module manufacturer and certification applicant is: 

SILICON LABORATORIES FINLAND OY Alberga Business Park, Bertel Jungin aukio 3, 02600 Espoo, Finland 

Refer to AN1048 for more information related to Regulatory Certifications. 

## **12.1  Qualified External Antenna Types** 

This device has been certified with an embedded antenna with an external loop as well as external dipole whip antennas connected to either RF port or both. The required antenna impedance is 50 Ω. 

## **Table 12.1.  Qualified Antennas for WFM200S** 

|**Antenna Type**|**Maximum Gain**|
|---|---|
|Connectorized Coaxial Dipole|4.7 dBi|



Any antenna of the same general type and of equal or less directional gain as listed in the above table can be used in the regulatory areas that have a full modular radio approval (USA, Canada, Korea, Japan) as long as spot-check testing is performed to verify that no performance changes compromising compliance have been introduced. In countries applying the ETSI standards, like the EU countries, the radiated emissions are always tested with the end-product and the antenna type is not critical, but antennas with higher gain may violate some of the regulatory limits. 

If an antenna of a different type (such as a patch antenna) with a gain less than or equal to 4.7 dBi is needed, it can be added as a permissive change, requiring some radiated emission testing. Antenna types with more gain than 4.7 dBi may require a fully new certification. Since the exact permissive change procedure is chosen on a case by case basis, please consult your test house, for example while performing with them the EMC testing of the end-product. 

The use of this certified module requires all applications to adhere to UG395: WFM200 Hardware Design User's Guide. 

## **12.2  CE and UKCA - EU and UK** 

The WFM200SA and WFM200SN modules have been tested against the relevant harmonized/designated standards and are in conformity with the essential requirements and other relevant requirements of the Radio Equipment Directive (RED) (2014/53/EU) and of the Radio Equipment Regulations (RER) (S.I. 2017/1206). 

Please notice that every end-product integrating a WFM200SA or WFM200SN module will need to perform the radio EMC tests on the whole assembly, according to the ETSI 301 489-x relevant standards. 

Furthermore, it is ultimately the responsibility of the manufacturer to ensure the compliance of the end-product as a whole. The specific product assembly is likely to have an impact to RF radiated characteristics, when compared to the bare module. Hence, manufacturers should carefully consider RF radiated testing with the final product assembly, especially taking into account the gain of the external antenna if any, and the possible deviations in the PSD, EIRP and spurious emissions measurements, as defined in the ETSI 300 328 standard. 

The modules are entitled to carry the CE and UKCA Marks, and a formal Declaration of Conformity (DoC) is available at the product web page which is reachable starting from https://www.silabs.com/. 

To ensure full conformity for CE, the end-product manufacturer is supposed to set the CCA to Absolute Mode, and to make sure the max RF TX power levels are configured appropriately, primarily based on the system antenna gain (the UG395: WFM200 Hardware Design User's Guide comes with a table showing configuration examples of this.) 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  39 

WFM200S Data Sheet Certifications 

## **12.3  FCC - USA** 

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 

1. This device may not cause harmful interference, and 

2. This device must accept any interference received, including interference that may cause undesirable operation. 

Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment. 

## **FCC RF Radiation Exposure Statement:** 

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure compliance. This transmitter meets both portable and mobile requirements in accordance to the limits exposed in the RF Exposure Analysis. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. 

## **OEM Responsibilities to comply with FCC Regulations:** 

OEM integrator is responsible for testing their end-product for any additional compliance requirements needed with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). Additionally, investigative measurements and spot checking are strongly recommended to verify that the full system compliance is maintained when the module is integrated, in accordance to the "Host Product Testing Guidance" in FCC's KDB 996369 D04 Module Integration Guide V01. 

- See the table in the Section 12.7 Locating the Module Close to Human Body for information on the minimum spacing between the module and the human body. This transmitter meets the Portable requirements at distances equal or above 23 mm. 

- The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter product procedures. 

## **Important Note:** 

In the event that these conditions cannot be met, then for the FCC authorization to remain valid the final product will have to undergo additional testing to evaluate the RF exposure, and a permissive change will have to be applied with the help of the customer's own Telecommunication Certification Body. 

## **End Product Labeling** 

The outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: 

## **"Contains Transmitter Module FCC ID: QOQWFM200"** 

Or 

## **"Contains FCC ID: QOQWFM200"** 

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  40 

WFM200S Data Sheet Certifications 

## **12.4  ISED - Canada** 

## **ISED** 

This radio transmitter (WFM200S) has been approved by _Innovation, Science and Economic Development Canada (ISED Canada, formerly Industry Canada_ ) to operate with the antenna types listed above, with the maximum permissible gain indicated. Antenna types not included in this list, having a gain greater than the maximum gain listed, are strictly prohibited for use with this device. 

This device complies with ISED’s license-exempt RSS standards. Operation is subject to the following two conditions: 

1. This device may not cause interference; and 

2. This device must accept any interference, including interference that may cause undesired operation of the device 

**RF Exposure Statement** 

Exemption from routine SAR evaluation limits are given in RSS-102 Issue 5. 

See the Section 12.6 "Locating the Module Close to Human Body" for details on minimum spacing between the module and the human body 

In other words, RF exposure or SAR evaluation is not required when the separation distance is same or more than stated above. If the separation distance is less than stated above the OEM integrator is responsible for evaluating the SAR when using the module at its highest transmission power. 

## **OEM Responsibilities to comply with IC Regulations** 

The WFM200S modules have been certified for integration into products only by OEM integrators under the following conditions: 

- The antenna(s) must be installed such that a minimum separation distance as stated above is maintained between the radiator (antenna) and all persons at all times. For Portable use cases, RF exposure or SAR evaluation is not required when the separation distances from the human body are equal or above 40 mm. 

- The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter. 

As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). 

## **IMPORTANT NOTE** 

In the event that these conditions cannot be met, then for the ISED authorization to remain valid the final product will have to undergo additional testing to evaluate the RF exposure, and a permissive change will have to be applied with the help of the customer's own Telecommunication Certification Body. 

## **End Product Labeling** 

The outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following: 

## “ **Contains Transmitter Module IC: 5123A-WFM200** ” 

## or 

## “ **Contains IC: 5123A-WFM200”** 

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  41 

WFM200S Data Sheet Certifications 

## **ISED (Français)** 

ISED a approuvé l’utilisation de cet émetteur radio (WFM200S) en conjonction avec des antennes de type dipolaire à 2.14dBi ou de son antenne intégrée. L’utilisation de tout autre type d’antenne avec ce composant est proscrite. 

Ce composant est conforme aux normes RSS, exonérées de licence d'ISED. Son mode de fonctionnement est soumis aux deux conditions suivantes: 

1. Ce composant ne doit pas générer d’interférences. 

2. Ce composant doit pouvoir être soumis à tout type de perturbation y compris celle pouvant nuire à son bon fonctionnement. 

**Déclaration d'exposition RF** 

L'exemption tirée des limites courantes d'évaluation DAS est donnée dans le document RSS-102 Issue 5. 

Reportez-vous à la Section 12.6 "Localisation du module près du corps humain" pour obtenir des informations sur l'espacement minimal entre le module et le corps humain.Pour les cas d'utilisation Portables, l'exposition aux fréquences radio ou l'évaluation du SAR n'est pas nécessaire lorsque les distances de séparation du corps humain sont égales ou supérieures à 40 mm. 

Pour les cas d'utilisation Portables, l'exposition aux fréquences radio ou l'évaluation du SAR n'est pas nécessaire lorsque les distances de séparation du corps humain sont égales ou supérieures à 40 mm 

La déclaration d’exposition RF ou l'évaluation DAS n'est pas nécessaire lorsque la distance de séparation est identique ou supérieure à celle indiquée ci-dessus. Si la distance de séparation est inférieure à celle mentionnées plus haut, il incombe à l'intégrateur OEM de procédé à une évaluation DAS. 

## **Responsabilités des OEM pour une mise en conformité avec le Règlement du Circuit Intégré** 

Le module WFM200S a été approuvé pour l'intégration dans des produits finaux exclusivement réalisés par des OEM sous les conditions suivantes: 

- L'antenne (s) doit être installée de sorte qu'une distance de séparation minimale indiquée ci-dessus soit maintenue entre le radiateur (antenne) et toutes les personnes avoisinante, ce à tout moment. 

- Le module émetteur ne doit pas être localisé ou fonctionner avec une autre antenne ou un autre transmetteur que celle indiquée plus haut. 

Tant que les deux conditions ci-dessus sont respectées, il n’est pas nécessaire de tester ce transmetteur de façon plus poussée. Cependant, il incombe à l’intégrateur OEM de s’assurer de la bonne conformité du produit fini avec les autres normes auxquelles il pourrait être soumis de fait de l’utilisation de ce module (par exemple, les émissions des périphériques numériques, les exigences de périphériques PC, etc.). 

## **REMARQUE IMPORTANTE** 

Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou co-implantation avec un autre émetteur), l'autorisation ISED n'est plus considérée comme valide et le numéro d’identification ID IC ne peut pas être apposé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera responsable de la réévaluation du produit final (y compris le transmetteur) et de l'obtention d'une autorisation ISED distincte. 

## **Étiquetage des produits finis** 

Le produit dans lequel le module est installé devra porter une étiquette faisant apparaitre la référence du module intégré. Dans un tel cas, sur le produit final doit se trouver une étiquette aisément lisible sur laquelle figurent les informations suivantes: 

## “ **Contient le module transmetteur IC: 5123A-WFM200** ” 

## ou 

## “ **Contient le circuit IC: 5123A-WFM200”** 

L'intégrateur OEM doit être conscient qu’il ne doit pas fournir, dans le manuel d’utilisation, d'informations relatives à la façon d'installer ou de d’enlever ce module RF ainsi que sur la procédure à suivre pour modifier les paramètres liés à la radio. 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  42 

WFM200S Data Sheet Certifications 

## **12.5  MIC - Japan** 

The WFM200S modules are certified in Japan with certification number 006-000781 

Since September 1, 2014 it is allowed (and highly recommended) that a manufacturer who integrates a radio module in their host equipment places the certification mark and certification number on the outside of the host equipment (same marking/number might also appear on the label of the radio module). The certification mark and certification number must be placed close to the text in the Japanese language which is provided below. This change in the Radio Law has been made in order to enable users of the combination of host and radio module to verify if they are actually using a radio device which is approved for use in Japan. 

Certification Text to be Placed on the Outside Surface of the Host Equipment: 

Translation of the text: 

_“This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under the Radio Law.”_ 

The "Giteki" mark shown in the following figures must be affixed to an easily noticeable section of the specified radio equipment. 

**Note:** Additional information may be required if the device is also subject to a telecom approval. 

**Figure 12.1.  GITEKI Mark and ID** 

**Figure 12.2.  Detail of GITEKI Mark** 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  43 

WFM200S Data Sheet Certifications 

## **12.6  KC - South Korea** 

The WFM200S modules have a RF certification for import and use in South-Korea. 

Certification number is: R-C-BGT-WFM200 

The maximum transmit power of the module is 15.1dBm (32.36mW), but due to the wide bandwidth of the communication channels, it still meets the limit of 10mW/MHz in the Korean regulations. 

Memory buffers and low-voltage circuits can withstand very high data rates. 

When integrating the RF-certified module, an end-product is automatically compliant to the local RF regulations and thus exempted from doing RF emission testing, as long as the recommended design guidance is followed, the approved antennas are used, and any additional transmit power backoff is implemented in accordance to the measurements and configurations seen in the test report. 

EMC testing, and any other relevant test, might still be required for the full compliance of the end-product. 

## **12.7  Locating the Module Close to Human Body** 

When using the module in an application where the radio is located close to human body, the human RF exposure must be evaluated. FCC, ISED, and CE all have different standards for evaluating the RF exposure, and because of this, each standard will require a different minimum separation distance between the module and human body. Certification of WFM200S allows for the minimum separation distances detailed in Table 12.2 Minimum Separation Distances for SAR Evaluation Exemption on page 44 in Portable use cases (less than 20 cm from human body). The module is approved for the Mobile use case (more than 20 cm) without any need for RF exposure evaluation. 

**Table 12.2.  Minimum Separation Distances for SAR Evaluation Exemption** 

|**Certification**|**WFM200S with embedded antenna**|**WFM200S with external reference dipole**<br>**antenna**|
|---|---|---|
|FCC|23 mm|23 mm|
|ISED|40 mm|40 mm|
|CE|The RF exposure must always be evaluated using the end-product when transmitting<br>with power levels higher than 20 mW = 13 dBm.||



For FCC and ISED, using the module in end products where the separation distance is smaller than those listed above is allowed but requires evaluation of the RF exposure in the final assembly and applying for a _Class 2 Permissive Change_ or _Change of ID_ to be applied to the existing FCC/ISED approvals of the module. For CE, RF exposure must be evaluated using the end-product in all cases. 

**Note:** Placing the module in touch or very close to the human body will have a negative impact on the efficiency of the antenna thus reducing range. 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  44 

WFM200S Data Sheet Revision History 

## **13.  Revision History** 

## **Revision 1.2** 

December 2021 

- Updated certifications to reflect UK specifics: Section 1. Features List and Section 12.2 CE and UKCA - EU and UK 

- Updated Section 5.1 Typical Application Circuit for SDIO Host Interface 

- Updated Section 5.2 Typical Application Circuit for SPI Host Interface 

## **Revision 1.1** 

## November 2020 

- Updated Figure 8.1 WFM200S Land Pattern on page 29 

## **Revision 1.0** 

September 2020 

- Updated Table 2.1 WFM200S Ordering Information (R indicates Full Reel) on page 3 

- Updated Table 9.1 Top Marking Definition on page 31 

December 2019 

- Updated Section 4.4 RF Transmitter General Characteristics and Section 4.4.1 RF Transmitter Characteristics 

- Updated Section 8. Land Pattern 

- Updated Table 4.1 Absolute Maximum Ratings on page 8 

- Added Section 12.5 MIC - Japan and Section 12.6 KC - South Korea 

- Added reference to AN1048 in 12. Certifications section 

## **Revision 0.51** 

November 2019 

- Minor updates to Certifications section 

- Correction to block diagrams 

## **Revision 0.5** 

September 2019 

- Updated Sections 2,3, and 5 with new text 

- Minor specification updates in section 4 

## **Revision 0.32** 

August 2019 

- Added Certifications section 

## **Revision 0.31** 

August 2019 

- Updated pin description for pin 47 

## **Revision 0.3** 

July 2019 

- Updated Pin Descriptions, Package Outline and Land Pattern sections with new pinout 

**silabs.com** | Building a more connected world. 

Rev. 1.2  |  45 

**==> picture [358 x 21] intentionally omitted <==**

**----- Start of picture text -----**<br>
IoT Portfolio Quality Support & Community<br>www.silabs.com/products www.silabs.com/quality www.silabs.com/community<br>**----- End of picture text -----**<br>


## **Disclaimer** 

Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and “Typical” parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the information supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A “Life Support System” is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications. **Note: This content may contain offensive terminology that is now obsolete. Silicon Labs is replacing these terms with inclusive language wherever possible. For more information, visit  www.silabs.com/about-us/inclusive-lexicon-project** 

## **Trademark Information** 

Silicon Laboratories Inc.[®] , Silicon Laboratories[®] , Silicon Labs[®] , SiLabs[®] and the Silicon Labs logo[®] , Bluegiga[®] , Bluegiga Logo[®] , EFM[®] , EFM32[®] , EFR, Ember[®] , Energy Micro, Energy Micro logo and combinations thereof, “the world’s most energy friendly microcontrollers”, Redpine Signals[®] , WiSeConnect , n-Link, ThreadArch[®] , EZLink[®] , EZRadio[®] , EZRadioPRO[®] , Gecko[®] , Gecko OS, Gecko OS Studio, Precision32[®] , Simplicity Studio[®] , Telegesis, the Telegesis Logo[®] , USBXpress[®] , Zentri, the Zentri logo and Zentri DMS, Z-Wave[®] , and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective holders. 

**46** 

**Silicon Laboratories Inc. 400 West Cesar Chavez**
Updated at March 31, 2026
Silicon Labs is a recognized industry leader in secure, intelligent wireless technology and precision timing solutions. Renowned for driving innovation in the Internet of Things (IoT) and industrial automation, the company develops electronic components that deliver the performance, energy savings, and design simplicity required to build a seamlessly connected world. Our extensive portfolio of Silicon Labs components prominently features their robust wireless connectivity and timing products. This includes a comprehensive selection of Bluetooth modules and adaptors engineered for reliable, low-power communication in smart devices. Complementing these wireless offerings is a broad array of precision timing devices, particularly standard and advanced MEMS oscillators, which are critical for ensuring exact synchronization and stable frequency control in demanding circuit designs. To support a wider spectrum of networking and communication requirements, the lineup also encompasses versatile WLAN modules and USB adaptors. Additionally, engineers will find highly integrated sub-2.4GHz ISM band RF transceivers, available as both standalone integrated circuits and complete RF modules, providing exceptional range and signal resilience for complex wireless deployments.
About Novapart

Novapart is a B2B electronic component broker specialising in stock shortages and cost reduction. We source hard-to-find parts and identify compliant alternatives across a catalogue of 410,000+ components from 500+ manufacturers.
Learn more →
Stock Shortage Specialist

When a component is unavailable, discontinued or has an unacceptable lead time, we tap into our network of vetted European and Asian distributors to source what you need — without compromising on quality or traceability.
Request a quote →
Compliant Alternatives

We identify pin-to-pin, electrically equivalent substitutes that meet the same certifications (RoHS, AEC-Q100, REACH) as your original specification — validated against datasheets, not just part numbers. Often at a lower cost.
BOM Analysis service →