TBPLLNN015PGUCV

Basic Board Mount Pressure Sensors **TBP Series, Compensated/Unamplified** 60 mbar to 10 bar | 6 kPa to 1 MPa | 1 psi to 150 psi Millivolt Analog Output 

Datasheet 

## Basic Board Mount Pressure Sensors 

Honeywell’s Basic Board Mount Pressure Sensors, TBP Series, Compensated/Unamplified, are piezoresistive silicon pressure sensors designed for customers who require a simple, high quality, cost-effective, mV output, unamplified, temperaturecompensated sensor for use in medical and industrial applications. 

These unamplified and temperature-compensated sensors offer infinite resolution of the pressure signal. They will operate as specified from -40 °C to 125 °C [-40 °F to 257 °F]. 

The TBP Series is often ideal for those customers who want to do their own amplification in order to make use of the maximum resolution of the bare sensor output, leveraging any algorithm needed for the application. 

They are available with several package styles and mounting options, making it easier for device manufacturers to integrate the product into their applications. 

The TBP Series measures gage pressures. Gage pressure sensors are referenced to atmospheric pressure and provide an output proportional to pressure variations from atmosphere. 

They are intended for use with non-corrosive, non-ionic gases, such as air and other dry gases, and for non-corrosive, nonionic liquids when the silicone gel coating option is selected. All products are designed and manufactured according to ISO 9001. 

## _**Why choose a Honeywell Basic Pressure Sensor?**_ 

- **Cost-effective:** Provides a cost-effective, highvolume solution with a variety of options 

- **Compensated, unamplified:** Ideal  for customers who want a temperature-compensated sensor with the maximum possible resolution 

- | **Flexible:** Package and pressure port options simplify integration into the application 

- **Durable:** Wide operating temperature range and media compatibility options 

- **High quality:** Six Sigma standards provide the highest level of product quality, performance, and consistency 

- **Reliable:** Dependable supply chain is there throughout your development cycle 

- • **Delivery:** Fast response to orders and sample requests 

- | 

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Leadless Leadless<br>SMT-AN SMT-LN<br>Leadless<br>SMT-PN<br>Pa<br>SMT-AN SMT-LN<br>SMT-PN<br>&4«,<br>DIP-AN DIP-LN<br>DIP-PN<br>AAS<br>**----- End of picture text -----**<br>


Cost EffECtivE • DurablE • HigH Quality 

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## Features and Benefits 

## _**Cost-effective sensing solution.**_ 

## **CoST-eFFeCTIve SeNSoRS wITH MANy oPTIoNS** 

Helps customers to meet their specific application needs. 

## _**Frees up PCB space, reduces costs.**_ 

## **SMALL PACkAge SIze** 

7 mm x 7 mm [0.276 in x 0.276 in], which is very small when compared to most board mount pressure sensors, occupying less space on the PCB (printed circuit board) and typically allowing for easy placement on crowded PCBs or in small devices. 

## _**Performs in tough environments with wet and dry media.**_ 

## **wIDe oPeRATINg TeMPeRATURe RANge oF -40 °C To 125 °C [-40 °F To 257 °F]** 

Allows for use in many applications 

## **MeDIA CoMPATIBILITy oPTIoNS:** 

- **No gel coating:** The input port is limited to non-corrosive, non-ionic 

media such as dry air and gases and should not be exposed to condensation. The gases are limited to media that are compatible with high temperature polyamide, silicone, alumina ceramic, silicon, gold, and glass. 

- **Silicone gel coating:** Uses the same materials in the wetted media path but 

- is protected from condensation by a silicone-based gel coating; allows use in applications where condensation can occur. 

## **RoHS AND ISo 9001 CoMPLIANCe** 

## _**Flexibility simplifies integration.**_ 

## **MANy PACkAge STyLeS, PReSSURe RANgeS, SILICoNe geL CoATINg AND PoRTINg oPTIoNS** 

Simplifies integration into the device manufacturer’s application. 

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Features and Benefits 

## **SUPPoRTS LeAN MANUFACTURINg** 

- J-STD-020-D MSL 1 unlimited shelf life after packaging is opened. 

- System can be calibrated within one hour after reflow solder. 

- Compatible with modern lead-free and no-clean solder processes. 

## _**Honeywell—the gold standard of quality and value.**_ 

## **MANUFACTURINg exCeLLeNCe** 

Honeywell has more than 100 years of manufacturing and engineering excellence. 

## **FAST ReqUeST FoR qUoTeS (RFqS)** 

Responding quickly to your RFQs and product sample needs are hallmarks of Honeywell. 

## **FAST ReSPoNSe FoR SAMPLeS** 

Dedicated teams and manufacturing processes help ensure that product samples are shipped quickly and delivered in time to support your development cycle. 

## **ReLIABLe SUPPLy CHAIN** 

Honeywell’s effective inventory management and dependable supply chain are there throughout your product life cycle. 

## **DeSIgNeD To SIx SIgMA STANDARDS** 

Six Sigma standards provide the highest level of product quality, performance and consistency. Six Sigma provides confidence that the sensor will perform to specification. Many competitive products are produced to lower Sigma tolerances, which may result in some products not performing to the specification to which they were designed. 

## **SUPPoRTINg DoCUMeNTATIoN** 

Honeywell’s website provides technical materials to assist you in your application needs. 

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## Potential Applications 

## **MeDICAL** 

- **Hospital beds** 

- **oxygen concentrators** 

- **Wound tHerapy** 

- **blood pressure monitoring** 

## **INDUSTRIAL** 

- **HvAC TRANSMITTeRS** 

- **air movement control** 

- **environmental control** 

- **leak detection** 

- **industrial controls** 

- **pneumatic controls** 

- **otHer commercial applications** 

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## TBP Series, Compensated/Unamplified 

## **Figure 1. Nomenclature and order guide** 

For example, **TBPDANN150PGUCV** defines a TBP Series Basic Board Mount Pressure Sensor, DIP package, AN pressure port, no gel coating in media path,150 psi gage pressure range, unamplified, compensated, constant supply voltage. 

**TBP  D  AN  N  150PG  U  C V** 

**Series TBP Supply Voltage Package V** Constant **D** DIP (Dual Inline Pin) **L** Leadless SMT (Surface Mount Technology) **Compensation M**[SMT (Surface Mount Technology)] **C** Compensated **Pressure Port** DIP Leadless SMT SMT **AN** Single axial **AN** Single axial **AN** Single axial **Output** barbed port barbed port barbed port **U** Unamplified **Pressure Range** i 4 4 E ~~a~~ **LN** Single axial **LN** Single axial **LN** Single axial 60 mbar to 10 bar 6 kPa to 1 MPa 1 psi to 150 psi barbless port barbless port barbless port _Gage Gage Gage_ **060MG** 0 mbar to 60 mbar **006KG** 0 kPa to 6 kPa **001PG** 0 psi to 1 psi **100MG** 0 mbar to 100 mbar **010KG** 0 kPa to 10 kPa **005PG** 0 psi to 5 psi **160MG** 0 mbar to 160 mbar **016KG** 0 kPa to 16 kPa **015PG** 0 psi to 15 psi **PN** Low-profile **PN** Low-profile **PN** Low-profile **250MG** 0 mbar to 250 mbar **025KG** 0 kPa to 25 kPa **030PG** 0 psi to 30 psi port port port **400MG** 0 bar to 400 mbar **040KG** 0 kPa to 40 kPa **060PG** 0 psi to 60 psi **600MG** 0 bar to 600 mbar **060KG** 0 kPa to 60 kPa **100PG** 0 psi to 100 psi 444 (333 **001BG** 0 bar to 1 bar **100KG** 0 kPa to 100 kPa **150PG** 0 psi to 150 psi **1.6BG** 0 bar to 1.6 bar **160KG** 0 kPa to 160 kPa **Gel Coating Option 2.5BG** 0 bar to 2.5 bar **250KG** 0 kPa to 250 kPa **004BG** 0 bar to 4 bar **400KG** 0 kPa to 400 kPa **N** No gel coating in media path **006BG** 0 bar to 6 bar **600KG** 0 kPa to 600 kPa **S** Silicone gel coating in media path **010BG** 0 bar to 10 bar **001GG** 0 kPa to 1 MPa 

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## Basic Board Mount Pressure Sensors 

## **Table 1. Absolute Maximum Ratings[1]** 

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Characteristic Min. Max. Unit<br>Supply voltage (Vsupply) [2] -12.0 12.0 Vdc<br>Storage temperature -40 [-40] 125 [257] °C [°F]<br>Soldering time and temperature:<br>    lead solder temperature (DIP) 4 s max. at 250 °C [482 °F]<br>    peak reflow temperature (Leadless SMT, SMT) 15 s max. at 250 °C [482 °F]<br>**----- End of picture text -----**<br>


1Absolute maximum ratings are the extreme limits the device will withstand without damage. 

2Incorrect application of supply voltage or ground to the wrong pin may cause electrical failure. 

## **Table 2. operating Specifications** 

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Characteristic Min.  Typ. Max. Unit<br>Supply voltage (Vsupply) [1, 2] 1.5 5.0 12.0 Vdc<br>Supply current (at 5.0 Vdc supply) - 0.6 1 mA<br>-<br>Operating temperature range [3] -40 [-40] 125 [257] °C [°F]<br>-<br>Compensated temperature range [4] 0 [32] 85 [185] °C [°F]<br>Output resistance - 2.5 - kOhm<br>**----- End of picture text -----**<br>


- 1Ratiometricity of the sensor (the ability of the device output to scale to the supply voltage) is achieved within the specified operating voltage. 

- 2Incorrect application of supply voltage or ground to the wrong pin may cause electrical failure. 

3Operating temperature range: The temperature range over which the sensor will produce an output proportional to pressure. 

4Compensated temperature range: The temperature range over which the sensor will produce an output proportional to pressure within the specified performance limits. 

## **Table 3. environmental Specifications** 

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Characteristic Parameter<br>Humidity:<br>    all external surfaces 0 %RH to 95 %RH, non-condensing<br>    internal surfaces of silicone gel coating option 0 %RH to 100 %RH, condensing<br>    internal surfaces of no gel coating option 0 %RH to 95 %RH, non-condensing<br>Vibration MIL-STD-202G, Method 204D, Condition B (15 g, 10 Hz to 2 kHz)<br>Shock MIL-STD-202G, Method 213B, Condition C (100 g, 6 ms duration)<br>Life [1] 1 million pressure cycles min.<br>Solder reflow J-STD-020-D, MSL 1 (unlimited shelf life when stored at less than 30 °C and 85 %RH)<br>**----- End of picture text -----**<br>


1Life may vary depending on specific application in which sensor is utilized. 

## **CAUTION** 

## **MEDIA INCOMPATIBILITY** 

- No gel coating option: The input port is limited to non-corrosive, non-ionic media such as dry air and gases and should not be exposed to condensation. The gases are limited to media that are compatible with the following wetted materials of construction: high temperature polyamide, silicone, epoxy, alumina ceramic, silicon, gold, and glass. 

- Silicone gel coating option: The gel coated sensors use the same materials in the wetted media path but are protected from condensation by a silicone-based gel coating. The gel coating option allows use in applications where condensation can occur. 

**Failure to comply with these instructions may result in product damage.** 

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TBP Series, Compensated/Unamplified 

## **Table 4. wetted Materials** 

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Component No gel Coating option Silicone gel Coating option<br>Ports high temperature polyamide high temperature polyamide<br>Substrate alumina ceramic not exposed - protected by silicone gel<br>Adhesives epoxy, RTV epoxy<br>Electronic components silicon, gold, glass not exposed - protected by silicone gel<br>**----- End of picture text -----**<br>


**Table 5. Pressure Range Specifications for 60 mbar to 10 bar** 

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Thermal<br>Thermal Effect<br>Pressure  Full Scale Span Effect on<br>on Span [5]<br>Range (mV/V) Offset [4]<br>Offset [3] (%FSS) (%FSS)<br>(mV/V)<br>10 ºC  0 ºC  10 ºC  0 ºC<br>Pmin. Pmax. Min. Nom. Max.  to   to  to  to<br> 50 ºC   85 ºC   50 ºC  85 ºC<br>Gage<br>060MG 0 60 mbar 872 1370 ±0.20 ±0.075 1.23 1.30 1.40 ±1.15 ±2.35 ±1.00 ±2.00 ±0.45 ±0.40 ±0.60<br>100MG 0 100 mbar 872 1370 ±0.20 ±0.075 2.06 2.20 2.33 ±0.70 ±1.40 ±1.00 ±2.00 ±0.30 ±0.25 ±0.35<br>160MG 0 160 mbar 2000 4000 ±0.15 ±0.12 2.18 2.30 2.46 ±1.65 ±3.30 ±0.75 ±2.00 ±0.55 ±0.35 ±0.55<br>250MG 0 250 mbar 2000 4000 ±0.15 ±0.12 3.41 3.65 3.85 ±1.05 ±2.10 ±0.75 ±2.00 ±0.35 ±0.20 ±0.35<br>400MG 0 400 mbar 2000 4000 ±0.15 ±0.12 5.45 5.80 6.15 ±0.65 ±1.30 ±0.75 ±2.00 ±0.20 ±0.15 ±0.20<br>600MG 0 600 mbar 4000 8000 ±0.15 ±0.075 2.94 3.05 3.18 ±0.85 ±1.65 ±0.50 ±1.25 ±0.40 ±0.15 ±0.35<br>001BG 0 1 bar 4 8 ±0.15 ±0.075 4.90 5.10 5.30 ±0.50 ±1.00 ±0.50 ±1.25 ±0.25 ±0.10 ±0.20<br>1.6BG 0 1.6 bar 4 8 ±0.15 ±0.075 7.84 8.15 8.48 ±0.30 ±0.65 ±0.50 ±1.25 ±0.15 ±0.10 ±0.15<br>2.5BG 0 2.5 bar 8 17 ±0.15 ±0.075 6.10 6.35 6.59 ±0.40 ±0.80 ±0.50 ±1.50 ±0.20 ±0.10 ±0.15<br>004BG 0 4 bar 10 17 ±0.15 ±0.075 5.57 5.80 6.04 ±0.50 ±1.00 ±0.50 ±1.25 ±0.25 ±0.10 ±0.20<br>006BG 0 6 bar 17 21 ±0.15 ±0.075 5.08 5.30 5.54 ±0.65 ±1.00 ±0.50 ±1.00 ±0.25 ±0.15 ±0.25<br>010BG 0 10 bar 17 21 ±0.15 ±0.075 8.47 8.85 9.22 ±0.40 ±0.60 ±0.50 ±1.00 ±0.15 ±0.10 ±0.15<br>6<br>6<br>1, 2<br>Unit<br>Pressure  (%FSS) (%FSS) (%FSS) (%FSS)<br>Pressure Range   Order Code (see Figure 1) Over Pressure Burst Pressure  Accuracy Long-Term Stability  1000 hr at 25 °C Thermal Hysteresis No Gel Option Thermal Hysteresis Silicone Gel OPtion<br>**----- End of picture text -----**<br>


1Accuracy: The maximum deviation in output from a Best Fit Straight Line (BFSL) fitted to the output measured over the pressure range at 25 °C [77 °F]. Includes all errors due to pressure non-linearity, pressure hysteresis, and non-repeatability. 

2Full Scale Span: The algebraic difference between the output signal measured at the maxumum and minimum limits of the pressure range (see Figure 1) for pressure ranges). 

3Offset: The output signal obtained when the reference pressure is applied to all available pressure ports. Also known as “null” or “zero”. 

4Thermal effect on offset: The deviation in offset due to changes in temperature over the compensated temperature range, relative to offset measured at 25 ºC. 

5Thermal effect on span: The deviation in full scale span due to changes in temperature over the compensated temperature range, relative to full scale span measured at 25 ºC. 

6Thermal hysteresis: The maximum difference between output readings when the same temperature is reached consecutively, under the same operating conditions, with temperature approaching from opposite directions within the operating temperature range. Validated over the full operating temperature and pressure ranges using a ~5 ºC/ minute ramp and 30 minute dwell. Application performance may be affected by thermal mass of end user system. 

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Basic Board Mount Pressure Sensors 

## **Table 6. Pressure Range Specifications for 6 kPa to 1 MPa** 

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Thermal<br>Thermal Effect<br>Pressure  Full Scale Span Effect on<br>on Span [5]<br>Range (mV/V) Offset [4]<br>Offset [3] (%FSS) (%FSS)<br>(mV/V)<br>10 ºC  0 ºC  10 ºC  0 ºC<br>Pmin. Pmax. Min. Nom. Max.  to   to  to  to<br> 50 ºC   85 ºC   50 ºC  85 ºC<br>Gage<br>006KG 0 6 kPa 87 137 ±0.20 ±0.075 1.23 1.30 1.40 ±1.15 ±2.35 ±1.00 ±2.00 ±0.45 ±0.40 ±0.60<br>010KG 0 10 kPa 87 137 ±0.20 ±0.075 2.06 2.20 2.33 ±0.70 ±1.40 ±1.00 ±2.00 ±0.30 ±0.25 ±0.35<br>016KG 0 16 kPa 200 400 ±0.15 ±0.12 2.18 2.30 2.46 ±1.65 ±3.30 ±0.75 ±2.00 ±0.55 ±0.35 ±0.55<br>025KG 0 25 kPa 200 400 ±0.15 ±0.12 3.41 3.65 3.85 ±1.05 ±2.10 ±0.75 ±2.00 ±0.35 ±0.20 ±0.35<br>040KG 0 40 kPa 200 400 ±0.15 ±0.12 5.45 5.80 6.15 ±0.65 ±1.30 ±0.75 ±2.00 ±0.20 ±0.15 ±0.20<br>060KG 0 60 kPa 400 800 ±0.15 ±0.075 2.94 3.05 3.18 ±0.85 ±1.65 ±0.50 ±1.25 ±0.40 ±0.15 ±0.35<br>100KG 0 100 kPa 400 800 ±0.15 ±0.075 4.90 5.10 5.30 ±0.50 ±1.00 ±0.50 ±1.25 ±0.25 ±0.10 ±0.20<br>160KG 0 160 kPa 400 800 ±0.15 ±0.075 7.84 8.15 8.48 ±0.30 ±0.65 ±0.50 ±1.25 ±0.15 ±0.10 ±0.15<br>250KG 0 250 kPa 800 1700 ±0.15 ±0.075 6.10 6.35 6.59 ±0.40 ±0.80 ±0.50 ±1.50 ±0.20 ±0.10 ±0.15<br>400KG 0 400 kPa 1000 1700 ±0.15 ±0.075 5.57 5.80 6.04 ±0.50 ±1.00 ±0.50 ±1.25 ±0.25 ±0.10 ±0.20<br>600KG 0 600 kPa 1700 2100 ±0.15 ±0.075 5.08 5.30 5.54 ±0.65 ±1.00 ±0.50 ±1.00 ±0.25 ±0.15 ±0.25<br>001GG 0 1 MPa 1.70 2.10 ±0.15 ±0.075 8.47 8.85 9.22 ±0.40 ±0.60 ±0.50 ±1.00 ±0.15 ±0.10 ±0.15<br>6<br>6<br>1, 2<br>Unit<br>Pressure  (%FSS) (%FSS) (%FSS) (%FSS)<br>Pressure Range   Order Code (see Figure 1) Over Pressure Burst Pressure  Accuracy Long-Term Stability  1000 hr at 25 °C Thermal Hysteresis No Gel Option Thermal Hysteresis Silicone Gel OPtion<br>**----- End of picture text -----**<br>


1Accuracy: The maximum deviation in output from a Best Fit Straight Line (BFSL) fitted to the output measured over the pressure range at 25 °C [77 °F]. Includes all errors due to pressure non-linearity, pressure hysteresis, and non-repeatability. 

2Full Scale Span: The algebraic difference between the output signal measured at the maxumum and minimum limits of the pressure range (see Figure 1) for pressure ranges). 

3Offset: The output signal obtained when the reference pressure is applied to all available pressure ports. Also known as “null” or “zero”. 

4Thermal effect on offset: The deviation in offset due to changes in temperature over the compensated temperature range, relative to offset measured at 25 ºC. 

5Thermal effect on span: The deviation in full scale span due to changes in temperature over the compensated temperature range, relative to full scale span measured at 25 ºC. 

6Thermal hysteresis: The maximum difference between output readings when the same temperature is reached consecutively, under the same operating conditions, with temperature approaching from opposite directions within the operating temperature range. Validated over the full operating temperature and pressure ranges using a ~5 ºC/ minute ramp and 30 minute dwell. Application performance may be affected by thermal mass of end user system. 

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## TBP Series, Compensated/Unamplified 

**Table 7. Pressure Range Specifications for 1 psi to 150 psi** 

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Thermal<br>Thermal Effect<br>Pressure  Full Scale Span Effect on<br>on Span [5]<br>Range (mV/V) Offset [4]<br>Offset [3] (%FSS) (%FSS)<br>(mV/V)<br>10 ºC  0 ºC  10 ºC  0 ºC<br>Pmin. Pmax. Min. Nom. Max.  to   to  to  to<br> 50 ºC   85 ºC   50 ºC  85 ºC<br>Gage<br>001PG 0 1 psi 12.7 20 ±0.20 ±0.075 1.42 1.50 1.61 ±1.00 ±2.05 ±1.00 ±2.00 ±0.40 ±0.35 ±0.50<br>005PG 0 5 psi 30 60 ±0.15 ±0.12 4.70 5.00 5.30 ±0.75 ±1.50 ±0.75 ±2.00 ±0.25 ±0.15 ±0.25<br>015PG 0 15 psi 60 115 ±0.15 ±0.075 5.06 5.25 5.49 ±0.50 ±0.95 ±0.50 ±1.25 ±0.25 ±0.10 ±0.20<br>030PG 0 30 psi 115 245 ±0.15 ±0.075 5.05 5.25 5.45 ±0.50 ±0.95 ±0.50 ±1.50 ±0.25 ±0.10 ±0.20<br>060PG 0 60 psi 145 245 ±0.15 ±0.075 5.76 6.00 6.24 ±0.50 ±0.95 ±0.50 ±1.25 ±0.25 ±0.10 ±0.20<br>100PG 0 100 psi 245 300 ±0.15 ±0.075 5.83 6.10 6.36 ±0.60 ±0.85 ±0.50 ±1.00 ±0.25 ±0.10 ±0.25<br>150PG 0 150 psi 245 300 ±0.15 ±0.075 8.75 9.15 9.54 ±0.40 ±0.60 ±0.50 ±1.00 ±0.15 ±0.10 ±0.15<br>6<br>6<br>1, 2<br>Unit<br>Pressure  (%FSS) (%FSS) (%FSS) (%FSS)<br>Pressure Range   Order Code (see Figure 1) Over Pressure Burst Pressure  Accuracy Long-Term Stability  1000 hr at 25 °C Thermal Hysteresis No Gel Option Thermal Hysteresis Silicone Gel OPtion<br>**----- End of picture text -----**<br>


1 Accuracy: The maximum deviation in output from a Best Fit Straight Line (BFSL) fitted to the output measured over the pressure range at 25 °C [77 °F]. Includes all errors due to pressure non-linearity, pressure hysteresis, and non-repeatability. 

2 Full Scale Span: The algebraic difference between the output signal measured at the maxumum and minimum limits of the pressure range (see Figure 1) for pressure ranges). 

3 Offset: The output signal obtained when the reference pressure is applied to all available pressure ports. Also known as “null” or “zero”. 

4 Thermal effect on offset: The deviation in offset due to changes in temperature over the compensated temperature range, relative to offset measured at 25 ºC. 

5 Thermal effect on span: The deviation in full scale span due to changes in temperature over the compensated temperature range, relative to full scale span measured at 25 ºC. 

6 Thermal hysteresis: The maximum difference between output readings when the same temperature is reached consecutively, under the same operating conditions, with temperature approaching from opposite directions within the operating temperature range. Validated over the full operating temperature and pressure ranges using a ~5 ºC/ minute ramp and 30 minute dwell. Application performance may be affected by thermal mass of end user system. 

## **Table 8. Sensor Pressure Type** 

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Pressure Type Description<br>Output is proportional to the difference between applied pressure and atmospheric (ambient) pressure. Reference<br>Gage<br>pressure is atmospheric pressure.<br>Figure 2. Typical Temperature Performance<br>The graph below indicates typical error multipliers for Thermal Effect on Offset (TEO) and Thermal Effect on Span (TES) outside the<br>Compensated Temperature Range. See Tables 5-7 for details of the specified maximum errors within the Compensated Temperature Range.<br>4<br>3<br>2<br>1<br>Operating Temperature Range<br>0<br>Compensated Temperature Range<br>-1<br>-2<br>-3<br>-4<br>-40 [-40] -20 [-4] 0 [32] 10 [50] 50 [122] 85 [185] 125 [257]<br>Temperature (°C [°F])<br>for TEO and TES<br>Typical Error Multiplier<br>**----- End of picture text -----**<br>


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## Basic Board Mount Pressure Sensors 

## **Figure 2. DIP Package Dimensional Drawings (For reference only: mm [in].)** 

## **AN: Single axial barbed port** 

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3,50 7,00<br>[0.138]   10,94 MAX. [0.276]<br>4 3 [0.430] 3 4<br>5,50 3,56<br>[0.217] [0.140]<br>11,50<br>[0.45]<br>Ø 1,91<br>INDICATORPIN 1     [0.075]     [0.108]Ø 2,74 [0.010]0,25<br>Ø 2,32<br>1 2     [0.091] 2 1<br>2,23   2,54 TYP. 1,02 4X 0,46<br>[0.088] [0.100] Ø 6,50 [0.040]       [0.018]<br>    [0.256]<br>8,64<br>[0.340]<br>**----- End of picture text -----**<br>


## **Recommended PCB Pad Layout** 

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2,54<br>[0.100]<br>11,50<br>[0.45]<br>Ø 0,813<br>    [0.032]<br>**----- End of picture text -----**<br>


**Table 8. Pinout for DIP Packages** 

## **LN: Single axial barbless port** 

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  10,94 MAX.<br>3,50 [0.430] 7,00<br>[0.138] 5,83 3,84 [0.276]<br>4 3 [0.230] [0.151] 3 4<br>5,50<br>[0.217]<br>11,5<br>Ø 3,18 [0.45]<br>    [0.125]<br>INDICATORPIN 1 [0.010]0,25<br>Ø 6,50<br>1 2     [0.256] 2 1<br>2,23     2,54 TYP. 4X 0,46<br>[0.088] [0.100] 1,02       [0.018]<br>[0.040]<br>8,64<br>[0.340]<br>**----- End of picture text -----**<br>


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Pin 4 Pin 3<br>Vout+ GND<br>Pin 1 Pin 2<br>Vsupply Vout-<br>**----- End of picture text -----**<br>


## **PN: Low-profile port** 

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3,50 3,84 7,00<br>[0.138] [0.151] [0.276]<br>3 4 2,10 3 4<br>[0.083]<br>5,50<br>[0.217]<br>11,5<br>Ø 6,50 [0.45]<br>    [0.256]<br>INDICATORPIN 1 [0.010]0,25<br>1 2 2 1<br>2,23  2,54 TYP. 4X 0,46<br>[0.088] [0.100] 1,02       [0.018]<br>[0.040]<br>8,64<br>[0.340]<br>**----- End of picture text -----**<br>


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## TBP Series, Compensated/Unamplified 

## **Figure 3. Leadless SMT Package Dimensional Drawings (For reference only: mm [in].)** 

**AN: Single axial barbed port** 

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PAD 1   10,94 MAX.<br>INDICATOR [0.430]<br>7,00 3,56      3,84 MAX.     1,00<br>[0.276] [0.140] [0.151]     [0.039]<br>1<br>3,50 6<br>[0.138]<br>[0.276]7,00     [0.075]Ø 1,91 5 2<br>Ø 2,74<br>    [0.108] 4 3<br>Ø 2,32<br>3,50     [0.091] 1,02<br>[0.138] Ø 6,50 [0.040] 2,50 TYP.<br>    [0.256] [0.098]<br>**----- End of picture text -----**<br>


## **Recommended PCB Pad Layout** 

**==> picture [132 x 123] intentionally omitted <==**

**----- Start of picture text -----**<br>
2,54<br>[0.100]<br>2,50<br>[0.098]<br>1,27<br>[0.050]<br>5,46<br>[0.215]<br>**----- End of picture text -----**<br>


**Table 9. Pinout for Leadless SMT Pressure Packages** 

## **LN: Single axial barbless port** 

**==> picture [328 x 111] intentionally omitted <==**

**----- Start of picture text -----**<br>
PAD 1<br>INDICATOR<br>7,00      3,84 MAX.   1,00<br>[0.276] Ø 6,50 [0.151]     [0.039]<br>    [0.256]<br>1<br>6<br>3,50<br>[0.138]<br>[0.276]7,00     [0.125]Ø 3,18 5 2<br>4 3<br>[0.138]3,50 [0.230]5,84 [0.040]1,02          2,50 TYP.[0.098]<br>  10,94 MAX.<br>[0.430]<br>**----- End of picture text -----**<br>


**==> picture [170 x 110] intentionally omitted <==**

**----- Start of picture text -----**<br>
Pad 1 Pad 6<br>Vsupply Vout+<br>Pad 2 Pad 5<br>NC NC<br>Pad 3 Pad 4<br>Vout- GND<br>**----- End of picture text -----**<br>


## **PN: Low-profile port** 

**==> picture [323 x 100] intentionally omitted <==**

**----- Start of picture text -----**<br>
PAD 1<br>INDICATOR<br>[0.276]7,00      3,84 MAX.[0.151]     [0.039]  1,00<br>1<br>6<br>3,50<br>[0.138]<br>[0.276]7,00     [0.256]Ø 6,50 5 2<br>4 3<br>3,50 1,02<br>[0.138] [0.040]          2,50 TYP.<br>[0.098]<br>**----- End of picture text -----**<br>


**12** sensing.honeywell.com 

## Basic Board Mount Pressure Sensors 

## **Figure 4. SMT Package Dimensional Drawings (For reference only: mm [in])** 

**AN: Single axial barbed port** 

**==> picture [347 x 123] intentionally omitted <==**

**----- Start of picture text -----**<br>
10,94<br>3,50 [0.430] 7,00<br>[0.138] 3,84 [0.276]<br>4 3 [0.151] 3 4<br>Ø 2,32<br>    [0.091]<br>5,50<br>[0.217]<br>11,5<br>Ø 2,74 [0.45]<br>    [0.108]<br>4X 1,27<br>PIN 1 Ø 1,91 0,25       [0.050]<br>INDICATOR     [0.075] [0.010]<br>Ø 6,50<br>[0.088]2,25 1      2,54 TYP.2[0.100]     [0.256] [0.040]1,02 3,03       [0.018]4X 0,46 2 1<br>[0.119]<br>**----- End of picture text -----**<br>


## **Recommended PCB Pad Layout** 

**==> picture [61 x 157] intentionally omitted <==**

**----- Start of picture text -----**<br>
2,54<br>[0.100]<br>7,59<br>[0.30]<br>1,143<br>[0.045]<br>**----- End of picture text -----**<br>


**==> picture [50 x 19] intentionally omitted <==**

**----- Start of picture text -----**<br>
     2,032<br>      [0.080]<br>**----- End of picture text -----**<br>


**Table 10. Pinout for SMT Packages** 

## **LN: Single axial barbless port** 

**==> picture [341 x 126] intentionally omitted <==**

**----- Start of picture text -----**<br>
10,94 MAX.<br>3,50 [0.430] 7,00<br>[0.138] 5,83 3,84 [0.276]<br>4 3 [0.230] [0.151] 3 4<br>5,50<br>[0.217]<br>Ø 3,18 11,5<br>    [0.125] [0.45]<br>4X 1,27<br>PIN 1 0,25       [0.050]<br>INDICATOR Ø 6,50 [0.010]<br>    [0.256]<br>[0.088]2,25 1      2,54 TYP2[0.100]. [0.040]1,02 [0.119]3,03       [0.018]4X 0,46 2 1<br>**----- End of picture text -----**<br>


**==> picture [170 x 74] intentionally omitted <==**

**----- Start of picture text -----**<br>
Pin 4 Pin 3<br>Vout+ GND<br>Pin 1 Pin 2<br>Vsupply Vout-<br>**----- End of picture text -----**<br>


## **PN: Low-profile port** 

**==> picture [335 x 110] intentionally omitted <==**

**----- Start of picture text -----**<br>
[0.138]3,50           3,84 MAX.[0.151] [0.276]7,00<br>4 3 [0.083]2,10 3 4<br>5,50<br>[0.217]<br>Ø 6,50 11,5<br>    [0.256] [0.45]<br>4X 1,27<br>PIN 1 0,25       [0.050]<br>INDICATOR [0.010]<br>1 2 1,02 4X 0,46 2 1<br>2,25      2,54 TYP. [0.040] 3,03       [0.018]<br>[0.088] [0.100] [0.119]<br>**----- End of picture text -----**<br>


**13** 

sensing.honeywell.com 

## **ADDITIoNAL INFoRMATIoN** 

The following associated literature is available at sensing.honeywell.com: 

## **WARNING** 

## **PERSONAL INJURY** 

- Board Mount Pressure Sensors Line Guide 

- Airflow, Force, and Pressure Sensors Product Range Guide 

- Product Installation Instructions 

- Product Nomenclature Tree and Order Guide 

- Selection Guides 

- Application-specific Information 

**DO NOT USE** these products as safety or emergency stop devices or in any other application where failure of the product could result in personal injury. 

**Failure to comply with these instructions could result in death or serious injury.** 

## **WARNING** 

## **MISUSE OF DOCUMENTATION** 

- The information presented in this datasheet is for reference only. Do not use this document as a product installation guide. 

- Complete installation, operation, and maintenance information is provided in the instructions supplied with each product. 

**Failure to comply with these instructions could result in death or serious injury.** 

## **wARRANTy/ReMeDy** 

## **Find out more** 

Honeywell serves its customers through a worldwide network of sales offices, representatives and distributors. For application assistance, current specifications, pricing or name of the nearest Authorized Distributor, contact your local sales office. 

Honeywell warrants goods of its manufacture as being free of defective materials and faulty workmanship. Honeywell’s standard product warranty applies unless agreed to otherwise by Honeywell in writing; please refer to your order acknowledgement or consult your local sales office for specific warranty details. If warranted goods are returned to Honeywell during the period of coverage, Honeywell will repair or replace, at its option, without charge those items it finds defective. **The foregoing is buyer’s sole remedy and is in lieu of all other warranties, expressed or implied, including those of merchantability and fitness for a particular purpose. In no event shall Honeywell be liable for consequential, special, or indirect damages.** 

While we provide application assistance personally, through our literature and the Honeywell website, it is up to the customer to determine the suitability of the product in the application. 

Specifications may change without notice. The information we supply is believed to be accurate and reliable as of this printing. However, we assume no responsibility for its use. 

To learn more about Honeywell’s sensing and control products, call **+1-815-235-6847 or 1-800-537-6945** , visit **sensing.honeywell.com,** or e-mail inquiries to **info.sc@honeywell.com** 

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50092900-B-EN IL50 October 2014 © 2014 Honeywell International Inc. All rights reserved.