TSUP8M45SH

## **TSUP8M45SH** KD ER EEE Taiwan Semiconductor 

## **8A, 45V Trench Schottky Rectifiers** 

## FEATURES 

- AEC-Q101 qualified 

- Patented Trench Schottky technology 

- Low power loss, high efficiency 

- Ideal for automated placement 

- Wettable flank 

- Moisture sensitivity level: level 1, per J-STD-020 

- RoHS Compliant 

- Halogen-free according to IEC 61249-2-21 

## APPLICATIONS 

- Switching mode power supply (SMPS) 

- Adapters 

- Lighting application 

- On-board DC/DC converter 

- Automotive 

|KEY PARAMETERS|KEY PARAMETERS|KEY PARAMETERS|
|---|---|---|
|PARAMETER|VALUE|UNIT|
|IF|8|A|
|VRRM|45|V|
|IFSM|150|A|
|TJ MAX|175|°C|
|Package|SMPC4.6U||



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(Pd) ROHS HALOGEN<br>— compuant FREE<br>3<br>1<br>2<br>**----- End of picture text -----**<br>


## MECHANICAL DATA 

- Case: SMPC4.6U 

- Molding compound meets  UL 94V-0 flammability rating 

- Terminal: Matte tin plated leads, solderable per J-STD-002 

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SMPC4.6U<br>**----- End of picture text -----**<br>


- Meet JESD 201 class 2 whisker test 

- Polarity: As marked 

- Weight: 104mg (approximately) 

|ABSOLUTE MAXIMUM RATINGS (TA= 25°C unless otherwise noted)|ABSOLUTE MAXIMUM RATINGS (TA= 25°C unless otherwise noted)|ABSOLUTE MAXIMUM RATINGS (TA= 25°C unless otherwise noted)|ABSOLUTE MAXIMUM RATINGS (TA= 25°C unless otherwise noted)|ABSOLUTE MAXIMUM RATINGS (TA= 25°C unless otherwise noted)|
|---|---|---|---|---|
|PARAMETER||SYMBOL|TSUP8M45SH|UNIT|
|Marking code on the device|||8M45||
|Repetitive peak reverse voltage||VRRM|45|V|
|Reverse voltage, total rms value||VR(RMS)|32|V|
|Forward current||IF|8|A|
|Surge peak forward current single<br>half sine-wave superimposed on<br>rated load|8.3 ms at TA= 25°C|IFSM|150|A|
||1.0 ms at TA= 25°C||286||
|Junction temperature||TJ|-55 to +175|°C|
|Storage temperature||TSTG|-55 to +175|°C|



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## SEMICONDUCTOR(i 

|THERMAL PERFORMANCE|THERMAL PERFORMANCE|THERMAL PERFORMANCE|THERMAL PERFORMANCE|
|---|---|---|---|
|PARAMETER|SYMBOL|TYP|UNIT|
|Junction-to-lead thermal resistance|RӨJL|7|°C/W|
|Junction-to-ambient thermal resistance|RӨJA|56|°C/W|
|Junction-to-case thermal resistance|RӨJC|12|°C/W|



**Thermal Performance Note:** Units mounted on PCB (16mm x 16mm Cu pad test board) 

|ELECTRICAL SPECIFICATIONS (TA= 25°C unless otherwise noted)|ELECTRICAL SPECIFICATIONS (TA= 25°C unless otherwise noted)|ELECTRICAL SPECIFICATIONS (TA= 25°C unless otherwise noted)|ELECTRICAL SPECIFICATIONS (TA= 25°C unless otherwise noted)|ELECTRICAL SPECIFICATIONS (TA= 25°C unless otherwise noted)|ELECTRICAL SPECIFICATIONS (TA= 25°C unless otherwise noted)|
|---|---|---|---|---|---|
|PARAMETER|CONDITIONS|SYMBOL|TYP|MAX|UNIT|
|Forward voltage(1)|IF= 4.0A, TJ= 25°C|VF|0.48|-|V|
||IF= 8.0A, TJ= 25°C||0.54|0.60|V|
||IF= 4.0A, TJ= 125°C||0.38|-|V|
||IF= 8.0A, TJ= 125°C||0.46|0.54|V|
|Reverse current @ rated VR (2)|TJ= 25°C|IR|-|200|µA|
||TJ= 125°C||-|8|mA|
|Junction capacitance|1 MHz, VR=4.0V|CJ|932|-|pF|



## **Notes:** 

1. Pulse test with PW=0.3 ms 

2. Pulse test with PW=30 ms 

## ORDERING INFORMATION 

|ORDERING INFORMATION|||
|---|---|---|
|ORDERING CODE|PACKAGE|PACKING|
|TSUP8M45SH M3G|SMPC4.6U|1,500/7” reel|
|TSUP8M45SH M2G|SMPC4.6U|6,000/13” reel|



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## CHARACTERISTICS CURVES 

(TA = 25°C unless otherwise noted) 

## **Fig.1 Forward Current Derating Curve** 

## **Fig.2 Typical Junction Capacitance** 

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10<br>8<br>6<br>4<br>2<br>0 a<br>0 25 50 75 100 125 150 175<br>LEAD TEMPERATURE ( ° C)<br>AVERAGE FORWARD CURRENT (A)<br>**----- End of picture text -----**<br>


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10000.0<br>1000.0<br>f=1.0MHz<br>Vsig=50mVp-p<br>100.0<br>1 10 100<br>REVERSE VOLTAGE (V)<br>CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


## **Fig.3 Typical Reverse Characteristics** 

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100000<br>TJ=175 ° C<br>10000<br>1000<br>TJ=125 ° C<br>100<br>10<br>1 TJ=25 ° C<br>0.1<br>10 20 30 40 50 60 70 80 90 100<br>PERCENT OF RATED PEAK REVERSE VOLTAGE (%)<br>INSTANTANEOUS REVERSE CURRENT (μA)<br>**----- End of picture text -----**<br>


## **Fig.4 Typical Forward Characteristics** 

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100<br>TJ=175 ° C<br>10<br>TJ=125 ° C<br>TJ=25 ° C<br>1<br>TJ=-55 ° C<br>Pulse width 300μs<br>1% duty cycle<br>0.1<br>0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8<br>FORWARD VOLTAGE (V)<br>INSTANTANEOUS FORWARD CURRENT (A)<br>**----- End of picture text -----**<br>


## **Fig.5 Typical Transient Thermal  Impedance** 

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100<br>10<br>1<br>0.1<br>0.01<br>0.001<br>0.0001 ceminee<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100<br>PULSE DURATION (s)<br>TRANSIENT THERMAL IMPEDANCE (°C/W)<br>**----- End of picture text -----**<br>


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os SEMICONDUCTOR(pg **TSUP8M45SH** Taiwan Semiconductor 

## PACKAGE OUTLINE DIMENSIONS (Unit: Millimeters) 

**SMPC4.6U** 

## SUGGESTED PAD LAYOUT 

## MARKING DIAGRAM 

- P/N = Marking Code YW = Date Code F = Factory Code 

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SEMICONDUCTOR(i 

## **Notice** 

Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. 

Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. 

Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. 

The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 

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