VS-3C40CP07L-M3

**VS-3C40CP07L-M3** 

www.vishay.com 

## Vishay Semiconductors 

## **650 V Power SiC Gen 3 Merged PIN Schottky Diode, 2 x 20 A** 

**==> picture [204 x 113] intentionally omitted <==**

**----- Start of picture text -----**<br>
Base  common<br>cathode<br>2<br>1<br>2 1        2         3<br>Anode         Anode<br>3<br>TO-247AD 3L<br>Common<br>Cathode<br>**----- End of picture text -----**<br>


## **FEATURES** 

- Majority carrier diode using Schottky technology on SiC wide band gap material 

- Improved VF and efficiency by thin wafer technology 

- Positive VF temperature coefficient, for easy paralleling 

- Virtually no recovery tail and no switching losses 

- Temperature invariant switching behavior 

- 175 °C maximum operating junction temperature 

- MPS structure for high ruggedness to forward current surge events 

- Meets JESD 201 class 1A whisker test 

## **LINKS TO ADDITIONAL RESOURCES** 

3D Models Application Notes 

- Solder Bath temperature 275 °C maximum, 10 s per JESD 22-B106 

- Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 ~~oO~~ 

## **DESCRIPTION / APPLICATIONS** 

Wide band gap SiC based 650 V Schottky diode, designed for high performance and ruggedness. 

## **PRIMARY CHARACTERISTICS** 

|**PRIMARY CHARACTERISTICS**|**PRIMARY CHARACTERISTICS**|
|---|---|
|IF(AV)|2 x 20 A|
|VR|650 V|
|VFat IFat 25 °C, typ.|1.3 V|
|TJmax.|175 °C|
|IRat VRat 175 °C|9 μA|
|QC(VR= 400 V)|53 nC|
|Package|TO-247AD 3L|
|Circuit configuration|Common cathode|



Optimum choice for high speed hard switching and efficient operation over a wide temperature range, it is also recommended for all applications suffering from Silicon ultrafast recovery behavior. 

Typical applications include AC/DC PFC and DC/DC ultra high frequency output rectification in FBPS and LLC converters. 

## **MECHANICAL DATA** 

**Case:** TO-247AD 3L 

Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS-compliant **Terminals:** matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 **Mounting torque:** 10 in-lbs maximum 

**MAXIMUM RATINGS** (TA = 25 °C unless otherwise specified) ~~Ce Ce~~ **PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS** ~~a~~ Peak repetitive reverse voltage VRRM 650 V IF[(1)] TC = 136 °C (DC) Continuous forward current, per leg 20 A ~~EL~~ IF[(2)] TC = 145 °C (DC) ~~a~~ DC blocking voltage VDC 650 V Repetitive peak forward current IFRM TC = 25 °C, f = 50 Hz, square wave, DC = 25 % 65 Non-repetitive peak forward surge current, per leg IFSM TC = 25 °C, tp = 10 ms, half sine wave 110 A ~~|nn a~~ TC = 110 °C, tp = 10 ms, half sine wave ~~oe~~ 104 Ptot[(1)] TC = 25°C 125 W TC = 110 °C 54 Power dissipation, per leg Ptot[(2)] TC = 25°C 166 W ~~eee~~ TC = 110 °C 72 TC = 25°C 60.5 ~~|~~ I[2] t value, per leg  i[2] dt TC = 110 °C ~~—_|~~ 54 A[2] s ~~a~~ Operating junction and storage temperatures TJ[(2)] , TStg -55 to +175 °C **Notes** (1) Based on maximum Rth 

> (2) Based on typical Rth 

> (3) The heat generated must be less than the thermal conductivity from junction-to-ambient: dPD/dTJ < 1/RθJA 

Revision: 10-Apr-2024 

Document Number: 97044 

**1** 

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**VS-3C40CP07L-M3** 

www.vishay.com 

## Vishay Semiconductors 

## **ELECTRICAL SPECIFICATIONS** (TJ = 25 °C unless otherwise specified) 

|**ELECTRICAL SPECIFICATIONS**(TJ= 25 °C unless otherwise specified)|**ELECTRICAL SPECIFICATIONS**(TJ= 25 °C unless otherwise specified)|**ELECTRICAL SPECIFICATIONS**(TJ= 25 °C unless otherwise specified)|**ELECTRICAL SPECIFICATIONS**(TJ= 25 °C unless otherwise specified)|**ELECTRICAL SPECIFICATIONS**(TJ= 25 °C unless otherwise specified)|**ELECTRICAL SPECIFICATIONS**(TJ= 25 °C unless otherwise specified)|**ELECTRICAL SPECIFICATIONS**(TJ= 25 °C unless otherwise specified)|
|---|---|---|---|---|---|---|
|**PARAMETER**|**SYMBOL**|**TEST CONDITIONS**|**MIN.**|**TYP.**|**MAX.**|**UNITS**|
|Forward voltage, per leg|VF|IF= 20 A|-|1.3|1.5|V|
|||IF= 20 A, TJ= 150 °C|-|1.5|1.85||
|||IF= 20 A, TJ= 175 °C|-|1.6|-||
|Reverse leakage current, per leg|IR|VR= VRrated|-|1.3|100|μA|
|||VR= VRrated, TJ= 150 °C|-|5.5|250||
|||VR= VRrated, TJ= 175 °C|-|9|-||
|Total capacitance, per leg|C|VR= 1 V, f = 1 MHz|-|845|-|pF|
|||VR= 400 V, f = 1 MHz|-|82|-||
|Total capacitive charge, per leg|QC|VR= 400 V, f = 1 MHz|-|53|-|nC|



## **THERMAL - MECHANICAL SPECIFICATIONS** (TA = 25 °C unless otherwise specified) 

|**PARAMETER**||**SYMBOL**|**TEST CONDITIONS**|**MIN.**|**TYP.**|**MAX.**|**UNITS**|
|---|---|---|---|---|---|---|---|
|Thermal resistance, junction-to-case|per leg<br>per device|RthJC||-<br>-|0.9<br>0.45|1.2<br>0.6|°C/W<br>°C/W|
|Marking device|||||3C40CP07L|||



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**----- Start of picture text -----**<br>
70 10000<br>T J = 25 °C<br>60<br>T J = -55 °C<br>50<br>1000<br>40<br>30<br>100<br>20<br>TJ = 125 °C<br>10 T T JJ = 150 °C = 175 °C<br>0 10<br>0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0<br>VF - Forward Voltage Drop (V)<br>Fig. 1 - Typical Forward Voltage Drop Characteristics, Per Leg<br>Axis Title<br>10 10000<br>1 TJ = 175 °C<br>T J = 150 °C 1000<br>0.1<br>0.01<br>100<br>0.001 TJ = 125 °C<br>TJ = 25 °C<br>T J  = -55 °C<br>0.0001 10<br>0 100 200 300 400 500 600 700<br>VR - Reverse Voltage (V)<br> - Instantaneous Forward Current (A)IF<br> - Reverse Current (µA)<br>IR<br>**----- End of picture text -----**<br>


Fig. 1 - Typical Forward Voltage Drop Characteristics, Per Leg 

Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage, Per Leg 

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10000 10000<br>1000 1000<br>100 100<br>T J = 25 °C<br>f = 1.0 MHz<br>10 10<br>0.1 1 10 100 1000<br>VR - Reverse Voltage (V)<br>Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage, Per Leg<br>Axis Title<br>10000<br>1000<br>TJ = 25 °C<br>1000<br>TJ = 110 °C<br>100<br>100<br>10 10<br>0.01 0.1 1 10<br>tp (ms)<br>C - Junction Capacitance (pF)T<br> (A)<br>IFSM<br>**----- End of picture text -----**<br>


Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage, Per Leg 

Fig. 4 - Non-Repetitive Peak Forward Surge Current vs. Pulse Duration, Per Leg (Square Wave) 

**2** 

Revision: 10-Apr-2024 

Document Number: 97044 

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**VS-3C40CP07L-M3** 

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**----- Start of picture text -----**<br>
www.vishay.com Vishay Semiconductors<br>a [a]<br>Axis Title<br>10000<br>ee<br>PT PTT TPTET<br>1<br>IN FEIN FEU UIT TE<br>1000<br>ee a<br>0.1 pasa cua eat D  ATT = 0.5 LL<br>D = 0.2 100<br>D = 0.1<br>D = 0.05<br>PT A Pe D = 0.02D = 0.01 a<br>0.01 PAI PT TTT DC 1 10<br>0.00001 0.0001 0.001 0.01 0.1 1 10 100<br>t1 - Rectangular Pulse Duration (s)<br>1st line 2nd line<br> - Thermal Impedance<br>thJC Junction to Case (°C/W)<br>Z<br>**----- End of picture text -----**<br>


## Vishay Semiconductors 

Fig. 5 - Typical Thermal Impedance ZthJC Characteristics, Per Leg 

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160<br>140 ml D = 0.1 T<br>120 ae D = 0.2 D = tp/Tp/T/T r[y] tpp<br>100 PN<br>—<br>80 D = 0.3<br>~~<br>60 Po D = 0.5 YENWN<br>D = 0.7<br>40 TSN A<br>SEN DC<br>20<br>| | eA<br>0<br>po} SS<br>25 50 75 100 125 150 175<br>TC (°C)C (°C) (°C)<br>(peak) (A)IF F<br>IF F<br>**----- End of picture text -----**<br>


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20<br>140 ml D = 0.1 T 18 a<br>16<br>120 ae D = 0.2 D = tp/Tp/T/T r[y] tpp 14 a<br>1000<br>100 PN | | | | | TY<br>— 12 Py<br>80 D = 0.3 10<br>~~ a<br>60 Po D = 0.5 YENWN 8 A<br>D = 0.7 100 6<br>40 TSN A | | |[A TJ = 25 °C<br>4<br>SEN DC aaa<br>20<br>2<br>| | eA Ta. fev<br>0 10 0<br>po} SS pat<br>25 50 75 100 125 150 175 0 100 200 300 400 500 600 700<br>TC (°C)C (°C) (°C) Reverse Voltage (V)<br>Fig. 6 - Peak Forward Current vs.  Fig. 8 - Typical Capacitive Energy vs. Reverse Voltage, Per Leg<br>Maximum Allowable Case Temperature, Per Leg<br>Axis Title Axis Title<br>90 10000 80<br>80 70<br>70 NET 60 pe<br>60 1000<br>mo | 50 tt<br>50 R thJC  typ.<br>40<br>40 PPSKINTN a ———TATE<br>30<br>3020 pA= R thJC  max. SA 100 20 Yt—— TJ = 25 °C<br>10 Ne 10 a<br>0 10 0<br>Po NA 7}aoe f'cw<br>25 50 75 100 125 150 175 0 100 200 300 400 500 600 700<br>Case Temperature (°C) Reverse Voltage (V)<br>(µJ)<br>line Energy<br>(peak) (A)IF F  1st line 2nd line 2nd<br>Capacitive<br>(nC)<br>line<br>Charge<br>1st line 2nd line 2nd<br>Allowable Input Power (W) Capacitive<br>**----- End of picture text -----**<br>


Fig. 8 - Typical Capacitive Energy vs. Reverse Voltage, Per Leg 

Fig. 7 - Forward Power Loss Characteristics, Per Leg 

Fig. 9 - Typical Capacitive Charge vs. Reverse Voltage, Per Leg 

Revision: 10-Apr-2024 

Document Number: 97044 

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For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**VS-3C40CP07L-M3** 

www.vishay.com 

## Vishay Semiconductors 

## **ORDERING INFORMATION TABLE** 

**==> picture [392 x 204] intentionally omitted <==**

**----- Start of picture text -----**<br>
Device code VS- 3C 40 C P 07 L -M3<br>1 2 3 4 5 6 7 8<br>1 - Vishay Semiconductors product<br>2 - 3C = SiC diode, Generation 3<br>3 - Current rating (40 = 40 A)<br>4 - C = common cathode<br>5 - P = package TO-247<br>6 - Voltage rating: (07 = 650 V)<br>7 -  L = long lead<br>8 - Environmental digit:<br>-M3 = halogen-free, RoHS-compliant, and termination lead (Pb)-free<br>**----- End of picture text -----**<br>


|**ORDERING INFORMATION**|**ORDERING INFORMATION**|**ORDERING INFORMATION**|||
|---|---|---|---|---|
|**PREFERRED P/N**|**BASE QUANTITY**|||**PACKAGING DESCRIPTION**|
|VS-3C40CP07L-M3|25/tube|||Antistatic plastic tubes|
||||||
|**LINKS TO RELATED DOCUMENTS**|||||
|Dimensions|||www.vishay.com/doc?95626||
|Part markinginformation|||www.vishay.com/doc?95007||



Revision: 10-Apr-2024 

Document Number: 97044 

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For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 

**Outline Dimensions** 

Vishay Semiconductors 

**==> picture [59 x 48] intentionally omitted <==**

www.vishay.com 

## **TO-247AD 3L** 

## **DIMENSIONS** in millimeters and inches 

||(2)<br>(2)   R/<br><br>2 x R<br>3<br>2 x<br>(5)   L1<br>Q|(2)<br>(2)   R/<br><br>2 x R<br>3<br>2 x<br>(5)   L1<br>Q|(2)<br>(2)   R/<br><br>2 x R<br>3<br>2 x<br>(5)   L1<br>Q|B||||||D<br>A<br>A2<br>A<br>A<br>A1<br>C<br>T<br> D E<br>E<br>C<br>C<br>View B|D<br>A<br>A2<br>A<br>A<br>A1<br>C<br>T<br> D E<br>E<br>C<br>C<br>View B|A<br>(6)ΦP|A<br>(6)ΦP|A<br>(6)ΦP|(Datum B)<br>Φ P1|(Datum B)<br>Φ P1|(Datum B)<br>Φ P1|(Datum B)<br>Φ P1|(Datum B)<br>Φ P1|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||2||||||||Ø K<br>B<br>D<br>M<br>M<br>hermal pad<br>D2|B<br>D<br><br>M|||||||
||||||||||||||||4||D|||
||||||1<br>2|3||||||||||||||
||||||<br>b4|||||||||||||||
||||||||||||||||(4)<br>E1|||||
|||||x b<br>b2<br>C||||||||||||||||
|||||||||||||||||||||
||||||(b1, b3, b5)|||||||||||||||
||||0.10<br>M|A<br>C<br>M||||||||||||||||
|||||||||||||||||||||
||(<br>Plating|||||||||||||||||||
|||||c)|(b b2 b4)|||||||||||||||
|||||||||||||||||||||
|||||||||||||||||||||
|||||||||||||||||||||
|**SYMBOL**|**MILLIMETERS**|||||**INCHES**|||**NOTES**<br>3<br>4||**SYMBOL**|**MILLIMETERS**||||**INCHES**|||**NOTES**|
||**MIN.**|||**MAX.**||**MIN.**||**MAX.**||||**MIN.**||**MAX.**||**MIN.**||**MAX.**||
|A|4.65|||5.31||0.183||0.209|||D2|0.51||1.30||0.020||0.051||
|A1|2.21|||2.59||0.087||0.102|||E|15.29||15.87||0.602||0.625|3|
|A2|1.50|||2.49||0.059||0.098|||E1|13.46||-||0.53||-||
|b|0.99|||1.40||0.039||0.055|||e|5.46 BSC||||0.215 BSC||||
|b1|0.99|||1.35||0.039||0.053|||Ø K|0.254||||0.010||||
|b2|1.65|||2.39||0.065||0.094|||L|19.81||20.32||0.780||0.800||
|b3|1.65|||2.34||0.065||0.092|||L1|3.71||4.29||0.146||0.169||
|b4|2.59|||3.43||0.102||0.135|||Ø P|3.56||3.66||0.14||0.144||
|b5|2.59|||3.38||0.102||0.133|||Ø P1|-||6.98||-||0.275||
|c|0.38|||0.89||0.015||0.035|||Q|5.31||5.69||0.209||0.224||
|c1|0.38|||0.84||0.015||0.033|||R|4.52||5.49||0.178||0.216||
|D|19.71|||20.70||0.776||0.815|||S|5.51 BSC||||0.217 BSC||||
|D1|13.08|||-||0.515||-||||||||||||



## **Notes** 

> (1) Dimensioning and tolerancing per ASME Y14.5M-1994 

> (2) Contour of slot optional 

> (3) Dimension D and E do not include mold flash. These dimensions are measured at the outermost extremes of the plastic body 

> (4) Thermal pad contour optional with dimensions D1 and E1 

> (5) Lead finish uncontrolled in L1 

> (6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154") 

> (7) Outline conforms to JEDEC® outline TO-247 with exception of dimension A min., D, E min., Q min., S, and note 4 

Revision: 06-Mar-2020 

Document Number: 95626 

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Revision: 01-Jul-2024 

Document Number: 91000 

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