SURS8360BT3G.

Update Notification Document # : FPCN21497Z1 Issue Date: 07 June 2017 

|ONSemiconductor®@|Update Notification<br>Document # : FPCN21497Z1<br>Issue Date: 07 June 2017June 2017|
|---|---|
|**Title of Change:**|Update to FPCN21497Z - Assembly & Test site transfer of SMB products currently manufactured in  ON<br>Semiconductor Malaysia facility (SBN) to ON Semiconductor Vietnam (OSV) facility.|
|**Proposed Changed Material First**<br>**Ship Date:**|07 June 2018   (OSV parts available for earlier conversions)|
|**Current Material Last Order**<br>**Date:**|31 March 2018<br>Orders received after the Current Material Last Order Date expiration are to be considered as orders for<br>new changed material as described in this PCN. Orders for current (unchanged) material after this date<br>will be per mutual agreement and current material inventory availability.|
|**Current Material Last Delivery**<br>**Date:**|31 May 2018<br>The Current Material Last Delivery Date may be subject to change based on build and depletion of the<br>current (unchanged) material inventory.|
|**Product Category:**|Active components – Discrete components|
|**Contact information**|Contact your local ON Semiconductor Sales Office or <Phuong.Hoang@onsemi.com>|
|**Samples**|Contact your local ON Semiconductor Sales Office to place sample order.<br>Sample requests are to be submitted no later than 45 days after publication of this change notification.|
|**Sample Availability Date:**|Samples Available On Request|
|**PPAP Availability Date:**|PPAP Available On Request|
|**Additional Reliability Data**|Contact your local ON Semiconductor Sales Office or <cheanching.sim@onsemi.com >.|
|**Type of Notification**|This is an update to a Final Product/Process Change Notification (FPCN) sent to customers.<br>ON Semiconductor will consider this proposed change and it’s conditions acceptable, unless an inquiry is<br>made in writing within 30 days of delivery of this notice. To do so, contact <PCN.Support@onsemi.com>.|
|**Change Category**|**Type of Change **|
|Process – Assembly|Move of all orpart of assemblyto a different location/site/subcontractor.|
|Test Flow|Move of all orpart of electrical wafer test and/or final test to a different location/site/subcontractor|
|Equipment|Production from a new equipment/tool which uses the same basic technology (replacement equipment or<br>extension of existingequipmentpool)without change ofprocess.|
|**Description and Purpose:**<br>This Update Notification (UN) is issued to communicate the transfer of Assembly and Test of SMB products from ON Semiconductor Malaysia (SBN)<br>to ON Semiconductor Vietnam (OSV) in order to ensure support for joint growth and alleviate SBN manufacturing capacity constraints.<br>The OSV produced devices will utilize the same BOM, Equipment, and Processes.  No change to the SBN affected device list of the original FPCN. No<br>change to the request for qualification of the Assembly & Test processes at the ON Semiconductor Vietnam facility announced in FPCN21497Z<br>utilizing the OSV specific part numbers.<br>The OSV part numbers, identified in FPCN21497Z, are available to early adaptors for immediate SBN demand conversion. You can view a list of<br>those OSV part numbers, cross referenced to the affected SBN part numbers listed in this Update notification, in the attached Excel file.<br>Upon completion of this transfer, SMB demand will be sourced solely from OSV and will no longer be available from SBN.  At that time, either the<br>transferring SBN or the current OSV part numbers can be utilized to order these products from OSV.||



## **Description and Purpose:** 

This Update Notification (UN) is issued to communicate the transfer of Assembly and Test of SMB products from ON Semiconductor Malaysia (SBN) to ON Semiconductor Vietnam (OSV) in order to ensure support for joint growth and alleviate SBN manufacturing capacity constraints. 

The OSV produced devices will utilize the same BOM, Equipment, and Processes.  No change to the SBN affected device list of the original FPCN. No change to the request for qualification of the Assembly & Test processes at the ON Semiconductor Vietnam facility announced in FPCN21497Z utilizing the OSV specific part numbers. 

The OSV part numbers, identified in FPCN21497Z, are available to early adaptors for immediate SBN demand conversion. You can view a list of those OSV part numbers, cross referenced to the affected SBN part numbers listed in this Update notification, in the attached Excel file. 

Upon completion of this transfer, SMB demand will be sourced solely from OSV and will no longer be available from SBN.  At that time, either the transferring SBN or the current OSV part numbers can be utilized to order these products from OSV. 

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TEM001092  Rev. M 

Update Notification Document # : FPCN21497Z1 Issue Date: 07 June 2017 

||•Change benefits for customer(s):|
|---|---|
||o Unconstrained Automotive Sourcing; Mfg floor space for future expansion|
||o Sustained TS16949 Certification with the Same BOM / Equipment / Processes|
|**Reason / Motivation for**|o Allow for increased support for Seremban packages that are currently constrained|
|**Change:**|o OSV has been audited to VDA6.3|
||•Risks for delayed conversion:|
||o No Seremban supply after Dec 31, 2017|
||o Limited ability to support bridge build availability.|
|**Anticipated impact on fit,**|No anticipated impacts.|
|**form, function, reliability,**|The device(s) has been qualified and validated based on the same Product Specification. The device(s) has|
|**product safety or**|successfully passed the AEC-Q101 qualification tests. Potential impacts can be identified, but due to testing|
|**manufacturability**|performed by ON Semiconductor in relation to the PCN, associated risks are verified and excluded.|
|**Sites Affected:**||



O All site(s) O not applicable X ON Semiconductor site(s) : O External Foundry/Subcon site(s) _ON Seremban, Malaysia ON Dong Nai Province, Vietnam_ **Marking of Parts/** Products from OSV will carry site code “VN” at the bottom of the package. **Traceability of Change:** 

## **Reliability Data Summary:** 

No Changes.  Successfully Passed AEC-Q101 Qualification.  Please refer to original FPCN 

## **Electrical Characteristic Summary:** 

No Changes.  Electrical characteristics are not impacted. Please refer to original FPCN 

## **List of Affected Standard Parts:** 

|**Transferring  Malaysia (SBN) Part Number**|**Transferring  Malaysia (SBN) Part Number**|**Qualification Vehicle**|
|---|---|---|
||SURS8110T3G||
||SURS8120T3G||
||SURS8160T3G||
||NRVUS230T3G||
||NRVUS240T3G|MURS360BT3G|
||SURS8220T3G||
||SURS8360BT3G||
||SURS360DBT3G||
||SURHS8160T3G||



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Update Notification Document # : FPCN21497Z1 Issue Date: 07 June 2017 

|Issue Date: 07 June 2017<br>@|Issue Date: 07 June 2017June 2017|
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|SZ1SMB5917BT3G||
|SZ1SMB5931BT3G||
||P6SMB200AT3G|
|SZ1SMB5934BT3G||
|SZ1SMB5935BT3G||
|SZ1SMB5938BT3G||



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TEM001092  Rev. M