SURS8320T3G

**DATA SHEET www.onsemi.com** 

## Surface Mount Ultrafast Power Rectifiers 

## MURS320T3G, SURS8320T3G, SURS8320T3G-VF01, MURS340T3G, SURS8340T3G, MURS360T3G, SURS8360T3G, SURS8360T3G-VF01 

## **ULTRAFAST RECTIFIERS 3.0 AMPERES 200−600 VOLTS** 

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SMC  2−LEAD<br>CASE 403AC<br>**----- End of picture text -----**<br>


## **MARKING DIAGRAM** 

This series employs the state−of−the−art epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes, in surface mount applications where compact size and weight are critical to the system. 

## **Features** 

- Small Compact Surface Mountable Package with J−Bend Leads 

- Rectangular Package for Automated Handling 

- High Temperature Glass Passivated Junction 

- Low Forward Voltage Drop 

   - (0.71 to 1.05 Volts Max @ 3.0 A, TJ = 150°C) 

- SURS8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable* 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

## **Mechanical Characteristics** 

- Case: Epoxy, Molded 

- Epoxy Meets UL 94 V−0 @ 0.125 in 

- Weight: 217 mg (approximately) 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

- Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds 

- Shipped in 16 mm Tape and Reel, 2500 units per reel 

- Polarity: Polarity Band on Plastic Body Indicates Cathode Lead 

- Device Meets MSL1 Requirements 

- ESD Ratings: 

   - ♦ Human Body Model, 3B (> 8 kV) 

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AYWW<br>U3x �<br>�<br>**----- End of picture text -----**<br>


- U3 = Specific Device Code x = D (320T3) = G (340T3) 

   - = J (360T3) 

- A = Assembly Location** Y = Year 

WW= Work Week 

- **The Assembly Location code (A) is front side optional. In cases where the Assembly Location is stamped in the package, the front side assembly code may be blank. 

## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|MURS320T3G|SMC<br>(Pb−Free)|2,500 /<br>Tape & Reel|
|MURS340T3G|SMC<br>(Pb−Free)|2,500 /<br>Tape & Reel|
|MURS360T3G|SMC<br>(Pb−Free)|2,500 /<br>Tape & Reel|
|SURS8320T3G*,<br>SURS8320T3G−VF01*|SMC<br>(Pb−Free)|2,500 /<br>Tape & Reel|
|SURS8340T3G*|SMC<br>(Pb−Free)|2,500 /<br>Tape & Reel|
|SURS8360T3G,<br>SURS8360T3G−VF01*|SMC<br>(Pb−Free)|2,500 /<br>Tape & Reel|



   - †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

- ♦ Charged Device Model, > 1000 V (Class C5) 

Publication Order Number: **MURS320T3/D** 

**1** 

© Semiconductor Components Industries, LLC, 2016 **January, 2022 − Rev. 19** 

## **MURS320T3G, SURS8320T3G, SURS8320T3G−VF01, MURS340T3G, SURS8340T3G, MURS360T3G, SURS8360T3G, SURS8360T3G−VF01** 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||||
|---|---|---|---|---|---|
|**Rating**|**Symbol**|**MURS320T3G/**<br>**SURS8320T3G/**<br>**SURS8320T3G−VF01**|**MURS340T3G/**<br>**SURS8340T3G**|**MURS360T3G/**<br>**SURS8360T3G/**<br>**SURS8360T3G−VF01**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|200|400|600|V|
|Average Rectified Forward Current|IF(AV)|3.0 @ TL= 140°C<br>4.0 @ TL= 130°C|3.0 @ TL= 130°C<br>4.0 @ TL= 115°C|3.0 @ TL= 130°C<br>4.0 @ TL= 115°C|A|
|Non−Repetitive Peak Surge Current<br>(Surge applied at rated load conditions<br>halfwave,<br>single phase, 60 Hz)|IFSM|100|||A|
|Operating Junction Temperature|TJ|�65 to +175|||°C|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||||
|---|---|---|---|---|---|
|Thermal Resistance, Junction−to−Lead|R�JL||11||°C/W|
|**ELECTRICAL CHARACTERISTICS**||||||
|Maximum Instantaneous Forward Voltage (Note 1)<br>(iF= 3.0 A, TJ= 25°C)<br>(iF= 4.0 A, TJ= 25°C)<br>(iF= 3.0 A, TJ= 150°C)|vF|0.875<br>0.89<br>0.71|1.25<br>1.28<br>1.05|1.25<br>1.28<br>1.05|V|
|Maximum Instantaneous Reverse Current (Note 1)<br>(Rated dc Voltage, TJ= 25°C)<br>(Rated dc Voltage, TJ= 150°C)|iR|5.0<br>150|10<br>250|10<br>250|�A|
|Maximum Reverse Recovery Time<br>(iF= 1.0 A, di/dt = 50 A/�s)<br>(iF= 0.5 A, iR= 1.0 A, IRECto 0.25 A)|trr|35<br>25|75<br>50|75<br>50|ns|
|Maximum Forward Recovery Time<br>(iF= 1.0 A, di/dt = 100 A/�s, Recovery to 1.0 V)|tfr|25|50|50|ns|
|Typical Peak Reverse Recovery Current<br>(IF= 1.0 A, di/dt = 50 A/�s)|IRM|0.8|||A|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Pulse Test: Pulse Width = 300 � s, Duty Cycle ≤ 2.0%. 

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**2** 

**MURS320T3G, SURS8320T3G, SURS8320T3G−VF01, MURS340T3G, SURS8340T3G, MURS360T3G, SURS8360T3G, SURS8360T3G−VF01** 

## **MURS320T3G/SURS8320T3G/SURS8320T3G−VF01** 

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80<br>40 TJ = 175°C<br>5.0 20<br>8.0<br>4.0<br>2.0 TJ = 100°C<br>0.8<br>3.0 0.4<br>TJ = 175°C 0.2<br>100°C 0.08<br>2.0 0.04 TJ = 25°C<br>0.02<br>0.008<br>0.004<br>25°C 0.002<br>0 20 40 60 80 100 120 140 160 180 200<br>1.0<br>VR, REVERSE VOLTAGE (VOLTS)<br>Figure 2. Typical Reverse Current*<br>0.7 * The curves shown are typical for the highest voltage device in the<br>voltage grouping. Typical reverse current for lower voltage selections<br>can be estimated from these same curves if VR is sufficiently below<br>0.5 rated VR.<br>10<br>9.0<br>8.0 I<br>0.3 (CAPACITIVE�LOAD) PK � 20 5.0<br>7.0 I<br>AV 10<br>6.0<br>0.2 5.0<br>4.0 dc<br>3.0<br>2.0 SQUARE WAVE<br>0.1 1.0<br>0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2<br>0<br>vF, INSTANTANEOUS VOLTAGE (VOLTS) 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>Figure 1. Typical Forward Voltage IF(AV), AVERAGE FORWARD CURRENT (AMPS)<br>�<br>, REVERSE CURRENT (   A)<br>, INSTANTANEOUS FORWARD CURRENT (A) IR<br>iF<br>, AVERAGE POWER DISSIPATION (W))<br>F(AV)<br>P<br>**----- End of picture text -----**<br>


**Figure 1. Typical Forward Voltage** 

**Figure 3. Power Dissipation** 

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10 200<br>RATED VOLTAGE APPLIED<br>9.0 R�JL = 11°C/W TYPICAL CAPACITANCE AT 0 V = 135 pF<br>8.0 TJ = 175 ° C 100<br>7.0 80<br>6.0 60<br>5.0<br>40<br>4.0<br>30<br>3.0 dc<br>20<br>2.0<br>1.0 SQUARE WAVE<br>0 10<br>90 100 110 120 130 140 150 160 170 180 190 0 10 20 30 40 50 60 70 80 90 100<br>TC, CASE TEMPERATURE (°C) VR, REVERSE VOLTAGE (VOLTS)<br>C, CAPACITANCE (pF)<br>, AVERAGE FORWARD CURRENT (A)<br>IF(AV)<br>**----- End of picture text -----**<br>


**Figure 4. Current Derating, Case** 

**Figure 5. Typical Capacitance** 

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**3** 

**MURS320T3G, SURS8320T3G, SURS8320T3G−VF01, MURS340T3G, SURS8340T3G, MURS360T3G, SURS8360T3G, SURS8360T3G−VF01 TYPICAL CHARACTERISTICS** 

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400<br>200<br>5.0 80 TJ = 175°C<br>40<br>20<br>3.0 8.0<br>TJ = 175°C 100°C 4.0 T J  = 100°C<br>2.0<br>2.0<br>0.8<br>0.4<br>0.2<br>25°C 0.08 T J  = 25°C<br>1.0 0.04<br>0.02<br>0.008<br>0.7<br>0.004<br>0 100 200 300 400 500 600 700<br>0.5 VR, REVERSE VOLTAGE (V)<br>Figure 7. Typical Reverse Current*<br>0.3 * The curves shown are typical for the highest voltage device in the<br>voltage grouping. Typical reverse current for lower voltage selections<br>can be estimated from these same curves if VR is sufficiently below<br>0.2 rated VR.<br>10<br>9.0<br>0.1<br>8.0<br>7.0<br>0.07 SQUARE WAVE<br>6.0<br>dc<br>0.05 5.0 (CAPACITIVE LOADS)<br>I<br>4.0 PK � 20 10 5.0<br>I<br>3.0 AV<br>0.03<br>2.0<br>0.02 1.0<br>0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3<br>0<br>vF, INSTANTANEOUS VOLTAGE (VOLTS) 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>Figure 6. Typical Forward Voltage IF(AV), AVERAGE FORWARD CURRENT (A)<br>�<br>, REVERSE CURRENT (   A)<br>, INSTANTANEOUS FORWARD CURRENT (A) IR<br>iF<br>, AVERAGE POWER DISSIPATION (WATTS)<br>F(AV)<br>P<br>**----- End of picture text -----**<br>


**Figure 6. Typical Forward Voltage** 

**Figure 8. Power Dissipation** 

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10 100<br>9.0 90<br>8.0 80 TYPICAL CAPACITANCE AT 0 V = 75 pF<br>7.0 70<br>6.0 60<br>5.0 50<br>4.0 40<br>dc<br>3.0 30<br>2.0 SQUARE WAVE 20<br>1.0 10<br>0 0<br>70 80 90 100 110 120 130 140 150 160 170 0 10 20 30 40 50 60 70 80 90 100<br>TC, CASE TEMPERATURE (°C) VR, REVERSE VOLTAGE (V)<br>C, CAPACITANCE (pF)<br>, AVERAGE FORWARD CURRENT (A)<br>IF(AV)<br>**----- End of picture text -----**<br>


**Figure 9. Current Derating, Case** 

**Figure 10. Typical Capacitance** 

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**4** 

**MURS320T3G, SURS8320T3G, SURS8320T3G−VF01, MURS340T3G, SURS8340T3G, MURS360T3G, SURS8360T3G, SURS8360T3G−VF01 MURS320T3G, SURS8320T3G, SURS8320T3G−VF01, MURS340T3G, SURS8340T3G, MURS360T3G, SURS8360T3G, SURS8360T3G−VF01** 

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10000<br>1000<br>100<br>10<br>10 100 1,000 10,000<br>tp, SQUARE WAVE PULSE DURATION ( � s)<br>CURRENT (A)<br>, NON−REPETITIVE SURGE<br>IFSM<br>**----- End of picture text -----**<br>


**Figure 11. Typical Non−Repetitive Surge Current** 

*Typical performance based on a limited sample size. **onsemi** does not guarantee ratings not listed in the Maximum Ratings table. 

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**5** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**SMC 2−LEAD** CASE 403AC ISSUE B 

## **SCALE 1:1** 

DATE 27 JUL 2017 

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HE<br>E<br>=<br>_ D<br>HD<br>A1 _ c<br>— a DETAIL A<br>TOP VIEW<br>DETAIL A<br>|<br>A2 A<br>L no s Todt b<br>SIDE VIEW END VIEW<br>RECOMMENDED<br>SOLDERING FOOTPRINT*<br>8.750<br>0.344<br>oe<br>3.790<br>2X<br>7 0.149<br>2X 2.250 mm SCALE 4:1<br>ot 0.089 inches<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

NOTES: 

1. DIMENSIONING AND TOLERANCING PER ANME Y14.5M, 1994. 

2. CONTROLLING DIMENSION: INCHES. 

3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.254mm PER SIDE. 

4. DIMENSIONS D AND E TO BE DETERMINED AT DATUM H. 

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5. DIMENSION b SHALL BE MEASURED WITHIN THE AREA<br>DETERMINED BY DIMENSION L.<br>MILLIMETERS INCHES<br>DIM MIN MAX MIN MAX<br>A 1.95 2.61 0.077 0.103<br>A1 0.05 0.20 0.002 0.008<br>——— A2 1.90 2.41 0.075 0.095<br>b 2.90 3.20 0.114 0.126<br>c 0.15 0.41 0.006 0.016<br>D 5.55 6.25 0.219 0.246<br>EE. E 6.60 7.15 0.260 0.281<br>H E 7.75 8.15 0.305 0.321<br>L 0.75 1.60 0.030 0.063<br>GENERIC<br>MARKING DIAGRAM*<br>**----- End of picture text -----**<br>


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AYWW<br>XXXX<br>XXXX = Specific Device Code<br>A = Assembly Location<br>Y = Year<br>WW = Work Week<br>(Note: Microdot may be in either location) , = Pb−Free Package<br>*This information is generic. Please refer to<br>device data sheet for actual part marking.<br>Pb−Free indicator, “G” or microdot “ ”, |<br>may or may not be present.<br>**----- End of picture text -----**<br>


|**DOCUMENT NUMBER:**|**98AON97675F**|
|---|---|
|**DESCRIPTION:**|**SMC 2−LEAD**|



Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

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