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UCLAMP2411ZATFT
TVS DIODE, BIDIR, 45V, SLP0603P2X3F
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- Manufacturer: SEMTECH
- Product type: TVS Diodes
- Pro; TVS DIODE, BIDIR, 45V, SLP0603P2X3F; Product Range:µClamp Series; TVS Polarity:Bidirectional; Reverse Standoff Voltage:24V; Clamping Voltage Max:45V; Diode Case Style:SLP0603P2X3
- SVHC: To Be Advised
- No. of Pins: 2Pins
- TVS Polarity: Bidirectional
- Product Range: µClamp Series
- Qualification: -
- Diode Mounting: Surface Mount
- Diode Case Style: SLP0603P2X3F
- Clamping Voltage Max: 45V
- Reverse Standoff Voltage: 24V
- Maximum Breakdown Voltage: 36V
- Minimum Breakdown Voltage: 27V
- Operating Temperature Max: 85°C
- Peak Pulse Power Dissipation: 150W
| Delivery and price | |
|---|---|
| Units per pack | 500 |
| Price | 0.15 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
**μClamp2411ZA Ultra Small µClamp® 1-Line, 24V ESD Protection** ## **PROTECTION PRODUCTS** ## **Description** ## **Features** μClamp® TVS diodes are designed to protect sensitive electronics from damage or latch-up due to ESD. It features large cross-sectional area junctions for conducting high transient currents. This device offers desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. μClamp®2411ZA is in a 2-pin SLP0603P2X3F package. It measures 0.6 x 0.3 mm with a nominal height of only 0.25mm. Leads are finished with lead-free NiAu. Each device will protect one line operating at 24 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, tablets, and notebook computers. - Transient protection for data and power lines to IEC 61000-4-2 (ESD) IEC 61000-4-4 (EFT) Cable Discharge Event (CDE) - Ultra-small package - Protects one data or DC Power line - Low clamping voltage - Working voltage: 24V - Low leakage current - Solid-state silicon-avalanche technology ## **Mechanical Characteristics** - SLP0603P2X3F package - Pb-Free, Halogen Free, RoHS/WEEE compliant - Nominal Dimensions: 0.6 x 0.3 x 0.25 mm - Lead Finish: NiAu - Marking: Marking code - Packaging: Tape and Reel ## **Applications** - Cellular Handsets & Accessories - Notebook Computers - Tablets - Portable Instrumentation - Chip-on-Glass Driver IC data line - Peripherals - 24V DC Power Rails **Package Dimension** ## **Schematic & Pin Configuration** **==> picture [112 x 153] intentionally omitted <==** **----- Start of picture text -----**<br> a 0.600<br>0.220 0.300<br>0.160<br>is 0.355 BSC<br>4<br>0.250<br>ns<br>Nominal Dimensions in mm<br>**----- End of picture text -----**<br> **==> picture [107 x 120] intentionally omitted <==** **----- Start of picture text -----**<br> 1<br>2<br>SLP0603P2X3F (Bottom View)<br>**----- End of picture text -----**<br> www.semtech.com **1 of 7 Semtech Proprietary & Confidential** **μClamp2411ZA Final Datasheet Rev 3.1 Revision Date 1/24/2017** ## **Absolute Maximum Rating** **==> picture [542 x 24] intentionally omitted <==** **----- Start of picture text -----**<br> Rating Symbol Value Units<br>**----- End of picture text -----**<br> |**Rating**|**Symbol**|**Value**|**Units**| |---|---|---|---| ||||| |Peak Pulse Power (tp= 8/20µs)|PPK|150|W| |Peak Pulse Current (tp= 8/20µs)|IPP|3|A| |ESD per IEC 61000-4-2 (Air)(1)<br>ESDper IEC 61000-4-2 (Contact)(1)|VESD|±20<br>±17|kV| |Operating Temperature|TJ|-40 to +85|OC| |Storage Temperature|TSTG|-55 to +150|OC| ## **Electrical Characteristics (T=25[O] C unless otherwise specified)** **==> picture [542 x 28] intentionally omitted <==** **----- Start of picture text -----**<br> Parameter Symbol Conditions Min. Typ. Max. Units<br>**----- End of picture text -----**<br> |**Parameter**|**Symbol**|**Conditions**|**Min.**|**Typ.**|**Max.**|**Units**| |---|---|---|---|---|---|---| |||||||| |Reverse Stand-Of Voltage|VRWM|Pin 1 to 2 or Pin 2 to Pin 1|||24|V| |Reverse Breakdown Voltage|VBR|IBR= 1mA, Pin 1 to 2 or Pin 2 to 1|27|32|36|V| |Reverse Leakage Current|IR|VRWM= 24V, Pin 1 to 2 or Pin 2 to Pin 1||0.05|0.100|μA| |Clamping Voltage|VC|IPP= 2A, tp = 8/20µs|||45|V| |ESD Clamping Voltage2|VC|I= 4A, tlp = 0.2/100ns||36||V| |||I=16A, tlp = 0.2/100ns||48||| |Dynamic Resistance2,3|RDYN|tlp= 0.2/100ns||1||Ω| |Junction Capacitance|CJ|I/O to GND, VR= 0V, f = 1MHz||9|15|pF| ## Notes: 1) ESD gun return path connected to ESD ground plane. 2) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A **2 of 7 Semtech Proprietary & Confidential** **μClamp2411ZA Final Datasheet Rev 3.1 Revision Date 1/24/2017** www.semtech.com ## **Typical Characteristics** ## **ESD Clamping (8kV Contact per IEC 61000-4-2)** **==> picture [249 x 181] intentionally omitted <==** **----- Start of picture text -----**<br> 100<br>Measured with 50 Ohm scope input<br>90 impedance, 2GHz bandwidth. Corrected<br>for 50 Ohm, 20dB attenuator. ESD gun<br>80 return path connected to ESD ground plane.<br>70<br>60<br>50<br>40<br>30<br>20<br>10<br>0<br>-10<br>-10 0 10 20 30 40 50 60 70 80<br>Time (ns)<br> (V)<br>C<br>Clamping Voltage - V<br>**----- End of picture text -----**<br> ## **TLP Characteristic (Positive Pulse)** **==> picture [249 x 391] intentionally omitted <==** **----- Start of picture text -----**<br> 30<br>Transmission Line Pulse Test<br>(TLP) Settings:<br>25 tp = 100ns, tr = 0.2ns,<br>ITLP and VTLP averaging window:<br>t1 = 70ns to t2 = 90ns<br>20<br>15<br>10<br>5<br>0<br>-5<br>0 20 40 60 80 100<br>Clamping Voltage (V)<br>Capacitance vs. Reverse Voltage<br>10<br>9<br>8<br>7<br>6<br>5<br>4<br>3<br>2<br>1 f = 1MHz<br>T=25 [o] C<br>0<br>0 4 8 12 16 20 24<br>Voltage (V)<br>TLP Current (A)<br> (pF)Junction Capacitance - CJ<br>**----- End of picture text -----**<br> ## **ESD Clamping (-8kV Contact per IEC 61000-4-2)** **==> picture [248 x 181] intentionally omitted <==** **----- Start of picture text -----**<br> 10<br>0<br>-10<br>-20<br>-30<br>-40<br>-50<br>-60<br>-70 Measured with 50 Ohm scope input<br>impedance, 2GHz bandwidth. Corrected<br>-80 for 50 Ohm, 20dB attenuator. ESD gun<br>return path connected to ESD ground plane.<br>-90<br>-10 0 10 20 30 40 50 60 70 80<br>Time (ns)<br> (V)<br>C<br>Clamping Voltage - V<br>**----- End of picture text -----**<br> ## **Clamping Voltage vs. Peak Pulse Current** **==> picture [246 x 179] intentionally omitted <==** **----- Start of picture text -----**<br> 70<br>60<br>50<br>40<br>30<br>20<br>10 TA = 25 [O] C<br>Waveform: tp= 8x20us<br>0<br>0 1 2 3 4<br>Peak Pulse Current - IPP (A)<br> (V)<br>C<br>Clamping Voltage - V<br>**----- End of picture text -----**<br> **Insertion Loss-S21** **==> picture [245 x 179] intentionally omitted <==** **----- Start of picture text -----**<br> 0<br>-2<br>-4<br>-6<br>-8<br>-10<br>-12<br>-14<br>-16<br>-18<br>-20<br>0 3 30 300 3000<br>Frequency (MHz)<br>Insertion Loss - IL (dB)<br>**----- End of picture text -----**<br> **3 of 7 Semtech Proprietary & Confidential** **μClamp2411ZA Final Datasheet Rev 3.1 Revision Date 1/24/2017** www.semtech.com ## **Application Information** ## **Assembly Guidelines** The small size of this device means that some care must be taken during the mounting process to insure reliable solder joints. The figure at the right details Semtech’s recommended mounting pattern. Recommended assembly guidelines are shown in Table 1. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. Exact manufacturing parameters will require some experimentation to get the desired solder application. Semtech’s recommended mounting pattern is based on the following design guidelines: ## **Land Pattern** The recommended land pattern follows IPC standards and is designed for maximum solder coverage. Detailed dimensions are shown elsewhere in this document. ## **Recommended Mounting Pattern** **==> picture [161 x 181] intentionally omitted <==** **----- Start of picture text -----**<br> Stencil Aperture<br>Mounting Pad<br>Package<br>0.175<br>0.272 0.250<br>0.298<br>0.270<br>**----- End of picture text -----**<br> ## **Solder Stencil** Stencil design is one of the key factors which will determine the volume of solder paste which is deposited onto the land pad. The area ratio of the stencil aperture will determine how well the stencil will print. The area ratio takes into account the aperture shape, aperture size, and stencil thickness. An area ratio of 0.70 – 0.75 is preferred for the subject package. The area ratio of a rectangular aperture is given as: Area Ratio = (L * W )/ (2 * (L + W) * T) Where: L = Aperture Length W = Aperture Width T = Stencil Thickness Semtech recommends a stencil thickness of 0.100mm for this device. The stencil should be laser cut with electropolished finish. The stencil should have a positive taper of approximately 5 degrees. Electropolishing and tapering the walls results in reduced surface friction and better paste release. For small pitch components, Semtech recommends a square aperture with rounded corners for consistent solder release. Due to the small aperture size, a solder paste with Type 4 or smaller particles are recommended. |Assembly Parameter|Recommendation| |---|---| |Solder Stencil Design|Laser cut, Electro-polished| |Aperture shape|Rectangular with rounded<br>corners| |Solder Stencil Thickness|0.100 mm (0.004")| |Solder Paste Type|Type 4 size sphere or smaller| |Solder Reflow Profile|Per JEDEC J-STD-020| |PCB Solder Pad Design|Non-Solder mask defined| |PCB Pad Finish|OSP OR NiAu| **4 of 7 Semtech Proprietary & Confidential** **μClamp2411ZA Final Datasheet Rev 3.1 Revision Date 1/24/2017** www.semtech.com ## **Outline Drawing - SLP0603P2X3F** **==> picture [542 x 333] intentionally omitted <==** **----- Start of picture text -----**<br> A D B DIMENSIONS<br>MILLIMETERS<br>DIM<br>MIN NOM MAX<br>A 0.235 0.250 0.265<br>E A1 0.000 0.010 0.050<br>b 0.200 0.220 0.240<br>D 0.580 0.600 0.620<br>E 0.280 0.300 0.320<br>e 0.355 BSC<br>TOP VIEW L 0.140 0.160 0.180<br>N 2<br>aaa 0.08<br>bbb 0.10<br>A<br>SEATING<br>aaa C PLANE<br>C<br>A1<br>e/2<br>R0.025<br>TYP<br>bxN<br>bbb C A B<br>2X L<br>e<br>BOTTOM VIEW<br>NOTES:<br>1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).<br>**----- End of picture text -----**<br> ## **Land Pattern - SLP0603P2X3F** **==> picture [226 x 116] intentionally omitted <==** **----- Start of picture text -----**<br> DIMENSIONS<br>DIM MILLIMETERS<br>Z (C) (0.425)<br>(C) G G 0.175<br>X 0.270<br>Y 0.250<br>Z 0.675<br>Y<br>X<br>**----- End of picture text -----**<br> ## NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. **5 of 7 Semtech Proprietary & Confidential** **μClamp2411ZA Final Datasheet Rev 3.1 Revision Date 1/24/2017** www.semtech.com ## **Marking Code** ## n ## **Tape and Reel Specification** **==> picture [63 x 22] intentionally omitted <==** **----- Start of picture text -----**<br> n n n<br>**----- End of picture text -----**<br> ## **Orderin Information g** **==> picture [262 x 20] intentionally omitted <==** **----- Start of picture text -----**<br> Part Number Qty per Reel Reel Size<br>**----- End of picture text -----**<br> |μClamp2411ZATFT|15,000|7”| |---|---|---| |MicroClamp, uClamp and µClamp are registered trademarks of Semtech||| |Corporation.||| **6 of 7 Semtech Proprietary & Confidential** **μClamp2411ZA Final Datasheet Rev 3.1 Revision Date 1/24/2017** www.semtech.com **==> picture [144 x 31] intentionally omitted <==** ## **IMPORTANT NOTICE** **Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale.** **SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise.** **The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved.** ## **© Semtech 2015** ## **Contact Information** **Semtech Corporation 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com** **7 of 7 Semtech Proprietary & Confidential** **μClamp2411ZA Final Datasheet 3.1 Revision Date 1/24/2017**
Updated at April 15, 2026
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