VC1210K401R017

Surface Mount Varistors **VC Low Voltage 125°C** 

## **Overview** 

KEMET's VC series of low voltage varistors are designed to protect sensitive electronic devices against high voltage surges in the low voltage region. VC varistors offer excellent transient energy absorption due to improved energy volume distribution and power dissipation. 

## **Applications** 

Typical applications include mobile phones and telecommunication infrastructure, I/O ports and controllers. 

The protection of integrated circuits and other components at the circuit board level including the suppression of inductive switching or other transient events such as surge voltage. ESD protection for components sensitive to IEC 1000–4–2, MILSTD 883C Method 3015.7 and other industry specifications. Replacement of larger surface mount TVS Zeners in many applications. Designed to achieve electromagnetic compliance of end products and provide on-board transient voltage protection of ICs and transistors. 

## **Benefits** 

- AEC–Q200 qualified Grade 1 

- Surface mount form factor 

- Operating ambient temperature of −55°C to +125°C 

- Operating voltage range of 11 – 170 VDC 

- Available case sizes: 0603, 0805, 1206, 1210, 1812, 2220 

- Short response time 

- Broad range of current and energy handling capabilities 

- Low clamping voltage – Uc 

- Non-sensitive to mildly activated fluxes 

- Barrier type and terminations solderable with Pb-free solders according to JEDEC J–STD–020C and IEC 60068–2–58 

- RoHS 2 2011/65/EC, REACH compliant 

~~_~~ © KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com 

**Built Into Tomorrow** 

V0002_VC • 7/21/2021 1 

Surface Mount Varistors VC Low Voltage 125°C 

## **Ordering Information** 

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**----- Start of picture text -----**<br>
VC 0603 M 300 R 002<br>Maximum Continuous<br>Chip  Rated Peak Single Pulse  Packaging/<br>Series Tolerances Working Voltage<br>Size Code Transient Current (A) Termination<br>(Vrms AC)<br>**----- End of picture text -----**<br>


|**VC**|**0603**|**M**|**300**|**R**|**002**|
|---|---|---|---|---|---|
|Series|Chip<br>Size Code|Tolerances|Rated Peak Single Pulse<br>Transient Current (A)|Packaging/<br>Termination|Maximum Continuous<br>Working Voltage<br>(Vrms AC)|
|||||||
|Varistor<br>SMD 125°C<br>Low Voltage<br>Multilayer Chip|0603 = 0603<br>0805 = 0805<br>1206 = 1206<br>1210 = 1210<br>1812 = 1812<br>2220 = 2220|K = ±10%<br>L = ±15%<br>M = ±20%|300 = 30<br>101 = 100<br>121 = 120<br>151 = 150<br>201 = 200<br>251 = 250<br>301 = 300<br>401 = 400<br>501 = 500<br>601 = 600<br>801 = 800<br>102 = 1,000<br>122 = 1,200<br>(First two digits represent<br>signifcant fgures. Third digit<br>specifes number of zeros.)|R = Reel 180 mm/Ni Sn<br>Barrier Terminations|008 = 8<br>011 = 11<br>014 = 14<br>017 = 17<br>020 = 20<br>025 = 25<br>030 = 30<br>035 = 35<br>040 = 40<br>050 = 50<br>060 = 60<br>075 = 75<br>095 = 95<br>115 = 115<br>130 = 130|



## **Dimensions – Millimeters** 

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**----- Start of picture text -----**<br>
0.5±0.25<br>W<br>t<br>L<br>**----- End of picture text -----**<br>


|**Size Code**|**L**|**W**|**tmax**|
|---|---|---|---|
|0603|1.6±0.20|0.80±0.10|0.95|
|0805|2.0±0.25|1.25±0.20|0.80|
|1206|3.2±0.30|1.60±0.20|0.85|
|1210|3.2±0.30|2.50±0.25|0.85|
|1812|4.7±0.40|3.20±0.30|1.25|
|2220|5.7±0.50|5.00±0.40|1.25|



© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com 

V0002_VC • 7/21/2021 

2 

Surface Mount Varistors VC Low Voltage 125°C 

## **Environmental Compliance** 

RoHS 2 2011/65/EC, REACH 

## **Performance Characteristics** 

|**Continuous**|**Units**|**Value**|
|---|---|---|
|Steady State Applied Voltage|||
|DC Voltage Range (Vdc)|V|11 – 170|
|AC Voltage Range (Vrms)|V|8 – 130|
|Transient|||
|Peak Single Pulse Surge Current, 8/20 µs Waveform (Imax)|A|30 – 1,200|
|Single Pulse Surge Energy, 10/1,000 µs Waveform (Wmax)|J|0.1 – 12.2|
|Operating Ambient Temperature|°C|−55 to +125|
|Storage Temperature Range (mounted components)|°C|−55 to +150|
|Threshold Voltage Temperature Coefcient|%/°C|< +0.05|
|Response Time|ns|< 2|
|Climatic Category||55/125/56|



## **Qualifications** 

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**----- Start of picture text -----**<br>
Condition to be Satisfied<br>Reliability Parameter Test Tested According to<br>after Testing<br>**----- End of picture text -----**<br>


|**Reliability Parameter**|**Test**|**Tested According to**|**Condition to be Satisfed**<br>**after Testing**|
|---|---|---|---|
|||||
|AC/DC Bias Reliability|AC/DC Life Test|CECC 42200, Test 4.20 or IEC 1051–1, Test 4.20.<br>AEC–Q200 Test 8 – 1,000 hours at UCT||δVn(1 mA)| < 10%|
|Pulse Current Capability|Imax8/20 µs|CECC 42200, Test C 2.1 or IEC 1051–1, Test 4.5.<br>10 pulses in the same direction at 2 pulses per minute<br>at maximum peak current for 10 pulses||δVn(1 mA)| < 10%<br>no visible damage|
|Pulse Energy Capability|Wmax10/1,000 µs|CECC 42200, Test C 2.1 or IEC 1051–1, Test 4.5. 10<br>pulses in the same direction at 1 pulses every 2<br>minutes at maximum peak current for 10 pulses||δVn(1 mA)| < 10%<br>no visible damage|
|WLD Capability|WLD x 10|ISO 7637, Test pulse 5, 10 pulses at rate 1 per minute||δVn(1 mA)| < 15%<br>no visible damage|
|VjumpCapability|Vjump5 minutes|Increase of supply voltage to V ≥ Vjumpfor 1 minute|<br>|δVn(1 mA)| < 15%<br>no visible damage|



© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com 

V0002_VC • 7/21/2021 

3 

Surface Mount Varistors VC Low Voltage 125°C 

## **Qualifications cont.** 

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**----- Start of picture text -----**<br>
Condition to be Satisfied<br>Reliability Parameter Test Tested According to<br>after Testing<br>**----- End of picture text -----**<br>


|**Reliability Parameter**|**Test**|**Tested According to**|**Condition to be Satisfed**<br>**after Testing**|
|---|---|---|---|
|||||
|Environmental and<br>Storage Reliability|Climatic Sequence|CECC 42200, Test 4.16 or IEC 1051–1, Test 4.17.<br>a) Dry heat, 16 hours, UCT, Test Ba, IEC 68–2–2<br>b) Damp heat, cyclic, the frst cycle: 55°C, 93% RH,<br>24 hours, Test Db 68–2–4<br>c) Cold, LCT, 2 hours Test Aa IEC 68–2–1<br>d) Damp heat cyclic, remaining 5 cycles: 55°C, 93%<br>RH, 24 hour/cycle, Test Bd, IEC 68–2–30||δVn(1 mA)| < 10%|
||Thermal Shock|CECC 42200, Test 4.12, Test Na, IEC 68–2–14,<br>AEC–Q200 Test 16, 5 cycles UCT/LCT, 30 minutes||δVn(1 mA)| < 10%<br>no visible damage|
||Steady State Damp Heat|CECC 42200, Test 4.17, Test Ca, IEC 68–2–3,<br>AEC–Q200 Test 6, 56 days, 40°C, 93% RH.<br>AEC–Q200 Test 7: Bias, RH, T all at 85.||δVn(1 mA)| < 10%|
||Storage Test|IEC 68–2–2, Test Ba, AEC–Q200 Test 3,<br>1,000 hours at maximum storage temperature||δVn(1 mA)| < 5%|
|Mechanical Reliability|Solderability|CECC 42200, Test 4.10.1, Test Ta IEC 68–2–20<br>solder bath and refow method|Solderable at shipment<br>and after 1 year of storage,<br>criteria > 95% must be<br>covered by solder for refow<br>meniscus|
||Resistance to Soldering<br>Heat|CECC 42200, Test 4.10.2, Test Tb, IEC 68–2–20 solder<br>bath and refow method||δVn(1 mA)| < 5%|
||Terminal Strength|JIS–C–6429, App. 1, 18 N for 60 seconds – same for<br>AEC–Q200 Test 22|no visual damage|
||Board Flex|JIS–C–6429, App. 2, 2 mm minimum<br>AEC–Q200 test 21 – Board fex: 2 mm fex minimum||δVn(1 mA)| < 2%<br>no visible damage|
||Vibration|CECC 42200, Test 4.15, Test Fc, IEC 68–2–6,<br>AEC–Q200 Test 14.<br>Frequency range 10 – 55 Hz (AEC: 10 – 2,000 Hz)<br>Amplitude 0.75 m/s2or 98 m/s2<br>(AEC: 5 G for 20 minutes)<br>Total duration 6 hours (3 x 2 hours)<br>(AEC: 12 cycles each of 3 directions)<br>Waveshape – half sine||δVn(1 mA)| < 10%<br>no visible damage|
||Mechanical Shock|CECC 42200, Test 4.14, Test Ea, IEC 68–2–27,<br>AEC–Q200 Test 13.<br>Acceleration = 490 m/s2<br>(AEC: MIL-STD–202–Method 213),<br>Pulse duration = 11 ms,<br>Waveshape – half sine; Number of shocks = 3 x 6||δVn(1 mA)| < 10%<br>no visible damage|
|Electrical Transient<br>Conduction|ISO–7637–1 Pulses|AEC–Q200 Test 30: Test pulses 1 to 3.<br>Also other pulses – freestyle.||δVn(1 mA)| < 10%<br>no visible damage|



© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com 

V0002_VC • 7/21/2021 

4 

Surface Mount Varistors VC Low Voltage 125°C 

## **Reliability** 

In general, reliability is the ability of a component to perform and maintain its functions in routine circumstances, as well as hostile or unexpected circumstances. The mean life of series components is a function of: 

- Factor of Applied Voltage 

- Ambient temperature 

Mean life is closely related to Failure rate (formula). 

Mean life (ML) is the arithmetic mean (average) time to failure of a component. 

Failure rate is the frequency with which an engineered system or component fails, expressed for example in failures per hour. Failure rate is usually time dependent, an intuitive corollary is that the rate changes over time versus the expected life cycle of a system. 

## **Mean Life on Arrhenius model** 

## **Failure rate formula – calculation** 

_10_[9] _Λ= [fit] ML[h]_ 

## **FAV – Factor of Applied Voltage** 

_Vapl Λ= V max_ 

Vapl = applied voltage Vmax = maximum operating voltage 

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**----- Start of picture text -----**<br>
10 [8]<br>h Years<br>10 [7]<br>1,000<br>10 [6] 100<br>FAV<br>10 [5] 0,7 10<br>0,8<br>10 [4] 0,9 1<br>1,0<br>10 [3]<br>120 100 80 60 40 20 °C<br>Ta<br>Mean life (ML)<br>**----- End of picture text -----**<br>


© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com 

V0002_VC • 7/21/2021 

5 

Surface Mount Varistors VC Low Voltage 125°C 

## **Table 1 – Ratings & Part Number Reference** 

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**----- Start of picture text -----**<br>
I W I C L<br>KEMET Part  L  W  t V c max P max typ typ<br>Number (mm) (mm) (mm)max [V][rms] [VDC] 1 mAn  Vc 8/20 µs  10/1000 µs  (W)max 8/20 µs  at 1 kHz  100 mA/ns<br>(A) (J) (A) (pF) (nH)<br>**----- End of picture text -----**<br>


|**KEMET Part**<br>**Number**|**L**<br>**(mm)**|**W**<br>**(mm)**|**tmax**<br>**(mm) **|**Vrms **|**VDC**|**Vn **<br>**1 mA**|**Vc**|**Ic**<br>**8/20 µs**<br>**(A)**|**Wmax**<br>**10/1000 µs**<br>**(J)**|<br>**Pmax**<br>**(W)**|**Imax**<br>**8/20 µs**<br>**(A)**|**Ctyp**<br>**at 1 kHz**<br>**(pF)**|<br>**Ltyp**<br>**100 mA/ns**<br>**(nH)**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||||||||||||
|**VC0603L300R008**|**1.6±0.20**|**0.80±0.10**|**0.95**|**8**|**11**|**15**|**25**|**1**|**0.1**|**0.003**|**30**|**240**|**1.0**|
|**VC0805L121R008**|**2.0±0.25**|**1.25±0.20**|**0.80**|**8**|**11**|**15**|**25**|**1**|**0.2**|**0.005**|**120**|**475**|**1.5**|
|**VC1206L201R008**|**3.2±0.30**|**1.60±0.20**|**0.85**|**8**|**11**|**15**|**25**|**1**|**0.6**|**0.008**|**200**|**2,000**|**1.8**|
|**VC1210L401R008**|**3.2±0.30**|**2.50±0.25**|**0.85**|**8**|**11**|**15**|**25**|**3**|**1.1**|**0.010**|**400**|**3,400**|**1.8**|
|**VC1812L501R008**|**4.7±0.40**|**3.20±0.30**|**1.25**|**8**|**11**|**15**|**25**|**5**|**1.9**|**0.015**|**500**|**6,300**|**2.5**|
|**VC2220L122R008**|**5.7±0.50**|**5.00±0.40**|**1.25**|**8**|**11**|**15**|**25**|**10**|**4.3**|**0.020**|**1,200**|**15,000**|**3.0**|
|VC0603K300R011|1.6±0.20|0.80±0.10|0.95|11|14|18|33|1|0.2|0.003|30|210|1.0|
|**VC0805K121R011**|**2.0±0.25**|**1.25±0.20**|**0.80**|**11**|**14**|**18**|**33**|**1**|**0.3**|**0.005**|**120**|**400**|**1.5**|
|**VC1206K201R011**|**3.2±0.30**|**1.60±0.20**|**0.85**|**11**|**14**|**18**|**33**|**1**|**0.6**|**0.008**|**200**|**1,300**|**1.8**|
|VC1210K401R011|3.2±0.30|2.50±0.25|0.85|11|14|18|33|3|1.3|0.010|400|2,600|1.8|
|VC1812K801R011|4.7±0.40|3.20±0.30|1.25|11|14|18|33|5|2.0|0.015|800|5,100|2.5|
|**VC2220K122R011**|**5.7±0.50**|**5.00±0.40**|**1.25**|**11**|**14**|**18**|**33**|**10**|**5.5**|**0.020**|**1,200**|**12,000**|**3.0**|
|VC0603K300R014|1.6±0.20|0.80±0.10|0.95|14|18|22|38|1|0.3|0.003|30|195|1.0|
|VC0805K121R014|2.0±0.25|1.25±0.20|0.80|14|18|22|38|1|0.4|0.005|120|355|1.5|
|VC1206K201R014|3.2±0.30|1.60±0.20|0.85|14|18|22|38|1|0.6|0.008|200|950|1.8|
|VC1210K401R014|3.2±0.30|2.50±0.25|0.85|14|18|22|38|3|1.6|0.010|400|2,000|1.8|
|VC1812K801R014|4.7±0.40|3.20±0.30|1.25|14|18|22|38|5|2.4|0.015|800|4,200|2.5|
|**VC2220K122R014**|**5.7± 0.50**|**5.00±0.40**|**1.25**|**14**|**18**|**22**|**38**|**10**|**6.0**|**0.020**|**1,200**|**9,400**|**3.0**|
|VC0603K300R017|1.6±0.20|0.80±0.10|0.95|17|22|27|44|1|0.3|0.003|30|185|1.0|
|VC0805K121R017|2.0±0.25|1.25±0.20|1.05|17|22|27|44|1|0.4|0.005|120|315|1.5|
|VC1206K201R017|3.2±0.30|1.60±0.20|1.25|17|22|27|44|1|0.7|0.008|200|740|1.8|
|VC1210K401R017|3.2±0.30|2.50±0.25|1.35|17|22|27|44|3|1.8|0.010|400|1,700|1.8|
|VC1812K801R017|4.7±0.40|3.20±0.30|1.25|17|22|27|44|5|2.8|0.015|800|3,500|2.5|
|VC2220K122R017|5.7±0.50|5.00±0.40|1.25|17|22|27|44|10|7.5|0.020|1,200|7,700|3.0|
|VC0603K300R020|1.6±0.20|0.80±0.10|0.95|20|26|33|54|1|0.3|0.003|30|175|1.0|
|VC0805K121R020|2.0±0.25|1.25±0.20|1.05|20|26|33|54|1|0.4|0.005|120|290|1.5|
|VC1206K201R020|3.2±0.30|1.60±0.20|1.25|20|26|33|54|1|0.8|0.008|200|620|1.8|
|VC1210K401R020|3.2±0.30|2.50±0.25|1.35|20|26|33|54|3|2.0|0.010|400|1,400|1.8|
|VC1812K801R020|4.7±0.40|3.20±0.30|1.55|20|26|33|54|5|3.0|0.015|800|3,000|2.5|
|VC2220K122R020|5.7±0.50|5.00±0.40|1.45|20|26|33|54|10|8.0|0.020|1,200|6,500|3.0|
|VC0603K300R025|1.6±0.20|0.80±0.10|0.95|25|31|39|65|1|0.1|0.003|30|165|1.0|
|VC0805K121R025|2.0±0.25|1.25±0.20|1.05|25|31|39|65|1|0.2|0.005|120|260|1.5|
|VC1206K201R025|3.2±0.30|1.60±0.20|1.25|25|31|39|65|1|1.0|0.008|200|510|1.8|
|VC1210K401R025|3.2±0.30|2.50±0.25|1.45|25|31|39|65|3|1.8|0.010|400|1,060|1.8|
|VC1812K801R025|4.7±0.40|3.20±0.30|1.55|25|31|39|65|5|3.9|0.015|800|2,300|2.5|
|VC2220K122R025|5.7±0.50|5.00±0.40|1.45|25|31|39|65|10|9.5|0.020|1,200|5,000|3.0|
|VC0603K300R030|1.6±0.20|0.80± 0.10|0.95|30|38|47|77|1|0.1|0.003|30|160|1.0|
|**KEMET**<br>**Part Number**|**L**<br>**(mm)**|**W**<br>**(mm)**|**tmax**<br>**(mm)**|**Vrms**|**VDC**|**Vn **<br>**1 mA**|**Vc**|**Ic**<br>**8/20 µs**<br>**(A)**|**Wmax**<br>**10/1000 µs**<br>**(J)**|**Pmax**<br>**(W)**|**Imax**<br>**8/20 µs**<br>**(A)**|**Ctyp**<br>**at 1 kHz**<br>**(pF)**|**Ltyp**<br>**100 mA/ns**<br>**(nH)**|



_**Part numbers marked in blue font are not for new design.**_ 

© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com 

V0002_VC • 7/21/2021 

6 

Surface Mount Varistors VC Low Voltage 125°C 

## **Table 1 – Ratings & Part Number Reference cont.** 

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**----- Start of picture text -----**<br>
I W I C L<br>KEMET Part  L  W  t V c max P max typ typ<br>Number (mm) (mm) (mm)max [V][rms] [VDC] 1 mAn  Vc 8/20 µs  10/1000 µs  (W)max 8/20 µs  at 1 kHz  100 mA/ns<br>(A) (J) (A) (pF) (nH)<br>**----- End of picture text -----**<br>


|**KEMET Part**<br>**Number**|**L**<br>**(mm)**|**W**<br>**(mm)**|**tmax**<br>**(mm) **|**Vrms **|**VDC**|**Vn **<br>**1 mA**|**Vc**|**Ic**<br>**8/20 µs**<br>**(A)**|**Wmax**<br>**10/1000 µs**<br>**(J)**|<br>**Pmax**<br>**(W)**|**Imax**<br>**8/20 µs**<br>**(A)**|**Ctyp**<br>**at 1 kHz**<br>**(pF)**|<br>**Ltyp**<br>**100 mA/ns**<br>**(nH)**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||||||||||||
|VC0805K121R030|2.0±0.25|1.25±0.20|1.05|30|38|47|77|1|0.2|0.005|120|230|1.5|
|VC1206K201R030|3.2±0.30|1.60±0.20|1.25|30|38|47|77|1|1.2|0.008|200|450|1.8|
|VC1210K301R030|3.2±0.30|2.50±0.25|1.45|30|38|47|77|3|2.1|0.010|300|850|1.8|
|VC1812K801R030|4.7±0.40|3.20±0.30|1.55|30|38|47|77|5|4.4|0.015|800|1,800|2.5|
|VC2220K122R030|5.7±0.50|5.00±0.40|1.45|30|38|47|77|10|12.2|0.020|1,200|4,000|3.0|
|VC1206K121R035|3.2±0.30|1.60±0.20|1.25|35|45|56|90|1|0.6|0.008|120|400|1.8|
|VC1210K251R035|3.2±0.30|2.50±0.25|1.45|35|45|56|90|3|2.2|0.010|250|670|1.8|
|VC1812K601R035|4.7±0.40|3.20±0.30|1.55|35|45|56|90|5|4.2|0.015|600|1,340|2.5|
|VC2220K102R035|5.7±0.50|5.00±0.40|1.45|35|45|56|90|10|7.6|0.020|1,000|3,000|3.0|
|VC1206K121R040|3.2±0.30|1.60±0.20|1.25|40|56|68|110|1|0.8|0.008|120|370|1.8|
|VC1210K251R040|3.2±0.30|2.50±0.25|1.45|40|56|68|110|3|2.4|0.010|250|570|1.8|
|VC1812K601R040|4.7±0.40|3.20±0.30|1.55|40|56|68|110|5|4.8|0.015|600|1,000|2.5|
|VC2220K102R040|5.7±0.50|5.00±0.40|1.45|40|56|68|110|10|9.2|0.020|1,000|2,200|3.0|
|VC1206K121R050|3.2±0.30|1.60±0.20|1.65|50|65|82|135|1|0.8|0.008|120|340|1.8|
|VC1210K251R050|3.2±0.30|2.50±0.25|1.75|50|65|82|135|3|1.7|0.010|250|470|1.8|
|VC1812K401R050|4.7±0.40|3.20±0.30|1.85|50|65|82|135|5|4.8|0.015|400|710|2.5|
|VC2220K801R050|5.7±0.50|5.00±0.40|1.85|50|65|82|135|10|5.8|0.020|800|1,500|3.0|
|VC1206K121R060|3.2±0.30|1.60±0.20|1.65|60|85|100|165|1|0.9|0.008|120|330|1.8|
|VC1210K251R060|3.2±0.30|2.50±0.25|1.75|60|85|100|165|3|2.2|0.010|250|390|1.8|
|VC1812K401R060|4.7±0.40|3.20±0.30|1.85|60|85|100|165|5|5.8|0.015|400|580|2.5|
|VC2220K801R060|5.7± 0.50|5.00±0.40|1.85|60|85|100|165|10|6.2|0.020|800|1,000|3.0|
|VC1812K401R075|4.7±0.40|3.20±0.30|1.90|75|100|120|200|5|5.8|0.015|400|440|2.5|
|VC2220K801R075|5.7±0.50|5.00±0.40|1.90|75|100|120|200|10|6.2|0.020|800|700|3.0|
|VC1812K301R095|4.7±0.40|3.20±0.30|1.90|95|125|150|250|5|5.2|0.015|300|340|2.5|
|VC2220K501R095|5.7±0.50|5.00±0.40|1.90|95|125|150|250|10|7.4|0.020|500|600|3.0|
|**VC1812K301R115**|**4.7±0.40**|**3.20±0.30**|**1.90**|**115**|**150**|**180**|**300**|**5**|**5.2**|**0.015**|**300**|**310**|**2.5**|
|**VC2220K501R115**|**5.7±0.50**|**5.00±0.40**|**1.90**|**115**|**150**|**180**|**300**|**10**|**7.4**|**0.020**|**500**|**560**|**3.0**|
|**VC2220K501R130**|**5.7±0.50**|**5.00±0.40**|**1.90**|**130**|**170**|**205**|**340**|**10**|**7.4**|**0.020**|**500**|**500**|**3.0**|
|**KEMET**<br>**Part Number**|**L**<br>**(mm)**|**W**<br>**(mm)**|**tmax**<br>**(mm)**|**Vrms**|**VDC**|**Vn **<br>**1 mA**|**Vc**|**Ic**<br>**8/20 µs**<br>**(A)**|**Wmax**<br>**10/1000 µs**<br>**(J)**|**Pmax**<br>**(W)**|**Imax**<br>**8/20 µs**<br>**(A)**|**Ctyp**<br>**at 1 kHz**<br>**(pF)**|**Ltyp**<br>**100 mA/ns**<br>**(nH)**|



## _**Part numbers marked in blue font are not for new design.**_ 

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Surface Mount Varistors VC Low Voltage 125°C 

## **Soldering** 

Popular soldering techniques used for surface mounted components are Wave and Infrared Reflow processes. Both processes can be performed with Pb-containing or Pb-free solders. The termination option available for these soldering techniques is Barrier Type End Terminations. 

|**End Termination**|**Designation**|**Recommended and**<br>**Suitable for**|**Component RoHS**<br>**Compliant**|
|---|---|---|---|
|Ni Sn Barrier Type End<br>Termination|Ni R1|Pb-containing and<br>Pb-free soldering|Yes|



**Wave Soldering** – this process is generally associated with discrete components mounted on the underside of printed circuit boards, or for large top-side components with bottom-side mounting tabs to be attached, such as the frames of transformers, relays, connectors, etc. SMD varistors to be wave soldered are first glued to the circuit board, usually with an epoxy adhesive. When all components on the PCB have been positioned and an appropriate time is allowed for adhesive curing, the completed assembly is then placed on a conveyor and run through a single, double wave process. 

**Infrared Reflow Soldering** – these reflow processes are typically associated with top-side component placement. This technique utilizes a mixture of adhesive and solder compounds (and sometimes fluxes) that are blended into a paste. The paste is then screened onto PCB soldering pads specifically designed to accept a particular sized SMD component. The recommended solder paste wet layer thickness is 100 to 300 µm. Once the circuit board is fully populated with MD components, it is placed in a reflow environment, where the paste is heated to slightly above its eutectic temperature. When the solder paste reflows, the SMD components are attached to the solder pads. 

**Solder Fluxes** – solder fluxes are generally applied to populated circuit boards to clean oxides forming during the heating process and to facilitate the flowing of the solder. Solder fluxes can be either a part of the solder paste compound or can be separate materials, usually fluids. Recommended fluxes are: 

- Non-activated (R) fluxes, whenever possible 

- Mildly activated (RMA) fluxes of class L3CN 

- Class ORLO 

**Activated (RA),** water soluble or strong acidic fluxes with a chlorine content > 0.2 wt. % are NOT RECOMMENDED. The use of such fluxes could create high leakage current paths along the body of the varistor components. 

When a flux is applied prior to wave soldering, it is important to completely dry any residual flux solvents prior to the soldering process. 

**Thermal Shock** – to avoid the possibility of generating stresses in the varistor chip due to thermal shock, a preheat stage to within 100°C of the peak soldering process temperature is recommended. Additionally, SMD varistors should not be subjected to a temperature gradient greater than 4°C/second, with an ideal gradient being 2°C/second. Peak temperatures should be controlled. Wave and Reflow soldering conditions for SMD varistors with Pb-containing solders are shown in Fig. 1 and 2 respectively, while Wave and Reflow soldering conditions for SMD varistors with Pb-free solders are shown in Figures 1 and 3 

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Surface Mount Varistors VC Low Voltage 125°C 

## **Soldering cont.** 

Whenever several different types of SMD components are being soldered, each having a specific soldering profile, the soldering profile with the least heat and the minimum amount of heating time is recommended. Once soldering has been completed, it is necessary to minimize the possibility of thermal shock by allowing the hot PCB to cool to less than 50°C before cleaning. 

**Inspection Criteria** – the inspection criteria to determine acceptable solder joints, when Wave or Infrared Reflow processes are used, will depend on several key variables, principally termination material process profiles. 

**Pb-contining Wave and IR Reflow Soldering** – typical “before” and “after” soldering results for Barrier Type End Terminations can be seen in Fig. 4. Barrier type terminated varistors form a reliable electrical contact and metallurgical bond between the end terminations and the solder pads. The bond between these two metallic surfaces is exceptionally strong and has been tested by both vertical pull and lateral (horizontal) push tests. The results exceed established industry standards for adhesion. 

The solder joint appearance of a barrier type terminated varistor shows that solder forms a metallurgical junction with the thin tin-alloy (over the barrier layer), and due to its small volume “climbs” the outer surface of the terminations, the meniscus will be slightly lower. This optical appearance should be taken into consideration when programming visual inspection of the PCB after soldering. 

## **Ni Sn Barrier Type End Terminations** 

Figure 4: Soldering Criterion in case of Wave and IR Reflow Pb-containing Soldering 

**Pb-free Wave and IR Reflow Soldering** – typical “before” and “after” soldering results for Barrier Type End Terminations are given in a phenomenon knows as “mirror” or “negative” meniscus. Solder forms a metallurgical junction with the entire volume of the end termination, i.e. it diffuses from pad to end termination across the inner side, forming a “mirror” or “negative” meniscus. The height of the solder penetration can be clearly seen on the end termination and is always 30% higher than the chip height. 

© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com 

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Surface Mount Varistors VC Low Voltage 125°C 

## **Soldering cont.** 

**Solder Test and Retained Samples** – reflow soldering test based on J-STD-020D.1 and soldering test by dipping based on IEC 600682 for Pb-free solders are preformed on each production lot as shown in the following chart. Test results and accompanying samples are retained for a minimum of two (2) years. The solderability of a specific lot can be checked at any time within this period should a customer require this information. 

**==> picture [542 x 60] intentionally omitted <==**

**----- Start of picture text -----**<br>
Static leaching  Dynamic Leaching<br>Test Resistance to Flux Solderability (Simulation of Reflow  (Simulation of Wave<br>Soldering) Soldering)<br>Parameter<br>**----- End of picture text -----**<br>


|**Test**|**Resistance to Flux**|**Solderability**|**Static leaching**<br>**(Simulation of Refow**<br>**Soldering)**|**Dynamic Leaching**<br>**(Simulation of Wave**<br>**Soldering)**|
|---|---|---|---|---|
|Parameter|||||
||||||
|Soldering method|Dipping|Dipping|Dipping|Dipping with agitation|
|Flux|L3CN, ORL0|L3CN, ORL0, R|L3CN, ORL0, R|L3CN, ORL0, R|
|Pb Solder|62 Sn/36 Pb/2 Ag||||
|Pb Soldering temperature (°C)|235±5|235±5|260±5|235±5|
|Pb-FREE Solder|Sn96/Cu0,4–0,8/3–4Ag||||
|Pb-FREE Soldering<br>Temperature (°C)|250±5|250±5|280±5|250±5|
|Soldering Time (s)|2|210|10|> 15|
|Burn-in Conditions|VDCmax, 48 h||||
|Acceptance Criterion|dVn < 5%, idcmust stay<br>unchanged|> 95% of end termination<br>must be covered by solder|> 95% of end termination<br>must be intact and covered<br>by solder|> 95% of end termination<br>must be intact and covered<br>by solder|



**Rework Criteria Soldering Iron** – unless absolutely necessary, the use of soldering irons is NOT recommended for reworking varistor chips. If no other means of rework is available, the following criteria must be strictly followed: 

- Do not allow the tip of the iron to directly contact the top of the chip 

- Do not exceed the following soldering iron specifications: 

Output Power: 30 Watts maximum Temperature of Soldering Iron Tip: 280°C maximum Soldering Time: 10 Seconds maximum 

**Storage Conditions** – SMD varistors should be used within 1 year of shipment from factory to avoid possible soldering problems caused by oxidized terminals. The storage environment should be controlled, with humidity less than 40% and temperature between -25 and 45 °C. Varistor chips should always be stored in their original packaged unit. 

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Surface Mount Varistors VC Low Voltage 125°C 

## **Soldering Pad Configuration** 

**==> picture [335 x 123] intentionally omitted <==**

**----- Start of picture text -----**<br>
M<br>B C B<br>W<br>A A<br>t<br>L<br>D<br>**----- End of picture text -----**<br>


**==> picture [542 x 21] intentionally omitted <==**

**----- Start of picture text -----**<br>
Size L (mm) W (mm) h (mm) tmax (mm) A (mm) B (mm) C (mm) D (mm)<br>**----- End of picture text -----**<br>


|**Size**|**L(mm)**|**W(mm)**|**h(mm)**|**tmax (mm)**|**A(mm)**|**B(mm)**|**C(mm)**|**D(mm)**|
|---|---|---|---|---|---|---|---|---|
||||||||||
|0603|1.6±0.20|0.80±0.10|0.5±0.25|1.0|1.0|1.0|0.6|2.6|
|0805|2.0±0.25|1.25±0.20|0.5±0.25|1.1|1.4|1.2|1.0|3.4|
|1206|3.2±0.30|1.60±0.20|0.5±0.25|1.6|1.8|1.2|2.1|4.5|
|1210|3.2±0.30|2.50±0.25|0.5±0.25|1.8|2.8|1.2|2.1|4.5|
|1812|4.7±0.40|3.20±0.30|0.5±0.25|1.9|3.6|1.5|3.2|6.2|
|2220|5.7±0.50|5.00±0.40|0.5±0.25|1.9|5.5|1.5|4.2|7.2|



## **Packaging** 

|**Voltage**<br>**Range (V)**|**Chip Size**|**Chip Size**|**Chip Size**|**Chip Size**|**Chip Size**|**Chip Size**|
|---|---|---|---|---|---|---|
||0603|0805|1206|1210|1812|2220|
||**Reel Size**||||||
||180|180|180|180|180|180|
|2 – 14|4,000|4,000|4,000|4,000|1,500|1,500|
|17|3,500|3,500|2,500|2,500|1,500|1,500|
|20 – 40|3,500|3,500|2,500|2,500|1,000|1,000|
|50 – 130|||2,000|2,000|1,000|1,000|



© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com 

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Surface Mount Varistors VC Low Voltage 125°C 

## **Construction** 

**==> picture [516 x 268] intentionally omitted <==**

**----- Start of picture text -----**<br>
Detailed Cross Section<br>Glass Passivation<br>a J<br>Termination<br>(Ag/Pd, Ni/Sn) Glass Passivation a e e Oe<br>ZnO Layer tea ey<br>Inner Electrodes<br>(Ag)<br>Terminate Termination<br>Edge (Ag/Pd, Ni/Sn)<br>Inner Electrodes Terminate<br>(Ag) Edge<br>**----- End of picture text -----**<br>


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Surface Mount Varistors VC Low Voltage 125°C 

## **Taping & Reel Specifications** 

|**Tape Size (mm)**|**8 mm**|**8 mm**|**8 mm**|**8 mm**|**12 mm**|**12 mm**|
|---|---|---|---|---|---|---|
||0603|0805|1206|1210|1812|2220|
|A0|1.2|1.6|1.9|2.9|3.75|5.6|
|B0|1.9|2.4|3.75|3.7|5.0|6.25|
|K0Maximum|1.1|1.1|1.8|2.0|2.0|2.0|
|B1Maximum|4.35|4.35|4.35|4.35|8.2|8.2|
|D1Minimum|0.3|0.3|0.3|0.3|1.5|1.5|
|E2Minimum|6.25|6.25|6.25|6.25|10.25|10.25|
|P1|4.0|4.0|4.0|4.0|8.0|8.0|
|F|3.5|3.5|3.5|3.5|5.5|5.5|
|W|8.0|8.0|8.0|8.0|12.0|12.0|
|T2Maximum|3.5|3.5|3.5|3.5|6.5|6.5|
|W1|8.4+1.5|8.4+1.5|8.4+1.5|8.4+1.5|12.4+2|12.4+2|
|W2Maximum|14.4|14.4|14.4|14.4|18.4|18.4|
|W3|7.9 – 10.9|7.9 – 10.9|7.9 – 10.9|7.9 – 10.9|11.9 – 15.4|11.9 – 15.4|
|A|180|180|180|180|180|180|



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## **Terms and Definitions** 

**==> picture [542 x 21] intentionally omitted <==**

**----- Start of picture text -----**<br>
Term Symbol Definition<br>**----- End of picture text -----**<br>


|**Term**|**Symbol**|**Defnition**|
|---|---|---|
||||
|Rated AC<br>Voltage|Vrms|Maximum continuous sinusoidal AC voltage (< 5% total harmonic distortion) which may be<br>applied to the component under continuous operation conditions at 25°C|
|Rated DC<br>Voltage|Vdc|Maximum continuous DC voltage (< 5% ripple) which may be applied to the component under<br>continuous operating conditions at 25°C|
|Supply<br>Voltage|V|<br>The voltage by which the system is designated and to which certain operating characteristics of<br>the system are referred; Vrms= 1, 1 x V<br>|
|Leakage Current|Idc|The current passing through the varistor at Vdc and at 25°C or at any other specifed<br>temperature|
|Varistor Voltage|Vn|Voltage across the varistor measured at agiven reference current In|
|Reference Current|In|Reference current = 1 mA DC|
|Clamping Voltage<br>Protection Level|Vc|The peak voltage developed across the varistor under standard atmospheric conditions, when<br>passing an 8/20 μs class current pulse|
|Class Current|Ic|<br>A peak value of current which is 1/10 of the maximum peak current for 100 pulses at two per<br>minute for the 8/20 μs pulse|
|Voltage<br>Clamping<br>Ratio|Vc/Vapp|<br>A fgure of merit measure of the varistor clamping effectiveness as defned by the symbols<br>Vc/Vapp, where (Vapp= Vrmsor Vdc)|
|Jump<br>Start<br>Transient|Vjump|The jump start transient resulting from the temporary application of an overvoltage in excess<br>of the rated battery voltage. The circuit power supply may be subjected to a temporary<br>overvoltage condition due to the voltage regulation failing or it may be deliberately generated<br>when it becomes necessary to boost start the car|
|Rated Single Pulse<br>Transient Energy|Wmax|<br>Energy which may be dissipated for a single 10/1,000 μs pulse of a maximum rated current,<br>with rated AC voltage or rated DC voltage also applied, without causing device failure|
|<br>Load<br>Dump<br>Transient|WLD|<br>Load Dump is a transient which occurs in an automotive environment. It is an exponentially<br>decaying positive voltage which occurs in the event of a battery disconect while the alternator<br>is still generating charging current with other loads remaining on the alternator circuit at the<br>time of battery disconect|
|Rated Peak Single<br>Pulse Transient<br>Current|Imax|<br>Maximum peak current which may be applied for a single 8/20 μs pulse, with, rated line<br>voltage also applies, without causing device failure|
|Rated Transient<br>Average Power<br>Dissipation|P|Maximum average power which may be dissipated due to a group of pulses occurring within a<br>specifed isolated time period, without causing device failure at 25°C|
|Capacitance|C|Capacitance between two terminals of the varistor measured at 1 kHz|
|Response Time|tr|The time lagbetween application of a surge and varistor's "turn-on" conduction action|
|Varistor Voltage<br>Temperature<br>Coefcient|TC|(Vnat 85°C – Vnat 25°C)/(Vnat 25°C) x 60°C) x 100|
|Insulation Resistance|IR|Minimum resistance between shorted terminals and varistor surface|
|Isolation<br>Voltage||The maximum peak voltage which may be applied under continuous operating conditions<br>between the varistor terminations and any conducting mounting surface|
|Operating<br>Temperature||<br>The range of ambient temperature for which the varistor is designed to operate continuously as<br>defned by the temperature limits of its climatic category|
|Climatic Category|LCT/UCT/DHD|<br>UCT = Upper Category Temperature – the maximum ambient temperature for which a varistor<br>has been designed to operate continuously, LCT = Lower Category Temperature – the minimum<br>ambient temperature at which a varistor has been designed to operate continuously<br>DHD=Dump Heat Test Duration|
|Storage Temperature||<br>Storage temperature range without voltage applied|



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Surface Mount Varistors VC Low Voltage 125°C 

## 

For a complete list of our global sales offi  ces, please visit www.kemet.com/sales. 

## **Disclaimer** 

All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. 

Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. 

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. 

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. 

_KEMET is a registered trademark of KEMET Electronics Corporation._ 

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