SZNZ9F6V2ST5G
Zener Single Diode, 6.2 V, 250 mW, SOD-923, 2 Pins, 150 °C, Surface Mount
- Manufacturer: ONSEMI
- Product type: Zener Single Diodes
- SVHC: No SVHC (25-Jun-2025)
- No. of Pins: 2Pins
- Product Range: NZ9F-S Series
- Qualification: AEC-Q101
- Diode Mounting: Surface Mount
- Diode Case Style: SOD-923
- Power Dissipation: 250mW
- Zener Voltage Nom: 6.2V
- Operating Temperature Max: 150°C
| Delivery and price | |
|---|---|
| Units per pack | 8000 |
| Price | 0.046 € |
| Current stock | 10+ |
| Lead time | 30 days |
## NZ9F2V4ST5G, SZNZ9F2V4ST5G SERIES
## Zener Voltage Regulators
## **250 mW SOD−923 Surface Mount**
This series of Zener diodes is packaged in a SOD−923 surface mount package. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, hand held portables, and high density PC boards.
## **Specification Features**
## **http://onsemi.com**
**==> picture [104 x 16] intentionally omitted <==**
**----- Start of picture text -----**<br>
1 2<br>Cathode Anode<br>**----- End of picture text -----**<br>
- Standard Zener Breakdown Voltage Range −2.4 V to 18 V
- Steady State Power Rating of 250 mW
- Small Body Outline Dimensions: 0.039″ x 0.024″ (1.00 mm x 0.60 mm)
- Low Body Height: 0.016″ (0.40 mm)
- ESD Rating of Class 3 (>16 kV) per Human Body Model
- Tight Tolerance VZ
- SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
- These are Pb−Free Devices
## **Mechanical Characteristics**
> **CASE:** Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94, V−0
**LEAD FINISH:** 100% Matte Sn (Tin)
**MOUNTING POSITION:** Any **QUALIFIED MAX REFLOW TEMPERATURE:** 260°C Device Meets MSL 1 Requirements
## **MAXIMUM RATINGS**
|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**<br>~~a~~|**Symbol**<br>~~a~~|**Max**<br>~~a~~|**Unit**<br>~~a~~|
|Total Device Dissipation FR−5 Board,<br>(Note 1) @ TA= 25°C<br>Derate above 25°C<br>~~a~~|PD<br>~~a~~|250<br>2.0<br>~~a~~|mW<br>mW/°C<br>~~a~~|
|Thermal Resistance from<br>Junction−to−Ambient<br>~~po~~|R JA<br>~~po~~<br>~~ee ee~~|500<br>~~po~~<br>~~ee~~|°C/W<br>~~po~~<br>~~ee~~|
|Junction and Storage Temperature Range<br>~~ee~~|TJ, Tstg<br>~~ee~~<br>~~ee ee~~|−65 to<br>+150<br>~~ee~~<br>~~ee~~|°C<br>~~ee~~<br>~~ee~~|
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−4 Minimum Pad.
**==> picture [147 x 63] intentionally omitted <==**
**----- Start of picture text -----**<br>
MARKING<br>2<br>DIAGRAM<br>©<br>1<br>X M<br>SOD−923<br>CASE 514AB 1 2<br>**----- End of picture text -----**<br>
X = Specific Device Code M = Month Code = Pb−Free Package
(Note: Microdot may be in either location)
## **ORDERING INFORMATION**
|**Device**|**Package**|**Shipping**†|
|---|---|---|
|NZ9FxxxST5G,<br>SZNZ9FxxxST5G|SOD−923<br>(Pb−Free)|8000/Tape & Reel|
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
## **DEVICE MARKING INFORMATION**
See specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet.
Publication Order Number: **NZ9F2V4S/D**
**1**
© Semiconductor Components Industries, LLC, 2014 **July, 2014 − Rev. 3**
**NZ9F2V4ST5G, SZNZ9F2V4ST5G SERIES**
## **ELECTRICAL CHARACTERISTICS**
(TA = 25 ° C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types)
|**Symbol**|**Parameter**|
|---|---|
|VZ|Reverse Zener Voltage @ IZT|
|IZT|Reverse Current|
|ZZT|Maximum Zener Impedance @ IZT|
|IZK|Reverse Current|
|ZZK|Maximum Zener Impedance @ IZK|
|IR|Reverse Leakage Current @ VR|
|VR|Reverse Voltage|
|IF|Forward Current|
|VF|Forward Voltage @ IF|
|�VZ|Maximum Temperature Coefficient of VZ|
|C|Max. Capacitance @VR= 0 and f = 1 MHz|
**==> picture [173 x 151] intentionally omitted <==**
**----- Start of picture text -----**<br>
I<br>IF<br>VZ VR<br>V<br>IR VF<br>IZT<br>**----- End of picture text -----**<br>
**Figure 1. Zener Voltage Regulator**
**==> picture [250 x 173] intentionally omitted <==**
**----- Start of picture text -----**<br>
100<br>80<br>60<br>40<br>20<br>0<br>0 25 50 75 100 125 150<br>TEMPERATURE ( ° C)<br>POWER DISSIPATION (%)<br>**----- End of picture text -----**<br>
**Figure 2. Steady State Power Derating**
**http://onsemi.com**
**2**
## **NZ9F2V4ST5G, SZNZ9F2V4ST5G SERIES**
**ELECTRICAL CHARACTERISTICS** (VF = 0.9 Max @ IF = 10 mA for all types)
|**Device*****|**Device**<br>**Marking**|**Zener Voltage**<br>**VZ**|**Zener Voltage**<br>**VZ**|**Test**<br>**Current**<br>**Izt mA**|**ZZT**<br>**IZ = IZT**<br>**@ 10%**<br>**Mod�**<br>**Max**|**ZZK IZ**<br>**= 1.0**<br>**mA�**<br>**Max**|**IZK**<br>**mA**|**Max**<br>**IR @ VR**|**Max**<br>**IR @ VR**|**dVZ/dt (mV/k)**<br>**@ IZT1 = 5 mA**|**dVZ/dt (mV/k)**<br>**@ IZT1 = 5 mA**|**CpF Max @**<br>**VR = 0**<br>**f = 1 MHz**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||**Min**|**Max**|||||**�A**|**V**|**Min**|**Max**||
|SZ, NZ9F2V4ST5G|2*|2.43|2.63|5|100|1000|1|50|1|−3.5|0|210|
|SZ, NZ9F2V7ST5G|3*|2.67|2.91|5|100|1000|1|20|1|−3.5|0|210|
|SZ, NZ9F3V0ST5G|4*|2.94|3.26|5|100|1000|1|10|1|−3.5|0|210|
|SZ, NZ9F3V3ST5G|5*|3.32|3.53|5|100|1000|1|10|1|−3.5|0|210|
|SZ, NZ9F3V6ST5G|6*|3.6|3.85|5|100|1000|1|10|1|−3.5|0|210|
|SZ, NZ9F3V9ST5G|A**|3.89|4.16|5|100|1000|1|5|1|−3.5|−2.5|210|
|SZ, NZ9F4V3ST5G|D**|4.17|4.43|5|100|1000|1|5|1|−3.5|0|210|
|SZ, NZ9F4V7ST5G|E**|4.55|4.75|5|100|800|0.5|2|1|−3.5|0.2|150|
|SZ, NZ9F5V1ST5G|F**|4.989|5.2|5|80|500|0.5|2|1.5|−2.7|1.2|130|
|SZ, NZ9F5V6ST5G|J**|5.49|5.73|5|60|200|0.5|1|2.5|−2.0|2.5|115|
|SZ, NZ9F6V2ST5G|K**|6.06|6.33|5|60|100|0.5|1|3|0.4|3.7|110|
|SZ, NZ9F6V8ST5G|L**|6.65|6.93|5|40|60|0.5|0.5|3.5|1.2|4.5|105|
|SZ, NZ9F7V5ST5G|P**|7.28|7.6|5|30|60|0.5|0.5|4|2.5|5.3|100|
|SZ, NZ9F8V2ST5G|Q**|8.02|8.36|5|30|60|0.5|0.5|5|3.2|6.2|90|
|SZ, NZ9F9V1ST5G|R**|8.85|9.23|5|30|60|0.5|0.5|6|3.8|7|80|
|SZ, NZ9F10VST5G|T**|9.77|10.21|5|30|60|0.5|0.1|7|4.5|8|80|
|SZ, NZ9F11VST5G|V**|10.76|11.22|5|30|60|0.5|0.1|8|5.4|9|80|
|SZ, NZ9F12VST5G|Y**|11.74|12.24|5|30|80|0.5|0.1|9|6|10|80|
|SZ, NZ9F13VST5G|2**|12.91|13.49|5|37|80|0.5|0.1|10|7|11|75|
|SZ, NZ9F15VST5G|3**|14.34|14.98|5|42|80|0.5|0.1|11|9.2|13|70|
|SZ, NZ9F16VST5G|4**|15.85|16.51|5|50|80|0.5|0.1|12|10.4|14|65|
|SZ,NZ9F18VST5G|5**|17.56|18.35|5|50|80|0.5|0.1|14|12.4|16|60|
° *Rotated 90 .
° **Rotated 180 .
***SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable.
**http://onsemi.com**
**3**
MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS**
**SOD−923** CASE 514AB ISSUE D
**==> picture [190 x 372] intentionally omitted <==**
**----- Start of picture text -----**<br>
STYLE 1 STYLE 2<br>SCALE 8:1<br>−X−<br>D<br>as −Y−<br>E<br>1 2<br>2X b oe<br>0.08 X Y<br>TOP VIEW<br>A<br>c HE<br>_ ><br>SIDE VIEW<br>2X L<br>2X L2 oe ache] fe<br>BOTTOM VIEW<br>SOLDERING FOOTPRINT*<br>1.20<br>2X<br>0.36 2X<br>0.25<br>tr<br>PACKAGE a<br>OUTLINE<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>
DATE 03 SEP 2020
- NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
**==> picture [171 x 272] intentionally omitted <==**
**----- Start of picture text -----**<br>
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD<br>FLASH, PROTRUSIONS, OR GATE BURRS.<br>5. DIMENSION L WILL NOT EXCEED 0.30mm.<br>MILLIMETERS INCHES<br>| DIM | MIN ~—__| NOM MAX MIN —____ NOM MAX ]<br>A 0.34 0.37 0.40 0.013 0.015 0.016<br>b 0.15 0.20 0.25 0.006 0.008 0.010<br>c 0.07 0.12 0.17 0.003 0.005 0.007<br>D 0.75 0.80 0.85 0.030 0.031 0.033<br>E 0.55 0.60 0.65 0.022 0.024 0.026<br>HE 0.95 1.00 1.05 0.037 0.039 0.041<br>L 0.19 REF 0.007 REF<br>—————— L2 0.05 0.10 0.15 0.002 0.004 0.006<br>GENERIC<br>MARKING DIAGRAM*<br>X M X M<br>STYLE 1 STYLE 2<br>{1}<br>X = Specific Device Code<br>M = Date Code<br>*This information is generic. Please refer to<br>device data sheet for actual part marking.<br>Pb−Free indicator, “G” or microdot “ ”,<br>may or may not be present.<br>)<br>STYLE 1: STYLE 2:<br>PIN 1. CATHODE (POLARITY BAND) NO POLARITY<br>2. ANODE<br>**----- End of picture text -----**<br>
See Application Note AND8455/D for more mounting details
- *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98AON23284D** Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. **DESCRIPTION: SOD−923, 1.0X0.6X0.37, MAX HEIGHT 0.40 PAGE 1 OF 1** ~~—_~~ ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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© Semiconductor Components Industries, LLC, 2019
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